5194 results about "Thermal radiation" patented technology

Arrangement and method for monitoring a tire mounted to the vehicle in which a thermal radiation detecting device detects the temperature of the tire at different circumferential locations along the circumference of the tire. The detected temperatures of the tire are analyzed to determine, for example, whether a difference in thermal radiation is present between the circumferential locations of the tire, and if so, an action is effected in response to the analysis. The thermal radiation detecting devices are preferably supplied with power wirelessly, e.g., through an inductive system, a capacitive system or a radio frequency energy transfer system.

An object of the present invention is to provide an EL display device, which has a high operating performance and reliability. A third passivation film 45 is disposed under an EL element 203 which comprises a pixel electrode (anode) 46, and EL layer 47 and a cathode 48, to make a structure in which heat generated by the EL element 203 is radiated. Further, the third passivation film 45 prevents alkali metals within the EL element 203 from diffusing into the TFTs side, and prevents moisture and oxygen of the TFTs side from penetrating into the EL element 203. More preferably, heat radiating effect is given to a fourth passivation film 50 to make the EL element 203 to be enclosed by heat radiating layers.

Disclosed is a susceptor which achieves uniform temperature distribution of a wafer placed on the susceptor, and also disclosed is a substrate processing apparatus provided with the susceptor. An annular recess 12a is formed in an intermediate portion between the central portion and the peripheral portion of a wafer support surface of the susceptor 12. Due to the provision of the recess, the substrate heating effect by thermal radiation from the susceptor is suppressed in the intermediate portion. The geometrical dimension of the recess is determined taking the chamber internal pressure into consideration.

Disclosed is a high power LED package. In the LED package, a lower board has a heat radiation member in an LED mounting area and at least one via hole around the heat radiation member. First and second bottom electrodes are formed in the underside of the lower board, and connected to the heat radiation member and the via hole. An insulation layer is formed on the lower board to cover the heat radiation member. First and second electrode patterns on the insulation layer are connected to the first and second bottom electrodes through the via hole.

In addition to the effect of harmonized illumination and increased heat radiation, a LED illumination lamp provides an improved effect of hermetic seal, anti-vibration and waterproofing between components and assures prolonged life span. The illumination lamp comprises a body adapted to be placed on or around a target illumination object, a LED module lying inside the body and a cover mounted on a seat part of the body. The LED module has a printed circuit board affixed to the body and a group of red, green and blue LEDs attached to the printed circuit. The cover is provided with a semitransparent color-producing part capable of harmonizing colors of the light emitted from the LEDs and an air passageway for permitting the heat generated from the LED module to dissipate to the outside.

The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

An improved method and an improved instrument for analyte determination that uses infrared radiation naturally emitted by subject are disclosed. The method is based on Thermal Emission Spectroscopy (TES) whereby the spectral signal is measured in reference to a body's physiological and ambient parameters. The instrument that realizes the method incorporates temperature and humidity sensors. Ambient environmental parameters and subject parameters as disclosed allow normalization of spectrally specific analyte signal for grater precision and accuracy of analytes concentration determination. Such improvement leads to a universal calibration in, for example, non-invasive blood glucose measurements in human subjects.

Systems and methods for designing and fabricating carbon nanotube based detectors are disclosed. In some embodiments, one or more sensor elements can be formed from a film of single-walled carbon nanotubes (SWNTs). Bolometric properties of such detectors are disclosed. In some embodiments, the film can be thermally isolated in various ways, such as suspending the film and providing a vacuum environment, to provide the bolometric properties. Various properties of the SWNT films, such as resistivity-dependence on temperature and spectral response, can be obtained by adjusting the dimension and / or composition of the film. Examples of SWNT film formation, detector element fabrication, and array fabrication are disclosed.

A radiation-heated fluidized-bed reactor and a process for producing high-purity polycrystalline silicon by using this reactor are provided. In this reactor, a heater device (14) is a radiation source for thermal radiation which is arranged outside the inner reactor tube and as a cylinder around the heater zone, without being in direct contact with the inner reactor tube. The inner reactor tube is designed in such a manner that it uses thermal radiation to heat the silicon particles in the heating zone to a temperature which is such that the reaction temperature is established in the reaction zone.

An exemplary aircraft anticollision beacon is constructed around a faceted aluminum support cylinder and base. The support cylinder has an outside surface with ten vertically oriented substantially planar faces. An array of LEDs is mounted in thermally conductive relationship on each face of the support cylinder. Each LED is partially surrounded by a trough-shaped reflecting surface that re-directs off axis light into a horizontal plane. Axially aligned, radially adjacent reflecting troughs combine to form the circumferential reflecting troughs. The support cylinder and base are connected in thermally conductive relationship to define a thermal pathway from the LEDs to a heat radiation surface on the base. The base is also configured to act as a heat sink for heat generating components of the LED driver circuits. The exemplary beacon employs a distributed energizing circuit in which each driver is configured to energize two of the ten arrays of LEDs.

