10784results about "Cleaning using gases" patented technology

Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.

A method of remote plasma cleaning a processing chamber of CVD equipment, which has high cleaning rates, low cleaning operational cost and high efficiency, is provided. The method comprises supplying cleaning gas to the remote plasma-discharge device; activating the cleaning gas inside the remote plasma-discharge device; and bringing the activated cleaning gas into the processing chamber and which is characterized in that a mixed gas of F₂ gas and an inert gas are used as the cleaning gas. A concentration of the F₂ gas is 10% or higher. The F₂ gas, which is a cleaning gas, is supplied to the remote plasma-discharge device from an F₂ gas cylinder by diluting F₂ gas at a given concentration by an inert gas.

Embodiments described herein provide methods for removing native oxide surfaces on substrates while simultaneously passivating the underlying substrate surface. In one embodiment, a method is provided which includes positioning a substrate containing an oxide layer within a processing chamber, adjusting a first temperature of the substrate to about 80° C. or less, generating a cleaning plasma from a gas mixture within the processing chamber, such that the gas mixture contains ammonia and nitrogen trifluoride having an NH₃/NF₃ molar ratio of about 10 or greater, and condensing the cleaning plasma onto the substrate. A thin film, containing ammonium hexafluorosilicate, is formed in part, from the native oxide during a plasma clean process. The method further includes heating the substrate to a second temperature of about 100° C. or greater within the processing chamber while removing the thin film from the substrate and forming a passivation surface thereon.

The present invention is a method for removing deposited etch byproducts from surfaces of a semiconductor processing chamber after a copper etch process. The method of the invention comprises the following general steps: (a) an oxidation step, in which interior surfaces of the processing chamber are contacted with an oxidizing plasma; (b) a first non-plasma cleaning step, in which interior surfaces of the processing chamber are contacted with an H+hfac-comprising gas; and (c) a second cleaning step, in which interior surfaces of the processing chamber are contacted with a plasma containing reactive fluorine species, whereby at least a portion of the copper etch byproducts remaining after step (b) are volatilized into gaseous species, which are removed from the processing chamber. The method of the invention is preferably performed at a chamber wall temperature of at least 150° C. in order to achieve optimum cleaning of the chamber at the chamber operating pressures typically used during the cleaning process. The dry cleaning method of the invention can be performed between wafer processing runs without opening the processing chamber, thereby minimizing potential contamination to the chamber as well as chamber downtime.

A system and method for removing both carbon-based contaminants and oxygen-based contaminants from a semiconductor substrate within a single process chamber is disclosed. The invention may comprise utilization of remote plasma units and multiple gas sources to perform the process within the single process chamber.

The present invention relates to plasma cleaning methods for removing surface deposits from a surface, such as the interior of a depositions chamber that is used in fabricating electronic devices. The present invention also provides gas mixtures and activated gas mixtures which provide superior performance in removing deposits from a surface. The methods involve activating a gas mixture comprising a carbon or sulfur source, NF₃, and optionally, an oxygen source to form an activated gas, and contacting the activated gas mixture with surface deposits to remove the surface deposits wherein the activated gas mixture acts to passivate the interior surfaces of the apparatus to reduce the rate of surface recombination of gas phase species.

In a brush assembly of a cleaner including plural brushes arranged at the bottom surface of a cleaner body radially at regular intervals; plural supporting shafts for rotatively supporting the brushes; and a driving unit connected to the brushes in order to rotate the brushes, by arranging the plural brushes radially, dust and filth can be collected in a wider region, and accordingly a cleaning performance can be improved. In addition, by forming the brushes as a curved shape, it is possible to compact a size of the cleaner.

In cleaning using a self-propelled cleaning device, firstly the cleaning device moves alongside a wall surface and then a reference direction is set. Next, the cleaning device advances alongside the wall surface at a prescribed distance, makes a right-angle turn, and travels in the reference direction. When the cleaning device reaches the surface of an opposing wall, it moves in a spiraling manner. At that time, the orientation angle of the cleaning device, which is estimated using a gyro sensor, is checked and corrected. If an obstacle is encountered while traveling, the cleaning device travels on a path that avoids the obstacle or travels in a spiral manner in a region in front of the obstacle.

