435results about "Printed capacitor incorporation" patented technology

The invention provides a charge control electric field driven jet micro-nano 3D printing curved surface conformal multilayer circuit method and system. A high-precision conformal thin film dielectric layer is formed by utilizing charge injection electrowetting and contact electric field driving jet micro-nano 3D printing; and the high-resolution curved surface conformal circuit is manufactured by combining active residual charge elimination and non-contact electric field driving spray deposition micro-nano 3D printing. Through organic combination of active charge regulation and control and electric field driven jet micro-nano 3D printing, a high-precision conformal film dielectric layer and conductive layer conformal circuit and an interlayer interconnection circuit thereof are integrally printed. According to the curved surface conformal multilayer circuit manufacturing method, efficient, low-cost, high-precision and uniform manufacturing of the curved surface conformal multilayer circuit is achieved.

An integrated assembly and an integrated power converter module are disclosed. The integrated assembly includes an inductor assembly and a first capacitor assembly. The top surface of the integrated assembly is provided with an upper surface pin, and the bottom surface is provided with a lower surface pin; the inductor assembly includes a magnetic core and a main winding penetrating through the magnetic core from the top surface to the bottom surface thereof, the main winding is electrically connected with the upper and the lower surface pins, the surface of the magnetic core is provided with a capacitor setting area where the first capacitor assembly is arranged; the bottom surface of the electrode of the first capacitor assembly and the pin of the lower surface of the inductor assembly are coplanar, and the top surface of the first capacitor assembly and the surface of the magnetic core are electrically isolated.

Provide for herein is an apparatus that includes multiple printed circuit board (PCB) layers and a via assembly. The via assembly includes a signal via extending through the multiple layers, and the signal via is configured to transmit a signal between the layers. The via assembly also includes a capacitive structure connected to the signal via to adjust an impedance of the via assembly along the via assembly. The capacitive structure is physically and electrically separate from other components of the PCB.

An apparatus including via structures capable of reducing crosstalk effects is provided. The apparatus includes a printed circuit board (PCB) including sequentially stacked multi-layers, a first via structure that partially penetrates the multilayers of the PCB and is connected to a first metal plate on a first layer of the multilayers, and a second via structure adjacent to the first via structure in a horizontal direction, partially penetrating the multi-layers of the PCB, and connected to a second metal plate disposed on a second layer of the multi-layers. A portion where the first metal plate and the second metal plate overlap each other is configured to provide a first mutual capacitive coupling between the first and second via structures.

A voltage converting circuit comprises a multi-layer printed-circuit-board stack having an input terminal and a reference terminal, first and second switching elements connected to each other at an output terminal and a parallel-plate capacitor connected with the first and the second switching elements; the stack comprises a top conductive layer provided with said input, reference and output terminals and with a plurality of power-conducting traces, a first and a second metal plane forming said electrodes of the parallel-plate capacitor, a first and a second signal layer having first and second signal-routing traces, wherein the first and the second metal plane are arranged between the top conductive layer and two signal layers, and wherein the top conductive layer and the first metal plane are separated from each other by an insulating layer of the stack only.

The purpose of the present invention is to provide a technique capable of ensuring the reliability of a glass core laminated structure and a wiring board while avoiding the occurrence of damage in a core substrate. A laminated glass core structure is provided with: a glass core substrate having a first surface and a second surface facing the first surface; and a laminated body including a layer formed of a material different from that of the glass core substrate above the first surface and below the second surface, characterized in that: a side surface of the glass core laminated structure is covered with the same material as one of the materials constituting the laminated body; a plurality of substantially rectangular recesses are formed in at least a portion of a side surface of the glass core substrate, the recesses allowing the plurality of longitudinal ridge lines and transverse ridge lines to be viewed.

The invention discloses a low-pass filter and a preparation method thereof, and the low-pass filter comprises a porcelain body, a first inductor, a second inductor, a third inductor, a fourth inductor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, and a fifth capacitor. A first inductor, a second inductor, a third inductor and a fourth inductor which are electrically connected in sequence are arranged in the left side of the porcelain body to form a series inductor middle layer, and a first capacitor, a third capacitor and a fifth capacitor are arranged above the inductor middle layer and electrically connected with the series inductor middle layer. The second capacitor and the fourth capacitor are arranged below the inductor middle layer and electrically connected with the series inductor middle layer, the capacitor and the inductor on the left side form a first filter circuit, the second filter circuit symmetrical to the first filter circuit is arranged on the right side of the porcelain body and electrically connected with the first filter circuit, and the first capacitor is connected to the input pin. The output end of the second filter circuit is connected to the output pin, and the input pin and the output pin are arranged on the upper surface of the porcelain body. The two filters are cascaded, so that high suppression can be realized.

