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5389results about "Conversion constructional details" patented technology

Flying apparatus

Provided is a flying apparatus capable of effectively cooling a constituent device. A flying apparatus 10 comprises: an airframe base 14; a power supply unit; an arm 11 which extends from the airframe base 14 toward a periphery; a rotor 12 which is disposed on an end portion side of the arm 11; a motor 17 which rotationally drives the rotor 12; and a power converting unit 19 which converts electric power supplied from the power supply unit to the motor 17. The power converting unit 19 is included inside the arm 11 below a rotation range 24 of the rotor 12.
Owner:ISHIKAWA ENERGY RES CO LTD

Electrical power system

An electrical system with selectable output voltage is disclosed. An example system includes a first set of energy storage modules, a second set of energy storage modules, a choke connected to the first set of energy storage modules and the second set of energy storage modules, and a switch configured to switch between a first state and a second state. Upon switching the switch to the first state, the first set of energy storage modules are connected in parallel with the second set of energy storage modules to provide a first voltage to at least one output. Upon switching the switch to the second state, the first set of energy storage modules are connected in series with the second set of energy storage modules to provide a second voltage to the at least one output.
Owner:INSTAGRID GMBH

Inverter, and, photovoltaic and energy storage system

The application discloses an inverter and a photovoltaic and energy storage system. The inverter includes a first cabinet configured for being fixed on a mounting surface and a second cabinet configured for being fixed on the mounting surface, where the first cabinet is provided with a first connection terminal, the second cabinet is provided with a second connection terminal, the first connection terminal and the second connection terminal are configured for plugging along a direction that the first cabinet moves to the mounting surface, and the first connection terminal and the second connection terminal are plugged with each other when the first cabinet is located on the mounting surface. The inverter described above simplifies assembly of the first cabinet and the second cabinet, thereby simplifying mounting of the inverter.
Owner:SUNGROW (SHANGHAI) CO LTD

Systems, methods, and mechanical designs for inverters for eVTOL aircraft

An electrical propulsion system for a vertical take-off and landing (VTOL) aircraft comprises an electrical motor assembly and an inverter assembly. The inverter assembly comprises a housing, a capacitor assembly, at least one printed circuit board assembly (PCBA), and a plurality of positioning pins. The capacitor assembly comprises a center hole, at least one capacitor, a capacitor housing having at least one busbar, and a plurality of through holes in the capacitor housing. The capacitor assembly and the at least one PCBA are positioned inside the housing. The plurality of positioning pins pass through the through the plurality of through holes of the capacitor housing and the at least one PCBA and are connected to the housing.
Owner:ARCHER AVIATION INC

Semiconductor device

A semiconductor device includes semiconductor elements and conductors. The conductors include a first upper conductor connected to an upper electrode of the first semiconductor element through a first upper solder, a first lower conductor connected to a lower electrode of the first semiconductor element through a first lower solder, a second upper conductor connected to an upper electrode of the second semiconductor element through a second upper solder, a second lower conductor connected to a lower electrode of the second semiconductor element through a second lower solder, and a joint conductor connecting the first upper conductor and the second lower conductor through a relay solder. Each solder contains Cu and Sn. Each solder connection target has an Ni layer. A grain size of at least one of the first upper solder, second upper solder, or relay solder is smaller than a grain size of the first and second lower solders.
Owner:DENSO CORP

Method and apparatus for detecting insulation impedance of direct current side of photovoltaic inverter

The present application discloses a method and apparatus for detecting insulation impedance of a direct current side of a photovoltaic inverter. The method includes the following steps: sampling a voltage of a protective earthing and a voltage of the positive terminal of a direct current bus respectively; obtaining a first voltage difference between voltages of the protective earthing at different moments and a second voltage difference between voltages of the positive terminal of the direct current bus at different moments; and calculating the insulation impedance of the direct current side of the photovoltaic inverter based on the first voltage difference, the second voltage difference, a resistance of an equivalent resistor between each terminal of the photovoltaic inverter and a signal ground, and resistances of equivalent resistors between the positive terminal and the negative terminal of the direct current bus and the protective earthing.
Owner:HOYMILES POWER ELECTRONICS INC

