29results about How to "Simplify the packaging process" patented technology

The invention relates to the technical field of infrared detectors, and discloses a packaging structure of an infrared detector, which comprises an optical window, a bracket, an infrared detection chip and a substrate, the substrate is of a flat plate structure; the support is of a frame-shaped structure. The infrared detection chip is connected to the upper surface of the substrate; and the optical window and the bracket as well as the bracket and the substrate are welded through welding flux to form a packaging structure. According to the packaging structure, the requirements of miniaturization, light weight, diversification and low cost of the infrared detector module can be met. Meanwhile, the invention further provides a packaging method of the infrared detector.

The invention provides an interface heat dissipation material preform, a preparation method thereof and a multi-chip packaging structure. According to the interface heat dissipation material preform, the preparation method thereof and the multi-chip packaging structure provided by the invention, the plurality of chip fixing areas are formed on the second surface, and the thicknesses of at least two chip fixing areas in the plurality of chip fixing areas are different, so that the heat dissipation performance of the interface heat dissipation material preform is improved. Therefore, the interface heat dissipation material preform can support at least two chips with different thicknesses at the same time and can adapt to different chip requirements, so that the packaging process is simplified, the assembly time is shortened, the production flexibility is improved, and the generation efficiency is improved; in addition, the standardized design of the interface heat dissipation material preformed part is beneficial to ensuring the consistency and repeatability of each multi-chip package, and the variability in the production process can be reduced.

The invention relates to the technical field of packaging equipment, and discloses automatic bagging packaging equipment for anti-leakage paper cup production and a packaging method.The automatic bagging packaging equipment for anti-leakage paper cup production comprises a rack, a feeding roller arranged on the inner side of the rack, a sliding table and a supporting table, and the sliding table and the supporting table are arranged at the top end of the rack; a supporting frame is fixedly installed in the middle of the top end of the rack. Through the arrangement of the bag opening barrel, the supporting barrel, the sealing assembly and the clamping assembly, a rolled barrel-shaped packaging film is directly adopted for packaging, the packaging film only needs to be arranged on the bag opening barrel in a sleeving mode in the initial stage, and the packaging film only needs to be pulled out of the bag opening barrel through the supporting barrel and the clamping assembly in the subsequent packaging process; the packaging film does not need to be conveyed, positioned, opened, fixed and the like subsequently, the packaging process is simplified, the number of mechanical driving parts is reduced, and therefore the manufacturing cost is reduced, due to the fact that the number and complexity of the driving mechanical parts are reduced, operation of the whole system is more stable, and the failure rate and the maintenance difficulty are reduced.

The utility model provides a double-sided packaging structure. In the double-sided packaging structure, a middle plastic packaging structure comprises a substrate, the substrate is provided with a front surface and a back surface which are opposite to each other, and the back surface of the substrate is provided with a conductive column; the back electronic component is mounted on the back surface of the substrate; the resin film is attached to the back face of the substrate and at least wraps the side wall of the back electronic element and the side wall of the conductive column, and the surface, away from the substrate, of the resin film is flush with the end face, away from the substrate, of the conductive column. Therefore, the packaging process can be simplified, and the packaging process difficulty and cost can be reduced.

The utility model belongs to but is not limited to the field of semiconductor manufacturing technology, disclose a kind of DBC ceramic base five-foot integrated PFC power semiconductor packaging structure, including a IGBT chip, first fast recovery diode chip, second fast recovery diode chip, DBC ceramic substrate, pin assembly and package body;The IGBT chip, first fast recovery diode chip and second fast recovery diode chip are installed side by side on the metal coating surface of the DBC ceramic substrate;The pin assembly includes five pins, and the package body adopts TO-247 outer shape structure.The utility model directly uses DBC ceramic as heat sink structure, and power chip is laid side by side on it, bottom surface metal is exposed, for optimizing heat path, simplifying packaging process, with more compact structure, the advantage of lower thermal resistance.The utility model's circuit is compact, and is adapted to high-power, high-frequency application scene.

