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80 results about "FOUP" patented technology
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FOUP is an acronym for Front Opening Unified Pod or Front Opening Universal Pod. It is a specialised plastic enclosure designed to hold silicon wafers securely and safely in a controlled environment, and to allow the wafers to be transferred between machines for processing or measurement. FOUPs began to appear along with the first 300mm wafer processing tools in the mid 1990s. The size of the wafers and their comparative lack of rigidity meant that SMIF was not a viable technology. FOUPs were designed with the constraints of 300mm in mind, with the removable cassette being replaced by fins in the FOUP which hold the wafers in place, and the bottom opening door being replaced by a front opening door to allow robot handling mechanisms to access the wafers directly from the FOUP. The weight of a fully loaded 25 wafer FOUP at around 9 kilograms means that automated material handling systems are essential for all but the smallest of fabrication plants. To allow this, each FOUP has various coupling plates, pins and holes to allow the FOUP to be located on a load port, and to be manipulated by the AMHS (Automated Material Handling System). FOUPs may also contain RF tags that allow them to be identified by readers on tools, in the AMHS etc. FOUPs are available in several colors, depending on the customers wish. FOUPs and IC manufacturing equipment can have a nitrogen atmosphere, in an effort to increase device yield.
Wafer process link pollution source identification method based on FOUP inner interlayer AMC distribution
ActiveCN120408106AMolecular entity identificationSemiconductor/solid-state device manufacturingEnvironmental engineeringAtmospheric sciences
The invention discloses a wafer process link pollution source identification method based on FOUP inner interlayer AMC distribution, and relates to the technical field of pollution source identification, the method comprises the following steps: analyzing airflow disturbance and pollutant diffusion characteristics, formulating an external detector deployment strategy, and collecting pollutant concentration and associated equipment operation parameters in real time; establishing a space-time matrix of pollutant concentration, extracting gradient characteristics of pollutant concentration change by using wavelet transform, and obtaining initial position data of a pollution source in combination with operation parameters of associated equipment; constructing a space-time gridding input matrix, designing a double-branch deep learning model, generating a pollution source positioning probability graph, and obtaining position data of a pollution source; the contribution weight of each associated device to pollutant diffusion is evaluated, and a directional treatment strategy is formulated and executed. According to the invention, the position of the pollution source can be accurately positioned, and the accuracy and response speed of pollution source identification are improved.
Owner:CHINA APPLIED TECH CO LTD
FOUP internal AMC flow characteristic simulation method based on mechanism model
The invention provides an FOUP internal AMC flow characteristic simulation method based on a mechanism model, and relates to the technical field of semiconductors, and the method comprises the steps: building an FOUP mechanism model, and carrying out the grid processing of the FOUP mechanism model through a topological mapping segmentation method; selecting an initial AMC simulation point through grid importance analysis, and optimizing the initial AMC simulation point by using an ecological niche theory to obtain a simulation sampling point layout; and setting a boundary condition and an initial condition in combination with the actual working condition of the FOUP, and carrying out analogue simulation on the flow characteristics of the AMC in the FOUP based on the simulation sampling point layout to obtain an analogue simulation result. The FOUP internal AMC flow characteristic simulation method not only can effectively solve the simulation problem of FOUP internal AMC flow characteristics, but also can provide scientific basis and technical support for pollution control in the semiconductor manufacturing field, and has important engineering value and application prospect.
Owner:CHINA APPLIED TECH CO LTD
Glass core substrate FOUP carrying box
ActiveCN223253689UClosure with auxillary devicesDamagable goods packagingMechanical engineeringPhysics
The utility model relates to the technical field of glass core substrate production, in particular to a glass core substrate FOUP carrying box. The device comprises a box body, a cover plate and a base plate supporting mechanism, the base plate supporting mechanism is arranged in the box body, the cover plate is detachably connected to an opening in the front end of the box body, the base plate supporting mechanism comprises side edge supporting assemblies and a middle supporting assembly, and the two sides in the box body are each provided with a set of side edge supporting assemblies; a group of middle supporting assemblies are arranged in the middle in the box body, the side edge supporting assemblies and the middle supporting assemblies are of a multi-layer structure, and the side edge supporting assemblies and the middle supporting assemblies on each layer form a three-point contact mode to support the glass core substrate. According to the carrying box, the middle supporting set is additionally arranged, the situation that the middle of a large-size substrate collapses due to the fact that the large-size substrate is too long can be effectively prevented, and the stability of the substrate in the box body and the product quality are improved; a three-point contact mode is adopted among the middle support group, the lateral support group and the substrate, so that the contact area is reduced.