A method for assaying fibrous material, such as carpet (or other fabric) condition, and treating the fibrous material such as carpet by physically separating contaminating particulate matter therefrom, thereafter releasing entrained matter, and absorbing the released formerly entrained matter.

A robot cleaning system uses a robot cleaner and a unit. The unit is connected to power the robot cleaner by a power cord. The robot cleaner can move around a room while being powered by the unit. In one embodiment, the unit is connected to a power socket by another power cord.

A self-running vacuum cleaner comprises a homing mode of following a back of a user with receiving a signal from a light emitting means or a transmitting means of a position indicator means held by the user, an instruction operation mode, in which the user instructs a cleaning area to the self-running vacuum cleaner, and an execution mode for cleaning up the cleaning area instructed. When the self-running vacuum cleaner operates under the homing mode or the instruction mode, a signal from the light-emitting means or the transmitting means is received by a receiver means attached on a periphery portion of a measuring means, which is provided in an upper portion of the vacuum cleaner. Comparing the signals from the two (2) receiver means in strength thereof determines the distance and the direction from the position indicated by the light-emitting means or the transmitting means up to the vacuum cleaner.

An apparatus for removing volatile residues from a substrate is provided. In one embodiment, an apparatus for removing halogen-containing residues from a substrate includes a chamber suitable for operating maintaining a vacuum therein and a heat module positioned to heat a substrate disposed in the chamber. The apparatus for removing halogen-containing residues from a substrate also includes at least one of A) a temperature controlled pedestal having a projection extending radially therefrom suitable for supporting the temperature control pedestal on a ledge of the chamber body, the projection thermally isolating the base from the chamber body; B) a pair of substrate holders that include two support flanges extending radially inward from an inner edge of an arc-shaped body, each support flange having a substrate support step that includes a sloped landing; or C) a domed window.

A method of cleaning the interior of a processing chamber first performs a halogenation treatment by supplying a treatment gas containing a halogenating gas into the processing chamber and heating a support member for a target substrate, thereby halogenating a metal element in a by-product film. A reduction treatment is then performed by supplying a treatment gas containing a reducing gas into the processing chamber, thereby reducing a halide of the metal element and liberating the metal element. An oxidation treatment is then performed by supplying a treatment gas containing an oxidizing gas into the processing chamber and heating the casing walls of the processing chamber, thereby passivating the liberated metal element by oxidation.

A robot cleaning system and a dust removing method of the same that are capable of moving a first dust collector mounted in a robot cleaner to a docking station to remove dust collected in the first dust collector. The robot cleaning system includes a robot cleaner having an opening, though which a first dust collector to collect suctioned dust is carried in and out of the robot cleaner, a docking station, to which the robot cleaner is docked to remove the dust collected in the first dust collector, and a collector moving unit to move the first dust collector to the docking station.

A surface cleaning apparatus has a cleaning unit that is mounted on a wheeled base.

A cleaning apparatus and a dust collecting method using the same are provided. The cleaning apparatus includes a body, a brush unit rotatably provided at the body, a dust collecting unit to store contaminants, such as dust, swept by the brush unit, and a blowing unit to suction contaminants, such as dust, scattered by the brush unit and to move the suctioned contaminants to the dust collecting unit.

Chemical formulations and methods for removing unwanted material, such as unexposed photoresist, metal oxides, CMP residue, and the like, from semiconductor wafers or other substrates. The formulations utilize a supercritical fluid-based cleaning composition, which may further include (I) co-solvent(s), (II) surfactant(s), (III) chelating agent(s), and/or (IV) chemical reactant(s).