Energy storage converter

The invention relates to the technical field of energy storage, and provides an energy storage converter which is at least beneficial to improving the heat dissipation efficiency of the energy storage converter. The energy storage converter comprises a box body, a partition plate, a radiator and a fan assembly, and the first partition plate divides a high-voltage area of the box body into an upper-layer high-voltage area and a lower-layer high-voltage area which are arranged up and down; the second partition plate and the third partition plate divide the low-voltage area of the box body into an upper-layer low-voltage area, a middle-layer low-voltage area and a lower-layer low-voltage area which are sequentially arranged from top to bottom; the radiator is located between the lower-layer low-voltage area and the lower-layer high-voltage The fan assembly is located in the lower-layer high-voltage area. Cooling air passes through the radiator from the air inlet to the lower-layer low-pressure area through the fan assembly and then is exhausted from the air outlet, so that a first air flow channel is formed; a plurality of ventilation holes are formed in the side, close to the radiator, of the first partition plate, and cooling air flows to the middle-layer low-pressure area from the air inlet through the fan assembly and the ventilation holes to form a second air flow channel; the air flow rate of the first air flow channel is larger than that of the second air flow channel.
Owner:ZHEJIANG JINKO ENERGY STORAGE CO LTD

High-frequency high-power packaging module and mixed substrate

The invention discloses a high-frequency high-power packaging module which comprises at least three semiconductor power devices and a driver. The semiconductor power devices are arranged on the same plane; the driver provides a driving signal for each semiconductor power device, and the projection of the driver on the plane partially coincides with the projection of each semiconductor power device on the plane. On the other hand, the invention discloses a mixed substrate which comprises a high-heat-conduction area and a low-heat-conduction area. The high heat conduction area and the low heat conduction area are arranged in the horizontal direction. The heat conductivity coefficient of the high-heat-conductivity area is larger than that of the low-heat-conductivity area. According to the invention, the heat dissipation capability is guaranteed, the loop inductance is greatly reduced, high power and high frequency are realized, the advantages of a third-generation semiconductor are fully played, and an application basis is provided for the upgrading of the performance of the third-generation semiconductor.
Owner:SHANGHAI METAPWR ELECTRONICS CO LTD

Power converter and detection method for terminal status

Example power converters and detection methods are described. One example power converter includes a control device, a plurality of wiring terminals, a power conversion circuit, and a plurality of temperature detection devices. The control device is configured to: when an absolute value of a difference between a temperature value of one wiring terminal in the plurality of wiring terminals and a first reference temperature value is greater than or equal to a first temperature difference threshold, output a signal indicating that an abnormality occurs in the plurality of wiring terminals. In this application, a relative change of a temperature of one wiring terminal relative to another wiring terminal can be directly determined based on temperature values of the plurality of wiring terminals, thereby quickly determining, based on a magnitude of the relative change, whether there is an abnormal temperature rise caused by loose connections in the plurality of wiring terminals.
Owner:HUAWEI DIGITAL POWER TECH CO LTD

Inverter, motor controller and vehicle

The embodiment of the invention provides an inverter, a motor controller and a vehicle, and the inverter comprises an integrated drive control board which comprises a drive part and a control part which are disposed on the same circuit board; the onboard current sensor is used for detecting direct current and converting the direct current into three-phase alternating current; the integrated liquid cooling heat dissipation capacitor comprises a high-voltage film capacitor and a liquid cooling heat dissipation device, and at least part of the high-voltage film capacitor is in contact with the liquid cooling heat dissipation device. At least part of the power semiconductor device is in contact with the liquid cooling radiator, the high-voltage film capacitor is connected with a positive electrode and a negative electrode of an upper bridge of the power semiconductor device through a positive electrode switching copper bar and a negative electrode switching copper bar respectively, and a lower bridge of the power semiconductor device is connected with the three-phase copper bar. The integrated liquid cooling heat dissipation capacitor and the liquid cooling heat dissipation device are arranged to dissipate heat of the power semiconductor device and the high-voltage thin film capacitor, and the high-voltage thin film capacitor and the power semiconductor device can be dissipated at the same time through one liquid cooling heat dissipation device.
Owner:ZINSIGHT TECH (SHANGHAI) CO LTD

