496 results about "Electromagnetic emission" patented technology

A marking paint applicator for a portable electronic locator that locates buried cables and pipes via electromagnetic emissions includes an elongated support structure and a manually moveable trigger mechanism mounted adjacent an upper end of the support structure. At least one bracket assembly is provided for removably connecting the support structure to an antenna mast of the portable locator so that the trigger mechanism will be adjacent a handle of the locator and the trigger mechanism can be squeezed by a finger of an operator's hand while grasping the handle. A receptacle is mounted to the support structure for carrying an inverted aerosol paint can and positioning a valve stem of the aerosol paint can for spraying paint onto the ground to mark the location of a buried cable or pipe. An actuating mechanism is capable of selectively deflecting the valve stem to cause the aerosol paint can to spray paint onto the ground to mark the location of a buried cable or pipe. A linkage connects the trigger mechanism to the actuating mechanism for deflecting the valve stem when the trigger mechanism is squeezed.

An electromagnetic wave propagation resistivity borehole logging system comprising multiple groups of electromagnetic transmitter-receiver arrays operating at three frequencies. The borehole logging tool component of the system employs eight transmitters and four receivers. The transmitters and receivers are disposed axially and symmetrically along the major axis of the tool to form four group pairs. Each group pair consists of a transmitter-receiver groups axially and symmetrically on opposing sides of a reference point on the tool. Each, transmitter-receiver group consists of one transmitter assembly and two receiver assemblies. Each transmitter-receiver group is operated at two of three operating frequencies which are 100 kHz, 400 kHz and 2 MHz. Some of the transmitter and receiver assemblies are fabricated to yield azimuthally focused resistivity measurements, and to yield vertical and horizontal resistivity in anisotropic dipping beds. The system can be embodied as a logging-while-drilling system or as a wireline logging system.

A pressure sensing apparatus for operative arrangement within an environment, having: a sensor comprising a hermetically-sealed receptacle, at least one side of which has an flexible membrane to which a magnetically hard element is attached. Enclosed within the receptacle is a magnetostrictive element that vibrates in response to a time-varying magnetic field. Also included is a receiver to measure a plurality of successive values for magneto-elastic emission intensity of the sensor taken over an operating range of successive interrogation frequencies to identify a resonant frequency value for the sensor. Additional features include: (a) the magnetically hard element may be adhered to an inner or outer side of, or embedded within, the membrane; (b) the magnetostrictive element can include one or more of a variety of different pre-formed, hardened regions; (c) the magneto-elastic emission may be a primarily acoustic or electromagnetic emission; and (d) in the event the time-varying magnetic field is emitted as a single pulse or series of pulses, the receiver unit can detect a transitory time-response of the emission intensity of each pulse (detected after a threshold amplitude value for the transitory time-response is observed). A Fourier transform of the time-response can yield results in the frequency domain. Also, an associated method of sensing pressure of an environment is included that uses a sensor having a magnetostrictive element to identify a magneto-elastic resonant frequency value therefore. Using the magneto-elastic resonant frequency value identified, a value for the pressure of the environment can be identified.

A substrate for reducing electromagnetic emissions is provided. The substrate may include a plurality of ground layers, signal layers and power layers. All of the layers other than the ground layer are provided with a ground ring that may extend around the perimeter of the layer. The ground rings are electrically coupled together by ground stitching or vias that are randomly spaced. The random spacing of the ground stitching is based on the operating frequencies of the integrated circuit devices mounted on the substrate. Additional shielding may be provided by providing a cover assembly made of any conductive material that is coupled to the exposed ground rings on the uppermost and lowermost surfaces of the substrate. The cover assembly is coupled to the exposed ground rings in a randomized pattern. The device provides a virtual electrical ground cage in which the internal signal layers are totally enclosed, thereby reducing electromagnetic emissions.

Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression, alone or in combination.

An infrared emitter, which utilizes a photonic bandgap (PBG) structure to produce electromagnetic emissions with a narrow band of wavelengths, includes a semiconductor material layer, a dielectric material layer overlaying the semiconductor material layer, and a metallic material layer having an inner side overlaying the dielectric material layer. The semiconductor material layer is capable of being coupled to an energy source for introducing energy to the semiconductor material layer. An array of holes are defined in the device in a periodic manner, wherein each hole extends at least partially through the metallic material layer. The three material layers are adapted to transfer energy from the semiconductor material layer to the outer side of the metallic material layer and emit electromagnetic energy in a narrow band of wavelengths from the outer side of the metallic material layer.

A capacitive sensing system are configured to sense a capacitance value and convert the sensed capacitance value to a digital format. The capacitive sensing system provides good selectivity and immunity to noise and interference, which can be further enhanced by enabling spread spectrum excitation. In some embodiments, the capacitive sensing system utilizes a sinusoidal excitation signal that results in low electromagnetic emissions, limited to narrow frequency band. In some embodiments, the capacitive sensing system is configured to operate in a spread spectrum mode, in which the majority of the excitation signal power is carried in the assigned bandwidth. The excitation frequency and the bandwidth of the spread spectrum excitation signal are programmable in a wide range, which allows for avoiding frequency conflicts in the operating environment.

