218 results about "Surface phase" patented technology

The invention relates to an arbitrary polarization dynamic control device and method based on metamaterial surface-phase change material, and belongs to the technical field of micro-nano optical applications. A metamaterial surface based on a V type nano-antenna array is used for reacting with a light field to generate a surface phase gradient, which causes that the abnormally transmitted polarized light generated under the condition of line polarized light normal incidence, deflects from the normal direction of the surface. At the same time, with the introduction of an interval modulation layer comprising periodically arrayed germanium-antimony-tellurium, under external excitation, phase differences of orthogonal polarization state emitted by different units are modulated, and overlap in space to achieve random polarization state synthesis of an outgoing light field. The method is an all-solid-state modulation method with no necessity of any mechanical modulation measures such as drawing or rotating. The separation of random polarized light and background light beams can be achieved to avoid cross fire. The method provides a flexible regulation and control measure for on-chip polarization applications of integrated optics.

The invention discloses a mobile satellite communication phased array antenna, which relates to a high performance satellite communication antenna device of a mobile satellite communication system in the communication field. The invention comprises a receiving array, a transmitting array, a feed network, a radio frequency receiving component, a radio frequency transmitting component, a servo tracking and beam controlling system, and an antenna seat and other components. The invention adopts a form of a one-dimensional phased array scanning antenna, a track mode of mutually combining azimuth plane mechanical tracking and pitching surface phased array electric track while scan is formed by adopting a non-planar array form structure, and the receiving and the transmitting of signals are completed. The invention also has the advantages that the tracking speed is quick, the electrical performance is good, and the outline is low, etc. The invention is in particular applied to the manufacturing of the high performance satellite communication antenna in the mobile satellite communication system.

Provided are a phase extraction method and a detecting device for single width carrier frequency interference fringes. The phase extraction method and the detecting device are used for large plane optical element detection. The method is mainly based on virtual grating phase shifting moire fringes and two-dimensional Fourier transformation, two-dimensional wave surface phase information of a detected optical element is extracted from a single carrier frequency interference pattern within a full aperture range, and a computing method for a GRMS value of a circular aperture component surface shape is put forward. In addition, the plane optical element surface shape detecting device constructed on the basis of the method can be applied to procedure interference detection of optical manufacturing workshops. According to the phase extraction method and the detecting device, the requirement for detection of plane optical element transmission/reflection low frequency surface shape deviation can be met, and precision and efficiency of manufacturing detecting are improved.

The invention belongs to the field of integrated optoelectronics and optical communication, and relates to an integrated orbital angular momentum mode transmitter. The integrated orbital angular momentum mode transmitter is constructed by integrally growing a substrate, a reflecting mirror structure, an active region, a transverse optical field and electric field limiting layer and a phase plate generating angular spiral phase distribution, thereby forming an independent integrated device. The phase plate generating angular spiral phase distribution can be a structured phase plate having a spiral continuous phase plate structure, a spiral stepped phase plate structure, a fork-shaped diffraction grating phase plate structure and a super-surface phase plate structure capable of providing spiral phase distribution along the angular direction. By adopting the integrated orbital angular momentum mode transmitter, high integration and miniaturization are realized, the device process is mature, and the structure is simple and is easy to realize. The wavelength of the angular momentum mode of a transmission orbit can be flexibly changed through selection of the structural parameters of a reflecting mirror as well as the material system and structure of an active layer. The integrated orbital angular momentum mode transmitter plays an important role in promoting the development of rapid orbital angular momentum optical communication.

The present invention provides a chemically strengthened glass suitable for use in applications in which the chemically strengthened glass is desired to have chemically strengthened properties that differ from surface to surface. The present invention relates to a chemically strengthened glass having a first surface and a second surface which faces the first surface, in which the first surface has a depth of compressive stress layer DOL₁ (μm) which is larger by at least 3 μm than a depth of compressive stress layer DOL₂ (μm) of the second surface, the second surface has a surface compressive stress CS₂ (MPa) which is higher by at least 50 MPa than a surface compressive stress CS₁ (MPa) of the first surface, and the chemically strengthened glass satisfies the following relational expressions (2) and (3):

[Dh(E)−Dh(1)]<0  (2)

[Dh(E)−Dh(2)]>0  (3).