Improved methods for stripping photoresist and removing etch-related residues from dielectric materials are provided. In one aspect of the invention, methods involve removing material from a dielectric layer using a hydrogen-based etch process employing a weak oxidizing agent and fluorine-containing compound. Substrate temperature is maintained at a level of about 160° C. or less, e.g., less than about 90° C.

A hand held vacuum cleaner having a housing, a motor-fan unit, a dust container, an air passage opening into the dust container and through which dust laden air is directed into the dust container, and at least one filter arranged after the dust container, as seen in the flow direction. The dust container has a first emptying opening, which is normally being covered by a lid and is sized such that it allows the dust collected in the dust container to fall out through the opening when the lid is opened. The dust container also has a second emptying opening. In one aspect, the second emptying opening is adapted to be fluidly connected to an external vacuum source via a connection. In another aspect, a similar device is provided, and adapted so the dust container can be emptied through the first emptying opening without removing the dust container from the vacuum cleaner. In another aspect, the invention provides a vacuum cleaner dust container having an air inlet, an air outlet, a first dirt outlet, and a second dirt outlet. The first and second dirt outlets are separate from the air outlet.

A method of displacing a supercritical fluid from a pressure vessel (e.g., in a microelectronic manufacturing process), with the steps of: providing an enclosed pressure vessel containing a first supercritical fluid (said supercritical fluid preferably comprising carbon dioxide); adding a second fluid (typically also a supercritical fluid) to said vessel, with said second fluid being added at a pressure greater than the pressure of the first supercritical fluid, and with said second fluid having a density less than that of the first supercritical fluid; forming an interface between the first supercritical fluid and the second fluid; and displacing at least a portion of the first supercritical fluid from the vessel with the pressure of the second, preferably fluid while maintaining the interface therebetween.

An automatic powder recycling apparatus includes a housing, a plurality of isolation elements, an air-blowing device, a powder filtering member, a recycling member and an air-inhaling device. A sealed space is defined within the housing. The air-blowing device is disposed within the sealed space for removing the powder attached on the surface of the finished product. The air-inhaling device is in communication with the first receptacle for allowing the first receptacle to be in a negative pressure state. When the powder on the finished product is removed by the air-blowing device and directed to the powder filtering member by the air-inhaling device, the powder is filtered and blocked by the powder filtering member. When the air-inhaling device is disabled, the powder blocked by the powder filtering member naturally falls down to the recycling member.

A steam nozzle attachment for a steam cleaner having a substantially rectangular frame with a steam outlet positioned between the front and rear walls of the frame is provided. A plurality of baffles to distribute steam are disposed substantially perpendicular to the steam nozzle between the side walls of the frame. A replaceable fabric pocket that fits snugly over the frame is provided to distribute cleaning steam to the surface to be cleaned.

A vacuum cleaner comprises a handle assembly pivotally attached to a foot assembly, where the handle assembly removably mounts a cyclone separator module. An ultraviolet sanitation assembly is provided on the vacuum cleaner for sanitizing the working air before it is exhausted from the vacuum cleaner. One or more component parts of the vacuum cleaner, particularly the components making up the working air path of the vacuum cleaner can be made from a plastic material that includes at least one anti-microbial agent in an effective amount sufficient to impart microbe-inhibiting properties to the working air path.

Device for cleaning a gas turbine engine (2), and in particular an engine of turbofan type. The present invention further relates to a method for cleaning such a engine. The device comprises a plurality of nozzles (31, 33, 35) arranged to atomize cleaning liquid in the air stream in an air inlet (20) of the engine (2) up-stream of a fan (25) of the engine (2). According to the invention a first nozzle (31) is arranged at a position such that the cleaning liquid emanating from the first nozzle (31) impinges the surfaces of the blades (40) substantially on the pressure side (53); a second nozzle (35) is arranged at a position such that the cleaning liquid emanating from the second nozzle (35) impinges the surfaces of the blades (40) substantially on the suction side (54); and a third nozzle (33) is arranged at a position such that the cleaning liquid emanating from the third nozzle (33) passes substantially between the blades (40) and enters an inlet (23) of the core engine (203). Thereby, the different types of fouling found on the fan and in the core engine compressor of turbofan engine can be removed in an efficient manner.

