83990results about "Using optical means" patented technology

A calibration system for a surgical instrument. The calibration system includes an actuator, such as a motor system and a flexible shaft. The calibration system also includes a surgical instrument actuatable by the actuator. The calibration system also include calibration data corresponding to the surgical instrument. A processor is configured to process the calibration data for determining a position of the surgical instrument. The calibration system may include a sensor configured to provide a signal corresponding to a movement of the actuator, the processor being further configured to process the signal for determining a position of the surgical instrument.

In a method of determining the focus of a lithographic apparatus used in a lithographic process on a substrate, the lithographic process is used to form a structure on the substrate, the structure having at least one feature which has an asymmetry in the printed profile which varies as a function of the focus of the lithographic apparatus on the substrate. A first image of the periodic structure is formed and detected while illuminating the structure with a first beam of radiation. The first image is formed using a first part of non-zero order diffracted radiation. A second image of the periodic structure is foamed and detected while illuminating the structure with a second beam of radiation. The second image is formed using a second part of the non-zero order diffracted radiation which is symmetrically opposite to the first part in a diffraction spectrum. The ratio of the intensities of the measured first and second portions of the spectra is determined and used to determine the asymmetry in the profile of the periodic structure and / or to provide an indication of the focus on the substrate. In the same instrument, an intensity variation across the detected portion is determined as a measure of process-induced variation across the structure. A region of the structure with unwanted process variation can be identified and excluded from a measurement of the structure.

A metrology apparatus is arranged to illuminate a plurality of targets with an off-axis illumination mode. Images of the targets are obtained using only one first order diffracted beam. Where the target is a composite grating, overlay measurements can be obtained from the intensities of the images of the different gratings. Overlay measurements can be corrected for errors caused by variations in the position of the gratings in an image field.

Systems and methods for volume dimensioning packages are provided. A method of operating a volume dimensioning system may include the receipt of image data of an area at least a first three-dimensional object to be dimensioned from a first point of view as captured using at least one image sensor. The system can determine from the received image data a number of features in three dimensions of the first three-dimensional object. Based at least on part on the determined features of the first three-dimensional object, the system can fit a first three-dimensional packaging wireframe model about the first three-dimensional object. The system can display of an image of the first three-dimensional packaging wireframe model fitted about an image of the first three-dimensional object on a display device.

Systems and methods of determining the volume and dimensions of a three-dimensional object using a dimensioning system are provided. The dimensioning system can include an image sensor, a non-transitory, machine-readable, storage, and a processor. The dimensioning system can select and fit a three-dimensional packaging wireframe model about each three-dimensional object located within a first point of view of the image sensor. Calibration is performed to calibrate between image sensors of the dimensioning system and those of the imaging system. Calibration may occur pre-run time, in a calibration mode or period. Calibration may occur during a routine. Calibration may be automatically triggered on detection of a coupling between the dimensioning and the imaging systems.

A method and apparatus for mapping depth of an object (22) in a preferred arrangement uses a projected light pattern to provide a selected texture to the object (22) along the optical axis (24) of observation. An imaging system senses (32, 34) first and second images of the object (22) with the projected light pattern and compares the defocused of the projected pattern in the images to determine relative depth of elemental portions of the object (22).

A method and a system for three-dimensional printing of a three-dimensional model is provided. The method includes dispensing a first interface material from a printing head, dispensing at least a second interface material from the printing head and combining the first and second interface material in pre-determined proportions to produce layers for forming the three-dimensional model. In one embodiment, the layers forming the construction layers of the model are formed from interface material having a harder modulus of elasticity from the layers forming the release layers, thereby allowing for the forming complex three-dimensional shapes.

A stage device suitable for exposure apparatus used to produce semiconductor devices, is movable in an area wider than the measurement area of interferometer for position measurement, and is capable of measuring the position with high precision. When a movable stage moves from the position where the laser beams from laser interferometers are not applied into the measurement area of the laser interferometer, the position of reference mark is measured by a wafer alignment sensor, and the measurement value measured by the laser interferometer is corrected based on the results of the measurement by the wafer alignment sensor. When another movable stage enters the measurement area of the laser interferometer, the position of the reference mark is similarly measured by a wafer alignment sensor, and the measurement value measured by the laser interferometer is corrected based on the results of the measurement by the wafer alignment sensor.