The invention discloses a method for measuring and representing microcosmic interface phases of asphalt concrete. According to the method, a small asphalt concrete piece is wrapped with epoxy resin AB glue and cured into a flat cylindrical test piece in a mold to prevent the small asphalt concrete piece from being stripped and deformed in the follow-up polishing process and improve the polishing flatness; the test piece is polished with metallographic abrasive paper, and then a final test piece meeting the requirements is obtained after ultrasonic cleaning is performed on the test piece when polishing is completed; the test piece enters a measuring step, all surface phases of the test piece are observed through amplification with a nanoindentation instrument, a measuring region containing all the phases is selected, equally-spaced dotting measuring is performed, and a load-displacement curve and a microscope image are recorded; after the test is finished, the Young modulus and hardness of all the points are computerized according to the load-displacement curve, and then the modulus and hardness indexes of all the phases are obtained by combining the phases where the measured points are located; finally, the size and the mechanical characteristics of a microcosmic interface transition area between asphalt and aggregates in the test piece can be analyzed and estimated according to the changing condition of the distance among the measured points and the mechanical indexes.

The invention discloses an ultrathin packaging structure of an image sensing chip, comprising a base plate, an image sensing chip, a support and a light transmission layer, wherein the base plate comprises an upper surface and a lower surface and is hollow in the middle part; a welding pad for connection chips is arranged around the hollow part of the upper surface; a welding pad for subsequent welding is arranged around lower surface; the image sensing chip is arranged at the hollow part of the base plate and smaller than the hollow part of the base plate to ensure that the image sensing chip can be totally placed in the base plate; the welding pad of the chip and the welding pad on the base plate are connected through wires; the support is of a frame structure; the lower surface of the support is connected with the upper surface of the base plate; stepped grooves are arranged on the upper surface of the support; and the light transmission layer is a piece of light transmission glass which is connected in the grooves of the support by utilizing glue. The invention also discloses a packaging method of the image sensing chip with the ultrathin packaging structure. The ultrathin packaging structure of the image sensing chip can be applied to ultrathin electronic products.

A method and computer product program for determining Young's modulus. The method includes placing a probe in contact with a surface of a material on a substrate and, with an initial force of 800 nano newtons or less; determining the location of the surface relative to an initial indentation depth for the initial force; increasing the force on the probe from the initial force to a maximum force greater than the initial force to generate a load curve; decreasing the force on the probe from the maximum force to the initial force to generate an unload curve, the maximum force selected such that the unload curve is independent of the presence of the substrate; and using the unload curve, determining a relationship between (i) the reduced modulus of the sample material and (ii) the ratio of probe penetration depth and the thickness of the layer.

The invention relates to an ETS-10 titanium silicalite molecular sieve modification method. The ETS-10 titanium silicalite molecular sieve modification method provided by the invention comprises the following steps: alkali treatment modification: carrying out alkali treatment modification of EST-10 titanium silicalite molecular sieve raw powder through adopting an alkaline solution, filtering, washing, and drying to obtain alkali treatment modified ETS-10 titanium silicalite molecular sieve; and realuminated modification treatment: carrying out realuminated modification treatment of the alkali treatment modified ETS-10 titanium silicalite molecular sieve through adopting an aluminum salt solution or an aluminate solution, filtering, washing, drying, and roasting to obtain the alkali treatment modification and realuminated modification treated ETS-10 titanium silicalite molecular sieve. The modification method provided by the invention adopts the alkali treatment modification and the realuminated modification treatment of the EST-10 titanium silicalite molecular sieve raw powder to be carried out, so the surface phase of the EST-10 titanium silicalite molecular sieve is rich in titanium and aluminum, abundant meso-structures are introduced, and the skeletal acidity is improved.

The invention relates to a wedged connecting rod bushing press fitting positioning mechanism, comprising a large-head positioning mechanism, a small-head positioning mechanism and a bushing press fitting positioning mechanism all arranged on the top of a worktable; the bushing press fitting positioning mechanism adopts a mandrel with a split structure for press fitting; a wedged bushing is mounted on the mandrel; a circumferential phase angle between the wedged inclined surface of a pressing sleeve and a positioning steel ball subjected to fine adjustment through a fastening screw; the wedge surface phase angle of the wedged bushing is adjusted through a hold-down screw; and the connecting rod bushing is press-fitted into a hole formed at the small head of the wedged connecting rod positioned by the large-head positioning mechanism and the small-head positioning mechanism. The wedged connecting rod bushing press fitting positioning mechanism is convenient for press fitting and accurate in positioning.

The invention provides a chip encapsulation structure and a circuit structure. The chip encapsulation structure comprises at least two chips, a connection part, multiple second welding balls and a substrate; the active surface of each chip in the at least two chips is positioned in the same plane; the active surface of each chip comprises a first area and a second area; multiple first bonding pads are arranged in the first area; at least one second bonding pad is arranged in the second area; the at least two chips comprise a first chip and a second chip, which are adjacent; multiple first metal wires are distributed in the connection part; both two ends of each first metal wire are exposed on the first surface of the connection part; one end of each first metal wire is connected with one first bonding pad of the first chip; the other end of each first metal wire is connected with one first bonding pad of the second chip; each second bonding pad of the first chip and the second chip is connected with the upper surface of the substrate through a second welding ball; and the upper surface of the substrate is towards the active surface of the chip. By means of the chip encapsulation structure and the circuit structure provided by the invention, the chip encapsulation efficiency is increased.

