280results about "Printed capacitor incorporation" patented technology

A voltage converting circuit comprises a multi-layer printed-circuit-board stack having an input terminal and a reference terminal, first and second switching elements connected to each other at an output terminal and a parallel-plate capacitor connected with the first and the second switching elements; the stack comprises a top conductive layer provided with said input, reference and output terminals and with a plurality of power-conducting traces, a first and a second metal plane forming said electrodes of the parallel-plate capacitor, a first and a second signal layer having first and second signal-routing traces, wherein the first and the second metal plane are arranged between the top conductive layer and two signal layers, and wherein the top conductive layer and the first metal plane are separated from each other by an insulating layer of the stack only.

A control device configured for use in a load control system to control one or more electrical loads may comprise an actuation member having a front surface defining a touch sensitive surface configured to detect a point actuation along at least a portion of the front surface, a touch sensitive circuit, and a control circuit. The touch sensitive device may comprise one or more receiving capacitive touch pads located behind the actuation member and arranged in a linear array adjacent to the touch sensitive surface. The control circuit may be configured to operate using different filtering techniques based on the state / mode of the control device and / or based on whether the positions of point actuations by a user along the touch sensitive surface indicate a fine tune or gross adjustment by the user. For example, the control circuit may generate an output signal using light / no filtering or using heavy filtering.

A wiring board includes a glass substrate having first and second surfaces and provided with through-holes; a first conductor layer including a first copper layer facing the first surface and a hydrofluoric acid resistant metal layer interposed between them, and covering openings of the through-holes on the first surface side, the first conductor layer having recesses at positions of the through-holes in a surface on the glass substrate side, each recess having an opening with a contour wider than and surrounding the opening of the corresponding through-hole on the first surface side; and a second conductor layer including an adhesion layer covering the side walls of the through-holes, inner surfaces of the recesses, and regions of the second surface surrounding the openings of the through-holes on the second surface side, a seed layer provided on the adhesion layer, and a second copper layer provided on the seed layer.

Aspects of the disclosure relate to a method of forming an article including: combining first and second chemical components that are reactive with each other to form a coreactive composition; depositing the coreactive composition to form a conductive portion of an article; wherein, 48 hours after depositing, the conductive portion comprises: a tensile modulus of at least 5 MPa; and an electrical conductivity of at least 2 S / m; wherein the coreactive composition comprising: a solvent content less than 5 wt %; and a conductive filler content effective for the conductive portion to reach the electrical conductivity of at least 2 S / m.

A multilayer filter according to an embodiment comprises: first and second ground layers; a plurality of conductive pattern layers stacked vertically between the first and second ground layers; a dielectric layer disposed between the first and second ground layers and the plurality of conductive pattern layers; and vias passing through the dielectric layer and connecting each of the first and second ground layers and the plurality of conductive pattern layers, wherein each of the plurality of conductive pattern layers includes an inductance pattern layer forming a plurality of inductors, the other parts of the plurality of conductive pattern layers include capacitance pattern layers facing each other vertically and facing each of the first and second ground layers to form a plurality of capacitors, and the plurality of inductors and the plurality of capacitors are connected vertically and horizontally using the vias. Therefore, the multilayer filter can filter a signal having a desired frequency band.

An apparatus for retrofitting an HID lighting system includes using existing components of a previously installed HID lighting system, such as a ballast thereof, while replacing some capacitors to regulate the power supplied to the retrofit LED lighting fixture. The unused ballast driver is removed and the independent ballast driver assembly is installed into the electronic control housing of the previously installed lighting system. Some retrofit LED lighting fixtures include upward illumination lenses, optics, or diffusers for providing upward illumination. The aiming support and the aiming plate can be used for setting the horizontal aiming angle of the lamp.

Disclosed in the present invention is a filter circuit. A first PCB layer consists of a power line, a power interface, a second filter capacitor, and a first filter capacitor; the power line comprises a power supply network and a GND network; the second PCB layer is provided with a conductor plane; the power interface is connected to the GND network and is further connected to the conductor plane; the GND network, the second filter capacitor, and the conductor plane are sequentially connected; the power supply network, the first filter capacitor, and the conductor plane are sequentially connected. The circuit design of the circuit structure and the overall layout design idea in the present invention have a good suppression effect on common-mode noise, differential mode noise, radiation noise and conduction noise.

