Multi-functional energy conditioner

Abstract

The present invention relates to a multi-functional energy conditioner having architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression.

Description

TECHNICAL FIELD [0001] This application is a continuation of application Ser. No. 09 / 946,190, filed Sep. 5, 2001, which is a continuation of application Ser. No. 09 / 579,606 filed May 26, 2000, which is a continuation-in-part of application Ser. No. 09 / 460,218 filed Dec. 13, 1999, which is a continuation of application Ser. No. 09 / 056,379 filed Apr. 7, 1998, now issued as U.S. Pat. No. 6,018,448, which is a continuation-in-part of application Ser. No. 09 / 008,769 filed Jan. 19, 1998, now issued as U.S. Pat. No. 6,097,581, which is a continuation-in-part of application Ser. No. 08 / 841,940 filed Apr. 8, 1997, now issued as U.S. Pat. No. 5,909,350. The disclosures of all of the foregoing applications are incorporated herein by reference.[0002] The present invention relates to a multi-functional energy conditioner that possesses a commonly shared centrally located conductive electrode of the structure that can simultaneously interact with energized and paired differential electrodes as sa...

AI Technical Summary

Benefits of technology

[0012] Based upon the foregoing, there has been found a need to provide a multi-functioning electronic component which can operate across a broad frequency range as compared to a single, prior art component or a multiple passive network. Ideally, this component would perform effectively past 1 GhZ while simultaneously providing energy decoupling for active componentry and maintaining a constant apparent voltage potential for portions of active circuitry. This new component would also minimize or suppress unwanted electromagnetic emissions resulting from differential and common mode currents flowing within electronic circuits. A multi-functioning electronic component in a multi-layered embodiment and in a dielectric independent passive architecture can, when attached into circuitry and energized, be able to provide simultaneous line conditioning functions such as, but not limited to, the forgoing needs. These needs include source to load and / or load to source decoupling, as well as, differential and common mode filtering, parasitic containment, and surge protection in one integrated package when utilizing an external conductive area or pathway. The invention can be utilized for protecting electronic circuitry and active electronic components from electromagnetic field interference (EMI), over voltages, and preventing debilitating electromagnetic emissions attributed to the circuitry and from the invention itself. Furthermore, the present invention minimizes or prevents detrimental parasitics from coupling back on to a host circuit from internally enveloped differential conductive elements located with the invention as it operates in an energized circuit. More specifically, this invention teaches that with proper placement techniques and attachment into circuitry, the system can utilize the energized physical architecture to suppresses unwanted electromagnetic emissions, both those received from other sources, and those created internally within the invention and it's electronic circuitry that could potentially result in differential and common mode currents that would be contributed as parasitics back into the host circuitry.

Problems solved by technology

These components can be very susceptible to stray electrical energy created by electromagnetic interference or voltage transients occurring on electrical circuitry servicing or utilizing these systems.

Voltage transients can severely damage or destroy such micro-electronic components or contacts thereby rendering the electronic equipment inoperative, often requiring extensive repair and / or replacement at a great cost.

Other sources of interference are also generated from equipment as it operates, coupling energy to the electrical circuitry, which may generate significant interference.

In a similar manner, electromagnetic pulses (EMP) can generate large voltage spikes with fast rise time pulses over a broad frequency range that are detrimental to most electronic devices.

Other sources of large voltage transients as well as ground loop interference caused by varying ground potentials can disrupt an electrical system.

Existing protection devices are unable to provide adequate protection in a single integrated package.

Electrical systems have undergone short product life cycles over the last decade.

However, with the advent of new generations of microprocessors, memory components and their data, there is intense pressure to provide the user increased processing power and speed at a decreasing unit cost.

As a result, the engineering challenge of conditioning the energy delivered to electrical devices has become both financially and technologically difficult.

During this same period, passive componentry technologies have failed to keep up and have produced only incremental changes in composition and performance.

Not to be overlooked, however, is the existence of a major limitation in the line conditioning ability of a single passive component and for many passive component networks.

This limitation presents an obstacle for technological progression and growth in the computer industry and remains as one of the last remaining challenges of the+GHz speed system.

This constraint to high-speed system performance is centered upon the limitations created by the supporting passive componentry that delivers and conditions energy and data signals to the processors, memory technologies, and those systems located outside of a particular electronic system.

The increased speed of microprocessors and memory combinations has resulted in another problem as evidenced by recent system failures that have occurred with new product deployments of high-speed processors & new memory combinations by major OEMs.

The current passive component technology is the root cause of many of these failures and delays.

This performance disparity between the higher operating frequency of microprocessors, clocks, power delivery bus lines and memory systems and that of the supporting passive elements has resulted in system failures.

Additionally, at these higher frequencies, energy pathways are normally grouped or paired as an electrically complementary element or elements that electrically and magnetically must work together in harmony and balance An obstacle to this balance is the fact that two discrete capacitors manufactured in the same production batch can easily posses a variability in capacitance, ranging anywhere from 15%-25%.

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