Owner:GUANGDONG ZHILIAN SEMICON EQUIP CO LTD
Door opening mechanism, loading and unloading chamber and semiconductor process equipment
PendingCN120341151ASemiconductor/solid-state device manufacturingConveyor partsProcess equipmentStructural engineering
The invention discloses a door opening mechanism, a loading and unloading chamber and semiconductor process equipment. The door opening mechanism comprises a cover opening assembly, a purging device, a driving mechanism and a mounting main board, the uncovering assembly is movably arranged on the installation main plate, a first opening is formed in the installation main plate, and the driving mechanism is used for driving the uncovering assembly to move to the position opposite to the first opening and make sealing contact with the edge of the first opening. Or the cover opening assembly is driven to move to the position staggered with the first opening; the installation main plate is provided with an air inlet channel and an air outlet channel, the blowing device is communicated with the inlet end of the air inlet channel, and the outlet end of the air inlet channel and the inlet end of the air outlet channel are both communicated with the first opening. According to the scheme, the problem that in the prior art, when the FOUP is purged through a pipeline, particles deposited in the cavity body are likely to be blown up, and then serious particle pollution is caused can be solved.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Front open type interface mechanical unit device of semiconductor process equipment
ActiveCN120955016ASemiconductor/solid-state device manufacturingVertical furnacesProcess equipmentSemiconductor
The invention relates to the technical field of semiconductor process equipment, and discloses a front opening type interface mechanical unit device of semiconductor process equipment, which comprises a door opening unit, the door opening unit comprises an outer frame and a fourth extraction opening connected to the outer frame, one side of the outer frame is connected with a fifth flexible sealing element, and the other side of the outer frame is connected with a second flexible sealing element. The other end of the fifth flexible sealing piece is connected with an inner frame, one end of the inner frame is connected with a first guide shaft and is slidably installed on the outer frame, the other end of the inner frame is connected with a frame driving mechanism and is fixedly installed on the outer frame, and the inner portion of the inner frame is connected with a sixth flexible sealing piece. The other end of the sixth flexible sealing piece is connected with an unlocking plate; the problems that in the prior art, particles generated in the working process of a front open type interface mechanical unit are difficult to effectively control, and an FOUP inner cavity and a process cavity can be polluted are solved.
Owner:BEIJING HEQI PRECISION TECH LTD
Load / Unload Chamber for Semiconductor Processing Equipment and Semiconductor Processing Equipment
ActiveCN119314895BSemiconductor/solid-state device manufacturingConveyor partsThermodynamicsProcess equipment
The application discloses a loading and unloading chamber of a semiconductor process equipment and the semiconductor process equipment, and relates to the semiconductor field. The loading and unloading chamber of the semiconductor process equipment comprises a mounting main plate, a sealing cover and a lock releasing mechanism. The sealing cover is movably arranged on one side of the mounting main plate in a first direction. A sealing shell is arranged in the sealing cover, and the sealing shell is movable relative to the sealing cover in a second direction. The lock releasing mechanism comprises a lock releasing component, the lock releasing component is arranged in the sealing shell, and a lock releasing end of the lock releasing component extends out of the sealing shell and is used for cooperating with a door plate of a wafer box. The first direction is parallel to the mounting main plate, and the second direction is perpendicular to the mounting main plate. The application can at least solve the problem that particles in a FIMS enter a FOUP and cause particle pollution.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Automatic detection method of front open type wafer transfer box cleaning equipment
ActiveCN120413459ASemiconductor/solid-state device testing/measurementCleaning processes and apparatusMechanical engineeringData harvesting
The invention relates to the technical field of semiconductors, and particularly discloses an automatic detection method of a front open type wafer transfer box cleaning device, which comprises the following steps: acquiring parameter information, configuring a control information code according to the parameter information, and binding the control information code to the front open type wafer transfer box (FOUP) cleaning device; when parameter conditions are met, the AMA system grabs the FOUP, control information codes are bound to the FOUP, and cleaning equipment is used for cleaning the FOUP; pulling a batch of wafers, measuring the wafers, obtaining a first measurement value, obtaining a data collection plan, determining whether the wafers are abnormal or not according to the first measurement value, if the wafers are abnormal, executing abnormality processing, and if the wafers are not abnormal, putting the wafers into Monitor Found; and measuring again to obtain a second measurement value, calculating a difference value between the second measurement value and the first measurement value, and determining a detection result of the cleaning equipment through the difference value. The control information codes are configured through various parameter information, and the cleaning equipment and the front open type wafer conveying box are bound through the control information codes, so that the cleaning equipment can be detected in multiple dimensions.