An apparatus for retrofitting a HID lighting system includes using existing components of previously installed HID lighting systems such as its ballasts while replacing some capacitors to adjust the power supplied to a retrofit LED luminaire. Unused ballast drivers are removed, and a self-contained ballast driver assembly is mounted into the electronic control enclosure of the previously installed lighting system. Some of the retrofit LED luminaires include an uplighting lens, an optic, or a diffuser for providing uplight. An aiming bracket and an aiming plate allow for the horizontal aiming angle of a light luminaire to be set.

In order to obtain a high-frequency module with less warping, small size, and high connection reliability, a wiring substrate is provided, which has: a core material made of glass, having a first surface, a second surface opposite to the first surface, and a through-hole passing through the first surface to the second surface; a first adhesion layer formed so as to adhere to the first surface and an inner wall of the through-hole, and further block a bottom of the through-hole on the second surface side; a second adhesion layer adhering to the second surface and the first adhesion layer blocking the bottom of the through-hole on the second surface side; a first wiring layer laminated on the first adhesion layer; and a second wiring layer laminated on the second adhesion layer, wherein in a case where a total area of the first wiring layer is set as A, and an area occupied by copper in the first wiring layer is set as B, a residual copper rate C of the first wiring layer is represented by C=B / A (%), C=70-100%, and a Young's modulus of a material of the first adhesion layer is 0.1-0.85 times a Young's modulus of a material of the first wiring layer.

An apparatus for retrofitting a HID lighting system includes using existing components of previously installed HID lighting systems such as its ballasts while replacing some capacitors to adjust the power supplied to a retrofit LED luminaire. Unused ballast drivers are removed, and a self-contained ballast driver assembly is mounted into the electronic control enclosure of the previously installed lighting system. Some of the retrofit LED luminaires include an uplighting lens, an optic, or a diffuser for providing uplight. An aiming bracket and an aiming plate allow for the horizontal aiming angle of a light luminaire to be set.

An apparatus having at least one interconnect is provided. In one aspect, an apparatus includes a first media providing a first signal channel, a second media providing a second signal channel, and an interconnect. The interconnect includes a first mating structure that includes a first electrode mounted to the first media and a thin film dielectric disposed on the first electrode. The interconnect also includes a second mating structure having a second electrode mounted to the second media. The first mating structure is connectable with the second mating structure to connect the interconnect so that, when connected, the first electrode, the thin film dielectric, and the second electrode form a thin film capacitor between the first media and the second media and connect the first signal channel and the second signal channel to form a connected signal channel.

A capacitor 1a includes a metallic tantalum 10, an electric conductor 20, and an oxidized tantalum film 30. The oxidized tantalum film 30 is disposed between the metallic tantalum 10 and the electric conductor 20, where the oxidized tantalum film 30 is in contact with the metallic tantalum 10. The oxidized tantalum film 30 includes a first portion 31 containing fluorine, and a second portion 32. The second portion 32 is located closer to the metallic tantalum 10 than the first portion 31 in a thickness direction of the oxidized tantalum film 30. And a fluorine concentration at the second portion 32 is lower than a fluorine concentration at the first portion 31.

A circuit board structure includes a glass substrate, a plurality of conductive penetration structures, a first conductive layer, a first insulating layer, a second conductive layer and a plurality of passive components. The conductive penetration structures are disposed on the rigid substrate of the glass substrate. The first conductive layer is disposed on the glass substrate. The first conductive layer includes a plurality of first conductive traces and a plurality of first conductive patterns. One of the first conductive traces is electrically connected to one of the conductive penetration structures, and one of the first conductive patterns is electrically connected to one of the first conductive traces. The first insulating layer is disposed on the glass substrate to cover the first conductive layer. The second conductive layer is disposed on the first insulating layer, and the second conductive layer includes a plurality of second conductive patterns.

A directional coupler according to various embodiment and an electronic device having the same are provided. The directional coupler includes a first layer having at least one conductive portion, a second layer disposed adjacent to the first layer in a first direction and having at least one conductive plate corresponding to the conductive portion of the first layer, a third layer disposed adjacent to the second layer in the first direction and including an RF signal transmission line, a fourth layer disposed adjacent to the third layer in the first direction and having a conductive line wound with at least one turn, and at least one conductive via electrically connecting the at least one conductive plate of the second layer and the conductive line of the fourth layer which is wound with at least one turn.