The invention discloses a flexibly-packaged cylindrical battery and a manufacturing method thereof. The flexibly-packaged cylindrical battery comprises a cylindrical roll core and a cylindrical flexibly-packaged shell for packaging the roll core, the cylindrical roll core comprises a first end part and a second end part which are oppositely arranged; the first end part is respectively connected with a positive pole lug and a negative pole lug, and the positive pole lug and the negative pole lug respectively extend outwards from the first end part and penetrate out of the soft package shell; or, the second end part is respectively connected with a positive pole lug and a negative pole lug, and the positive pole lug and the negative pole lug respectively extend outwards from the second end part and penetrate out of the soft package shell. Compared with the prior art, the positive and negative tabs are led out from the same end of the roll core, so that the packaging process of the battery can be simplified, the production efficiency is improved, and the production cost is reduced; meanwhile, as the tab leading-out space only needs to be reserved at one end of the roll core, the utilization rate of the internal space of the battery is improved, and the volume energy density of the battery is improved.

The utility model discloses a medical supply packaging structure can reduce the oxygen and moisture content in the packing, including packing box, scavenger and sealed bag, the scavenger is built -in in packing box, and the sealed bag is set up in packing box outside and seals packing box. Packing box includes bottom shell and top cover, and the side edge of bottom shell is swingingly linked with the side edge of top cover, and bottom shell is equipped with at least one and is used for accommodating medical supply's accommodation cavity and at least one storage groove, and the edge of bottom shell is equipped with a plurality of first positioning piece, and the edge of top cover is equipped with a plurality of with first positioning piece one -to -one corresponding second positioning piece, and second positioning piece and first positioning piece interference fit make top cover with bottom shell cover, and in packing box cover state, the accommodation cavity and storage groove between have the breathable passage of intercommunication. Scavenger includes dehumidifier and oxygen scavenger, and dehumidifier and oxygen scavenger are contained in same storage groove or are contained in different storage groove respectively, for through the breathable passage and remove the moisture and oxygen in accommodation cavity.

The application provides a deep trench field effect transistor and a preparation method thereof, which comprises the following steps: forming a P-type layer and an N-type layer in an N-type substrate; forming a gate trench and a terminal trench; forming an N-type source region by ion implantation; forming a gate oxide layer in the trench; forming a first polysilicon layer, a thick oxide layer and a second polysilicon layer in the trench; depositing a dielectric layer; forming a drain contact region, a source contact region, a gate contact region and a terminal contact region; forming a source electrode, a gate electrode and a drain electrode, wherein the source electrode is connected with the N-type source region and the terminal contact region simultaneously. The source electrode, the gate electrode and the drain electrode can be attached to a heat dissipation substrate simultaneously, the heat dissipation path is greatly optimized, and the source path inductance is reduced; the source contact region of the application is arranged in the terminal region, and the source contact region is realized by directly etching the dielectric layer and the substrate below the dielectric layer, the process controllability is high, the steps are simple, and the etching process of the source contact region has high stability.

This utility model belongs to the technical field of battery electrolyte addition equipment, specifically relating to an automatic batch battery electrolyte addition device. It includes an infeed conveyor belt, an outfeed conveyor belt, a tray transfer assembly, a tray gripping arm, and an automatic dispensing head. The tray gripping arm and the automatic dispensing head are respectively positioned above both ends of the tray transfer assembly. The infeed conveyor belt and the outfeed conveyor belt are respectively positioned on the front and rear sides of the tray transfer assembly corresponding to one end of the tray gripping arm. The tray transfer assembly includes a tray holder, which is slidably fitted onto a reciprocating guide rail. This utility model can quickly complete the batch addition process of battery electrolyte and output material plates containing batteries one by one, facilitating subsequent assembly processes, helping to avoid electrolyte leakage, and improving battery production quality and efficiency.

The application relates to the technical field of digital twinning, and discloses a sports equipment whole life cycle management system and method based on digital twinning, which comprises a hash mapping module, a digital twinning body construction module, a feature statistics module, a state entropy calculation module, a state grading mapping module and an instruction coding module, a unique identification hash value is obtained by hashing a factory serial code; an initial digital twinning body data set is obtained by allocating a multi-dimensional field storage area and dynamically expanding based on the unique identification hash value; a stage feature value vector is obtained by accumulating data feature statistics based on a field writing event; a comprehensive state entropy value is obtained by nonlinear state entropy calculation; a maintenance priority code is obtained by grading mapping with a multi-level threshold interval; and a structured management instruction frame is obtained by instruction protocol coding; the application can improve the whole life cycle management efficiency of sports equipment based on digital twinning.

