44 results about "FOUP" patented technology

The invention relates to the technical field of semiconductor process equipment, and discloses a front opening type interface mechanical unit device of semiconductor process equipment, which comprises a door opening unit, the door opening unit comprises an outer frame and a fourth extraction opening connected to the outer frame, one side of the outer frame is connected with a fifth flexible sealing element, and the other side of the outer frame is connected with a second flexible sealing element. The other end of the fifth flexible sealing piece is connected with an inner frame, one end of the inner frame is connected with a first guide shaft and is slidably installed on the outer frame, the other end of the inner frame is connected with a frame driving mechanism and is fixedly installed on the outer frame, and the inner portion of the inner frame is connected with a sixth flexible sealing piece. The other end of the sixth flexible sealing piece is connected with an unlocking plate; the problems that in the prior art, particles generated in the working process of a front open type interface mechanical unit are difficult to effectively control, and an FOUP inner cavity and a process cavity can be polluted are solved.

The application discloses a loading and unloading chamber of a semiconductor process equipment and the semiconductor process equipment, and relates to the semiconductor field. The loading and unloading chamber of the semiconductor process equipment comprises a mounting main plate, a sealing cover and a lock releasing mechanism. The sealing cover is movably arranged on one side of the mounting main plate in a first direction. A sealing shell is arranged in the sealing cover, and the sealing shell is movable relative to the sealing cover in a second direction. The lock releasing mechanism comprises a lock releasing component, the lock releasing component is arranged in the sealing shell, and a lock releasing end of the lock releasing component extends out of the sealing shell and is used for cooperating with a door plate of a wafer box. The first direction is parallel to the mounting main plate, and the second direction is perpendicular to the mounting main plate. The application can at least solve the problem that particles in a FIMS enter a FOUP and cause particle pollution.

The invention discloses a front open type wafer conveying box which comprises a box body with an opening in one side. The door plate is matched with the opening of the box body, and the door plate switch assembly is arranged on the door plate; and the air pressure balance unit is arranged on the door plate and / or the door plate switch assembly, and the door plate switch assembly is controlled to adjust the air pressure balance unit so as to adjust the internal air pressure and the external air pressure of the front open type wafer conveying box. According to the invention, the original air tightness of the FOUP is ensured, the internal and external air pressures of the FOUP are ensured to be consistent before the door is opened, the air holes are communicated only when the FOUP port is adsorbed on the machine table, and the outside is a dust-free environment in the machine table, so that the air holes are prevented from being directly exposed in the air, the possibility that external particles enter from the air holes is greatly reduced, and the service life of the FOUP is prolonged. The problem that an FOUP door cannot be opened due to thermal expansion and cold contraction of an existing FOUP is solved, and the wafer processing efficiency is guaranteed.

Even if the container is not rotated, the amount of deflection of the substrate in the container is calculated. The loading port (4) comprises a support frame (43), a loading part (44) for loading a FOUP (100) for accommodating a plurality of wafers (W), a scanning part (45) and a control part (46). The scanning unit (45) detects a first portion (Wb1), a second portion (Wb2), and a third portion (Wb3) of the end surface (Wb) of the wafer (W) while maintaining a fixed state in which the FOUP (100) is placed on the placement unit (44) and the angle of the FOUP (100) about the vertical axis with respect to the support frame (43) is fixed. The control unit (46) determines whether or not each wafer (W) is normally housed in the FOUP (100) by using the information on the first position of the first portion (Wb1) and the information on the second position of the second portion (Wb2). The control unit (46) calculates the amount of deflection in the vertical direction of the wafer (W) normally housed in the FOUP (100) by using the first position information, the second position information, or both, and the third position information of the third portion (Wb3).

A transport case is configured to hold a plurality of wafers for transport of the wafers. The transport case includes a sensor system configured to generate sensor data indicative of conditions within the transport case while the transport case is docked at a load / unload system of a semiconductor process tool. The transport case includes a communication system configured to transmit the sensor data from the sensor system to an external control system.

