The invention provides a low-stress double-sided
cooling power module and a manufacturing method thereof, the low-stress double-sided
cooling power module comprises a first
copper-clad
ceramic substrate and a second
copper-clad
ceramic substrate which are oppositely arranged, the first
copper-clad
ceramic substrate is provided with at least two power chips, and two sides of each power
chip are provided with C-shaped auxiliary support column connecting
layers; and the lower surface of the second copper-clad
ceramic substrate is provided with an inverted
metal buffer
cushion block which is arranged opposite to each power
chip. The inverted
metal buffer
cushion block comprises a connecting frame with a groove, an auxiliary supporting column connected with the connecting frame is arranged at the position, corresponding to the auxiliary supporting column connecting layer, of the connecting frame, a protruding quadrangular
frustum pyramid heat conduction structure is arranged in the groove of the connecting frame, and the bottom of the inverted quadrangular
frustum pyramid heat conduction structure is connected with a power
chip. The inverted
metal cushion block constructs an optimized heat conduction path for the
power module, so that heat generated in the working process of the chip can be efficiently conducted to an external heat dissipation environment through the metal cushion block, and the
junction temperature of the chip is effectively reduced.