A provided circuit board includes an embedded capacitor, a substrate, and an insulating layer. The embedded capacitor includes a dielectric layer, a first electrode and a second electrode. The dielectric layer has a first side surface, a second side surface adjacent to the first side surface, a third side surface opposite to the first side surface, and a fourth side surface opposite to the second side surface. The first and second electrodes respectively cover the first and third side surfaces. The substrate surrounds the embedded capacitor and is physically connected to the second and fourth side surfaces. The first electrode is between the first side surface and a sidewall of the substrate. The insulating layer covers the embedded capacitor and the substrate and extends from an upper surface to a lower surface of the substrate along the first electrode and the sidewall of the substrate.

A control device configured for use in a load control system to control one or more electrical loads may comprise an actuation member having a front surface defining a touch sensitive surface configured to detect a point actuation along at least a portion of the front surface, a touch sensitive circuit, and a control circuit. The touch sensitive device may comprise one or more receiving capacitive touch pads located behind the actuation member and arranged in a linear array adjacent to the touch sensitive surface. The control circuit may be configured to operate using different filtering techniques based on the state / mode of the control device and / or based on whether the positions of point actuations by a user along the touch sensitive surface indicate a fine tune or gross adjustment by the user. For example, the control circuit may generate an output signal using light / no filtering or using heavy filtering.

Electrical connector (1) for a data or communication cable with the following features: - a case (10), - first (41) and second contact elements (42), - the first contact elements (41) are connected to the second contact elements (42) via conductor tracks (64, 65), with two conductor tracks (64, 65) forming a differential line (61), - a first circuit board (86), - the first circuit board (86) has compensation units (68), - the first circuit board (86) is at least partially arranged in the housing (10), characterized by the following additional features: - the first circuit board (86) is designed as a flexible circuit board, - the first circuit board (86) is arranged on a support element (75).

A wiring board includes a glass substrate having first and second surfaces and provided with through-holes; a first conductor layer including a first copper layer facing the first surface and a hydrofluoric acid resistant metal layer interposed between them, and covering openings of the through-holes on the first surface side, the first conductor layer having recesses at positions of the through-holes in a surface on the glass substrate side, each recess having an opening with a contour wider than and surrounding the opening of the corresponding through-hole on the first surface side; and a second conductor layer including an adhesion layer covering the side walls of the through-holes, inner surfaces of the recesses, and regions of the second surface surrounding the openings of the through-holes on the second surface side, a seed layer provided on the adhesion layer, and a second copper layer provided on the seed layer.

A circuit carrier includes at least one wiring layer and a capacitive element. The capacitive element is disposed in at least one dielectric layer of the wiring layer. The capacitive element includes a lower electrode, an inter-electrode and an upper electrode. The inter-electrode is located between the lower electrode and the upper electrode. The inter-electrode includes a plate, at least one first finger and at least one second finger. The first finger and the second finger extend from opposite sides of the plate, respectively.

The invention provides a printed circuit board. The printed circuit board includes a substrate portion including a first insulating layer and a first wiring layer disposed on or in the first insulating layer; the connecting structure is arranged on the base plate part or in the base plate part; the connecting structure comprises a plurality of first dielectric layers, a first metal layer and a second metal layer which are respectively arranged on the plurality of first dielectric layers or in the plurality of first dielectric layers, and a second insulating layer arranged on the plurality of first dielectric layers, and a second wiring layer disposed on or in the second insulating layer. Each of the plurality of first dielectric layers includes an organic material. The distance between the first metal layer and the second metal layer is smaller than the distance between the first metal layer and the second wiring layer.

Aspects of the disclosure relate to a method of forming an article including: combining first and second chemical components that are reactive with each other to form a coreactive composition; depositing the coreactive composition to form a conductive portion of an article; wherein, 48 hours after depositing, the conductive portion comprises: a tensile modulus of at least 5 MPa; and an electrical conductivity of at least 2 S / m; wherein the coreactive composition comprising: a solvent content less than 5 wt %; and a conductive filler content effective for the conductive portion to reach the electrical conductivity of at least 2 S / m.