The invention provides an automatic dispatching method and an automatic dispatching system for cleaning wafer cassettes, which can be used for sorting the cleaning sequence of each wafer cassette in a list of wafer cassettes needing to be cleaned according to the requirements of an actual production line, the cleaning period of each wafer cassette type, the set cleaning priority and the current state of the wafer cassettes needing to be cleaned (FOUP). Therefore, under the condition that the capacity of the wafer box cleaning machine is insufficient, the wafer boxes can be automatically dispatched and cleaned according to the sequence, so that various types of wafer boxes required by a production line can be cleaned in time and timely, the normal operation of the production line is maintained, the condition of line breakage caused by insufficient empty wafer boxes in current shortage of the production line is avoided, and the production efficiency is improved. And meanwhile, manpower is saved, human participation is reduced, and cleaning errors are reduced.

This product is a front retainer removal tool for removing a front retainer for holding semiconductor wafers from the door body that constitutes the door set of a substrate storage container, such as a FOUP. As shown in the reference perspective view, this front retainer removal tool has a bent front part of the operating lever handle, on which a pair of left and right working claws that engage with the side plate of the front retainer are formed to protrude at a predetermined interval, a pair of left and right first pivot rollers that can contact the side plate of the front retainer are rotatably supported on both sides of the front part of the operating lever handle, and a second pivot roller that can contact the back surface of the door body is rotatably supported in the middle part of the operating lever handle.

The utility model discloses a support structure capable of preventing a wafer from drooping and a FOUP, the support structure comprises a main skeleton, a plurality of auxiliary supports and a plurality of extension tongues, the first sides of the plurality of auxiliary supports are respectively arranged on the two sides of the main skeleton, the plurality of extension tongues are uniformly installed on the main skeleton, the extension tongues contact the bottom of the wafer and support the wafer, and the first sides of the plurality of auxiliary supports and the second sides of the plurality of auxiliary supports are respectively arranged on the two sides of the main skeleton. Therefore, the wafer is prevented from sagging, and the reject ratio on a production line is effectively reduced.

As a conveyance-container fall-off detection device, a FOUP lid fall-off detection device 3 comprises a reflector 32 disposed in the vicinity of a FOUP support base 12 of a load port 1, and a reflection-type optical sensor 311 disposed in the vicinity of a load port door 13, and is configured to receive, by the reflection-type optical sensor 311, reflected light L2 resulting from reflection by the reflector 32 of emission light L1 emitted obliquely from the reflection-type optical sensor 311; and detect, by the reflection-type optical sensor 311, the presence of a FOUP lid 22 which has fallen off at the undocking position. Accordingly, a conveyance-container fall-off detection device that can reliably detect fall-off of the conveyance-container lid during undocking and facilitates easy attachment to the load port is provided.

An interface device of a semiconductor process equipment, a wafer loading and unloading device comprising the interface device and the semiconductor process equipment, the interface device being used for connecting the wafer loading and unloading device of the semiconductor process equipment and a wafer transfer box, the interface device comprising: a main plate, the main plate being provided with an opening for transmitting a wafer; a shell, the shell being arranged at the opening of the main plate and being communicated with the opening; a panel, the panel being arranged at the opening and being capable of moving along a direction perpendicular to the main plate; a driving mechanism, the driving mechanism being arranged in the shell, the driving mechanism comprising a driving device and a sealing structure for accommodating the driving device, the center axis of the driving device being deviated from the center axis of the panel along the moving direction of the panel, the driving device being in transmission connection with the panel and being used for driving the panel to move to close or open the opening, the driving device being sealed in the sealing structure when the opening is opened. The interface device can avoid causing particle pollution to the internal environment of the FOUP connected therewith.

