27 results about "FOUP" patented technology

The invention discloses a front open type wafer conveying box which comprises a box body with an opening in one side. The door plate is matched with the opening of the box body, and the door plate switch assembly is arranged on the door plate; and the air pressure balance unit is arranged on the door plate and / or the door plate switch assembly, and the door plate switch assembly is controlled to adjust the air pressure balance unit so as to adjust the internal air pressure and the external air pressure of the front open type wafer conveying box. According to the invention, the original air tightness of the FOUP is ensured, the internal and external air pressures of the FOUP are ensured to be consistent before the door is opened, the air holes are communicated only when the FOUP port is adsorbed on the machine table, and the outside is a dust-free environment in the machine table, so that the air holes are prevented from being directly exposed in the air, the possibility that external particles enter from the air holes is greatly reduced, and the service life of the FOUP is prolonged. The problem that an FOUP door cannot be opened due to thermal expansion and cold contraction of an existing FOUP is solved, and the wafer processing efficiency is guaranteed.

Even if the container is not rotated, the amount of deflection of the substrate in the container is calculated. The loading port (4) comprises a support frame (43), a loading part (44) for loading a FOUP (100) for accommodating a plurality of wafers (W), a scanning part (45) and a control part (46). The scanning unit (45) detects a first portion (Wb1), a second portion (Wb2), and a third portion (Wb3) of the end surface (Wb) of the wafer (W) while maintaining a fixed state in which the FOUP (100) is placed on the placement unit (44) and the angle of the FOUP (100) about the vertical axis with respect to the support frame (43) is fixed. The control unit (46) determines whether or not each wafer (W) is normally housed in the FOUP (100) by using the information on the first position of the first portion (Wb1) and the information on the second position of the second portion (Wb2). The control unit (46) calculates the amount of deflection in the vertical direction of the wafer (W) normally housed in the FOUP (100) by using the first position information, the second position information, or both, and the third position information of the third portion (Wb3).

A transport case is configured to hold a plurality of wafers for transport of the wafers. The transport case includes a sensor system configured to generate sensor data indicative of conditions within the transport case while the transport case is docked at a load / unload system of a semiconductor process tool. The transport case includes a communication system configured to transmit the sensor data from the sensor system to an external control system.

This product is a front retainer removal tool for removing a front retainer for holding semiconductor wafers from the door body that constitutes the door set of a substrate storage container, such as a FOUP. As shown in the reference perspective view, this front retainer removal tool has a bent front part of the operating lever handle, on which a pair of left and right working claws that engage with the side plate of the front retainer are formed to protrude at a predetermined interval, a pair of left and right first pivot rollers that can contact the side plate of the front retainer are rotatably supported on both sides of the front part of the operating lever handle, and a second pivot roller that can contact the back surface of the door body is rotatably supported in the middle part of the operating lever handle.

An interface device of a semiconductor process equipment, a wafer loading and unloading device comprising the interface device and the semiconductor process equipment, the interface device being used for connecting the wafer loading and unloading device of the semiconductor process equipment and a wafer transfer box, the interface device comprising: a main plate, the main plate being provided with an opening for transmitting a wafer; a shell, the shell being arranged at the opening of the main plate and being communicated with the opening; a panel, the panel being arranged at the opening and being capable of moving along a direction perpendicular to the main plate; a driving mechanism, the driving mechanism being arranged in the shell, the driving mechanism comprising a driving device and a sealing structure for accommodating the driving device, the center axis of the driving device being deviated from the center axis of the panel along the moving direction of the panel, the driving device being in transmission connection with the panel and being used for driving the panel to move to close or open the opening, the driving device being sealed in the sealing structure when the opening is opened. The interface device can avoid causing particle pollution to the internal environment of the FOUP connected therewith.

1. Name of the design product: full-automatic FOUP cleaning machine. 2. Use of the design product: used in the cleaning manufacturing process of FOUP. 3. Design points of the design product: in shape. 4. Picture or photo best indicating the design points: design 1 perspective view 1. 5. Design 1 is designated as the basic design.

