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25092 results about "Input/output" patented technology

In computing, input/output or I/O (or, informally, io or IO) is the communication between an information processing system, such as a computer, and the outside world, possibly a human or another information processing system. Inputs are the signals or data received by the system and outputs are the signals or data sent from it. The term can also be used as part of an action; to "perform I/O" is to perform an input or output operation.

High speed memory control and I/O processor system

An input/output processor for speeding the input/output and memory access operations for a processor is presented. The key idea of an input/output processor is to functionally divide input/output and memory access operations tasks into a compute intensive part that is handled by the processor and an I/O or memory intensive part that is then handled by the input/output processor. An input/output processor is designed by analyzing common input/output and memory access patterns and implementing methods tailored to efficiently handle those commonly occurring patterns. One technique that an input/output processor may use is to divide memory tasks into high frequency or high-availability components and low frequency or low-availability components. After dividing a memory task in such a manner, the input/output processor then uses high-speed memory (such as SRAM) to store the high frequency and high-availability components and a slower-speed memory (such as commodity DRAM) to store the low frequency and low-availability components. Another technique used by the input/output processor is to allocate memory in such a manner that all memory bank conflicts are eliminated. By eliminating any possible memory bank conflicts, the maximum random access performance of DRAM memory technology can be achieved.
Owner:CISCO TECH INC

Clustered file management for network resources

Methods for operating a network as a clustered file system is disclosed. The methods involve client load rebalancing, distributed Input and Output (I/O) and resource load rebalancing. Client load rebalancing refers to the ability of a client enabled with processes in accordance with the current invention to remap a path through a plurality of nodes to a resource. Distributed I/O refers to the methods on the network which provide concurrent input/output through a plurality of nodes to resources. Resource rebalancing includes remapping of pathways between nodes, e.g. servers, and resources, e.g. volumes/file systems. The network includes client nodes, server nodes and resources. Each of the resources couples to at least two of the server nodes. The method for operating comprising the acts of: redirecting an I/O request for a resource from a first server node coupled to the resource to a second server node coupled to the resource; and splitting the I/O request at the second server node into an access portion and a data transfer portion and passing the access portion to a corresponding administrative server node for the resource, and completing at the second server nodes subsequent to receipt of an access grant from the corresponding administrative server node a data transfer for the resource. In an alternate embodiment of the invention the methods may additionally include the acts of: detecting a change in an availability of the server nodes; and rebalancing the network by applying a load balancing function to the network to re-assign each of the available resources to a corresponding available administrative server node responsive to the detecting act.
Owner:HEWLETT-PACKARD ENTERPRISE DEV LP

Wafer level stack structure for system-in-package and method thereof

A wafer level stack structure, including a first wafer including at least one first device chip of a first chip size, wherein each first device chip contains a first plurality of input / output (I / O) pads, a second wafer including at least one second device chip of a second chip size smaller than the first chip size, wherein each second device chip contains a second plurality of I / O pads, wherein the at least one second device chip is increased to the first chip size, wherein the first wafer and the second wafer are stacked, and wherein the first wafer and the second wafer are coupled to each other. A method of forming a wafer level stack structure, including forming a first wafer including at least one first device chip of a first chip size, wherein each first device chip contains a first plurality of input / output (I / O) pads, forming a second wafer including at least one second device chip of a second chip size smaller than the first chip size, wherein each second device chip contains a second plurality of I / O pads, wherein the at least one second device chip is increased to the first chip size, stacking the first wafer and the second wafer, and coupling the first wafer and the second wafer to each other. A system-in-package, including a wafer level stack structure including at least one first device chip with a first plurality of input / output (I / O) pads and at least one second device chip with a second plurality of I / O pads, and a common circuit board to which the wafer level stack structure is connected.
Owner:SAMSUNG ELECTRONICS CO LTD

Portable system for analyzing human gait

The invention is a portable gait analyzer comprising of at least one independent rear foot motion collection unit, at least one independent lower shank motion collection unit, plantar pressure collection unit, at least one processing and display unit, and a soft casing unit. A plurality of accelerometers, rate sensors, force sensor resistors, and pressure sensors provide for the acquisition of acceleration signals, angular velocity signals, foot force signals, and foot pressure signals to be processed. At least one central processing unit, a plurality of memory components, input/output components and ports, telemetry components, calibration components, liquid crystal displays components for the processing and outputting of three dimensional acceleration, angular velocity, tilt, and position. The rearfoot motion collection unit and lower shank motion collection unit interact with the processing and display unit to calculate rear foot kinematic data crucial to identify the motions of pronation and supination. The plantar pressure collection unit interacts with the processing and display unit to calculate plantar pressure data crucial to identify the center of pressure line and excessive and abnormal loads on the sole of the foot. These factors of rear-foot kinematics and plantar pressure lead to gait style identification.
Owner:ADVANCED MOTION TECH INC

Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same

A method to achieve a very low effective dielectric constant in high performance back end of the line chip interconnect wiring and the resulting multilayer structure are disclosed. The process involves fabricating the multilayer interconnect wiring structure by methods and materials currently known in the state of the art of semiconductor processing; removing the intralevel dielectric between the adjacent metal features by a suitable etching process; applying a thin passivation coating over the exposed etched structure; annealing the etched structure to remove plasma damage; laminating an insulating cover layer to the top surface of the passivated metal features; optionally depositing an insulating environmental barrier layer on top of the cover layer; etching vias in the environmental barrier layer, cover layer and the thin passivation layer for terminal pad contacts; and completing the device by fabricating terminal input/output pads. The method obviates issues such as processability and thermal stability associated with low dielectric constant materials by avoiding their use. Since air, which has the lowest dielectric constant, is used as the intralevel dielectric the structure created by this method would possess a very low capacitance and hence fast propagation speeds. Such structure is ideally suitable for high density interconnects required in high performance microelectronic device chips.
Owner:GLOBALFOUNDRIES INC

Semiconductor package and method for fabricating the same

Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed. An embodiment of a semiconductor package includes a semiconductor chip having a first major surface and a second major surface, the semiconductor chip being provided at the second major surface with a plurality of input / output pads; a circuit board including a resin substrate having a first major surface and a second major surface, a first circuit pattern formed at the first major surface and provided with a plurality of ball lands, a second circuit pattern formed at the second major surface and provided with a plurality of bond fingers connected with he ball lands by conductive via holes through the resin substrate, cover coats respectively coating the first and second circuit patterns while allowing the bond fingers and the ball lands to be exposed therethrough, and a central through hole adapted to receive the semiconductor chip therein; electrical conductors that electrically connect the input / output pads of the semiconductor chip with the bond fingers of the circuit board, respectively; a resin encapsulate that covers the semiconductor chip, the electrical conductors, and at least part of the circuit board; and, a plurality of conductive balls fused on the ball lands of the circuit board, respectively.
Owner:AMKOR TECH SINGAPORE HLDG PTE LTD

Novel massively parallel supercomputer

A novel massively parallel supercomputer of hundreds of teraOPS-scale includes node architectures based upon System-On-a-Chip technology, i.e., each processing node comprises a single Application Specific Integrated Circuit (ASIC). Within each ASIC node is a plurality of processing elements each of which consists of a central processing unit (CPU) and plurality of floating point processors to enable optimal balance of computational performance, packaging density, low cost, and power and cooling requirements. The plurality of processors within a single node may be used individually or simultaneously to work on any combination of computation or communication as required by the particular algorithm being solved or executed at any point in time. The system-on-a-chip ASIC nodes are interconnected by multiple independent networks that optimally maximizes packet communications throughput and minimizes latency. In the preferred embodiment, the multiple networks include three high-speed networks for parallel algorithm message passing including a Torus, Global Tree, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance. For particular classes of parallel algorithms, or parts of parallel calculations, this architecture exhibits exceptional computational performance, and may be enabled to perform calculations for new classes of parallel algorithms. Additional networks are provided for external connectivity and used for Input / Output, System Management and Configuration, and Debug and Monitoring functions. Special node packaging techniques implementing midplane and other hardware devices facilitates partitioning of the supercomputer in multiple networks for optimizing supercomputing resources.
Owner:INT BUSINESS MASCH CORP

Symmetrically and asymmetrically stacked transistor group RF switch

A silicon-on-insulator (SOI) RF switch adapted for improved power handling capability using a reduced number of transistors is described. In one embodiment, an RF switch includes pairs of switching and shunting stacked transistor groupings to selectively couple RF signals between a plurality of input / output nodes and a common RF node. The switching and shunting stacked transistor groupings comprise one or more MOSFET transistors connected together in a “stacked” or serial configuration. In one embodiment, the transistor groupings are “symmetrically” stacked in the RF switch (i.e., the transistor groupings all comprise an identical number of transistors). In another embodiment, the transistor groupings are “asymmetrically” stacked in the RF switch (i.e., at least one transistor grouping comprises a number of transistors that is unequal to the number of transistors comprising at least one other transistor grouping). The stacked configuration of the transistor groupings enable the RF switch to withstand RF signals of varying and increased power levels. The asymmetrically stacked transistor grouping RF switch facilitates area-efficient implementation of the RF switch in an integrated circuit. Maximum input and output signal power levels can be withstood using a reduced number of stacked transistors.
Owner:PSEMI CORP
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