A multilayer filter according to an embodiment comprises: first and second ground layers; a plurality of conductive pattern layers stacked vertically between the first and second ground layers; a dielectric layer disposed between the first and second ground layers and the plurality of conductive pattern layers; and vias passing through the dielectric layer and connecting each of the first and second ground layers and the plurality of conductive pattern layers, wherein each of the plurality of conductive pattern layers includes an inductance pattern layer forming a plurality of inductors, the other parts of the plurality of conductive pattern layers include capacitance pattern layers facing each other vertically and facing each of the first and second ground layers to form a plurality of capacitors, and the plurality of inductors and the plurality of capacitors are connected vertically and horizontally using the vias. Therefore, the multilayer filter can filter a signal having a desired frequency band.

An apparatus for retrofitting an HID lighting system includes using existing components of a previously installed HID lighting system, such as a ballast thereof, while replacing some capacitors to regulate the power supplied to the retrofit LED lighting fixture. The unused ballast driver is removed and the independent ballast driver assembly is installed into the electronic control housing of the previously installed lighting system. Some retrofit LED lighting fixtures include upward illumination lenses, optics, or diffusers for providing upward illumination. The aiming support and the aiming plate can be used for setting the horizontal aiming angle of the lamp.

In one aspect, a capacitor or network of capacitors is / are provided for vertical power delivery in a package where the capacitor(s) is / are embedded in or forms the entirety of the package substrate core. In a second aspect, a plurality of thin-film capacitor structures are provided for implementing vertical power delivery in a package. In a third aspect a method is provided for fabricating hermetically sealed thin-film capacitors.

Disclosed in the present invention is a filter circuit. A first PCB layer consists of a power line, a power interface, a second filter capacitor, and a first filter capacitor; the power line comprises a power supply network and a GND network; the second PCB layer is provided with a conductor plane; the power interface is connected to the GND network and is further connected to the conductor plane; the GND network, the second filter capacitor, and the conductor plane are sequentially connected; the power supply network, the first filter capacitor, and the conductor plane are sequentially connected. The circuit design of the circuit structure and the overall layout design idea in the present invention have a good suppression effect on common-mode noise, differential mode noise, radiation noise and conduction noise.

Electrical connector (1) for a data or communication cable with the following features: - a housing (3), - a circuit board (50), wherein the circuit board (50) is at least partially arranged in the housing (3), - the circuit board (50) has at least one differential line (53), - the differential line (53) has a first conductor track (51) and a second conductor track (52), - the first (51) and second conductor track (52) each have a conductor path (57) and first contact pads (54) and second contact pads (55) at the ends of the conductor path (57), - the second contact pads (55) are electrically connected to second contact elements (65), - at least one capacitance plate (91) is formed on the circuit board (50), characterized by the following additional features: - a single capacitance plate (91) is formed at least partially overlapping with one of the second contact elements (65) on the circuit board (50), wherein the capacitance plate (91) is not electrically connected to the overlapping second contact element (65).

An apparatus for retrofitting a HID lighting system includes using existing components of previously installed HID lighting systems such as its ballasts while replacing some capacitors to adjust the power supplied to a retrofit LED luminaire. Unused ballast drivers are removed, and a self-contained ballast driver assembly is mounted into the electronic control enclosure of the previously installed lighting system. Some of the retrofit LED luminaires include an uplighting lens, an optic, or a diffuser for providing uplight. An aiming bracket and an aiming plate allow for the horizontal aiming angle of a light luminaire to be set.

In order to obtain a high-frequency module with less warping, small size, and high connection reliability, a wiring substrate is provided, which has: a core material made of glass, having a first surface, a second surface opposite to the first surface, and a through-hole passing through the first surface to the second surface; a first adhesion layer formed so as to adhere to the first surface and an inner wall of the through-hole, and further block a bottom of the through-hole on the second surface side; a second adhesion layer adhering to the second surface and the first adhesion layer blocking the bottom of the through-hole on the second surface side; a first wiring layer laminated on the first adhesion layer; and a second wiring layer laminated on the second adhesion layer, wherein in a case where a total area of the first wiring layer is set as A, and an area occupied by copper in the first wiring layer is set as B, a residual copper rate C of the first wiring layer is represented by C=B / A (%), C=70-100%, and a Young's modulus of a material of the first adhesion layer is 0.1-0.85 times a Young's modulus of a material of the first wiring layer.

An apparatus for retrofitting a HID lighting system includes using existing components of previously installed HID lighting systems such as its ballasts while replacing some capacitors to adjust the power supplied to a retrofit LED luminaire. Unused ballast drivers are removed, and a self-contained ballast driver assembly is mounted into the electronic control enclosure of the previously installed lighting system. Some of the retrofit LED luminaires include an uplighting lens, an optic, or a diffuser for providing uplight. An aiming bracket and an aiming plate allow for the horizontal aiming angle of a light luminaire to be set.