The present invention provides an EFEM (Equipment Front End Module) device that can transport materials in a clean state, even when gas is circulated internally. [Solution] An EFEM apparatus 1 for transferring wafers, which are the objects to be transported, between a FOUP (Front-Opening Unified Pod) 41 and a processing apparatus using a transport robot 2 inside a housing 3, wherein the housing 3 has a transport space S11 that houses the transport robot 2, a gas processing space (chemical filter 7) that houses a gas processing apparatus, and a gas return space S12 that can return gas from the transport space S11 to the gas processing space. The transport space S11, the gas processing space, and the gas return space S12 are in communication to form a single sealed space CS and constitute a circulation path CL, and a plurality of fans 74, 75, 77 are provided in the circulation path CL to form a circulating flow.

Method for cleaning items used in the field of semiconductor manufacturing, especially semiconductor devices such as wafers and reticles, containers, especially carrier and / or storage pods such as FOUPs, FOSBs, EUV double pods, and surfaces, comprising a main cleaning process, wherein the main cleaning process is preceded by a pre-treatment process and / or followed by a post-treatment process.

This provides a load port that enhances the airtightness within the EFEM, reduces the amount of gas supplied to the EFEM, and improves wafer quality. [Solution] This device is provided adjacent to the wafer transport chamber and is used for loading and unloading wafers between the wafer transport chamber and the FOUP. It comprises a panel that forms part of the wall surface of the wafer transport chamber and has an opening formed to open the wafer transport chamber, a door for opening and closing the opening, a mounting platform on which the FOUP is placed with a lid that allows the internal space to be opened and closed facing the door and which can move back and forth toward the panel, and an O-ring provided along the periphery of the opening.

The utility model relates to the technical field of mechanical clamps, in particular to a Foup clamping device and picking and placing equipment, which comprises a base, two clamping plates, a limiting mechanism and a locking mechanism, the clamping plates are in an L shape, a sliding groove is formed between the bottom face of the base and the clamping plates, the locking mechanism comprises a linkage rod and two locking assemblies arranged on the two sides of the base, the two locking assemblies and the two clamping plates are arranged in a one-to-one correspondence mode, each locking assembly comprises a mounting base, an elastic piece and a locking block, and the bottom face of each mounting base is upwards concavely provided with a telescopic cavity. The locking blocks are slidably connected to the inner wall of the telescopic cavity in a lifting mode, the two ends of the elastic piece elastically abut against the top wall of the telescopic cavity and the top faces of the locking blocks correspondingly, the bottom ends of the locking blocks can stretch into the sliding grooves from top to bottom, extrusion slopes are arranged on the outer sides of the bottom ends of the locking blocks, and the two ends of the linkage rod are fixedly connected with the locking blocks of the two locking assemblies correspondingly. The Foup clamping device is simple in structure, low in cost, convenient to operate and good in Foup clamping stability.

A filter module includes an interface body and a filter retention body. A filter can be disposed between the filter retention body and a filter retainer joined to the filter retention body. The filter retention body can further include a valve. The filter retainer can be joined to the filter retention body by a snap fit, a press-fit, or a weld. The filter retainer can include stand-offs configured to contact the filter such that the filter is held away from the filter grill. The filter module can be used for providing purge in a wafer container such as a front opening unified pod (FOUP).