An alignment system uses a self-referencing interferometer that produces two overlapping and relatively rotated images of an alignment markers. Detectors detect intensities in a pupil plane where Fourier transforms of the images are caused to interfere. The positional information is derived from the phase difference between diffraction orders of the two images which manifests as intensity variations in the interfered orders. Asymmetry can also be measured by measuring intensities at two positions either side of a diffraction order.

Apparatus for a CMM Arm with Exoskeleton is provided comprising an Internal CMM Arm with a base end and a probe end, and an Exoskeleton driving the Internal CMM Arm through a plurality of transmission. One or more contact probes, optical probes and tools are mounted on the probe end. The CMM Arm with Exoskeleton is provided in manually operable and automated embodiments. The CMM Arm with Exoskeleton is operable for accurate measurement or for performing accurate operations. Methods are provided for operation of the CMM Arm with Exoskeleton.

Systems and methods of determining the volume and dimensions of a three-dimensional object using a dimensioning system are provided. The dimensioning system can include an image sensor, a non-transitory, machine-readable, storage, and a processor. The dimensioning system can select and fit a three-dimensional packaging wireframe model about each three-dimensional object located within a first point of view of the image sensor. Calibration is performed to calibrate between image sensors of the dimensioning system and those of the imaging system. Calibration may occur pre-run time, in a calibration mode or period. Calibration may occur during a routine. Calibration may be automatically triggered on detection of a coupling between the dimensioning and the imaging systems.

While a wafer stage linearly moves in a Y-axis direction, a multipoint AF system detects surface position information of the wafer surface at a plurality of detection points that are set at a predetermined distance in an X-axis direction and also a plurality of alignment systems that are arrayed in a line along the X-axis direction detect each of marks at positions different from one another on the wafer. That is, detection of surface position information of the wafer surface at a plurality of detection points and detection of the marks at positions different from one another on the wafer are finished, only by the wafer stage (wafer) linearly passing through the array of the plurality of detection points of the multipoint AF system and the plurality of alignment systems, and therefore, the throughput can be improved, compared with the case where a detection operation of the marks and a detection operation of the surface position information (focus information) are independently performed.

Positional information of a movable body in a Y-axis direction is measured using an interferometer and an encoder whose short-term stability of measurement values excels when compared with the interferometer, and based on the measurement results, a predetermined calibration operation for obtaining correction information for correcting measurement values of the encoder is performed. Accordingly, by using measurement values of the interferometer, correction information for correcting the measurement values of the encoder whose short-term stability of the measurement values excels the interferometer is obtained. Then, based on the measurement values of the encoder and the correction information, the movable body is driven in the Y-axis direction with good precision.

Volume dimensioning employs techniques to reduce multipath reflection or return of illumination, and hence distortion. Volume dimensioning for any given target object includes a sequence of one or more illuminations and respective detections of returned illumination. A sequence typically includes illumination with at least one initial spatial illumination pattern and with one or more refined spatial illumination patterns. Refined spatial illumination patterns are generated based on previous illumination in order to reduce distortion. The number of refined spatial illumination patterns in a sequence may be fixed, or may vary based on results of prior illumination(s) in the sequence. Refined spatial illumination patterns may avoid illuminating background areas that contribute to distortion. Sometimes, illumination with the initial spatial illumination pattern may produce sufficiently acceptable results, and refined spatial illumination patterns in the sequence omitted.

A three-dimensional imaging and display system is provided in which user input is optically detected in an imaging volume by measuring the path length of an amplitude modulated scanning beam as a function of the phase shift thereof. Visual image user feedback concerning the detected user input is presented.

A method and system for physiological gating is disclosed. A method and system for detecting and predictably estimating regular cycles of physiological activity or movements is disclosed. Another disclosed aspect of the invention is directed to predictive actuation of gating system components. Yet another disclosed aspect of the invention is directed to physiological gating of radiation treatment based upon the phase of the physiological activity. Gating can be performed, either prospectively or retrospectively, to any type of procedure, including radiation therapy or imaging, or other types of medical devices and procedures such as PET, MRI, SPECT, and CT scans.

