The invention belongs to the field of photoelectric co-packaging, and particularly relates to a photoelectric co-packaging
temperature control framework based on an embedded glass-based micro-channel. Independent lower-layer heat dissipation is carried out on a heat-sensitive component optical
interconnection chip through an embedded glass-based micro-channel technology, an electric
interconnection heat dissipation channel continues to use existing upper-layer heat dissipation, mutual isolation of two heat dissipation channels in the whole common packaging body is achieved, heat dissipation partition is achieved from a new dimension, and thermal
crosstalk is avoided; the whole common packaging body dissipates heat at the upper layer and the lower layer, so that the effective heat dissipation area is greatly increased, and the heat dissipation capability of the packaging body is greatly improved; and the guidance quality of the heat dissipation channel is better through
material selection and additional arrangement of the heat
insulation layer. And a
metal film temperature sensor can be additionally arranged, so that the temperature of a component can be monitored in real time,
heat management regulation and control can be performed in a targeted manner, the temperature rise of a heating device and the heat contact efficiency between the micro-channels are balanced, and more efficient heat dissipation is realized.