4169results about "Conversion constructional details" patented technology

Provided is a flying apparatus capable of effectively cooling a constituent device. A flying apparatus 10 comprises: an airframe base 14; a power supply unit; an arm 11 which extends from the airframe base 14 toward a periphery; a rotor 12 which is disposed on an end portion side of the arm 11; a motor 17 which rotationally drives the rotor 12; and a power converting unit 19 which converts electric power supplied from the power supply unit to the motor 17. The power converting unit 19 is included inside the arm 11 below a rotation range 24 of the rotor 12.

An electrical system with selectable output voltage is disclosed. An example system includes a first set of energy storage modules, a second set of energy storage modules, a choke connected to the first set of energy storage modules and the second set of energy storage modules, and a switch configured to switch between a first state and a second state. Upon switching the switch to the first state, the first set of energy storage modules are connected in parallel with the second set of energy storage modules to provide a first voltage to at least one output. Upon switching the switch to the second state, the first set of energy storage modules are connected in series with the second set of energy storage modules to provide a second voltage to the at least one output.

A semiconductor device includes semiconductor elements and conductors. The conductors include a first upper conductor connected to an upper electrode of the first semiconductor element through a first upper solder, a first lower conductor connected to a lower electrode of the first semiconductor element through a first lower solder, a second upper conductor connected to an upper electrode of the second semiconductor element through a second upper solder, a second lower conductor connected to a lower electrode of the second semiconductor element through a second lower solder, and a joint conductor connecting the first upper conductor and the second lower conductor through a relay solder. Each solder contains Cu and Sn. Each solder connection target has an Ni layer. A grain size of at least one of the first upper solder, second upper solder, or relay solder is smaller than a grain size of the first and second lower solders.

A power conversion device includes a power conversion unit and a control unit. The power conversion unit includes a first semiconductor module. The first semiconductor module includes a plurality of power semiconductor elements. Some of the plurality of power semiconductor elements are detection target elements. The power conversion unit further includes a temperature sensor and a voltage sensor. The temperature sensor detects a surface temperature of the detection target element as a sensor position temperature. The voltage sensor detects an inter-terminal voltage of the detection target element. The control unit calculates a loss in the detection target element based on the sensor position temperature and the inter-terminal voltage, and estimates a maximum temperature based on the calculated loss.

An electrical system with selectable output voltage is disclosed. An example system includes a first set of energy storage modules, a second set of energy storage modules, a choke connected to the first set of energy storage modules and the second set of energy storage modules, and a switch configured to switch between a first state and a second state. Upon switching the switch to the first state, the first set of energy storage modules are connected in parallel with the second set of energy storage modules to provide a first voltage to at least one output. Upon switching the switch to the second state, the first set of energy storage modules are connected in series with the second set of energy storage modules to provide a second voltage to the at least one output.

The power conversion device provided by the invention comprises a direct current end, a positive direct current bus, a negative direct current bus, a positive bus capacitor, a negative bus capacitor, at least three inverter bridge arms, a switch unit, a controller, filter inductors corresponding to the at least three inverter bridge arms one by one, a filter capacitor and an alternating current end. And the third end of each inverter bridge arm sequentially passes through the filter inductor, the filter capacitor and the switch unit corresponding to each inverter bridge arm and then is connected with the midpoint of the bus. The controller controls the switch unit to be switched off or the impedance of the switch unit to be increased when the voltage of the power grid is smaller than or equal to a first voltage threshold value; and after the switch unit is switched off or the impedance of the switch unit is increased, the modulation wave of each inverter bridge arm is controlled to be the modulation wave after the first common-mode modulation signal is superposed on the initial modulation wave of each inverter bridge arm, so that the amplitude of the modulation wave of each inverter bridge arm is increased. Furthermore, not only can the loss of the switching tube in each inverter bridge arm be balanced, but also the problem of common-mode oscillation caused by modulation wave change can be improved.

A fuse group assembly may include a first bus bar, a second bus bar in a stepped arrangement with the first bus bar, a first support plate arranged on the second bus bar, a second support plate in a stepped arrangement with the first support plate, a first fuse having a first end electrically connected to the first bus bar and a second end supported by the first support plate, and a second fuse having a first end electrically connected to the second bus bar and a second end supported by the second support plate.

A power conversion device includes a first electronic component group including a plurality of electronic components and a second electronic component group including a plurality of electronic components each having a shorter maintenance cycle than each of the plurality of electronic components included in the first electronic component group. The first electronic component group and the second electronic component group are accommodated in a housing. At least one of the plurality of electronic components included in the second electronic component group is located adjacent to an opening in the housing.