The tableware packaging box comprises a shell assembly, a concave interlayer and a first round bowl, a shell bottom plate in the shell assembly is fixedly connected with a second paper angle bead, and the second paper angle bead is tightly attached to a dish packaging bottom plate in a dish packaging assembly and a bowl packaging side plate in a bowl packaging assembly; the plate packaging bottom plate is fixedly connected with a fourth paper angle bead, the fourth paper angle bead is tightly attached to a concave interlayer, and the concave interlayer is tightly attached to the first small plate; in the assembling process of the dish, the interlayer is used as a support, and the dish is assembled into the space formed by the interlayer in a separated mode; in the assembling process of bowls, the bowls are assembled into the spaces formed by separating the interlayer and the protection plate with the interlayer and the protection plate as supports, the structure of the packaging box is compact through the interlayer and the protection plate, the protection strength on tableware is greatly improved, and then the plate packaging assembly and the bowl packaging assembly are packaged into the shell assembly; the assembly process of the tableware packaging and containing method is completed, the whole packaging process is simple, and the working efficiency is improved.

The invention discloses a sweet potato baking and selling all-in-one machine and a using method thereof, and relates to the technical field of sweet potato baking and selling machines, the sweet potato baking and selling all-in-one machine comprises a first shell, and a feeding device, a microwave prefabricating mechanism, a sweet potato transfer mechanism, a hot air baking mechanism and a discharging and packaging mechanism are installed in the first shell; a sweet potato sleeve is arranged in the microwave shell; one end of the hot air baking shell is provided with a folding paperboard which can be stretched and contracted, and the folding paperboard can be switched between a corrugated paperboard and a paper sleeve; a plurality of cooling plates are installed in a conveying and storing channel of the feeding device in a matched mode. The sweet potato processing device is unique in an efficient sweet potato processing flow, the sweet potatoes are firstly subjected to microwave heating operation once through the microwave prefabricating mechanism in the sweet potato processing device, then the sweet potatoes are subjected to hot air baking through the hot air baking mechanism, and by means of the mixed heating mode, the meal delivery speed can be higher, and a large amount of heat can be saved.

The disclosure provides a battery housing and a battery. The battery housing includes a bottom shell and a cover. The cover includes an outer contact layer, an insulating layer, and an inner contact layer. The electrode contact portion of the outer contact layer passes through the insulating layer and the inner contact layer to be electrically connected to one pole of a battery cell. The other electrode of the battery cell can be electrically conducted with the bottom shell. The inner contact layer and the bottom shell are configured to be welded for packaging the battery cell. Since the inner contact layer and the outer contact layer of the cover are pre-insulated, the inner contact layer and the bottom shell need to be welded, and the insulating film is not needed, thereby simplifying the packaging process of the battery and improving the packaging efficiency.

The application relates to the field of low-temperature sensing technology, in particular to an integrated low-temperature temperature sensor based on high-temperature superconducting material and a preparation method thereof. The temperature sensor comprises a single-crystal substrate layer, a YBCO superconducting layer and an electrode layer. The YBCO superconducting layer comprises a measured superconducting circuit area and a superconducting micro-bridge array area. The measured superconducting circuit area and the superconducting micro-bridge array area are located in the same film plane and are electrically isolated from each other through etching grooves. The measured superconducting circuit area and the superconducting micro-bridge array area are electrically connected to an external measured circuit end through the electrode layer. The preparation method of the temperature sensor can conduct heat through the continuous single-crystal substrate layer in a short path and low loss, so that the superconducting micro-bridge array can instantaneously capture the real temperature fluctuation of the core sensitive position of the measured superconducting circuit area, realize the leap from macro-environment temperature measurement to micro-in-situ temperature measurement, and has a near-zero delay response capability of the order of microseconds.

The invention relates to an anti-splashing chip pre-packaging cover body and a chip pre-packaging method, the anti-splashing chip pre-packaging cover body comprises an annular wall and a mold sheet layer, and the annular wall and the mold sheet layer are both made of polydimethylsiloxane; one end of the annular wall is connected to the peripheral edge of the mold sheet layer, the annular wall is perpendicular to the mold sheet layer, and a concave structure which is arranged corresponding to a pattern on a pre-packaged chip and has the same shape as the pattern on the pre-packaged chip is formed on one side surface, close to the annular wall, of the mold sheet layer; the inner side wall of the annular wall is matched with the peripheral edge of the pre-packaged chip, and the axial height of the annular wall is larger than the thickness of the pre-packaged chip, so that when the inner side wall of the other end of the annular wall is fixed to the peripheral edge of the pre-packaged chip, an avoiding gap is reserved between the inner surface of the mold sheet layer and the top of the pre-packaged chip. The surface of the surface acoustic wave filter can be isolated, so that splashes generated in the welding process are effectively isolated, the filter is protected against pollution, meanwhile, the packaging process is simplified, the cost is reduced, and the production efficiency and the product quality are improved.