An apparatus having at least one interconnect is provided. In one aspect, an apparatus includes a first media providing a first signal channel, a second media providing a second signal channel, and an interconnect. The interconnect includes a first mating structure that includes a first electrode mounted to the first media and a thin film dielectric disposed on the first electrode. The interconnect also includes a second mating structure having a second electrode mounted to the second media. The first mating structure is connectable with the second mating structure to connect the interconnect so that, when connected, the first electrode, the thin film dielectric, and the second electrode form a thin film capacitor between the first media and the second media and connect the first signal channel and the second signal channel to form a connected signal channel.

A capacitor 1a includes a metallic tantalum 10, an electric conductor 20, and an oxidized tantalum film 30. The oxidized tantalum film 30 is disposed between the metallic tantalum 10 and the electric conductor 20, where the oxidized tantalum film 30 is in contact with the metallic tantalum 10. The oxidized tantalum film 30 includes a first portion 31 containing fluorine, and a second portion 32. The second portion 32 is located closer to the metallic tantalum 10 than the first portion 31 in a thickness direction of the oxidized tantalum film 30. And a fluorine concentration at the second portion 32 is lower than a fluorine concentration at the first portion 31.

A method of electrically connecting a wire to a connection pad of a flexible circuit strip using a joining tool, which method comprising: receiving the flexible circuit strip on a support surface, wherein the flexible circuit strip includes a plurality of electrodes, a plurality of connection pads and conductive traces connecting each of the plurality of electrodes to a connection pad of the plurality of connection pads; positioning a joining tool over a first connection pad of the flexible circuit strip; monitoring a first capacitance between said joining tool and a conductive layer positioned under the connection pads, wherein said conductive layer is sized, shaped, and positioned to extend over a footprint of said plurality of connection pads; controllably lowering said joining tool toward said first connection pad until the first capacitance reaches a first predefined capacitance threshold, wherein said first predefined capacitance threshold defines a first height of said joining tool with respect to said flexible circuit strip; monitoring a second capacitance between a first electrode electrically connected to said first connection pad and said joining tool; controllably lowering said joining tool from said first height until said second capacitance reaches a second predefined capacitance threshold, wherein said second predefined capacitance threshold defines a second height of said joining tool with respect to said first connection pad; and activating said joining tool to electrically connect said first connection pad to said wire.

The present disclosure relates to a printed circuit board including: a glass layer; a first wiring layer disposed on an upper surface of the glass layer; and a capacitor including a plurality of blind holes penetrating through a portion of the glass layer from an upper surface to a lower surface of the glass layer, respectively, a first electrode layer disposed on the upper surface of the glass layer and extending into each of the plurality of blind holes, a second electrode layer disposed on the first electrode layer and disposed in each of the plurality of blind holes, and a first dielectric layer disposed between the first and second electrode layers.

A circuit board structure includes a glass substrate, a plurality of conductive penetration structures, a first conductive layer, a first insulating layer, a second conductive layer and a plurality of passive components. The conductive penetration structures are disposed on the rigid substrate of the glass substrate. The first conductive layer is disposed on the glass substrate. The first conductive layer includes a plurality of first conductive traces and a plurality of first conductive patterns. One of the first conductive traces is electrically connected to one of the conductive penetration structures, and one of the first conductive patterns is electrically connected to one of the first conductive traces. The first insulating layer is disposed on the glass substrate to cover the first conductive layer. The second conductive layer is disposed on the first insulating layer, and the second conductive layer includes a plurality of second conductive patterns.

A directional coupler according to various embodiment and an electronic device having the same are provided. The directional coupler includes a first layer having at least one conductive portion, a second layer disposed adjacent to the first layer in a first direction and having at least one conductive plate corresponding to the conductive portion of the first layer, a third layer disposed adjacent to the second layer in the first direction and including an RF signal transmission line, a fourth layer disposed adjacent to the third layer in the first direction and having a conductive line wound with at least one turn, and at least one conductive via electrically connecting the at least one conductive plate of the second layer and the conductive line of the fourth layer which is wound with at least one turn.

An apparatus for retrofitting a HID lighting system includes using existing components of previously installed HID lighting systems such as its ballasts while replacing some capacitors to adjust the power supplied to a retrofit LED luminaire. Unused ballast drivers are removed, and a self-contained ballast driver assembly is mounted into the electronic control enclosure of the previously installed lighting system. Some of the retrofit LED luminaires include an uplighting lens, an optic, or a diffuser for providing uplight. An aiming bracket and an aiming plate allow for the horizontal aiming angle of a light luminaire to be set.