Owner:SHANGHAI XINGEKE SOFTWARE CO LTD
Load port
To provide a load port capable of realizing a low profile. A load port 1 on which a wafer-holding FOUP is placed and which is for loading / unloading wafers into / from a processing device includes a base 11 having an opening 11a which serves as a carry-in / carry-out port of the wafers to the processing device and opens in a front-rear direction; a door 12 that opens / closes the opening 11a; and a door moving mechanism 13 for moving the door 12. The door moving mechanism 13 includes a door lifting mechanism 20 that lowers the door 12 removed from the opening 11a. At least a part 20a of the door lifting mechanism 20 is arranged at a position to be side by side with at least a part of the opening 11a when the base 11 is viewed from the front.
Owner:SINFONIA TECHNOLOGY CO LTD
Front opening type wafer conveying box
The invention discloses a front open type wafer conveying box which comprises a box body with an opening in one side. The door plate is matched with the opening of the box body, and the door plate switch assembly is arranged on the door plate; and the air pressure balance unit is arranged on the door plate and / or the door plate switch assembly, and the door plate switch assembly is controlled to adjust the air pressure balance unit so as to adjust the internal air pressure and the external air pressure of the front open type wafer conveying box. According to the invention, the original air tightness of the FOUP is ensured, the internal and external air pressures of the FOUP are ensured to be consistent before the door is opened, the air holes are communicated only when the FOUP port is adsorbed on the machine table, and the outside is a dust-free environment in the machine table, so that the air holes are prevented from being directly exposed in the air, the possibility that external particles enter from the air holes is greatly reduced, and the service life of the FOUP is prolonged. The problem that an FOUP door cannot be opened due to thermal expansion and cold contraction of an existing FOUP is solved, and the wafer processing efficiency is guaranteed.
Owner:GEKKO SEMICON (SHANGHAI) CO LTD
Load port
Even if the container is not rotated, the amount of deflection of the substrate in the container is calculated. The loading port (4) comprises a support frame (43), a loading part (44) for loading a FOUP (100) for accommodating a plurality of wafers (W), a scanning part (45) and a control part (46). The scanning unit (45) detects a first portion (Wb1), a second portion (Wb2), and a third portion (Wb3) of the end surface (Wb) of the wafer (W) while maintaining a fixed state in which the FOUP (100) is placed on the placement unit (44) and the angle of the FOUP (100) about the vertical axis with respect to the support frame (43) is fixed. The control unit (46) determines whether or not each wafer (W) is normally housed in the FOUP (100) by using the information on the first position of the first portion (Wb1) and the information on the second position of the second portion (Wb2). The control unit (46) calculates the amount of deflection in the vertical direction of the wafer (W) normally housed in the FOUP (100) by using the first position information, the second position information, or both, and the third position information of the third portion (Wb3).
Owner:SINFONIA TECHNOLOGY CO LTD
Novel monitor function with robot arm and foup
PendingUS20260052938A1Semiconductor/solid-state device manufacturingManipulatorWaferingCommunications system
A transport case is configured to hold a plurality of wafers for transport of the wafers. The transport case includes a sensor system configured to generate sensor data indicative of conditions within the transport case while the transport case is docked at a load / unload system of a semiconductor process tool. The transport case includes a communication system configured to transmit the sensor data from the sensor system to an external control system.