The invention relates to one kind of chip encapsulation structure, which includes a first chip, a circuit substrate and a two-stage thermosetting adhesive layer. The first chip has a first super-surface, a first side and a first undersurface; the circuit substrate has a super-surface and an undersurface, and it links with the first chip by the electric properties. In addition, the two-stage thermosetting adhesive layer lies on the substrate, and the layer has the first and the second adhesive surface, the partial first adhesive surface bonds with the first undersurface, and the second adhesive surface links with the super-surface of the substrate, making the first chip adhesion to the super-surface of the substrate. The first adhesive surface roughly parallels with second adhesive surface, and the two-stage thermosetting adhesive layer has the edge which diminishes its thickness gradually.

A protective device for a mobile terminal includes a glass window and a glass case housed in the mobile terminal and formed with glass of a three-dimensional curved surface form having a circumferential edge lower than the center, the protective device includes: a first peripheral protection portion housed along a circumferential edge of the glass window and in which a tangent line in which a portion thereof contacts with a surface of the glass window forms an angle of 0 DEG or more with a horizontal line; and a second peripheral protection portion housed along a circumferential edge of the glass case and in which a tangent line in which a portion thereof contacts with a surface of the glass case forms an angle of 0 DEG or more with a horizontal line.

The invention relates to a multi-beam spherical surface phased array antenna tracking target vertex passing method, and the tracking vertex passing method is simple, reliable and small in hardware resource consumption; the method comprises the following steps: rotating an original coordinate system in a following mode according to the vertex passing information forecasted by a target track or thedynamic information of the captured target, and building a new coordinate system; using the z shaft of the original coordinate system of the multi-beam spherical surface phased array antenna as the center in the rotation of the original coordinate system, rotating the coordinate system according to the beam pointing orientation direction P1, using the azimuth of the tracking target vertex passingas zero degree, and using the y shaft as the center to rotate and track the target pitch angle to the x shaft, wherein the x shaft points to the passing vertex. The method can obviously reduce the dynamic variations of the azimuth and pitch angle when the target passing the vertex, thus stably tracking the target.

Disclosed is an image sensor with a 3D stack structure, in which pixels of a top plate are realized as image pixels and pixels of a bottom plate are realized as pixels for realizing a phase difference AF, so that the phase difference AF is realized without loss of resolution. In the image sensor with a 3D stack structure, a problem of the reduction of resolution, which is a disadvantage of an existing imaging surface phase difference AF device, is solved, so that a fast phase difference AF is realized while maintaining high resolution without a separate phase difference AF module.

The invention provides a method for fast recovering a surface phase of a high-light object based on the least square method. The method is different from an original method that valid gray values and invalid gray values in N optical grating pictures are directly substituted into a standard N-step phase shifting formula to solve the phase. The method comprises the steps that firstly, invalid pixel points and invalid gray values are removed, valid gray values of valid pixel points are directly used, a linear equation set is established according to the valid gray values, the optimal solution of the equation set is solved based on the least square method, the high-precision phase value is solved according to the optimal solution, and the phase value of the surface of the high-light object can be fast recovered. The method is simple in step, high in robustness and good in random error rejection capability, extra hardware facilities are not needed, the diaphragm and exposure time of a CCD camera do not need to be adjusted, the surface of the high-light object does not need to be processed, time is saved, the operation is fast, the measuring precision of the surface of the high-light object can be guaranteed, and the measuring accuracy is high.

The invention discloses a safety authentication method based on phase retrieval and sparse double random phase encryption. The method comprises the following two steps: firstly, encrypting, namely encrypting an image to be encrypted into an amplitude image by a Fresnel domain double random phase encryption system, obtaining approximate distribution of output surface phases through a phase retrieval algorithm, and at last generating a sparse double random phase encryption image through a method for randomly extracting elements; secondly, decrypting and authenticating, namely decrypting the sparse double random phase encryption image at first and then comparing the decrypted image with an original image for authentication. The method disclosed by the invention has the advantages of simple encryption light path, good original information security and simple and reliable authentication process.

A phase leg for a three-level power converter includes a heat sink device that includes a first surface and a second surface opposite the first surface. The phase leg also includes a first portion including at least one semiconductor switching device coupled to the first surface. The phase leg further includes a second portion including at least one semiconductor switching device coupled to the second surface.

