The application relates to the technical field of
welding materials, in particular to a high-stability lead-free
soldering paste without an inner cover and a preparation method thereof, the lead-free
soldering paste contains the following components in parts by weight: 10-14 parts of a
soldering paste, 86-90 parts of lead-free soldering
powder; the lead-free soldering
powder is selected from one or more of Sn99Ag0.3Cu0.7, Sn98.5Ag1Cu0.5 and Sn96.5Ag3Cu0.5; the soldering paste contains the following components in parts by weight: 30-50 parts of
rosin, 4-10 parts of resin, 30-50 parts of a
solvent, 3-15 parts of an additive, 4-8 parts of a thixotropic agent, 5-10 parts of an
organic acid, 0.5-3 parts of a
halogen compound and 0.5-2 parts of an
antioxidant. In the application, the prepared low-water absorption additive is introduced into the lead-free soldering paste to obtain a high-stability, low-water absorption soldering paste, the soldering paste can be stored for a long time without covering the inner cover, the material for producing the inner cover is saved, the packaging process is simplified, the storage time is prolonged, small and micro enterprises can concentrate on furnace
welding, the
welding time is reduced, and the
energy consumption is reduced.