Disclosed are a method for manufacturing a purging plate supporting the supply of nitrogen gas into a FOUP, and a computing device using same, the method comprising the steps of: (a) providing a solid material to each of four regions on a predetermined plane and then generating a first adhesive solid material by using a predetermined adhesive supplied from a predetermined stimulus source, or providing the first adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulus source on the solid material to each of the four regions on the predetermined plane, so that four pipe-fitting coupling portions are generated as four first adhesive layers each having a first length, a first width, and a first height, wherein the four pipe-fitting coupling portions are generated by forming four 1-1 inner spaces in which each the four first adhesive layers are not generated to a 1-1 inner height of the first height, the 1-1 inner lengths and the 1-1 inner widths of the four 1-1 inner spaces being smaller than the first lengths and the first widths, and forming predetermined through-holes on at least some surfaces excluding an upper surface located at the upper portion corresponding to the first height; (b) after moving each of the four pipe-fitting coupling portions a distance corresponding to the first height in a direction away from the predetermined stimulation source, providing the solid material to the upper portions of the four pipe-fitting coupling portions corresponding to the first height, and then generating a second adhesive solid material by using the predetermined adhesive supplied from the predetermined stimulation source, or providing the second adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulation source on the solid material to each of the upper portions of the four pipe fitting-coupling portions corresponding to the first height, and laminating same, so that a second adhesive layer is generated to a second height, wherein the second adhesive layer is generated by forming, in portions continuous with the four 1-1 inner spaces of the four pipe-fitting coupling portions, four 1-2 inner spaces in which the second adhesive layer is not generated to a 1-2 inner height of the second height, the 1-2 inner lengths and the 1-2 inner widths of the four 1-2 inner spaces being smaller than the first lengths and the first widths, forming, in a direction away from each of the four pipe-fitting coupling portions from specific inner side surfaces among surfaces of the second adhesive layer surrounding the four 1-2 inner spaces, four gas pipes serving as four second inner spaces, each having a second inner length and a second inner width, and in which the second adhesive layer is not generated to a second inner height of the second height, the second inner height being smaller than the 1-2 inner height, and forming four first hollow portions defined from a central position spaced a predetermined distance apart from one of the two ends of each of the four gas pipes, the one end being distal to each of the four pipe fitting coupling portions; (c) after moving each of the four pipe-fitting coupling portions and the second adhesive layer a distance corresponding to the second height in a direction away from the predetermined stimulation source, providing the solid material to the upper portion of the second adhesive layer, and then generating a third adhesive solid material by using the predetermined adhesive supplied from the predetermined stimulation source, or providing the third adhesive solid material generated by using the predetermined adhesive supplied from the predetermined stimulation source on the solid material to the upper portion of the second adhesive layer, and laminating same, so that a third adhesive layer is generated to a third height, wherein the third adhesive layer is generated by forming, to the third height, four FOUP coupling structures, each having four second hollow portion defined from the central position above the four first hollow portions.

The invention relates to the technical field of semiconductor advanced packaging and manufacturing, in particular to a double-verification error-proofing method and system integrating visual positioning and data comparison, and the method comprises the steps: S100, obtaining the actual physical slot position of each wafer based on a slot position image and a predefined FOUP slot position coordinate system; step S200, performing consistency verification on the bonding state, the inspection structure and the process flow data of the wafer based on a preset triple verification logic rule in an MES system to obtain a verification result; if the verification result is qualified, a qualification report is generated, and if the verification result is not qualified, the step S300 is carried out; and step S300, distinguishing an exception type according to a verification result, and then selecting an exception response mechanism according to the exception type. According to the invention, a closed-loop error-proofing system with physical positioning, logic verification and automatic deviation correction is established, so that the automation level and the quality guarantee capability of the wafer bonding process are improved.

The present invention relates to an Equipment Front End Module (EFEM), and more specifically, to an EFEM comprising: a Front-Opening Unified Pod (FOUP) on which a substrate is loaded; a main body having a first space formed therein that communicates with the FOUP through a door and allows the transported substrate to stay there; a dehumidifier that dehumidifies by adsorbing moisture from a gas supplied to the first space onto a zeolite; a blower disposed spaced apart from the dehumidifier within the main body and supplying the dehumidified gas to the first space; and an internal circulation duct disposed on both sides inside the first space and providing a passage so that the gas can move and circulate to a second space formed between the dehumidifier and the blower, wherein the dehumidifier is disposed on the upper part of the main body.

The utility model relates to the technical field of taking and placing equipment, in particular to an FOUP taking and placing device used when an FOUP automatic storage bin breaks down. The ladder is arranged on one side of a base of an electric taking and placing device in the FOUP automatic storage bin, the lifting hanging device is detachably arranged on a cross rod of the ladder, the handheld FOUP clamping device is arranged on a lifting rope of the lifting hanging device, and the top end of the ladder is connected with a sky rail of the FOUP automatic storage bin in a sliding mode. According to the utility model, an operator can stand on the ladder to take out and hang down FOUP stored in the FOUP automatic storage bin in a power failure or fault state or hang up the FOUP and place the FOUP in the FOUP automatic storage bin in the power failure or fault state through the cooperation of the lifting hanging device and the handheld FOUP clamping device, so that the efficiency of taking and placing the FOUP is greatly improved; and the safety of taking and placing the FOUP by an operator is improved.