An apparatus for retrofitting a HID lighting system includes using existing components of previously installed HID lighting systems such as its ballasts while replacing some capacitors to adjust the power supplied to a retrofit LED luminaire. Unused ballast drivers are removed, and a self-contained ballast driver assembly is mounted into the electronic control enclosure of the previously installed lighting system. Some of the retrofit LED luminaires include an uplighting lens, an optic, or a diffuser for providing uplight. An aiming bracket and an aiming plate allow for the horizontal aiming angle of a light luminaire to be set.

An earphone device includes a housing subassembly, an inner casing subassembly, an audio processor, and a force sensor patch. The inner casing subassembly is disposed in the housing subassembly and integrated with a printed circuit board having specific electrode(s). The audio processor is disposed on the printed circuit board. The force sensor patch is pasted onto specific electrode(s) of the printed circuit board to be coupled to the audio processor through specific electrode(s). The force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.

The invention provides a circuit board, a semiconductor module and a semiconductor system. A circuit board includes: an insulating layer configured to have a first surface and a second surface opposite to each other; a first terminal on the first surface of the insulating layer and configured to include a first signal terminal and a second signal terminal; and a first floating pattern embedded in the insulating layer, configured to have a region overlapping each of the first signal terminal and the second signal terminal, and electrically disconnected from the first signal terminal and the second signal terminal.

The invention relates to an integrated passive component and a method for manufacturing the integrated passive component. The integrated passive component has an upper surface and a lower surface facing opposite directions to each other. The integrated passive component includes: an insulating film having a first surface facing in the same direction as the upper surface and a second surface facing in the same direction as the lower surface; a capacitor disposed in the insulating film; and a multilayer wiring structure disposed on the first surface of the insulating film. The multilayer wiring structure includes a plurality of resin layers and a plurality of wiring layers alternately stacked, each of the plurality of wiring layers including a plurality of wirings, at least a portion of the plurality of wirings constituting an inductor. The insulating film includes an inorganic material layer composed of an inorganic insulating material, and a thickness of the inorganic material layer is thinner than a sum of thicknesses of each of the plurality of resin layers of the multilayer wiring structure. The second surface of the insulating film constitutes the lower surface of the integrated passive component.

A power converter module includes a multilayer printed circuit board, a switching device, a controlling device and a capacitor device. The switching device includes two switching circuit combinations. Each of the switching circuit combinations includes two switching circuits connected in parallel. Each of the switching circuits includes a switching unit. Each of the switching circuits extracts charges from different capacitors. The controlling device is configured for outputting a first control signal and a second control signal to control the switching circuits of the first switching circuit combination and the switching circuits of the second switching circuit combination respectively. The first control signal and the second control signal are out of phase with each other. On a direction, the switching units of the first switching circuit combinations and the switching units of the second switching circuit combinations are alternately arranged.

A surface mount transmission line capacitor can have excellent high frequency performance characteristics. The surface mount transmission line capacitor can include a monolithic substrate having a surface, a first electrode formed over the surface, a second electrode arranged over the first electrode, a dielectric layer arranged between the first electrode and second electrode, a first terminal layer exposed along the surface of the substrate and electrically connected with the first electrode, and a second terminal layer exposed along the surface of the substrate and electrically connected with the second electrode. The first terminal layer and the second terminal layer can be contained within a perimeter of the surface of the monolithic substrate.

An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface for a processor substrate at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage at the first main side of the electrically insulating material.

In an aspect, an IC device may include a base substrate including an embedded component and a first metallization structure. The first metallization structure includes a plurality of first metal layers, a plurality of first dielectric layers, a plurality of first vias configured to couple adjacent metal layers of the plurality of first metal layers through the plurality of first dielectric layers and a reserve capacitor disposed within one of the plurality of first dielectric layers. The reserve capacitor directly coupled between a first contact pad and a second contact pad formed in one of the plurality of first metal layers, and electrically coupled to the embedded component.