Power conversion device

A power conversion device includes a power conversion unit and a control unit. The power conversion unit includes a first semiconductor module. The first semiconductor module includes a plurality of power semiconductor elements. Some of the plurality of power semiconductor elements are detection target elements. The power conversion unit further includes a temperature sensor and a voltage sensor. The temperature sensor detects a surface temperature of the detection target element as a sensor position temperature. The voltage sensor detects an inter-terminal voltage of the detection target element. The control unit calculates a loss in the detection target element based on the sensor position temperature and the inter-terminal voltage, and estimates a maximum temperature based on the calculated loss.
Owner:MITSUBISHI ELECTRIC CORP

Electrical power system

An electrical system with selectable output voltage is disclosed. An example system includes a first set of energy storage modules, a second set of energy storage modules, a choke connected to the first set of energy storage modules and the second set of energy storage modules, and a switch configured to switch between a first state and a second state. Upon switching the switch to the first state, the first set of energy storage modules are connected in parallel with the second set of energy storage modules to provide a first voltage to at least one output. Upon switching the switch to the second state, the first set of energy storage modules are connected in series with the second set of energy storage modules to provide a second voltage to the at least one output.
Owner:INSTAGRID GMBH

Power conversion device

The power conversion device provided by the invention comprises a direct current end, a positive direct current bus, a negative direct current bus, a positive bus capacitor, a negative bus capacitor, at least three inverter bridge arms, a switch unit, a controller, filter inductors corresponding to the at least three inverter bridge arms one by one, a filter capacitor and an alternating current end. And the third end of each inverter bridge arm sequentially passes through the filter inductor, the filter capacitor and the switch unit corresponding to each inverter bridge arm and then is connected with the midpoint of the bus. The controller controls the switch unit to be switched off or the impedance of the switch unit to be increased when the voltage of the power grid is smaller than or equal to a first voltage threshold value; and after the switch unit is switched off or the impedance of the switch unit is increased, the modulation wave of each inverter bridge arm is controlled to be the modulation wave after the first common-mode modulation signal is superposed on the initial modulation wave of each inverter bridge arm, so that the amplitude of the modulation wave of each inverter bridge arm is increased. Furthermore, not only can the loss of the switching tube in each inverter bridge arm be balanced, but also the problem of common-mode oscillation caused by modulation wave change can be improved.
Owner:HUAWEI TECH CO LTD

Power module, power supply system, vehicle, and photovoltaic system

A power module includes a first metal layer-coated substrate, a plurality of chips, and a first connection piece. A first electrode of each chip is electrically connected to a first metal layer of the first metal layer-coated substrate. The first connection piece includes a first main body part and a plurality of first contact parts. A second electrode of each of the plurality of chips is in contact with at least one of the first contact parts. A part of the first main body part is between at least one pair of adjacent first contact parts. A current flowing out from the chip directly flows to the first main body part through the first contact part. The chips are connected in parallel by using the first connection piece.
Owner:HUAWEI DIGITAL POWER TECH CO LTD

Systems and methods for lower commutation loop inductance bulk capacitor

A bulk capacitor assembly for an inverter includes a stacked busbar, the stacked busbar including a first direct current (DC) busbar and a second DC busbar; one or more first capacitors on a first side of the stacked busbar, the one or more first capacitors electrically connected to the first DC busbar and the second DC busbar; and one or more second capacitors on a second side of the stacked busbar, the first side being opposite to the second side, the one or more second capacitors electrically connected to the first DC busbar and the second DC busbar.
Owner:BORGWARNER US TECHNOLOGIES LLC

Fuse group assembly for a power converter assembly

A fuse group assembly may include a first bus bar, a second bus bar in a stepped arrangement with the first bus bar, a first support plate arranged on the second bus bar, a second support plate in a stepped arrangement with the first support plate, a first fuse having a first end electrically connected to the first bus bar and a second end supported by the first support plate, and a second fuse having a first end electrically connected to the second bus bar and a second end supported by the second support plate.
Owner:CATERPILLAR INC