The invention provides an optical fiber array, a preparation method of the optical fiber array and an optical device. The optical fiber array comprises optical fibers and a substrate; the optical fiber is used for emitting light beams; the substrate is provided with an accommodating groove, a reflecting surface and a light emitting surface, the accommodating groove and the reflecting surface are arranged at intervals along the length direction of the substrate, the reflecting surface is positioned on one side of the end part of the accommodating groove, the reflecting surface and the light emitting surface are arranged at intervals along the height direction of the substrate, and at least part of the optical fiber is arranged in the accommodating groove; a light beam emitted from the optical fiber is emitted to the reflecting surface, is reflected to the light-emitting surface through the reflecting surface, and is emitted out of the substrate through the light-emitting surface. The accommodating groove, the reflecting surface and the light emitting surface are formed on the substrate by utilizing a photoetching process, so that the process of mutually assembling a lens and the substrate in the related technology is omitted, the use quantity of a lens material is reduced, and the assembly cost, the material cost and the production cost are reduced. Moreover, the subsequent packaging process is simplified, the spacing tolerance between the accommodating grooves is reduced, and the miniaturization of the optical device is realized.

The present invention relates to the field of liquid crystal module packaging technology, and in particular to an easily disassembled liquid crystal display module packaging structure and a packaging method thereof, which includes an outer packaging box, a foam box, an anti-static bag, and a plurality of blister trays, wherein the foam box includes a lower buffer foam box and an upper buffer foam box, each blister tray is used to load a liquid crystal display module, and the plurality of blister trays are stacked and arranged, and the plurality of blister trays are stacked and placed in the anti-static bag, and the anti-static bag is placed in the lower buffer foam box, and the upper buffer foam box cover is arranged on the lower buffer foam box. The present invention has a novel structure, eliminates several inner boxes in the traditional packaging technology, and the number of anti-static bags can also be reduced; simplifies the packaging process, and the client disassembly steps are also greatly reduced, thereby improving work efficiency; and the application of the foam box is added, and the buffering protection effect it plays is better than the inner box used before, and more effectively reduces the probability of damage to the liquid crystal display module.

The application relates to a MOS structure for automobile starting, a manufacturing method and an automobile starting system, which comprises a base island, a first MOS tube and a second MOS tube arranged on the base island, and a plastic sealing body for sealing the base island, the first MOS tube and the second MOS tube, the gate of the first MOS tube is connected with the gate of the second MOS tube, and the drain of the first MOS tube is connected with the drain of the second MOS tube. The application has the effects of saving space, reducing cost and reducing internal resistance.

The application relates to the technical field of welding materials, in particular to a high-stability lead-free soldering paste without an inner cover and a preparation method thereof, the lead-free soldering paste contains the following components in parts by weight: 10-14 parts of a soldering paste, 86-90 parts of lead-free soldering powder; the lead-free soldering powder is selected from one or more of Sn99Ag0.3Cu0.7, Sn98.5Ag1Cu0.5 and Sn96.5Ag3Cu0.5; the soldering paste contains the following components in parts by weight: 30-50 parts of rosin, 4-10 parts of resin, 30-50 parts of a solvent, 3-15 parts of an additive, 4-8 parts of a thixotropic agent, 5-10 parts of an organic acid, 0.5-3 parts of a halogen compound and 0.5-2 parts of an antioxidant. In the application, the prepared low-water absorption additive is introduced into the lead-free soldering paste to obtain a high-stability, low-water absorption soldering paste, the soldering paste can be stored for a long time without covering the inner cover, the material for producing the inner cover is saved, the packaging process is simplified, the storage time is prolonged, small and micro enterprises can concentrate on furnace welding, the welding time is reduced, and the energy consumption is reduced.

The utility model relates to sealing equipment technical field, and disclose a kind of glove vacuum packaging temperature control sealing machine, including: stand, the top of the stand is fixedly installed with fixed plate.This kind of glove vacuum packaging temperature control sealing machine, while completing vacuum extraction and exiting packaging bag in suction pipe, automatically drive two heat sealing plates to realize sealing by moving towards each other, optimize the operation of vacuum extraction and sealing in traditional equipment as coherent action, simplify overall packaging process, reduce mechanical equipment operation link, improve production efficiency, while reducing the complexity of equipment mechanical structure, save design, manufacturing and maintenance cost, and heat sealing plate adopts wave shape design, will increase the contact area of heat sealing plate and packaging bag, make the combination of sealing part more tightly firm, effectively prevent the problems such as air leakage, cracking at sealing, further improve the quality of vacuum packaging, ensure that glove and other products are better protected during storage and transportation.