1. Name of the design product: full-automatic FOUP cleaning machine. 2. Use of the design product: used in the cleaning manufacturing process of FOUP. 3. Design points of the design product: in shape. 4. Picture or photo best indicating the design points: design 1 perspective view 1. 5. Design 1 is designated as the basic design.

A wafer load port is configured to load a FOUP, and the wafer load port has a mounting base, a load station, an opening part, a board, and a switch assembly. The load station is mounted on the top surface and is configured to load the FOUP. The opening part is mounted on a lateral side surface of the mounting base. An opening is formed through the opening part, and the opening is adjacent to the load station. The board may close the opening of the opening part. The switch assembly is mounted on the board and has a first embedding unit and a second embedding unit. The first embedding unit and the second embedding unit are located at different horizontal locations, and the first embedding unit and the second embedding unit are movable between a connection position and a waiting position.

A method includes retrieving a first front opening unified pod (FOUP) from a FOUP stocker utilizing an interface module equipped with a transfer module; transporting the retrieved first FOUP via the transfer module across a first path within the interface module to align the first FOUP with an available first load port of a process tool; loading the first FOUP on the first load port; delivering wafers from the first FOUP to the process tool via the first load port to initiate a wafer processing operation using the wafers.

This invention discloses a conveying control method, system, and industrial control computer for a FOUP conveying system. The conveying control method determines in real time whether a FOUP is placed on each conveying device used for docking with overhead cranes and / or with storage equipment. When a FOUP is determined to be placed on a conveying device, that conveying device is defined as the starting point. When the starting point is a conveying device used for docking with overhead cranes or with storage equipment, an optimal conveying path is determined based on the attributes configured for the corresponding object in a one- or two-dimensional map to convey the FOUP to a conveying device used for docking with storage equipment or overhead cranes. The conveying devices along the determined optimal conveying path are controlled to operate so that the FOUP is conveyed to the endpoint of the optimal conveying path. This invention eliminates the need to develop different control programs for different scenarios, greatly reducing development costs and improving equipment versatility.

The present invention provides an EFEM (Equipment Front End Module) device that can transport materials in a clean state, even when gas is circulated internally. [Solution] An EFEM apparatus 1 for transferring wafers, which are the objects to be transported, between a FOUP (Front-Opening Unified Pod) 41 and a processing apparatus using a transport robot 2 inside a housing 3, wherein the housing 3 has a transport space S11 that houses the transport robot 2, a gas processing space (chemical filter 7) that houses a gas processing apparatus, and a gas return space S12 that can return gas from the transport space S11 to the gas processing space. The transport space S11, the gas processing space, and the gas return space S12 are in communication to form a single sealed space CS and constitute a circulation path CL, and a plurality of fans 74, 75, 77 are provided in the circulation path CL to form a circulating flow.

Method for cleaning items used in the field of semiconductor manufacturing, especially semiconductor devices such as wafers and reticles, containers, especially carrier and / or storage pods such as FOUPs, FOSBs, EUV double pods, and surfaces, comprising a main cleaning process, wherein the main cleaning process is preceded by a pre-treatment process and / or followed by a post-treatment process.

The present application provides a container carrying device for storing articles such as FOUPs, reticle boxes, etc. in a dead zone space located in an upper portion of a semiconductor manufacturing apparatus constructed in a manufacturing plant, and a container storage system having the container carrying device. The container storage system includes a first storage unit provided at a side of a moving path of a transfer device that transfers containers containing substrates, and storing the containers; a second storage unit provided at a side of the first storage unit, and storing the containers; and a carrying unit that moves between the first storage unit and the second storage unit, and carries the containers stored in the first storage unit to the second storage unit.

This provides a load port that enhances the airtightness within the EFEM, reduces the amount of gas supplied to the EFEM, and improves wafer quality. [Solution] This device is provided adjacent to the wafer transport chamber and is used for loading and unloading wafers between the wafer transport chamber and the FOUP. It comprises a panel that forms part of the wall surface of the wafer transport chamber and has an opening formed to open the wafer transport chamber, a door for opening and closing the opening, a mounting platform on which the FOUP is placed with a lid that allows the internal space to be opened and closed facing the door and which can move back and forth toward the panel, and an O-ring provided along the periphery of the opening.