The present invention relates to a load port for correcting a mounting position of a FOUP and a method for correcting a mounting position of a FOUP, the load port comprising: a base member having a door; a frame member provided in a direction perpendicular to the base member; a mounting part which is provided on the frame member and on which the FOUP is mounted; a first sensing member which is provided on the frame member and senses a mounting state of the FOUP; a second sensing member which is provided in front of the frame member and senses an obstacle approaching the frame member; a moving member for moving the mounting part forward and backward; a rotating member for rotating the mounting part; and a control module for controlling driving of the moving member and the rotating member according to mounting state information of the FOUP sensed by the first sensing member and obstacle information sensed by the second sensing member, thereby correcting a mounting position of the FOUP to a normal mounting position.

The invention relates to a method for cleaning items, especially containers for transporting and / or storing wafers or reticles such as FOUPs or reticle pods, in a fab environment, comprising the steps of identification of a plurality of critical contaminants amongst the total contamination, especially in in a closed (mini) environment such as the interior of a container, after identifying the critical contaminants, choosing and / or optimizing a cleaning process with a view to suppressing at least one of the plurality of critical contaminants, especially until a predetermined first threshold level of the at least one of the critical contaminants has been reached, and after supressing the at least one of the plurality of the critical contaminants, reducing the overall contamination, especially comprising AMCs, VoCs etc, especially until a predetermined second threshold level of the overall contamination has been reached.

A filter module includes an interface body and a filter retention body. A filter can be disposed between the filter retention body and a filter retainer joined to the filter retention body. The filter retention body can further include a valve. The filter retainer can be joined to the filter retention body by a snap fit, a press-fit, or a weld. The filter retainer can include stand-offs configured to contact the filter such that the filter is held away from the filter grill. The filter module can be used for providing purge in a wafer container such as a front opening unified pod (FOUP).

The utility model discloses a fixed-point locking mechanism for forward and reverse rotation of an FOUP external tool, and relates to the technical field of wafer manufacturing, the fixed-point locking mechanism comprises a circular plate, the bottom of the circular plate is provided with a supporting seat, and the top of the supporting seat is provided with a first movable groove in a penetrating manner; and the positioning mechanism is arranged between the circular plate and the supporting seat, and the positioning mechanism is used for driving the FOUP outer tool above the circular plate to rotate. According to the FOUP outer tool, by adopting the front and rear plug pin mode, the fixing plug pin is pushed inwards, the spring is extruded, the clamping rod enters the inner side of the arc-shaped plate, and at the moment, the FOUP outer tool can be manually rotated. When the clamping rod is separated from the fixing position, the fixing plug pin does not need to be manually pushed, and when the FOUP outer tool rotates by 180 degrees to reach the fixing position on the opposite side, the clamping rod can pop out to be clamped at the fixing position by means of the elastic force of the spring. The problem of manual continuous pressing is solved, and manual operation is facilitated.

Semiconductor manufacturing equipment includes a substrate supply unit to which a front opening unified pod (FOUP) is detachably coupled and accommodates a first substrate therein, a process chamber in which a process is performed on a second substrate, a stage provided between the process chamber and the substrate supply unit, the stage including a cooler configured to cool a third substrate and a transfer robot configured to transfer the substrates, and a control unit configured to control the transfer robot by comparing first time data with second time data, the first time data being an amount of time taken for the transfer robot to transfer the third substrate from the cooler to the substrate supply unit, and the second time data being an amount of time remaining before completion of the process performed in the process chamber.

A detection device for FOUP comprises an adjusting and moving mechanism installed on a shell mechanism, a plurality of first distance measuring sensors installed on the adjusting and moving mechanism and a control device. The adjusting and moving mechanism can be controlled by the control device to drive the first distance measuring sensor to move into the box body of the FOUP. The first distance measuring sensor can measure the distance towards the left side wall and the right side wall of the box body so as to generate a first distance measuring signal. The control device can analyze the first distance measuring signal to obtain the deformation quantity of the box body. The first distance measuring sensor can be driven to move into the box body through the adjusting and moving mechanism, the structural design that distance measurement is conducted on the left side wall and the right side wall of the box body is achieved, the control device can analyze a first distance measuring signal of the first distance measuring sensor, and then the design of the deformation quantity of the box body is obtained. Therefore, the deformation quantity of the box body can be accurately measured.

