The invention discloses a
wafer-level flip-
chip bonding packaging mechanism and method, and relates to the technical field of packaging equipment, the
wafer-level flip-
chip bonding packaging mechanism comprises a
processing table, a controller, a
chip mounting mechanism and a feeding mechanism, a fixing mechanism is arranged in the
processing table, the controller and the feeding mechanism are fixedly installed on the front end face of the
processing table, the chip mounting mechanism is installed in the processing table, and the chip mounting mechanism is arranged on the front end face of the processing table. The fixing mechanism is installed at the lower end of the chip mounting mechanism and comprises a material plate table, an adsorption supporting column, a clamping plate, a lead screw, a motor, a circulating fan and a
welding slag collecting cup, the material plate table is fixedly installed on the
machining table, a positioning groove is formed in the upper end face of the material plate table, and the adsorption supporting column moves on the upper end face of the bottom of the positioning groove. The device has the advantages of efficient fixation, automatic cleaning and accurate
temperature control, and solves the problem of insufficient
soldering caused by easy deviation of a circuit board, residual
welding slag and
improper temperature control in the traditional packaging process.