The utility model relates to the technical field of mechanical clamps, in particular to a Foup clamping device and picking and placing equipment, which comprises a base, two clamping plates, a limiting mechanism and a locking mechanism, the clamping plates are in an L shape, a sliding groove is formed between the bottom face of the base and the clamping plates, the locking mechanism comprises a linkage rod and two locking assemblies arranged on the two sides of the base, the two locking assemblies and the two clamping plates are arranged in a one-to-one correspondence mode, each locking assembly comprises a mounting base, an elastic piece and a locking block, and the bottom face of each mounting base is upwards concavely provided with a telescopic cavity. The locking blocks are slidably connected to the inner wall of the telescopic cavity in a lifting mode, the two ends of the elastic piece elastically abut against the top wall of the telescopic cavity and the top faces of the locking blocks correspondingly, the bottom ends of the locking blocks can stretch into the sliding grooves from top to bottom, extrusion slopes are arranged on the outer sides of the bottom ends of the locking blocks, and the two ends of the linkage rod are fixedly connected with the locking blocks of the two locking assemblies correspondingly. The Foup clamping device is simple in structure, low in cost, convenient to operate and good in Foup clamping stability.

A filter module includes an interface body and a filter retention body. A filter can be disposed between the filter retention body and a filter retainer joined to the filter retention body. The filter retention body can further include a valve. The filter retainer can be joined to the filter retention body by a snap fit, a press-fit, or a weld. The filter retainer can include stand-offs configured to contact the filter such that the filter is held away from the filter grill. The filter module can be used for providing purge in a wafer container such as a front opening unified pod (FOUP).

Disclosed are a method for manufacturing a purging plate supporting the supply of nitrogen gas into a FOUP, and a computing device using same, the method comprising the steps of: (a) providing a solid material to each of four regions on a predetermined plane and then generating a first adhesive solid material by using a predetermined adhesive supplied from a predetermined stimulus source, or providing the first adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source on the solid material to each of the four regions on the predetermined plane, so that four pipe-fitting coupling portions are generated as four first adhesive layers each having a first length, a first width, and a first height, wherein the four pipe-fitting coupling portions are generated by forming four 1-1 inner spaces in which each the four first adhesive layers are not generated to a 1-1 inner height of the first height, the 1-1 inner lengths and the 1-1 inner widths of the four 1-1 inner spaces being smaller than the first lengths and the first widths, and forming predetermined through-holes on at least some surfaces excluding an upper surface located at the upper portion corresponding to the first height; (b) after moving each of the four pipe-fitting coupling portions a distance corresponding to the first height in a direction away from the predetermined stimulation source, providing the solid material to the upper portions of the four pipe-fitting coupling portions corresponding to the first height, and then generating a second adhesive solid material by using the predetermined adhesive supplied from the predetermined stimulation source, or providing the second adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulation source on the solid material to each of the upper portions of the four pipe fitting-coupling portions corresponding to the first height, and laminating same, so that a second adhesive layer is generated to a second height, wherein the second adhesive layer is generated by forming, in portions continuous with the four 1-1 inner spaces of the four pipe-fitting coupling portions, four 1-2 inner spaces in which the second adhesive layer is not generated to a 1-2 inner height of the second height, the 1-2 inner lengths and the 1-2 inner widths of the four 1-2 inner spaces being smaller than the first lengths and the first widths, forming, in a direction away from each of the four pipe-fitting coupling portions from specific inner side surfaces among surfaces of the second adhesive layer surrounding the four 1-2 inner spaces, four gas pipes serving as four second inner spaces, each having a second inner length and a second inner width, and in which the second adhesive layer is not generated to a second inner height of the second height, the second inner height being smaller than the 1-2 inner height, and forming four first hollow portions defined from a central position spaced a predetermined distance apart from one of the two ends of each of the four gas pipes, the one end being distal to each of the four pipe fitting coupling portions; (c) after moving each of the four pipe-fitting coupling portions and the second adhesive layer a distance corresponding to the second height in a direction away from the predetermined stimulation source, providing the solid material to the upper portion of the second adhesive layer, and then generating a third adhesive solid material by using the predetermined adhesive supplied from the predetermined stimulation source, or providing the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulation source on the solid material to the upper portion of the second adhesive layer, and laminating same, so that a third adhesive layer is generated to a third height, wherein the third adhesive layer is generated by forming, to the third height, four FOUP coupling structures, each having four second hollow portion defined from the central position above the four first hollow portions.