A heat radiator for emitting infrared radiation to the human body has a heat source which is energized to emit infrared radiation, whose penetration depth into the human body is to near warmth sensing points of the human body, and an insulator for covering the surface of the heat source to be directed toward the human body. The free surface of the insulator forms a surface for contacting with the human body and the thickness of the insulator is less than the penetration depth of the infrared radiation into the insulator.

An LED lighting device has high cooling efficiency and long life with a plurality of high-intensity LEDs mounted thereto. The LED lighting device is composed of a light emission part provided with a plurality of LEDs and a heat radiator for the LEDs, a power source part generating a current to be supplied to the LEDs from a commercial power source, and an air circulation part for circulating ambient air. The light emission part and the power source part are thermally separated by the air circulation part. The light emission part is provided with an annular heat radiation base having a hole formed at a central portion thereof and a substrate attaching face formed around the hole, and an LED substrate which is attached to the substrate attaching face and on which a plurality of LED chips are mounted. The heat radiation base has heat radiation fins as the heat radiator which are formed on an outer periphery of the heat radiation base and on an inner periphery of the hole. By the presence of the air circulating part, little heat generated from the power source part is transmitted to the light emission part. Therefore, it is possible to accomplish desired designing of heat radiation of the light emission part concerned with intensity and life of an LED, which is critical to performance of an LED lighting device.

Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is released therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.

A light emitting device that can provide enhanced heat radiation as well as allowing light from a light emitting diode (LED) chip to be efficiently extracted out of the device. This light emitting device includes a metal plate (11) that is made of aluminum. The metal plate (11) has a projection (11a) projecting forward. The projection (11a) has a front side provided with a housing recess (11b). An LED chip (1) is mounted on the bottom of the housing recess (11b) so that it is thermally coupled to the metal plate (11), thus allowing heat to be radiated efficiently. A printed circuit board (12), having a grass epoxy substrate to be joined to the front surface of the metal plate (11), is provided with an insertion hole (13) into which the projection (11a) is inserted. The LED chip (1) and a bonding wire (W) are encapsulated in a transparent resin seal portion (50). The side wall of the housing recess (11b) that is part of the metal plate (11) functions as a reflector for reflecting forward light emitted from the LED chip (1). Thus, light from the LED chip (1) can be extracted efficiently.

In addition to the effect of harmonized illumination and increased heat radiation, a LED illumination lamp provides an improved effect of hermetic seal, anti-vibration and waterproofing between components and assures prolonged life span. The illumination lamp comprises a body adapted to be placed on or around a target illumination object, a LED module lying inside the body and a cover mounted on a seat part of the body. The LED module has a printed circuit board affixed to the body and a group of red, green and blue LEDs attached to the printed circuit. The cover is provided with a semitransparent color-producing part capable of harmonizing colors of the light emitted from the LEDs and an air passageway for permitting the heat generated from the LED module to dissipate to the outside.

A non-contact infrared (IR) thermometer for measuring temperature from the surface of an object includes an IR radiation sensor attached to a heating element and a thermal shield having an interior surface positioned within the sensor's field of view that has a high emissivity. An electronic circuit controlling the heating element maintains the temperatures of the sensor and shield substantially close to an anticipated surface temperature of the object. The IR radiation sensor is further thermally coupled to a reference temperature sensor. An optical system positioned in front of the shield focuses thermal radiation from the object on the surface of the sensor, while the shield prevents stray radiation from reaching the sensor. Signals from the IR and reference sensors are used to calculate the object's surface temperature.

A method and apparatus for detecting and classifying an object, including a human intruder. The apparatus includes one or more passive thermal radiation sensors that generate a plurality of signals responsive to thermal radiation. A calculation circuit compares the plurality of signals to a threshold condition and outputs an alarm signal when the threshold condition is met, indicating the presence of the object. The method includes detecting thermal radiation from an object at a first and second wavelength and generating a first and second responsive signal. The signals are compared to a threshold condition that indicates whether the object is an intruder.

An LED lamp cooling apparatus (10) includes a substrate (11), a plurality of LEDs (13) electrically connected with the substrate, a heat sink (19) for dissipation of heat generated by the LEDs and a pulsating heat pipe (15) thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions (154) and a plurality of heat radiating portions (155), and contains a working fluid (153) therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.

An LED lamp cooling apparatus (10) includes a substrate (11), a plurality of LEDs (13) electrically connected with the substrate, a heat sink (19) for dissipation of heat generated by the LEDs and a pulsating heat pipe (15) thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions (154) and a plurality of heat radiating portions (155), and contains a working fluid (153) therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.