Owner:TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
Automatic dispatching method and automatic dispatching system for wafer cassette cleaning
The invention provides an automatic dispatching method and an automatic dispatching system for cleaning wafer cassettes, which can be used for sorting the cleaning sequence of each wafer cassette in a list of wafer cassettes needing to be cleaned according to the requirements of an actual production line, the cleaning period of each wafer cassette type, the set cleaning priority and the current state of the wafer cassettes needing to be cleaned (FOUP). Therefore, under the condition that the capacity of the wafer box cleaning machine is insufficient, the wafer boxes can be automatically dispatched and cleaned according to the sequence, so that various types of wafer boxes required by a production line can be cleaned in time and timely, the normal operation of the production line is maintained, the condition of line breakage caused by insufficient empty wafer boxes in current shortage of the production line is avoided, and the production efficiency is improved. And meanwhile, manpower is saved, human participation is reduced, and cleaning errors are reduced.
Owner:SIEN (QINGDAO) INTEGRATED CIRCUITS CO LTD
FOUP transfer device
ActiveUS12327746B2ConveyorsSemiconductor/solid-state device manufacturingCommunication devicePhysics
Provided is a FOUP transfer device for transferring FOUPs between load ports and which is capable of reducing remodeling work on a pre-installed conveyance device as much as possible. FOUP transfer devices 1-1, 1-2 are installed in the vicinity of the load ports of the conveyance device, comprising one or more load ports 18-1, 18-2, and transfer FOUPs 3 between the load ports 18-1, 18-2. The FOUP transfer devices 1-1, 1-2 have first optical I / O communication devices 31-3, 31-4 and are configured such that second optical I / O communication devices 31-1, 31-2 provided for the load ports 18-1, 18-2 are connected thereto, and so as to carry out, in place of the load ports 18-1, 18-2, the optical I / O communication carried out between the load ports 18-1, 18-2 and an OHT cart 11.
Owner:RORZE CORP
Front retainer removal tool
This product is a front retainer removal tool for removing a front retainer for holding semiconductor wafers from the door body that constitutes the door set of a substrate storage container, such as a FOUP. As shown in the reference perspective view, this front retainer removal tool has a bent front part of the operating lever handle, on which a pair of left and right working claws that engage with the side plate of the front retainer are formed to protrude at a predetermined interval, a pair of left and right first pivot rollers that can contact the side plate of the front retainer are rotatably supported on both sides of the front part of the operating lever handle, and a second pivot roller that can contact the back surface of the door body is rotatably supported in the middle part of the operating lever handle.
Owner:SHIN ETSU POLYMER CO LTD
Semiconductor wafer pick-and-place device and pick-and-place method
ActiveCN120413486ASemiconductor/solid-state device manufacturingConveyor partsLaser detectionMechanical engineering
The invention provides a semiconductor wafer pick-and-place device and a pick-and-place method, and belongs to the technical field of semiconductor pick-and-place, and the device comprises a laser detection module which is used for scanning a pick-and-place port and a related area in an FOUP where a wafer is located based on a three-dimensional laser irradiator; the adjustment analysis module is used for carrying out unit length cutting in the central axis direction of the taking and placing piece routing path, analyzing each cutting unit and determining whether the fingertip span needs to be adjusted or not; the action adjusting module is used for determining a safe pick-and-place starting position according to the wafer deformation condition, controlling a fingertip to execute pick-and-place actions according to a pick-and-place piece routing path, monitoring the pick-and-place actions executed by the fingertip in real time, adjusting the pick-and-place actions if the position and shape of the wafer are changed, and controlling the rhythm of lifting the wafer by the fingertip in combination with the distance difference of supporting points; and the verification module is used for controlling the laser detection module to perform scanning verification again after taking and placing are completed. And the wafer taking and placing yield is improved.