A substrate processing apparatus 8 for feeding a processing liquid and processing a substrate W with the processing liquid comprises holding member 22 for holding the substrate W, and a lower side member 42 which is moved relatively with respect to the back surface of the substrate W held by the holding member 22 between a processing position A near the substrate undersurface and a retreat position B remote from the substrate undersurface. The processing liquid is fed between a gap between the lower side member 42 moved to the processing position A and the back surface of the substrate held by the holding member 22, and the substrate undersurface is processed. A cleaning processing unit 221a as one embodiment of the liquid processing apparatus comprises a spin chuck 22 for holding a wafer W substantially horizontally, a stage 224 substantially horizontally below the wafer W held by the spin chuck 223, and a cleaning liquid discharge openings 241 for feeding a required cleaning liquid into a gap between the wafer W held by the spin chuck 223 and the stage 224. The stage 224 has the surface coated with a hydrophobic polymer so that the surface has wetting which allows a contact angle of the cleaning liquid to be above 50E. A layer of the cleaning liquid is formed in the gap between the wafer W held by the spin chuck 223 and the stage 224 to subject the wafer W to the liquid processing.

Methods and systems for cleaning coins and issuing a redeemable voucher for same. In one embodiment, an apparatus for issuing a redeemable voucher includes a coin input region configured to receive a plurality of coins, and a user interface configured to receive a request for a redeemable voucher. The apparatus can further include a debris separation device having a first opening configured to receive the plurality of coins from the coin input region, and at least a first wall forming an interior surface and an exterior surface. The first wall of the debris separation device includes at least one second opening smaller than the first opening and sized to prevent passage therethrough of the smallest coin of the plurality of coins. A driver can be configured to move the debris separation device and agitate the plurality of coins.

A shock force indicating device for measuring and visually displaying the extent of a shock force received by an article during handling of the article is disclosed. The device has a cavity formed between a base member and a top member having a raised portion. A bearing is disposed within the cavity. In a preferred embodiment, the top member and the base member provide a compressive force to the bearing such that the bearing is held in place until the device is subjected to a shock force greater than a predetermined threshold. The base member has a pressure sensitive material which provides a visually identifiable path which traces the movement of the bearing when the bearing moves in response to a shock force to the device. The base member may have indicating marks for representing a scale with which to measure a component of a force to the device. The top member is transparent for easy viewing of the indicating marks. The base member may have an adhesive on a bottom portion for attaching the device directly to a package or other article.

The present invention refers to a cleaning drone (1), a corresponding docking station (2) configured to operate with the cleaning drone (1), a system comprising at least one cleaning drone (1) and at least one docking station (2) and a cleaning method using at least one cleaning drone (1). The cleaning drone (1) comprises a cleaning device (1.11) configured to operate on surfaces such as glass or photovoltaic panels.

System and method for cleaning a solar row of solar panels. The solar row has an upper edge elevated from ground level more than a lower edge to provide an inclination of the solar row. A cleaning assembly operates to clean a surface of the solar panels. A support frame supports the cleaning assembly and enables the cleaning assembly to move (1) upwardly and downwardly in the width direction of the solar row, and (2) in the length direction of the solar row. Operation and movement of the cleaning assembly is controlled by a control unit to cause the cleaning assembly to clean a surface of the solar panels during downward movement of the cleaning assembly. The cleaning assembly is preferably not operative during its upward vertical movement. During the downward movement, the cleaning assembly removes dirt, debris and dust from the surface of the solar panels and generates an air stream to blow off the dirt, debris, and dust.

A system for controlling dust during hydraulic fracturing operations includes a manifold having a plurality of ports for capturing dust when negative air pressure is applied to the manifold. A support frame positions the manifold above a piece of hydraulic fracturing equipment receiving sand from a sand source.