The invention relates to the technical field of semiconductor advanced packaging and manufacturing, in particular to a double-verification error-proofing method and system integrating visual positioning and data comparison, and the method comprises the steps: S100, obtaining the actual physical slot position of each wafer based on a slot position image and a predefined FOUP slot position coordinate system; step S200, performing consistency verification on the bonding state, the inspection structure and the process flow data of the wafer based on a preset triple verification logic rule in an MES system to obtain a verification result; if the verification result is qualified, a qualification report is generated, and if the verification result is not qualified, the step S300 is carried out; and step S300, distinguishing an exception type according to a verification result, and then selecting an exception response mechanism according to the exception type. According to the invention, a closed-loop error-proofing system with physical positioning, logic verification and automatic deviation correction is established, so that the automation level and the quality guarantee capability of the wafer bonding process are improved.

The present invention relates to the field of semiconductor technology and specifically discloses an automated inspection method for front-loading wafer pod cleaning equipment. The method includes obtaining parameter information, configuring a control information code based on the parameter information, and binding the control information code to a front-loading wafer pod (FOUP) cleaning equipment. When the parameter conditions are met, an automated automated detection (AMA) system grabs the FOUP, binds the control information code to the FOUP, and uses a cleaning device to clean the FOUP. The method then pulls a batch of wafers, measures the wafers to obtain a first measurement value, obtains a data collection plan, and determines whether the wafers are abnormal based on the first measurement value. If abnormal, abnormality processing is performed; otherwise, the wafers are placed in a monitor pod. The method then measures again to obtain a second measurement value, calculates the difference between the second and first measurement values, and determines the inspection result of the cleaning device based on the difference. By configuring the control information code with various parameter information and binding the cleaning device and the front-loading wafer pod through the control information code, the cleaning device can be inspected in multiple dimensions.

The invention provides a semiconductor equipment FOUP cache system which can perform automatic loading and unloading and cache, so that the waiting time is shortened, and the utilization rate is further improved. The system comprises a multifunctional buffer area which has an FOUP temporary storage function and also integrates functions of automatic code scanning identification, intelligent scheduling and priority ranking; the intelligent scheduling system is used for calculating and optimizing a scheduling path and a cache sequence of the FOUP by monitoring the operation state of the semiconductor equipment and the circulation condition of the FOUP in real time; the automatic butt joint and carrying system comprises a high-precision positioning system, an automatic carrying robot and an intelligent butt joint device and automatically completes precise positioning, grabbing, carrying and releasing of the FOUP; standardized interfaces and communication protocols are arranged on a multifunctional cache region and a semiconductor device, and the interfaces not only support rapid and stable connection and disconnection of FOUP, but also can realize data exchange and instruction transmission with an upstream process, a downstream process and a central control system.

The present invention relates to an Equipment Front End Module (EFEM), and more specifically, to an EFEM comprising: a Front-Opening Unified Pod (FOUP) on which a substrate is loaded; a main body having a first space formed therein that communicates with the FOUP through a door and allows the transported substrate to stay there; a dehumidifier that dehumidifies by adsorbing moisture from a gas supplied to the first space onto a zeolite; a blower disposed spaced apart from the dehumidifier within the main body and supplying the dehumidified gas to the first space; and an internal circulation duct disposed on both sides inside the first space and providing a passage so that the gas can move and circulate to a second space formed between the dehumidifier and the blower, wherein the dehumidifier is disposed on the upper part of the main body.