A front opening unified pod has a housing and a plurality of horizontal support members disposed within the housing and adapted to accommodate a plurality of semiconductor wafers or panels. The plurality of semiconductor wafers or panels have a different size or shape, such as circular and rectangular. A first one of the plurality of horizontal support members has a wing to support the plurality of different size or shape semiconductor wafers or panels. The plurality of horizontal support members has a first side horizontal support member, a second side horizontal support member, and a center horizontal support member disposed between the first side horizontal support member and the second side horizontal support member. The plurality of horizontal support members is insertable into the housing. One or more of the plurality of horizontal support members has an opening for laser identification.

An instrumented substrate may provide a metrology platform for monitoring extreme ultraviolet (EUV) radiation in an image plane of an EUV lithography tool. The instrumented substrate may include an in-band dose sensor. The in-band dose sensor may produce a dose measurement corresponding to illumination within the band. The instrumented substrate may also include an out-of-band dose sensor and an in-band scatter dose sensor. The instrumented substrate may be housed within a front open wafer transfer cassette (FOUP) of a system.

To obtain a wafer transfer device that can suppress a rise in the temperature of the inside of a wafer transfer chamber by reducing a system resistance without changing the size of the wafer transfer chamber, the present invention provides a wafer transfer device including a wafer transfer chamber including a robot configured to transfer a wafer between a FOUP configured to house the wafer and a processing chamber configured to process the wafer, a door installed for a human to enter and exit from an inside of the wafer transfer chamber, and a fan and filter unit (FFU) chamber installed above the wafer transfer chamber and configured to feed inert gas into the wafer transfer chamber, a return flow passage for the inert gas being formed in a column constituting the wafer transfer chamber and being formed by hollowing the column, to make the FFU chamber and the wafer transfer chamber communicate with each other, and a duct being provided on the wafer transfer chamber side of the door and configured such that the inert gas in the wafer transfer chamber passes through the duct and flows into the FFU chamber when the door is in a closed state.

The invention discloses a low-cost chip carrier plate magazine box unloading mechanism which is mainly composed of a door frame, a movable door plate, a carrier table and a material box. A lifting door plate for opening and closing is arranged on the back surface of the door frame; the carrying table is provided with three positioning pins which are accurately matched with notches of positioning blocks at the bottom of the material box. A plurality of layers of discharging grooves are formed in the material box, and a unique blocking module is arranged, and when the material box is not in place, the module automatically blocks a groove opening; after the platform deck is located, blocking is removed, meanwhile, the door plate is automatically opened, and automatic loading and unloading and product scanning are achieved. The scheme has the core advantages that high-end Foup and Loadport modes are imitated, a low-cost magazine type carrier and a loading and unloading platform deck are researched and developed, and the equipment cost for realizing full automation in a low-cleanliness process section is remarkably reduced; the system can be directly compatible with market standard logistics systems such as AGVs and OHT, and can be easily accessed to an existing automation process; the intelligent operation of automatic door opening of the material box in place and automatic product scanning is achieved, and the carrying efficiency and the feeding and discharging efficiency are effectively improved.

The utility model provides a wafer box hanger and a wafer box cleaning system. According to the wafer box hanger and the wafer box cleaning system, the first containing groove in a cuboid shape is designed, so that the wafer box hanger can contain a cascade type wafer box; by additionally arranging the second accommodating groove, the wafer box hanging rack can accommodate a foup type wafer box; by designing the first accommodating groove in the shape of the trapezoid body, the wafer box hanging rack can accommodate octagonal wafer boxes. Therefore, the wafer box containing device can meet the containing requirement of the wafer box through different designs, and has the advantages of being simple in structure and convenient and fast to operate.

One embodiment provides a vacuum EFEM comprising: a loader in which a Front Opening Unified Pod (FOUP) is lowered in an atmospheric pressure atmosphere; and an Equipment Front End Module (EFEM) chamber disposed on the side of the loader between a Vacuum Transfer Module (VTM) and the loader, wherein the FOUP is introduced and seated on the side upon opening of a first valve, the internal space is converted to a vacuum atmosphere after closing of the first valve, and an aligner is disposed on the upper side of the space where the FOUP is seated.