The invention relates to the technical field of silicon material packaging equipment, in particular to a full-automatic silicon material packaging machine, a silicon material packaging method and a silicon material weighing method. The full-automatic silicon material packaging machine comprises a weighing and charging device, a sealing device and a controller. The weighing and charging device comprises a feeding assembly, a counterweight assembly and a charging assembly. The feeding assembly is used for putting the large-particle-size silicon material into the packaging bag, so that the weight of the silicon material entering the packaging bag is within the set weight range interval, the set weight range interval can better meet the actual putting requirement of the large-particle-size silicon material, and the putting difficulty of the large-particle-size silicon material is reduced. The silicon material actually needed to be put into the counterweight assembly is determined by obtaining the weight value of the weighing bin I and the preset weight of the silicon material actually needed to be put into the packaging bag, and therefore the purpose of accurate weighing is achieved. According to the scheme, through cooperation of the feeding assembly, the counterweight assembly and the controller, accurate feeding operation can be conducted in the packaging bag, and the purpose of conducting uniform weight and accurate packaging on the silicon materials is achieved.

This invention discloses a top-and-bottom type television outer packaging box, including a base assembly, side supports, an upper support, and an outer carton. The side supports abut against the left and right inner sidewalls of the outer carton, and the upper support abuts against the inner upper surface of the outer carton. The outer carton is fitted around the base assembly, and the outer carton and the base assembly are closable. The base assembly includes a blister base and a lower support. The lower support is inserted into the blister base, and a limiting step is provided on the outer side wall of the lower support. The distance from the limiting step to the lower end face of the lower support is the same as the inner cavity depth of the blister base. The upper side of the blister base abuts against the limiting step. This invention uses a blister base, which simplifies the television packaging process, thereby improving processing efficiency. It has moisture-proof and damp-proof functions, is less prone to damage than traditional cardboard, is thin and tough, scratch-resistant and wear-resistant. With a fixed outer size, the inner support is thicker, increasing the cushioning capacity of the packaging and making the quality more reliable.

The invention discloses a hollow plate buffer box structure and a preparation method thereof, and relates to the technical field of packaging. Comprising a box body hollow plate, a box body defined by the box body hollow plate and piled nails, and the box body hollow plate is of an inner-outer double-wall hollow structure; cutting and blanking are conducted through laser or a cutting die, a pre-folding line structure and a fixing hole are cut out, and the box is fixed through a pin after being folded and formed and can be used as an ultimate packaging box of a product; compared with a packaging mode of adopting buffering auxiliary materials and a paper box, the packaging process is greatly simplified, the hollow plate of the box body has good buffering performance, use of non-environment-friendly buffering materials such as foam is omitted, and the environment is protected; meanwhile, the high-strength, moisture-proof, water-proof and mildew-proof properties are achieved, and compared with a carton, the good severe environment resistance advantage is achieved; meanwhile, the strength can be conveniently increased by increasing the wall thickness, the traditional complex packaging modes of wooden boxes, wooden frames and wooden supports can be replaced, and convenience is brought to normal express logistics transportation packaging of extra-heavy and ultra-large products.

The utility model discloses a packaging angle bead structure. The folding plate comprises a first folding plate, a second folding plate, a third folding plate, a top end face and a bottom end face. The first side of the top end face is connected with the first folding plate through a first folding line, the second side of the top end face is connected with the second folding plate through a second folding line, and the first side of the top end face is opposite to the second side of the top end face. The first side of the bottom end face is connected with the second folding plate through a third folding line, the second side of the bottom end face is connected with the third folding plate through a fourth folding line, the first side of the bottom end face is opposite to the second side of the bottom end face, and the bottom end face and the top end face are connected to the two opposite sides of the second folding plate respectively; collinear reverse folding lines are arranged on the first folding plate and the third folding plate respectively, continuous fracture lines are arranged on the bottom end face, the top end face and the second folding plate, one end of each fracture line is connected with the reverse folding line on the first folding plate, and the other end of each fracture line is connected with the reverse folding line on the third folding plate.