The utility model relates to the technical field of taking and placing equipment, in particular to an FOUP taking and placing device used when an FOUP automatic storage bin breaks down. The ladder is arranged on one side of a base of an electric taking and placing device in the FOUP automatic storage bin, the lifting hanging device is detachably arranged on a cross rod of the ladder, the handheld FOUP clamping device is arranged on a lifting rope of the lifting hanging device, and the top end of the ladder is connected with a sky rail of the FOUP automatic storage bin in a sliding mode. According to the utility model, an operator can stand on the ladder to take out and hang down FOUP stored in the FOUP automatic storage bin in a power failure or fault state or hang up the FOUP and place the FOUP in the FOUP automatic storage bin in the power failure or fault state through the cooperation of the lifting hanging device and the handheld FOUP clamping device, so that the efficiency of taking and placing the FOUP is greatly improved; and the safety of taking and placing the FOUP by an operator is improved.

The present invention relates to a load port for correcting a mounting position of a FOUP and a method for correcting a mounting position of a FOUP, the load port comprising: a base member having a door; a frame member provided in a direction perpendicular to the base member; a mounting part which is provided on the frame member and on which the FOUP is mounted; a first sensing member which is provided on the frame member and senses a mounting state of the FOUP; a second sensing member which is provided in front of the frame member and senses an obstacle approaching the frame member; a moving member for moving the mounting part forward and backward; a rotating member for rotating the mounting part; and a control module for controlling driving of the moving member and the rotating member according to mounting state information of the FOUP sensed by the first sensing member and obstacle information sensed by the second sensing member, thereby correcting a mounting position of the FOUP to a normal mounting position.

The application relates to the technical field of semiconductor process equipment, and discloses a front opening unified pod (FOUP) mechanical unit device of semiconductor process equipment, which comprises an opening door unit, the opening door unit comprises an outer frame and a fourth air exhaust port connected to the outer frame, one side of the outer frame is connected with a fifth flexible sealing piece, the other end of the fifth flexible sealing piece is connected with an inner frame, one end of the inner frame is connected with a first guide shaft and is slidingly installed on the outer frame, the other end of the inner frame is connected with a frame driving mechanism and is fixedly installed on the outer frame, the inner frame is internally connected with a sixth flexible sealing piece, and the other end of the sixth flexible sealing piece is connected with an unlocking plate; the problem that particles generated in the working process of the front opening unified pod (FOUP) mechanical unit in the prior art cannot be effectively controlled and contaminate the inner cavity of the FOUP and a process chamber is solved.

The invention relates to a method for cleaning items, especially containers for transporting and / or storing wafers or reticles such as FOUPs or reticle pods, in a fab environment, comprising the steps of identification of a plurality of critical contaminants amongst the total contamination, especially in in a closed (mini) environment such as the interior of a container, after identifying the critical contaminants, choosing and / or optimizing a cleaning process with a view to suppressing at least one of the plurality of critical contaminants, especially until a predetermined first threshold level of the at least one of the critical contaminants has been reached, and after supressing the at least one of the plurality of the critical contaminants, reducing the overall contamination, especially comprising AMCs, VoCs etc, especially until a predetermined second threshold level of the overall contamination has been reached.

A filter module includes an interface body and a filter retention body. A filter can be disposed between the filter retention body and a filter retainer joined to the filter retention body. The filter retention body can further include a valve. The filter retainer can be joined to the filter retention body by a snap fit, a press-fit, or a weld. The filter retainer can include stand-offs configured to contact the filter such that the filter is held away from the filter grill. The filter module can be used for providing purge in a wafer container such as a front opening unified pod (FOUP).