Power conversion device

A power conversion device includes a first electronic component group including a plurality of electronic components and a second electronic component group including a plurality of electronic components each having a shorter maintenance cycle than each of the plurality of electronic components included in the first electronic component group. The first electronic component group and the second electronic component group are accommodated in a housing. At least one of the plurality of electronic components included in the second electronic component group is located adjacent to an opening in the housing.
Owner:MITSUBISHI ELECTRIC CORP

Systems, devices, and methods for integrated voltage regulators

Disclosed embodiments may include systems, devices and methods for fabricating high-density charge-storage devices and power conversion devices. In one embodiment, a device is disclosed, comprising an inductor. The inductor includes a first inductor surface and a second inductor surface opposite the first inductor surface. The inductor further includes a first inductor substrate including a cavity. A seed layer is formed on a bottom surface of the cavity, and a magnetic layer is formed on the seed layer. The magnetic layer includes a plurality of stacked magnetic layers separated from each other by an insulating material layer.
Owner:MURATA MFG CO LTD

Integral photovoltaic energy storage assembly

The invention relates to an integral type photovoltaic energy storage assembly, belongs to the field of solar photovoltaic power generation, and aims to solve the problems that an existing photovoltaic energy storage product is complex in structure and installation, high in cost, low in efficiency and high in safety risk. The integrated photovoltaic energy storage assembly comprises a solar cell panel, an alternating current and direct current multidirectional conversion device and an energy storage battery. The AC-DC multidirectional conversion device and the energy storage battery are installed on the back surface of the solar cell panel, and the extension height does not exceed the back side end surface of the frame of the solar cell panel. The alternating current and direct current multidirectional conversion device comprises three groups of connecting ends, a plurality of voltage converters, a plurality of switch elements and a control chip, the three groups of connecting ends are electrically connected to a solar cell panel, an energy storage battery and an alternating current power grid respectively, and the control chip is configured to selectively switch on at least one switch element in different working modes of the integral photovoltaic energy storage assembly so as to control the three groups of connecting ends. A voltage conversion path is established between the respective two sets of connection terminals by means of at least one voltage converter.
Owner:HANGZHOU INVCELL NEW ENERGY TECHNOLOGY CO LTD

Low-stress double-sided cooling power module and manufacturing method

The invention provides a low-stress double-sided cooling power module and a manufacturing method thereof, the low-stress double-sided cooling power module comprises a first copper-clad ceramic substrate and a second copper-clad ceramic substrate which are oppositely arranged, the first copper-clad ceramic substrate is provided with at least two power chips, and two sides of each power chip are provided with C-shaped auxiliary support column connecting layers; and the lower surface of the second copper-clad ceramic substrate is provided with an inverted metal buffer cushion block which is arranged opposite to each power chip. The inverted metal buffer cushion block comprises a connecting frame with a groove, an auxiliary supporting column connected with the connecting frame is arranged at the position, corresponding to the auxiliary supporting column connecting layer, of the connecting frame, a protruding quadrangular frustum pyramid heat conduction structure is arranged in the groove of the connecting frame, and the bottom of the inverted quadrangular frustum pyramid heat conduction structure is connected with a power chip. The inverted metal cushion block constructs an optimized heat conduction path for the power module, so that heat generated in the working process of the chip can be efficiently conducted to an external heat dissipation environment through the metal cushion block, and the junction temperature of the chip is effectively reduced.
Owner:PN JUNCTION SEMICON (HANGZHOU) CO LTD