The invention provides a self-correcting method for a spherical surface phased-array antenna near-field channel calibration link. The self-correcting method can consume few hardware resources and automatically operate the calibration link. According to the technical scheme, the method comprises the steps that before amplitude/phase characteristic calibration is performed on all channels of an array antenna, according to the spherical surface array antenna top calibration antenna concentrated characteristics, a fixed antenna element is selected for performing calibration, the relative amplitudeand phase characteristics of the antenna top calibration link are calibrated, antenna top calibration antennas are made to correspond to calibration rods distributed in the periphery respectively, the same antenna channel on the spherical surface array antenna is adopted, and the amplitude/phase difference between the two adjacent calibration antenna channels is calibrated; then, the differentialtransmission self-correcting mode is adopted from the top of the antenna to different directions, and the relative amplitude/phase characteristics of the two calibration links are obtained; an antenna element channel fixed to the spherical surface array antenna is used for performing amplitude/phase correction reversely, and the relative amplitude/phase characteristics of each calibration link are obtained.

The invention provides a seal which comprises a seal body, a seal face and a handle. One end of the seal body is connected with the handle. The other end of the seal body is connected with the upper surface of the seal face. The seal is characterized by further comprising an intelligent chip and a trigger mechanism. The intelligent chip is used for recording the seal using time and uploading the seal using time to a special database. The trigger mechanism is electrically connected with the intelligent chip and is capable of triggering the intelligent chip to record and upload the seal using time. When the authenticity of a stamp needs distinguishing, the sealing time record can be retrieved from the special database for comparison with the time of the stamp. Consequently, true and false distinguishing is achieved, the risk that the seal is counterfeited is effectively avoided, and safety of using the seal is greatly improved.

The invention discloses a digital hologram-based high-precision spherical surface sub-aperture splicing fusion method. The method of the invention is based on digital holographic technology and sub-aperture splicing technology; a spherical surface sub-aperture hologram measured through adopting the digital holographic technology is subjected to digital reproduction, so that sub-aperture phase diagrams can be obtained, and the sub-aperture phase diagrams are subjected to splicing fusion, and therefore a full-field-of-view spherical surface phase diagram can be obtained; and digital reproduction calculation is performed on the obtained sub-aperture hologram data based on an off-axis holographic optical path. The method specifically includes the following steps that: image apodization, frequency-domain filtering, aberration compensation and digital focusing reproduction are performed sequentially; and the splicing fusion of the sub-aperture phase diagrams is completed through adopting a sub-aperture splicing algorithm, and sub-aperture relative position errors are further corrected through iterative calculation, so that the phase diagram of a complete spherical surface can be obtained. The digital hologram-based high-precision spherical surface sub-aperture splicing fusion method of the invention has the advantages of fully-digitized data processing process, high precision, simple operation, high reliability and the like, and can detect data processing of a spherical surface based on the digital holographic technology.

The invention discloses a surface bonding typed polymeric PTC thermo-sensitive resistor, and a fabrication method of the thermo-sensitive resistor. The thermo-sensitive resistor comprises a first extraction electrode, a second extraction electrode and a polymeric PTC chip; the lower surface of the first extraction electrode is connected with the upper surface of the polymeric PTC chip; the upper surface of the first extraction electrode is a first extraction terminal; the second extraction electrode is connected with the lower surface of the polymeric PTC chip; the thermo-sensitive resistor is characterized in that an encapsulating layer is also included; the encapsulating layer is covered on other surfaces of the polymeric PTC chip which are not contacted with the extraction electrode. The polymeric PTC chip is completely sealed inside an element by the thermo-sensitive resistor, thus achieving the aim that the polymeric PTC material is completely isolated from the air, and improving the weatherability of the surface bonding typed polymeric PTC thermo-sensitive resistor.

The invention provides an external surface modification method of a microporous molecular sieve, which comprises the following steps: mixing silicasol and a microporous molecular sieve, carrying out liquid deposition to initiate physical adsorption between the molecular sieve and the silicasol, filtering, drying and roasting to prepare the external-surface-modified microporous molecular sieve. In the invention, colloidal particles of the silicasol are larger than pores of the selected molecular sieve, thereby preventing the colloidal particles from entering the inside of the pores; and when the silicasol particles are adsorbed onto the external surface of the molecular sieve, drying and roasting are utilized to remove water in the colloidal particles, so that the colloidal particles are firmly attached onto the external surface of the molecular sieve. The XPS (X-ray photoelectron spectroscopy) measurement indicates that the modified molecular sieve has obviously higher surface phase silica-alumina ratio than the un-modified molecular sieve. The improved Hammett tracer method measurement on the acid quantity of the external surface of the molecular sieve before and after modification proves that the modified molecular sieve has lower acid quantity on the external surface.