The disclosure provides a battery housing and a battery. The battery housing includes a bottom shell and a cover. The cover includes an outer contact layer, an insulating layer, and an inner contact layer. The electrode connecting portion of the inner contact layer is electrically connected to one pole of the battery cell. The other pole of the battery cell is electrically connected to the bottom shell. Since the inner contact layer and the outer contact layer are insulated through the insulating layer, the bottom shell is also insulated from the inner contact layer, thereby preventing the two electrodes of the battery cell from being mutually connected and short-circuited. Since the inner contact layer and the outer contact layer of the cover are pre-insulated, the insulating film is not needed, thereby simplifying the packaging process of the battery and improving the packaging efficiency.

The utility model relates to a packaging assembly and a battery, the packaging assembly is used for being arranged at the top of a battery cell and forming packaging connection with the battery cell, the packaging assembly comprises: a flexible soft plate extending along the width direction of the battery cell, the plate surface of the flexible soft plate being parallel to the plane where the top of the battery cell is located; the protection plate is connected to one side, facing the battery core, of the flexible soft plate; the plurality of electric components are arranged on one side, facing the battery core, of the protection plate at intervals, and the electric components are electrically connected with the protection plate; and the electric connection part is electrically connected to the side, provided with the electric component, of the protection plate, and the electric connection part is used for being electrically connected with a tab of the battery cell. According to the technical scheme, the technical problems that the overall energy density of the battery is small and the battery performance is poor due to the fact that a traditional battery occupies too large packaging space in the length direction of the traditional battery are effectively solved.

According to the pressing discharging vacuum bottle, when the pressing discharging vacuum bottle is used for the first time, a user can press the pressing part, the pressing part compresses the space between the pressing part and the material storage channel, negative pressure is formed in the material storage channel, after force applied to the pressing part is removed, the pressing part recovers to the original shape, and in the process of recovering to the original shape, the pressing part is not damaged. The fluid material in the containing cavity is sucked into the material storage channel through the material pumping part, then the pressing part is pressed again, the pressing part can force the fluid material in the material storage channel to be transferred into the discharging channel, the fluid material can force the discharging part to be switched to the open state, and therefore the fluid material is guided to be discharged out of the outside, and after force on the pressing part is removed again, the fluid material is discharged out of the discharging channel. And the material pumping part sucks the fluid material into the material storage channel again, preparation is made for the next discharging action, and the design can keep the fluid in the shell not in contact with the outside air all the time, so that the problems of oxidation of the fluid material, pollution of microorganisms and the like are avoided, and the safety of the fluid material and the user experience are ensured.

The utility model discloses a normal chip and a chip packaging product, and relates to the technical field of chips. The positive electrode and the negative electrode of the positive chip are arranged on the periphery of the light-emitting surface, so that the number, the position, the wire diameter and the wire arc design of gold wires for welding the electrodes can be more flexible, the gold wires, the positive electrode and the negative electrode can flexibly avoid the light-emitting surface and do not shield the light-emitting surface, the light-emitting surface can be fully exposed, packaging design is facilitated, and the light-emitting efficiency is improved. And the packaging design of the chip is more flexible and changeable. In the packaging process, the fluorescent film with the corresponding size is directly attached to the light-emitting face, the fluorescent film does not need to be provided with a through hole any more, the packaging technological process is simplified, the packaging difficulty and packaging cost are reduced, the integrity of the fluorescent film is guaranteed, the light-emitting face is covered with the fluorescent film, and then the problem of blue light leakage in a traditional normal chip is solved.

An intelligent power module packaging structure includes an intelligent power integrated unit and an integrally formed packaging shell, wherein the intelligent power integrated unit includes a power circuit substrate, a built-in functional circuit board and a plurality of connecting columns; a plurality of first through holes corresponding to the plurality of connecting columns are provided on the built-in functional circuit board, the bottom ends of the plurality of connecting columns are fixed on the power circuit substrate, the top ends of the plurality of connecting columns pass through the built-in functional circuit board through the plurality of first through holes respectively, and are fixedly connected to the built-in functional circuit board at the first through holes corresponding thereto; the packaging shell includes an installation cavity with an opening at the bottom, the intelligent power integrated unit is installed in the installation cavity, and the power circuit substrate of the intelligent power integrated unit is sealed at the bottom opening position of the installation cavity, forming a closed packaging structure with the packaging shell. The structure reduces the investment cost of the production line, improves the space utilization rate and design freedom of the intelligent power integrated unit, and simplifies the packaging shell structure and packaging process.