Photovoltaic inverter

The invention provides a photovoltaic inverter. The photovoltaic inverter comprises a shell, a circuit board and a power conversion circuit, wherein the circuit board and the power conversion circuit are located in the shell. The shell comprises a first containing cavity, a second containing cavity, a third containing cavity and a fourth containing cavity. The power conversion circuit comprises a first inductor, a bus capacitor and a second inductor which are sequentially connected in series. The bus capacitor is located in the third accommodating cavity. The first inductor and the second inductor are located in the fourth containing cavity. A terminal panel of the housing is provided with a DC input terminal and an AC output terminal. The DC input terminal extends into the first accommodating cavity and is electrically connected with the first inductor, and the AC output terminal extends into the second accommodating cavity and is electrically connected with the second inductor. When the photovoltaic inverter works, current sequentially passes through the direct-current input terminal, the first inductor, the bus capacitor, the second inductor and the alternating-current output terminal, so that the current forms an approximate C-shaped flowing path in the shell, electromagnetic interference between modules is reduced, and the electromagnetic compatibility and the working efficiency of the photovoltaic inverter with the inverted buckling type structure are improved.
Owner:HUAWEI DIGITAL POWER TECH CO LTD

Half-bridge switch arrangement

The invention relates to a half-bridge switch arrangement with a plurality of parallel-connected half-bridges, each half-bridge comprising a first semiconductor switching element and a second semiconductor switching element, comprising: a plurality of half-bridge units (100), each half-bridge unit comprising one of the first semiconductor switching elements (110), one of the second semiconductor switching elements (120), and a support element, wherein the respective first semiconductor switching element (110) and the respective second semiconductor switching element (120) are arranged on the respective support element, a heat sink (180), wherein the plurality of half-bridge units (100) are in thermal contact with the heat sink (180), a first busbar to which a first terminal of each of the first semiconductor switching elements (110) of the plurality of half-bridge units (100) is electrically connected, a second busbar,a third busbar, to which a second terminal of each of the first semiconductor switching elements (110) of the plurality of half-bridge units (100) and a first terminal of each of the second semiconductor switching elements (120) of the plurality of half-bridge units (100) are electrically connected, a third busbar, to which a second terminal of each of the second semiconductor switching elements (20) of the plurality of half-bridge units (100) is electrically connected.
Owner:SEG AUTOMOTIVE GERMANY GMBH

Semiconductor device

An object is to provide a technique that suppresses heat generation in a first semiconductor switching element and a second semiconductor switching element. A semiconductor device includes a gate drive circuit that drives each of the first semiconductor switching element and the second semiconductor switching element based on an input signal. When a first gate voltage applied to the first gate to turn On the first semiconductor switching element is lower than a first threshold, the gate drive circuit turns Off the first semiconductor switching element after turns Off the second semiconductor switching element regardless of the input signal.
Owner:MITSUBISHI ELECTRIC CORP

Power module and manufacturing method therefor

A power module includes a first substrate, a second substrate, a first heat sink, a second heat sink, and a chip that are disposed opposite to each other. The chip is disposed between the first heat sink and the second heat sink that are disposed opposite to each other. The first heat sink and the second heat sink are connected to the chip through sintering or welding. The first substrate and the second substrate are respectively connected to the first heat sink and the second heat sink through welding or sintering.
Owner:HUAWEI DIGITAL POWER TECH CO LTD

High-frequency high-power packaging module, manufacturing method for module, and hybrid substrate

A high-frequency high-power packaging module comprises at least one power conversion bridge arm, at least one high-frequency capacitor, a circuit layer, an insulating heat-conducting plate, and a plastic package body. The front surface of the semiconductor power device is electrically connected with the first surface of the circuit layer, and the back surface of the semiconductor power device is thermally connected with or electrically connected with the lower surface of the insulating heat-conducting plate. The high-frequency capacitor is electrically connected with the first surface of the circuit layer or the second surface of the circuit layer or the lower surface of the insulating heat-conducting plate, and at least one electrode of the high-frequency capacitor is electrically connected with at least one electrode of the at least one semiconductor power device through the inner-layer electric connection layer.
Owner:SHANGHAI METAPWR ELECTRONICS CO LTD