An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration. A connector arrangement provides electrical, mechanical and/or other operational coupling between the circuit board and a chassis regardless of whether the board is disposed in a slot on a first (e.g., upper) side of a source of cooling air for the chassis or on a second (e.g, lower) opposite side of that source. A circuit board can have one or two portions, each with an air flow inlet edge through which cooling air flow is received and an air flow outlet edge through which the air flow exists. An improved chassis for mounting of such circuit boards can have a center air inlet. It can also have a circuit-board insertion slot with a first air flow aperture disposed adjacent to a first edge of an inserted circuit board and a second apertures disposed adjacent to a second edge of the board. These apertures can be sized so that the impedance to air flow to a circuit board inserted in the slot substantially matches that to one or more other boards in the chassis. Such slots can form part of a card cage that is vacuum or dip brazed, or manufactured by an alternate process yielding a cage of desired structural stiffness and air-flow/interference sealing. The circuit boards and chassis can include an air and/or electromagnetic interference (EMI) seal which forms as the circuit board is inserted into the chassis slot.

The present invention relates to a multi-functional energy conditioner having architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression.

A clock recovery circuit and a method for reducing electromagnetic emission (EMI) and increasing an attainable clock frequency includes a spread spectrum clock (SSC) generator that receives an input clock signal and generates a frequency-modulated clock signal, and a zero-delay buffer circuit that receives and buffers said modulated clock frequency signed to generated an output clock signal. The frequency-modulated clock signal and the output clock signal are phase-aligned such that there is no phase difference between the output clock signal and the modulated frequency clock signal. The clock recovery circuit also includes a delay-locked loop (DLL) circuit that reduces related art jitter and skew characteristics, and a phase detector circuit that eliminates phase ambiguity problems of a related art phase detector.

An electrically continuous conformal EMI protective shield for conformingly adhering directly to surfaces of a printed circuit board is disclosed. The EMI protective shield comprises a dielectric coating and a conductive coating. The dielectric coating adheres directly to surfaces of the printed circuit board to provide an electrically nonconductive, contiguous coating that covers all such printed circuit board surfaces. The conductive coating comprises a substantially contiguous layer of an intrinsically conducting polymer adhering directly to surfaces of the dielectric coating to provide an electrically conductive layer that prevents the passage of electromagnetic emissions through the conformal EMI shield.

The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression, alone or in combination.

The invention discloses a fast electromagnetic compatibility test and diagnosis system with quantization electromagnetic interference. A receiving antenna of the system is arranged on a frequency spectrum tester, a chuck end of a current probe is clamped on a cable through which tested objects are connected, the other end of the current probe is connected on the frequency spectrum tester which is connected with a computer; and the computer is internally provided with a fast electromagnetic compatibility test and diagnosis unit. The fast electromagnetic compatibility test and diagnosis unit is used for fast testing the electromagnetic-transmitted frequency spectrum of the tested objected on site, conducting analysis and diagnosis to the electromagnetic-transmitted frequency spectrum, and judging whether the electromagnetic transmission characteristic exceeds a standard limit value or has abnormality. The fast electromagnetic compatibility test and diagnosis system has important meaning on solving the electromagnetic compatibility problem and monitoring and evaluating the electromagnetic environment.

A system of spreading the energy of higher harmonic frequencies in digital circuits to lower the interference to bandpass receivers is disclosed. A set of passive, impedance-regulated circuits, preferably housed in a standard enclosure, comprises a power restoring unit, a modulating signal generator, an internal oscillator and an impedance spreading unit. The circuits are equivalent to passive resonators such as crystal resonators used in standard oscillators. Any existing standard oscillator that uses common crystal resonators can be transformed into a spectrum-spread oscillator by replacing the crystal resonator with the disclosed circuit, whereby a tightly controlled small frequency spreading occurs in the fundamental clock frequency. Further an active oscillator is disclosed wherein a spreading circuit spreads the frequency of the clock signal originally generated by the oscillator based on a sequence of processing the original clock signal. The processing includes the use of a plurality of delay elements based on a certain topology, the comparisons between the clock signal and a set of predefine parameters so as to create a frequency offset. The spreading circuit, without using additional clocking sources, spreads the frequency of the clock signal with respect to the comparisons.

The invention relates to optical devices for producing and/or transforming polarised electromagnetic emission by means of anisotropic absorption and/or optical rotation effects and/or birefringence and can be used as different polarizers (dichroic, reflecting), lagging layers (retarders), liquid-crystal displays and indicators and also for producing polarising glass for building construction and for sun and antiglare glasses, masks, aprons and faceplates. The inventive optical device is based on at least one molecularly oriented layer of a low-molecular or oligomeric dichroic material which can form a stable lyotropic liquid crystal structure. The projection of at least one anisotropically absorbing fragment of a molecule of the dichroic material on the surface of the molecularly oriented layer of a dipole moment of optical transition is disposed in a parallel position to the optical axis of the molecularly oriented layer at least within several ranges of wavelength of the electromagnetic emission.

In a communication device, electric circuits other than an antenna are enclosed in a shielding member made of a material that shuts off radio waves, and the antenna is enclosed by disposing in front thereof a radio wave absorbing member that attenuates radio waves in a predetermined frequency band. Thus, unnecessary electromagnetic emission is alleviated while satisfactory communication quality is secured.

A radio frequency and electromagnetic emission shield employed on wireless personal and portable electronic devices, containing one or more layers of radio frequency (RF) or electromagnetic (EM) screening material, shielding the user from harmful RF or EM radiation, or a redirection antenna that receives all RF signals, and redirects those signals away from the user. The RF emission shield may be contained within a plurality of outer layers, providing a secure fit to a wireless electronic device and an outer layer providing an easy grip for the user.

A system for identifying a real-world geographic location of an emission source emitting electromagnetic energy includes a platform configured for movement and an apparatus disposed on the platform and configured to collect and process, in a passive manner and during movement of the platform, at least a pair of successive samples of the electromagnetic energy emission and define angular and spatial coordinates of the emission source. The apparatus includes at least a pair of antennas, a receiver coupled to antennas and a processor executing a predetermined logic.