The invention relates to an integral type photovoltaic energy storage assembly, belongs to the field of solar photovoltaic power generation, and aims to solve the problems that an existing photovoltaic energy storage product is complex in structure and installation, high in cost, low in efficiency and high in safety risk. The integrated photovoltaic energy storage assembly comprises a solar cell panel, an alternating current and direct current multidirectional conversion device and an energy storage battery. The AC-DC multidirectional conversion device and the energy storage battery are installed on the back surface of the solar cell panel, and the extension height does not exceed the back side end surface of the frame of the solar cell panel. The alternating current and direct current multidirectional conversion device comprises three groups of connecting ends, a plurality of voltage converters, a plurality of switch elements and a control chip, the three groups of connecting ends are electrically connected to a solar cell panel, an energy storage battery and an alternating current power grid respectively, and the control chip is configured to selectively switch on at least one switch element in different working modes of the integral photovoltaic energy storage assembly so as to control the three groups of connecting ends. A voltage conversion path is established between the respective two sets of connection terminals by means of at least one voltage converter.

The invention provides a low-stress double-sided cooling power module and a manufacturing method thereof, the low-stress double-sided cooling power module comprises a first copper-clad ceramic substrate and a second copper-clad ceramic substrate which are oppositely arranged, the first copper-clad ceramic substrate is provided with at least two power chips, and two sides of each power chip are provided with C-shaped auxiliary support column connecting layers; and the lower surface of the second copper-clad ceramic substrate is provided with an inverted metal buffer cushion block which is arranged opposite to each power chip. The inverted metal buffer cushion block comprises a connecting frame with a groove, an auxiliary supporting column connected with the connecting frame is arranged at the position, corresponding to the auxiliary supporting column connecting layer, of the connecting frame, a protruding quadrangular frustum pyramid heat conduction structure is arranged in the groove of the connecting frame, and the bottom of the inverted quadrangular frustum pyramid heat conduction structure is connected with a power chip. The inverted metal cushion block constructs an optimized heat conduction path for the power module, so that heat generated in the working process of the chip can be efficiently conducted to an external heat dissipation environment through the metal cushion block, and the junction temperature of the chip is effectively reduced.

A power module includes a first substrate, a second substrate, a first heat sink, a second heat sink, and a chip that are disposed opposite to each other. The chip is disposed between the first heat sink and the second heat sink that are disposed opposite to each other. The first heat sink and the second heat sink are connected to the chip through sintering or welding. The first substrate and the second substrate are respectively connected to the first heat sink and the second heat sink through welding or sintering.

An energy self-balancing flexible direct-current converter valve, a control method, and a direct-current system, which relate to the technical field of power transmission and distribution networks. The converter valve comprises three phase units, and each phase unit comprises an upper leg and a lower leg. The upper legs and the lower legs each comprise a plurality of full-bridge energy self-balancing submodules and a plurality of half-bridge energy self-balancing submodules. Each of the full / half-bridge energy self-balancing submodules is an optimized MMC submodule comprising an energy self-balancing circuit. The energy self-balancing circuit is composed of a power electronic switch and an energy dissipation resistor connected in series, and is used for dissipating surplus energy when an overvoltage early warning occurs for the capacitor voltage of the submodule. The present application, without affecting the operational logic of conventional converter valves and at low costs, can solve the technical problem of surplus power not being dissipated promptly due to faults occurring in a direct-current power transmission system in a new energy islanded ultra-long-distance direct-current delivery scenario. Meanwhile, temporary energy stored in the capacitors of the optimized MMC submodules can be fully utilized, reducing the waste generated by surplus power dissipated as heat.

A case body has a first opening that is open along a first direction and through which an inverter device is insertable, a surrounding wall portion disposed along the first direction so as to surround the first opening, and a second opening that is formed in the surrounding wall portion and through which a power cable is insertable. A cover member is fixed to the surrounding wall portion by a plurality of fastening members disposed away from each other along an opening edge of the first opening so as to cover the first opening. A second opening width in a direction orthogonal to the first direction is smaller than an opening width of the second opening in the first direction, and a pair of the fastening members is disposed on both sides across the second opening.

The invention discloses an integration and optimization method of a multilayer circuit board in a photovoltaic inverter, and the method comprises at least seven layers of functional stacked structures which are an electromagnetic shielding layer, a power device layer, a first insulating dielectric layer, a control circuit layer, a second insulating dielectric layer, a heat dissipation substrate layer and a mechanical strengthening layer from top to bottom in sequence. Wherein the power device layer adopts a three-dimensional embedded packaging technology to integrate an IGBT module and a SiC MOSFET module, and a gate drive circuit of the power device layer is embedded into a first insulating dielectric layer in a coplanar waveguide structure; the heat dissipation substrate layer is provided with a micro-channel array with gradient apertures, and the inner wall of each micro-channel is subjected to anodic oxidation treatment to form an Al2O3 ceramic layer with the thickness of 20-50 microns.