Owner:SHANGHAI WEIFU SEMICON EQUIP CO LTD
Supporting structure capable of preventing wafer from sagging and FOUP
ActiveCN223598704USemiconductor/solid-state device manufacturingConveyor partsProduction lineFailure rate
The utility model discloses a support structure capable of preventing a wafer from drooping and a FOUP, the support structure comprises a main skeleton, a plurality of auxiliary supports and a plurality of extension tongues, the first sides of the plurality of auxiliary supports are respectively arranged on the two sides of the main skeleton, the plurality of extension tongues are uniformly installed on the main skeleton, the extension tongues contact the bottom of the wafer and support the wafer, and the first sides of the plurality of auxiliary supports and the second sides of the plurality of auxiliary supports are respectively arranged on the two sides of the main skeleton. Therefore, the wafer is prevented from sagging, and the reject ratio on a production line is effectively reduced.
Owner:WUHU YIBAI VEHICLE PRECISION TECH CO LTD
Conveyance-container lid fall-off detection device, load port, and conveyance-container lid fall-off detection method
As a conveyance-container fall-off detection device, a FOUP lid fall-off detection device 3 comprises a reflector 32 disposed in the vicinity of a FOUP support base 12 of a load port 1, and a reflection-type optical sensor 311 disposed in the vicinity of a load port door 13, and is configured to receive, by the reflection-type optical sensor 311, reflected light L2 resulting from reflection by the reflector 32 of emission light L1 emitted obliquely from the reflection-type optical sensor 311; and detect, by the reflection-type optical sensor 311, the presence of a FOUP lid 22 which has fallen off at the undocking position. Accordingly, a conveyance-container fall-off detection device that can reliably detect fall-off of the conveyance-container lid during undocking and facilitates easy attachment to the load port is provided.
Owner:SINFONIA TECHNOLOGY CO LTD
Interface device, wafer loading and unloading device, and semiconductor process equipment
An interface device of a semiconductor process equipment, a wafer loading and unloading device comprising the interface device and the semiconductor process equipment, the interface device being used for connecting the wafer loading and unloading device of the semiconductor process equipment and a wafer transfer box, the interface device comprising: a main plate, the main plate being provided with an opening for transmitting a wafer; a shell, the shell being arranged at the opening of the main plate and being communicated with the opening; a panel, the panel being arranged at the opening and being capable of moving along a direction perpendicular to the main plate; a driving mechanism, the driving mechanism being arranged in the shell, the driving mechanism comprising a driving device and a sealing structure for accommodating the driving device, the center axis of the driving device being deviated from the center axis of the panel along the moving direction of the panel, the driving device being in transmission connection with the panel and being used for driving the panel to move to close or open the opening, the driving device being sealed in the sealing structure when the opening is opened. The interface device can avoid causing particle pollution to the internal environment of the FOUP connected therewith.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Manufacturing method for reducing leakage between gates of NAND flash memory
The present invention discloses a manufacturing method for reducing leakage between word lines of a NAND flash memory, including: Step 1, providing a semiconductor substrate on which a gate structure has been fabricated. Step 2, loading the wafer into a first type of FOUP to complete: Step 21, depositing a nickel-platinum alloy. Step 22, performing a first silicidation annealing process. Step 23, removing the remaining nickel-platinum alloy. Step 3, loading the wafer into a second type of FOUP to complete: using the PECVD process to grow a second dielectric layer to seal the first trench and form an air gap. Step 4, loading the wafer into a first type of FOUP to complete: Step 41, performing a second silicidation annealing process. Step 42, performing a first wet cleaning process for replacing the FOUP. Step 5, loading the wafer into a second type of FOUP and completing: performing a third annealing on the second dielectric layer. The present invention can prevent the word lines formed by the polysilicon control gate connections of the memory cells from tilting, thereby reducing the leakage between the word lines.
Owner:SHANGHAI HUALI INTEGRATED CIRCUIT CORP
Full-automatic FOUP cleaning machine
1. Name of the design product: full-automatic FOUP cleaning machine. 2. Use of the design product: used in the cleaning manufacturing process of FOUP. 3. Design points of the design product: in shape. 4. Picture or photo best indicating the design points: design 1 perspective view 1. 5. Design 1 is designated as the basic design.
