Cooling
system for
electronics, which includes: a housing (110) containing: a base section (120) with sides (121) and a bottom surface (123) that define a cavity; and a cover section (116) that encloses the base section (120) and contains cooling elements (118, 119) attached to it; electronic components; a shield (244) which is arranged in the cavity between the electronic components and the cover section (116); a vertical element arranged below the shield (244) to define a first fluid chamber between one side of the vertical element and one side of the base section (120) and a second fluid chamber between an opposite side of the vertical element and another side of the base section (120), wherein the electronic components are arranged in the second fluid chamber; and a
cooling fluid (260) arranged in the cavity and having a
fluid level below at least one section of the shielding (244), and either: the housing (110) is mounted at an
angle of inclination relative to the horizontal; or the housing (110) is mounted parallel to the horizontal and the shielding (244) is mounted at an
angle of inclination relative to the horizontal; characterized by the fact that an upper edge of the vertical element is connected to an edge of the shield (244); or that an upper edge of the vertical element and an edge of the shield (244) are arranged below the
fluid level; or that a lower edge of the vertical element contains several openings to allow a fluid to flow from the first fluid chamber to the second fluid chamber; or that the vertical element contains a gate
printed circuit board (gate PCB) (254); or that the electronic components comprise at least one
power inverter (250), busbars (210), a
current sensor (253) and a volume
capacitor (224); or that the electronic components comprise: a
power inverter module (250) containing several circuit breakers; a
current sensor (253) which is connected to the
power inverter module (250) via first busbars (210); AC busbars (128) connected to the
current sensor (253); a volume
capacitor (224) which is connected to the power
inverter module (250) via second busbars (210); and DC busbars (132) connected to the volume
capacitor (224).