Extraction type structure of charging pile rectification module

The charging pile rectification module extraction type structure comprises a charging pile body and a rectification module, the charging pile body is provided with an inner cavity and a first opening located in the outer side wall, a vertically-arranged middle partition plate is arranged in the inner cavity, and the inner cavity is divided into a rectification chamber and a maintenance chamber through the middle partition plate; the first opening communicates with the rectifying chamber, and the opening direction of the first opening is the same as the length direction of the charging pile body; and at least two bins arranged at intervals in the height direction of the charging pile body are arranged in the rectification chamber. According to the extraction type structure of the charging pile rectifier module designed by the invention, a plurality of independent bins are separated by arranging a plurality of standardized partition plate units, so that the manufacturing cost is reduced, and rapid plugging and maintenance of the rectifier module are realized, and each rectifier module can independently slide in or out from the outside of the charging pile; parameter setting is directly carried out at the rear end, and convenience and rapidness are achieved.
Owner:SOYEA TECH

Power semiconductor array with direct power semiconductor cooling

The present invention relates to a power semiconductor arrangement (18) for a traction converter (12), comprising: a first power semiconductor (22a) and a second power semiconductor (22b); a cooling channel (26) for guiding a cooling fluid to the first power semiconductor and from the first power semiconductor to the second power semiconductor, wherein the first power semiconductor and the second power semiconductor are arranged at least partially within the cooling channel in direct contact with the cooling fluid; and a transfer unit (28) for transferring a first partial flow (30a) of the cooling fluid from a first cross-sectional area (32a) of the cooling channel to a second cross-sectional area (32b) of the cooling channel, wherein the transfer unit is arranged within the cooling channel between the first power semiconductor and the second power semiconductor.The invention further relates to a traction converter (12) for a vehicle (10), comprising: a power semiconductor arrangement (18) according to one of the preceding claims; and a cooling fluid source for supplying the cooling channel (16).
Owner:ZF FRIEDRICHSHAFEN AG

Photovoltaic inverter for solar photovoltaic module

The invention provides a photovoltaic inverter for a solar photovoltaic module, and belongs to the field of photovoltaic inverters. Comprising a shell, a mounting seat is fixedly connected to the inner surface of the shell, a power module and a control module are fixedly connected to the outer surface of the mounting seat, ventilation grooves are symmetrically formed in the outer surface of the shell, and a dehumidification assembly is arranged on the inner side of the shell and comprises a partition plate fixedly connected with the lower end of the inner surface of the shell; a supporting plate is fixedly connected to the outer surface of the partition plate, a notch is formed in the outer surface of the upper end of the supporting plate, and a baffle is fixedly connected to the inner surface of the shell. Through the arrangement of the moisture removal assembly, air can be in full contact with the moisture absorption plate after entering the shell, moisture in the air can be effectively absorbed, the probability that condensation is formed in the inverter is reduced, the stability and safety of the inverter in the working process can be improved, and meanwhile the service life of the inverter can be effectively prolonged.
Owner:DATANG HUAIBEI POWER PLANT

Energy self-balancing flexible direct-current converter valve, control method, and direct-current system

An energy self-balancing flexible direct-current converter valve, a control method, and a direct-current system, which relate to the technical field of power transmission and distribution networks. The converter valve comprises three phase units, and each phase unit comprises an upper leg and a lower leg. The upper legs and the lower legs each comprise a plurality of full-bridge energy self-balancing submodules and a plurality of half-bridge energy self-balancing submodules. Each of the full / half-bridge energy self-balancing submodules is an optimized MMC submodule comprising an energy self-balancing circuit. The energy self-balancing circuit is composed of a power electronic switch and an energy dissipation resistor connected in series, and is used for dissipating surplus energy when an overvoltage early warning occurs for the capacitor voltage of the submodule. The present application, without affecting the operational logic of conventional converter valves and at low costs, can solve the technical problem of surplus power not being dissipated promptly due to faults occurring in a direct-current power transmission system in a new energy islanded ultra-long-distance direct-current delivery scenario. Meanwhile, temporary energy stored in the capacitors of the optimized MMC submodules can be fully utilized, reducing the waste generated by surplus power dissipated as heat.
Owner:ELECTRIC POWER RES INST CHINA SOUTHERN POWER GRID CO LTD