Owner:深圳市凯尔迪光电科技有限公司
FOUP Transfer Device
Provided is a FOUP transfer device that transfers a FOUP between a loading port, and the FOUP transfer device can minimize the modification work of a conveyor that has already been installed. The FOUP transfer devices (1-1, 1-2) are provided near the loading ports of a conveyor having one or more loading ports (18-1, 18-2), and transfer the FOUP 3 between the loading ports (18-1, 18-2). The FOUP transfer devices (1-1, 1-2) have first optical I / O communication devices (31-3, 31-4), and are arranged to be connected to second optical I / O communication devices (31-1, 31-2) of the loading ports (18-1, 18-2), so as to perform optical I / O communication between the loading ports (18-1, 18-2) and the OHT cart (11) instead of the above-mentioned loading ports (18-1, 18-2).
Owner:RORZE CORP
Systems and methods for humidity control of FOUP during semiconductor fabrication
ActiveUS12406869B2Semiconductor/solid-state device manufacturingConveyor partsHigh humidityMechanical engineering
The present disclosure relates to systems and methods for reducing the humidity within a FOUP (Front Opening Unified Pod) when loaded on an EFEM (Equipment Front End Module) for transfer of a semiconductor wafer substrate during fabrication processes. A deflector of specified structure is placed inside the EFEM above the load port of the FOUP. The deflector directs airflow in the EFEM away from the load port. The deflector includes a body with a plurality of apertures in the deflector body, and with a sloped front surface. Thus, the degree of penetration of high-humidity air from the EFEM into the FOUP is reduced.
Owner:TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
A FOUP automatic handling device that avoids wafer damage
ActiveCN119361493BSemiconductor/solid-state device manufacturingConveyor partsDual modeMechanical engineering
The present invention discloses a FOUP automatic handling device that avoids damage to wafers, comprising a main shell, a cover-sealed protective mechanism and a self-clamping picking mechanism. The cover-sealed protective mechanism is arranged on the main shell in a structural state that can be flipped open and closed. When it is in the unfolded state, it performs a cover-sealed docking operation with the FOUP, and when it is closed, it performs a closed covering and protective treatment on the wafer. The self-clamping picking mechanism is arranged in a horizontal state on the left side of the main shell. It adopts a dual mode of adsorption locking and clamping limit to perform an automated fixing operation during wafer picking, and it cooperates with the sliding position adjustment to perform an automatic wafer picking operation. The FOUP automatic handling device that avoids damage to wafers realizes a closed covering and protection of the wafers, reduces the contamination and damage caused by the contact between the wafers and the external environment during transportation, and also avoids accidental slipping during the picking process through the dual modes of adsorption locking and clamping limit.
Owner:ANHUI TOPOLOGY CORE TECHNOLOGY CO LTD
Wafer load port
PendingUS20250349588A1Semiconductor/solid-state device manufacturingConveyor partsWaferingStructural engineering
A wafer load port is configured to load a FOUP, and the wafer load port has a mounting base, a load station, an opening part, a board, and a switch assembly. The load station is mounted on the top surface and is configured to load the FOUP. The opening part is mounted on a lateral side surface of the mounting base. An opening is formed through the opening part, and the opening is adjacent to the load station. The board may close the opening of the opening part. The switch assembly is mounted on the board and has a first embedding unit and a second embedding unit. The first embedding unit and the second embedding unit are located at different horizontal locations, and the first embedding unit and the second embedding unit are movable between a connection position and a waiting position.
Owner:SHENG CHUAN TECHNOLOGY CO LTD +2
Transport device having local purge function
The purpose of the present invention is to provide, at low cost, a transport apparatus 2 which is capable of transporting a semiconductor wafer W between a FOUP 19 and a processing apparatus 3 without exposing a surface to be processed of the semiconductor wafer to an oxidizing atmosphere. This transport apparatus 2 includes a load port 20 that has atmosphere replacing function, a transport robot 2 that has an atmosphere replacing function, an aligner 40 that has an atmosphere replacing function, and a load lock chamber 12 that has an atmosphere replacing function. The surface being processed of the semiconductor wafer has the atmosphere replaced locally while the semiconductor wafer is being moved and is being subjected to processes such as positioning.