The present invention relates to an electronic power card (1) comprising - a capacitive laminated bus bar (2) in the form of a first stack of two layers of metal, in particular copper, namely a so-called inner metal layer and a so-called outer metal layer (4) separated from each other by a first layer of electrically insulating material, - a layer of thermal interface material arranged between said first stack and a metal sole, - an integrated current sensor comprising a magnetic flux concentrator (9) which is inserted into openings made in the metal sole, said magnetic flux concentrator (9) containing a second stack of layers comprising a second layer of electrically insulating material, a layer of material conductive to the current to be measured, a printed circuit called PCB, and a current measuring component. Figure for the abstract: Fig 2

The invention relates to a sensor (1) for distance or position measurement, in particular a capacitive or inductive or eddy current effect-based sensor (1), comprising a carrier (3) and a sensor element (2) arranged on or integrated into the carrier (3), in order to achieve reliable measurement performance under a very wide variety of environmental conditions using structurally simple means, the sensor is designed and further improved in such a way that the carrier (3) has a hydrocarbon ceramic laminate, is designed on the basis of a hydrocarbon ceramic laminate, or consists of a hydrocarbon ceramic laminate.

The present invention provides a method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes or post to form one or more high surface area capacitive device for monolithic system level integration on a glass substrate.

An integrated passive component has upper and lower surfaces facing in mutually opposite directions. The integrated passive component includes an insulating film having a first surface facing in the same direction as the upper surface and a second surface facing in the same direction as the lower surface; a capacitor in the insulating film; and a multilayer wiring structure on the first surface. The multilayer wiring structure includes resin layers and wiring layers, the resin and wiring layers being alternately stacked, each of the wiring layers includes wiring lines, and at least a portion of the wiring lines constitutes an inductor. The insulating film includes an inorganic material layer made of an inorganic insulating material, and a thickness of the inorganic material layer is smaller than a sum of a thickness of each of the resin layers. The second surface of the insulating film constitutes the lower surface.

This capacitor 1a comprises a metal tantalum 10, a conductor 20, and a tantalum oxide film 30. The tantalum oxide film 30 is disposed in contact with the metal tantalum 10, and is disposed between the metal tantalum 10 and the conductor 20. The tantalum oxide film 30 includes a first part 31 and a second part 32 containing fluorine. The second part 32 exists at a position closer to the metal tantalum 10 than the first part 31 in the thickness direction of the tantalum oxide film 30. Additionally, the concentration of fluorine in the second part 32 is lower than the concentration of fluorine in the first part 31.

The invention relates to a capacitor bank structure, a semiconductor package structure and a manufacturing method thereof. A capacitor bank structure includes: a capacitor including a plurality of first electrodes and a plurality of second electrodes opposite the plurality of first electrodes; a plurality of conductive pads electrically connected to the capacitor; a first protective material covering sidewalls of the capacitor and the plurality of conductive pads; and a second protective material covering the first protective material and a sidewall of the first electrode, in which a material of the first protective material is different from a material of the second protective material.

Coated, printed electronic device comprising the following: several contact points (104) arranged in a pattern, several electrode tracks (106) arranged in a different pattern, the several electrode tracks comprising a set of lower electrode tracks (106f-j) and a set of upper electrode tracks (106a-e), each electrode track being electrically connected to an associated contact point (104a-j) of the several contact points, several memory cells (108), each memory cell being arranged at an intersection of a pair of electrode tracks of the several electrode tracks and comprising a lower electrode layer (112) formed from a region of one of the lower electrode tracks, an upper electrode layer (110) formed from a region of one of the upper electrode tracks and a ferroelectric layer between the lower and the upper electrode layer, and a protective layer (116) covering the multiple electrode tracks and extending laterally beyond each edge of each electrode track to provide a buffer zone surrounding each electrode track, the buffer zone extending from one end of each electrode track to cover a portion of each associated contact point in an overlap area, each contact point also having at least one uncovered edge.

The invention belongs to the field of electronic manufacturing, and relates to an AME plate, a composite plate, a laminated plate and a preparation method thereof.The AME plate is manufactured through the 3D printing technology and comprises a base plate, a first boss, a second boss and a third boss, the first boss, the second boss and the third boss are arranged on the base plate, and the base plate is provided with an exhaust hole and a centering positioning part; a first conductive connecting part is arranged on the bottom surface of the substrate, and a second conductive connecting part is arranged on the top surface of the substrate; the composite board is formed by bonding an AME board and a PCB, the laminated board is formed by laminating and bonding a plurality of composite boards, and the AME boards of two adjacent composite boards are connected through a conducting ring. The AME plate with the thickness of 0.6 mm is obtained through printing, the pressure resistance can reach 40.3 kilovolts, and the pressure resistance level of the AME plate is obviously superior to that of a plate with the same thickness in a traditional process.