For achieving small-sizing and high efficiency by improving heat radiation of coils, and further for simple-construction to be easily disassembled, thereby being environment-friendly from a view point of recycling, an electric rotating machine comprising: a stator 1a being constructed by inserting coils 10a into slots 11 of a stator core 2a; an outer frame 4 being divided into a plurality thereof, so as to cover periphery of the stator core of said stator; a pair of bearing holder portions 6a and 6b, each having a fitting portion 35a or 35b to be fitted into an inner diameter reference surface 25a at both end portions of said stator and being provided with a bearing 8a or 8b at an axial center portion thereof, and being attached at both sides of said stator core so as to cover coil end portions dropping out at both sides of said stator; a squeezing mechanism (30, 32a, 32b, 6a, 6b) fixing the outer frame at an outer periphery of the stator core, by a wedge function between each of the bearing holder portions and the outer frame due to a squeezing function of attaching the each of said pair of bearing holder portions at both sides of said stator core; and a rotor 3 being formed with an escaping portion for escaping from an outer diameter of a portion opposing to a fitting portion of each of said bearing holder portion, rotatably positioned within said stator core.

A utility lamp (1) comprises a curved reflector (2) having a spherically curved surface. An array of LEDs (3) is arranged in an electrical circuit on a thin substrate mounted via thermally conductive epoxy on a thermally-conductive base (4), which in turn forms an integral part of the reflector (2). The LEDs are mounted for efficient heat transfer by conduction to the reflector (2). The reflector (2) thus operates as both a light reflector and as a radiative heat sink. The heat radiating properties of the reflector are enhanced by integral fins (7) extending in the radial direction around the periphery of the reflector (2). The reflector (2) is of integral aluminium construction.

There is provided a high power LED package and a method of manufacturing the same. The method includes: forming at least one chip mounting part and at least one through hole in a metal plate; forming an insulating layer of a predetermined thickness on an entire outer surface of the metal plate; forming an electrode part to be electrically connected to a light emitting chip mounted on the chip mounting part; and cutting the metal plate along a trimming line to separate the package. The LED package is free from thermal impact resulting from different thermal coefficients among components, thus ensuring stable heat radiation characteristics in a high temperature atmosphere. Also, the LED package is minimized in optical loss to improve optical characteristics. In addition, the LED package is simplified in a manufacturing and assembly process and thus can be manufactured in mass production at a lower cost.

In an apparatus for manufacturing a ceramic thin film by employing a thermal CVD method, an internal jig, which is provided with a heat radiation material film on the surface, is provided at a position that faces a substrate (S) on which the film is to be formed. The thin film and a semiconductor device are manufactured using such apparatus.

Disclosed herein is a device for controlling the temperature of batteries for electric vehicles. The device includes a thermoelectric semiconductor unit, a thermoelectric semiconductor unit, a temperature sensor, and a battery controller. The thermoelectric semiconductor unit is configured such that a portion thereof is exposed in a battery tray. The thermoelectric semiconductor unit controller causes the thermoelectric semiconductor unit to radiate heat, and causes the thermoelectric semiconductor unit to absorb heat. The temperature sensor detects and outputs the temperature of the battery tray. The battery controller outputs the heat radiating control signal to the thermoelectric semiconductor unit controller when the temperature detected by the temperature sensor is lower than a predetermined value, and outputting the heat absorbing control signal to the thermoelectric semiconductor unit controller when the temperature detected by the temperature is equal to or higher than the predetermined value.

A stack package with improved heat radiation capability and a module having the stack package mounted thereon are provided in which the back surfaces of first and second chips are exposed through the bottom and top surfaces of the stack package, allowing improved heat radiation capability as well as reduced thickness of the stack package. A heat sink may be attached to the stack package for increasing heat radiation capability. A solder bonding portion may be formed between the stack package and a module substrate, establishing good solder bondability between the stack package and the module substrate.

A light emitting device has a plurality of conductive members with good heat conductivity provided in a base member, the conductive members are isolated by insulating members provided between the conductive members. A light emitting element device is mounted on the base member. An light emitting diode is provided in the light emitting device and mounted on conductive member. A projection is outwardly projected from the heat conductive member for cooling the LED.

A backlight unit and an LCD employing the backlight unit are provided. The backlight unit includes: a plurality of division areas; a light source which is able to be lighted and is disposed on one sidewall surface of a barrier rib defining the plurality of division areas; and a heat radiation device disposed on an opposite wall surface of the barrier rib to the one sidewall surface, wherein each of the plurality of division areas is constructed to bi-divide light reflection and heat radiation.

A welding accessory and a system for detecting thermal and / or UV radiation exposure during welding operations are disclosed. The welding accessory may have a surface exposed to thermal and / or UV radiation generated by electric arc welding, a first image visible without exposure to the thermal and / or UV radiation, and a second image formed from either a UV activated dye that is visible only after exposure to UV radiation generated by the electric welding arc or a thermochromic dye that is visible only after exposure to a predetermined level of thermal radiation generated by the welding arc. A system may include either a thermal or UV exposure indicator with a first state and at least a second state, and include either a thermochromic or UV activated dye adapted to provide a reversible or persistent visual indication upon exposure to radiation. The visual indication may include any combination of symbols, logos, images, text, or other decorative or informational designs as desired.