A system and method for measuring an item's dimensions using a time-of-flight dimensioning system is disclosed. The system and method mitigate multipath distortion and improve the accuracy of the measurements, especially in a mobile environment. To mitigate the multipath distortion, an imager captures an image of an item of interest. This image is processed to determine an illumination region corresponding item-of-interest's size, shape, and position. Using this information, an adjustable aperture's size, shape, and position are controlled so the light beam used in the time-of-flight analysis substantially illuminates the illumination region without first being reflected.

A lithographic apparatus includes a displacement measuring system configured to measure the position of a substrate table in at least three degrees of freedom. The displacement measuring system includes a first x-sensor configured to measure the position of the substrate table in a first direction and a first and a second y-sensor configured to measure the position of the substrate table in a second direction. Said displacement measuring system further comprises a second x-sensor. The first and second x-sensor and first and second y-sensors are encoder type sensors configured to measure the position of each of the sensors with respect to at least one grid plate. The displacement measuring system is configured to selectively use, depending on the position of the substrate table, three of the first and second x-sensors and the first and second y-sensors to determine the position of the substrate table in three degrees of freedom.

A system and method for obtaining a dimension measurement that conforms to a conformance criteria is disclosed. The dimensioning system provides either (i) feedback to confirm that the measurement complies with the criteria or (ii) information on how the measurement geometry could be adjusted in order to provide a compliant measurement in a subsequent dimension measurement.

Apparatus, method, logic arrangement and storage medium are provided for increasing the sensitivity in the detection of optical coherence tomography and low coherence interferometry (“LCI”) signals by detecting a parallel set of spectral bands, each band being a unique combination of optical frequencies. The LCI broad bandwidth source can be split into N spectral bands. The N spectral bands can be individually detected and processed to provide an increase in the signal-to-noise ratio by a factor of N. Each spectral band may be detected by a separate photo detector and amplified. For each spectral band, the signal can be band p3 filtered around the signal band by analog electronics and digitized, or, alternatively, the signal may be digitized and band pass filtered in software. As a consequence, the shot noise contribution to the signal is likely reduced by a factor equal to the number of spectral bands, while the signal amplitude can remain the same. The reduction of the shot noise increases the dynamic range and sensitivity of the system.

Systems and methods for processing gesture-based user interactions with an interactive display are provided.

A disclosed substrate position detection apparatus includes an imaging portion configured to take an image of a substrate subject to a position detection; a panel member provided between the imaging portion and the substrate and including a first opening that ensures a field of view for the imaging portion with respect to the substrate, the panel member having a light scattering property; a first illuminating portion configured to illuminate the panel member; and a processing portion capable of determining a position of the substrate in accordance with the image taken through the first opening by the imaging portion.

A method and apparatus for obtaining an image to determine a three dimensional shape of a stationary or moving object using a bi dimensional coded light pattern having a plurality of distinct identifiable feature types. The coded light pattern is projected on the object such that each of the identifiable feature types appears at most once on predefined sections of distinguishable epipolar lines. An image of the object is captured and the reflected feature types are extracted along with their location on known epipolar lines in the captured image. Displacements of the reflected feature types along their epipolar lines from reference coordinates thereupon determine corresponding three dimensional coordinates in space and thus a 3D mapping or model of the shape of the object at any point in time.

The apparatus and method measure the three-dimensional surface shape of a surface without contact with the surface, and without any physical constraint on the device during measurement. The device is a range-sensor or scanner, and in one embodiment is a laser-camera sensor, which has a portable camera and multi-line light projector encased in a compact sensor head, and a computer. The apparatus provides three-dimensional coordinates in a single reference frame of points on the surface. The sensor head does not have to be physically attached to any mechanical positioning device such as a mechanical arm, rail, or translation or rotation stage, and its position in three-dimensional space does not have to be measured by any position-tracking sensor. This allows unrestricted motion of the sensor head during scanning, and therefore provides much greater access to surfaces which are immovable, or which have large dimensions or complex shape, and which are in confined spaces such as interior surfaces. It also permits measurement of a surface to be made by a continuous sweeping motion rather than in stages, and thus greatly simplifies the process of measurement. The apparatus can be hand-held, mounted on any moving device whose motion is unknown or not accurately known, or airborne. The apparatus and method also permit unknown and unmeasured movement of the object whose surface is to be measured, which may be simultaneous with the movement of the range-sensor head.