An electronic component. The electronic component includes a base; a first semiconductor device attached to the base and having: a first Gallium nitride (GaN)-based switch having a first gate, a first source and a first drain, the first gate arranged to control a current flow between the first source and the first drain; a second GaN-based switch having a second source, a second gate and a second drain, the second gate coupled to the first gate, and the second drain coupled to the first drain. In one aspect, the electronic component also includes a second semiconductor device attached to the base and having: a logic circuit coupled to the second source and arranged to detect a magnitude of the current flow; and a driver circuit coupled to the first and second gates, the driver circuit arranged to control on and off states of the first and second GaN-based switches.

Provided are an integrated energy storage unit, an energy storage-power expansion pack, and an energy storage device. The integrated energy storage unit includes an integrated unit case and a first firefighting module. The integrated unit case includes a first battery box housing and a heat sink housing that are detachably connected to each other. A first battery module is fixed in the first battery box housing. An inverter circuit board is fixed in the heat sink housing. The inverter circuit board is configured for a conversion between an alternating current and a direct current and heat dissipation to an exterior environment through the heat sink housing. The first firefighting module is disposed in the integrated unit case. The first firefighting module includes a trigger mechanism, a fire-extinguishing agent storage compartment, and a release mechanism. The trigger mechanism is disposed in a firefighting detection region in the integrated unit case and configured to generate a trigger signal when a firefighting trigger condition in the firefighting detection region is met. The fire-extinguishing agent storage compartment is configured to store a fire extinguishing agent. The release mechanism is configured to, in response to the trigger signal from the trigger mechanism, release the fire extinguishing agent into a chamber where the first battery module is located.

An electrical propulsion system comprises an inverter, an electrical motor assembly, an assembly, and a rotor position sensor. The inverter comprises a printed circuit board assembly (PCBA). The electrical motor assembly comprises a stator and a rotor. The assembly is configured to rotate a propeller and comprises a moving component and a stationary component. The rotor position sensor comprises at least one sensor coupled to the PCBA, and a magnet located on the moving component. The at least one sensor is configured to detect a magnetic field of the magnet through the stationary component.

An electrical line selection system comprising a circuit module configured to connect energy sources with multiple line outputs. The circuit module has a number of inputs configured to connect to energy sources, including rechargeable battery systems, and a number of outputs configured to connect with other electrical systems such as other battery systems, loads, charging sources, and various AC or DC power supplies. A switching circuit is contained by the circuit module and a controller manages the switching circuit based on desired connections and strategies for managing power supplies and current sinks.

The invention is directed at an electric power converter, such as an electric motor drive for driving an electric motor. The converter includes a cooling system with a heat sink for dissipating thermal energy generated by the converter and with coolant flow means for cooling the heat sink, first measuring means for measuring the coolant inlet temperature, second measuring means for measuring the heat sink temperature, estimating means for estimating the thermal energy transferred to the heat sink, wherein the converter is provided for estimating the thermal resistance of the heat sink based on the measured temperatures and the estimated thermal energy transferred to the heat sink, for comparing the estimated thermal resistance to reference values and for outputting a signal, if the difference between the estimated thermal resistance and the reference values exceeds a threshold value. The invention is also directed at a method for operating the electric power converter.

A power electronics converter includes a substrate and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element is comprised in a power semiconductor prepackage. An electrical connection side of the respective power semiconductor prepackage is spaced apart in a z direction from the substrate so as to define a prepackage gap between the substrate and the electrical connection side. At least a portion of the prepackage gap is filled with an electrically insulating material having voids. A converter parameter σ defined as an insulation fill factor divided by a maximum void size is greater than or equal to 10 / mm. The insulation fill factor is defined as a cumulated volume of the voids subtracted from a volume of the electrically insulating material divided by the volume of the electrically insulating material.

A multiphase inverter for an electric drive system comprises multiple X-type multi-stage power converters positioned between a high-voltage DC power supply and an electric machine. Each of the multiple X-type multi-stage power converters is an integrated solid-state circuit (IC) comprising a positive DC power bus, a negative DC power bus, a neutral bus, and multiple semiconductor switches arranged in a stacked configuration. The multiple semiconductor switches are interconnected via the positive DC power bus, the negative DC power bus, and the neutral bus.

In a first embodiment provided herein, a high voltage and high power module (also referred to as a SuperMOS) comprising SiC MOSFETs that are connected in series and parallel configurations that can operate in concert to one another as, or equivalent to, a single device that could operate in high voltage and high current range. To mitigate mismatch operations due to multiple singled and paralleled devices, the exemplary power module includes both dynamic and static voltage balancing components as well as dynamic current balance circuit comprising a voltage gate clamp that are connected via a secondary parallel connection to ensure concerted dynamic current sharing.

