The utility model belongs to the field of
semiconductor packaging, and particularly relates to a
semiconductor packaging device which comprises a
machine body, the outer wall of the
machine body is fixedly connected with a supporting plate frame, the top of the supporting plate frame is fixedly connected with a heightening frame, the heightening frame is provided with a
station assembly, the
station assembly comprises a driving motor, and the driving motor is connected with the supporting plate frame. A driving motor is arranged below the heightening frame, a synchronous belt transmission
assembly is arranged below the heightening frame, a synchronous block is fixedly connected to the outer wall of the synchronous belt transmission assembly, and a connecting plate is detachably connected to the outer wall of the synchronous block. The
semiconductor packaging device is driven by the synchronous belt transmission assembly of the
station assembly, synchronous transposition can be achieved through the two sets of inner sliding frames and outer sliding frames, when the stations in the
machine body conduct packaging on semiconductor elements, the external stations can conduct feeding or discharging operation synchronously, and therefore the situation that in the production process, a machine needs to be stopped for taking and placing semiconductors is avoided, and the production efficiency is improved. The
idle time of
machining is effectively shortened, and the continuity of a
production line is remarkably improved.