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9718results about "Epoxy resin adhesives" patented technology

Resin composition, method of its composition, and cured formulation

It is an object of the present invention to provide a resin composition which can form cured formulations having various excellent properties such as an insulating property, thermal shock resistance, moldability / formability and strength, and exhibit an excellent appearance in which transparency is enhanced, a resin composition whose cured thin film has excellent flame retardancy, good mechanical property and heat resistance, a dispersing element containing an inorganic microfine particle which can give a flame retardancy to a resin, to which the inorganic microfine particle is added, and can reduce a hygroscopic property to the extent possible, a method for producing the same and a cured formulation obtained by using the resin composition. The present invention relates to a resin composition comprising a compound having at least one of a glycidyl group and / or an epoxy group and an inorganic microfine particle, a resin composition comprising three components of a phenolic compound, a compound having at least one of a glycidyl group and / or an epoxy group and an inorganic microfine particle, a flame retardant resin composition comprising a polyhydric phenol and an inorganic microfine particle, and a dispersing element containing an inorganic microfine particle obtained by a hydrolysis condensation reaction of alkoxide and / or metal carboxylate in a dispersion medium.
Owner:NIPPON SHOKUBAI CO LTD
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