The invention belongs to the field of power semiconductor devices, and discloses a dynamic current-sharing layout design method and system for a multi-chip parallel power module, and the method comprises two aspects of main power loop layout and wiring and driving loop layout and wiring. A main power loop is designed in a vertical commutation manner, and parallel chip source electrodes and drain electrodes are designed in an integrated manner, so that quasi-common-source-electrode inductors of the chips are consistent and integrated, and parallel dynamic current sharing of multiple gallium nitride chips is facilitated; wiring of the driving loop is in vertical commutation and is vertical to the main power loop, mutual inductance of the power loop to the driving loop is basically zero, and parallel dynamic current sharing of gallium nitride chips is facilitated; when the design is met and grid leading-out ends and Kelvin source leading-out ends of the four chips are symmetrical about the symmetry axis of the main power loop, the mutual inductance of the main power loop to a part of wiring from a drive to each chip grid is equal, and the mutual inductance of the main power loop to a wiring from a Kelvin source to a drive ground of each chip is also equal. And an excellent gallium nitride multi-chip parallel dynamic current sharing effect can be realized.

A power package includes an assembly having a first power package side and a second power package side; first power terminals arranged at the first power package side; second power terminals arranged at the second power package side; first signal terminals arranged at the first power package side; and second signal terminals arranged at the second power package side. Additionally, locations of the first power terminals and the second power terminals are symmetrical and / or locations of the first signal terminals and the second signal terminals are symmetrical.

A controller includes a circuit board, and a module assembly arranged at the circuit board. The module assembly includes a first power module, a second power module, and a third power module. The circuit board includes a first current circuit connected to the first power module, a second current circuit connected to the second power module, and a third current circuit connected to the third power module. The first current circuit and the second current circuit share one or more circuit components.

The embodiment of the invention relates to the technical field of energy storage, and provides an energy storage converter and an energy storage system thereof. The capacitor assembly and the inductor assembly are arranged on the two sides of the plate body assembly respectively; the two ends of the connecting assembly are electrically connected with the capacitor assembly and the inductor assembly respectively; and the heat dissipation assembly is provided with a heat dissipation air channel, and at least part of the capacitor assembly is located in the heat dissipation air channel, so that the problem of low working efficiency of an inductor and a capacitor in the energy storage converter in the prior art is at least favorably solved.

The invention belongs to the technical field of extra-high voltage direct current transmission, and discloses an IGCT single-valve structure for a converter valve. The IGCT single-valve structure comprises a shielding cover assembly, an IGCT valve string unit, a frame assembly, a water pipe assembly, a resistance-capacitance absorption assembly and a water-cooled reactor. Wherein the IGCT valve string unit, the water pipe assembly and the resistance-capacitance absorption assembly are arranged on the frame assembly, and the shielding cover assembly covers the periphery of the outer portion of the frame assembly; the water-cooling reactor is arranged in the shielding case assembly and connected with the frame assembly and the shielding case assembly, and the water pipe assembly is connected with a water path of the water-cooling radiator in the IGCT valve string unit and a water path of the water-cooling reactor. The problem of hidden danger of commutation failure in the traditional direct-current power transmission converter valve technology can be solved, the function of the circuit breaker is added, fault current can be blocked, the new single valve structure can replace the single valve layer of the traditional direct-current power transmission converter valve of the thyristor, and the engineering replacement cost and the operation difficulty are greatly reduced.

An electrical propulsion system for a vertical take-off and landing (VTOL) aircraft comprises an electrical motor assembly and an inverter assembly. The inverter assembly comprises a housing, a capacitor assembly, at least one printed circuit board assembly (PCBA), and a plurality of positioning pins. The capacitor assembly comprises a center hole, at least one capacitor, a capacitor housing having at least one busbar, and a plurality of through holes in the capacitor housing. The capacitor assembly and the at least one PCBA are positioned inside the housing. The plurality of positioning pins pass through the through the plurality of through holes of the capacitor housing and the at least one PCBA and are connected to the housing.

A system includes: an inverter, wherein the inverter includes: a power module including: a flex layer including a gate trace, a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

The invention discloses a power assembly, a semiconductor module and a vehicle, and belongs to the technical field of power semiconductors. The power assembly comprises a chip layer and a wiring layer, and a power chip is arranged in the chip layer; the wiring layer is provided with a control electrode and a conduction circuit; the wiring layer and the chip layer are sequentially stacked in the first direction, and the conduction circuit is connected between the power chip and the control electrode. By embedding the power chip into the semiconductor structure, the design space of an internal circuit of the semiconductor structure is large, the flexibility is high, on one hand, the optimization of the module performance is facilitated, on the other hand, the number of connecting terminals and binding wires can be reduced, an inverter, a charger and a DC / DC unit can be integrated, the size of the module is effectively reduced, and the power density is improved.