Owner:RORZE CORP
Semiconductor structure and manufacturing method thereof
PendingUS20260005053A1Semiconductor/solid-state device manufacturingConveyor partsWaferingSemiconductor structure
A method includes retrieving a first front opening unified pod (FOUP) from a FOUP stocker utilizing an interface module equipped with a transfer module; transporting the retrieved first FOUP via the transfer module across a first path within the interface module to align the first FOUP with an available first load port of a process tool; loading the first FOUP on the first load port; delivering wafers from the first FOUP to the process tool via the first load port to initiate a wafer processing operation using the wafers.
Owner:TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
FOUP Conveyor System Conveyor Control Method, System and Industrial Control Computer
ActiveCN119764222BSemiconductor/solid-state device manufacturingConveyor partsControl engineeringOverhead crane
This invention discloses a conveying control method, system, and industrial control computer for a FOUP conveying system. The conveying control method determines in real time whether a FOUP is placed on each conveying device used for docking with overhead cranes and / or with storage equipment. When a FOUP is determined to be placed on a conveying device, that conveying device is defined as the starting point. When the starting point is a conveying device used for docking with overhead cranes or with storage equipment, an optimal conveying path is determined based on the attributes configured for the corresponding object in a one- or two-dimensional map to convey the FOUP to a conveying device used for docking with storage equipment or overhead cranes. The conveying devices along the determined optimal conveying path are controlled to operate so that the FOUP is conveyed to the endpoint of the optimal conveying path. This invention eliminates the need to develop different control programs for different scenarios, greatly reducing development costs and improving equipment versatility.
Owner:SUZHOU XINSHINUO SEMICON EQUIP CO LTD
A FOUP locking device
The present invention belongs to the field of semiconductor equipment technology, and more specifically, relates to a FOUP locking device. The device includes a fixing unit, a driving unit, and a locking unit. The two ends of the driving unit are respectively connected to the fixing unit and the locking unit. When the driving unit is working, the locking unit and the driving unit rotate together; the FOUP locking device is used to lock the FOUP on the loading table of the loading port. A fixed support panel is provided on the loading table, and the FOUP locking device is fixed on the fixed support panel. When the device moves, the cylinder rod and the locking point are in the same direction, and the cylinder is in a retracted state, which can effectively utilize the performance of the cylinder. At the same time, when the FOUP is in the locked state, from the vertical direction, the locking point is slightly higher than the bottom fixing point of the locking point. The cylinder contraction force can more effectively lock the FOUP. The fixing units of this device are all fixed at the top, which is more convenient in practical applications.
Owner:合肥欣奕华智能机器股份有限公司
EFEM device
The present invention provides an EFEM (Equipment Front End Module) device that can transport materials in a clean state, even when gas is circulated internally. [Solution] An EFEM apparatus 1 for transferring wafers, which are the objects to be transported, between a FOUP (Front-Opening Unified Pod) 41 and a processing apparatus using a transport robot 2 inside a housing 3, wherein the housing 3 has a transport space S11 that houses the transport robot 2, a gas processing space (chemical filter 7) that houses a gas processing apparatus, and a gas return space S12 that can return gas from the transport space S11 to the gas processing space. The transport space S11, the gas processing space, and the gas return space S12 are in communication to form a single sealed space CS and constitute a circulation path CL, and a plurality of fans 74, 75, 77 are provided in the circulation path CL to form a circulating flow.
Owner:SINFONIA TECHNOLOGY CO LTD
Method and device for cleaning semiconductor devices and carriers for semiconductor devices
Method for cleaning items used in the field of semiconductor manufacturing, especially semiconductor devices such as wafers and reticles, containers, especially carrier and / or storage pods such as FOUPs, FOSBs, EUV double pods, and surfaces, comprising a main cleaning process, wherein the main cleaning process is preceded by a pre-treatment process and / or followed by a post-treatment process.
Owner:BROOKS AUTOMATION GERMANY