Multi-functional energy conditioner

Abstract

The present invention relates to a multi-functional energy conditioner having architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression.

Description

TECHNICAL FIELD [0001] This application is a continuation of application Ser. No. 09 / 946,190, filed Sep. 5, 2001, which is a continuation of application Ser. No. 09 / 579,606 filed May 26, 2000, which is a continuation-in-part of application Ser. No. 09 / 460,218 filed Dec. 13, 1999, which is a continuation of application Ser. No. 09 / 056,379 filed Apr. 7, 1998, now issued as U.S. Pat. No. 6,018,448, which is a continuation-in-part of application Ser. No. 09 / 008,769 filed Jan. 19, 1998, now issued as U.S. Pat. No. 6,097,581, which is a continuation-in-part of application Ser. No. 08 / 841,940 filed Apr. 8, 1997, now issued as U.S. Pat. No. 5,909,350. The disclosures of all of the foregoing applications are incorporated herein by reference.[0002] The present invention relates to a multi-functional energy conditioner that possesses a commonly shared centrally located conductive electrode of the structure that can simultaneously interact with energized and paired differential electrodes as sa...

AI Technical Summary

Benefits of technology

"The present invention provides a multi-functional electronic component that can operate across a broad frequency range and provide effective decoupling, differential and common mode filtering, parasitic containment, surge protection, and energy decoupling for active circuitry. This component can be integrated into electronic circuits and can be attached to external conductive areas or paths. It can also be manufactured in a cost-effective and low-integrated way. The invention can be used in a variety of electronic products and can provide protection against voltage transients, over voltages, and electromagnetic interference. It can also be used as a blocking circuit or in a circuit arrangement that eliminates the need for specialized dielectrics. The invention utilizes a plurality of common conductive plates that are joined and partially surrounding corresponding differentially conductive electrode plates, which create a state of effective differential and common mode electromagnetic interference filtering and surge protection. The invention can also provide line-to-line and line-to-ground capacitive or inductive coupling between internal plates and external conductors."

Problems solved by technology

These components can be very susceptible to stray electrical energy created by electromagnetic interference or voltage transients occurring on electrical circuitry servicing or utilizing these systems.

Voltage transients can severely damage or destroy such micro-electronic components or contacts thereby rendering the electronic equipment inoperative, often requiring extensive repair and / or replacement at a great cost.

Other sources of interference are also generated from equipment as it operates, coupling energy to the electrical circuitry, which may generate significant interference.

In a similar manner, electromagnetic pulses (EMP) can generate large voltage spikes with fast rise time pulses over a broad frequency range that are detrimental to most electronic devices.

Other sources of large voltage transients as well as ground loop interference caused by varying ground potentials can disrupt an electrical system.

Existing protection devices are unable to provide adequate protection in a single integrated package.

Electrical systems have undergone short product life cycles over the last decade.

However, with the advent of new generations of microprocessors, memory components and their data, there is intense pressure to provide the user increased processing power and speed at a decreasing unit cost.

As a result, the engineering challenge of conditioning the energy delivered to electrical devices has become both financially and technologically difficult.

During this same period, passive componentry technologies have failed to keep up and have produced only incremental changes in composition and performance.

Not to be overlooked, however, is the existence of a major limitation in the line conditioning ability of a single passive component and for many passive component networks.

This limitation presents an obstacle for technological progression and growth in the computer industry and remains as one of the last remaining challenges of the+GHz speed system.

This constraint to high-speed system performance is centered upon the limitations created by the supporting passive componentry that delivers and conditions energy and data signals to the processors, memory technologies, and those systems located outside of a particular electronic system.

The increased speed of microprocessors and memory combinations has resulted in another problem as evidenced by recent system failures that have occurred with new product deployments of high-speed processors & new memory combinations by major OEMs.

The current passive component technology is the root cause of many of these failures and delays.

This performance disparity between the higher operating frequency of microprocessors, clocks, power delivery bus lines and memory systems and that of the supporting passive elements has resulted in system failures.

Additionally, at these higher frequencies, energy pathways are normally grouped or paired as an electrically complementary element or elements that electrically and magnetically must work together in harmony and balance An obstacle to this balance is the fact that two discrete capacitors manufactured in the same production batch can easily posses a variability in capacitance, ranging anywhere from 15%-25%.

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