180 results about "Thermal contact" patented technology

This invention discloses a power terminal, a power terminal assembly, and a charging dock. The power terminal includes: a cylindrical portion for mating with a matching power terminal; and a welding portion connected to the rear end of the cylindrical portion for welding to a high-voltage cable. The welding portion is flat and has a first side and a second side opposite each other in its thickness direction. The first side of the welding portion is used for welding to the high-voltage cable, and a partial protrusion is formed on the second side of the welding portion. The partial protrusion is used for thermal contact with the thermal pad of the charging dock, so that the heat of the power terminal can be transferred to the temperature sensor of the charging dock via the thermal pad. In this invention, the axial length of the power terminal of the charging dock is relatively short, reducing the volume and manufacturing cost of the power terminal.

An injection molding system is disclosed. The injection molding system includes: a mold; a hot runner including: a manifold; one or more injection nozzles coupled to the manifold; a plurality of heaters in thermal contact with the manifold and the one or more injection nozzles, the heaters being arranged into one or more defined heating zones within the hot runner; and at least one temperature sensor associated with each heating zone, and a system controller coupled to the plurality of heaters, the system controller being configured to: for each heating zone: determine a setpoint temperature associated with the heating zone; obtain, via a temperature sensor, measurement of a current local temperature of the heating zone; determine a control gain value associated with the heating zone; and compute a predicted heating time for the heating zone based on the setpoint temperature, the current local temperature, and the control gain value, determine a heating schedule for the hot runner based on the predicted heating times for the heating zones; and operate the plurality of heaters in accordance with the heating schedule.

The present invention relates to a furnace structure having an upper compartment above a discharge tank compartment, wherein the upper compartment comprises a molten salt furnace (MSR) having a furnace vessel containing molten fuel salt, and a molten salt discharge system connected to the furnace vessel, and the discharge tank compartment comprises one or more discharge tanks communicating with the molten salt discharge system, and a buffer water tank surrounding the one or more discharge tanks, having an inner wall and an outer wall, and buffer water in the gap between the inner wall and the outer wall of the buffer water tank, wherein the first piping structure comprises a heat exchanger that defines a circuit for at least a portion of the buffer water and is in thermal contact with a storage water tank, and the storage water is in thermal contact with the environment, and the second piping structure comprises a heat exchanger that defines a circuit for at least a portion of the buffer water and is in thermal contact with the environment, and the seawater heat exchanger is in thermal contact with the buffer water and seawater.

This application provides a battery pack, energy storage system, power station, and charging network, relating to the field of energy technology, to solve the technical problems of poor heat dissipation and poor temperature uniformity. The battery pack provided by this application may include a cell assembly, a first heat exchange plate, and a second heat exchange plate. The cell assembly has a first heat-conducting surface and a second heat-conducting surface that are opposite to each other, and the electrodes of the cell assembly are all located on the first heat-conducting surface. The first heat exchange plate has a first plate surface with a first groove, the first plate surface being in thermal contact with the first heat-conducting surface, and the electrodes being located within the first groove. The second heat exchange plate has a second plate surface, the second plate surface being in thermal contact with the bottom surface. The battery pack provided by this application helps to reduce the temperature difference between different areas of the cell, thereby improving the temperature uniformity of the cell. Each cell in the cell assembly can dissipate heat through the first and second heat exchange plates, effectively improving the cooling effect and reducing the operating cost of the battery pack.

The application provides an inverter, a power device and a photovoltaic system, to improve the heat dissipation performance of the power device such as the inverter, and further improve the use reliability of the power device. Taking the power device as the inverter for example, the inverter usually can include a shell and a heat dissipation device. The shell can include a first cavity and a second cavity, the first cavity is provided with a power semiconductor device. The second cavity has a first air inlet and a first air outlet, and the second cavity is provided with a magnetic device. The heat dissipation device includes a heat sink and a first fan, the heat sink includes an evaporator and a condenser connected with each other, the evaporator is arranged in the second cavity, and the power semiconductor device is in heat conduction contact with the evaporator to realize heat dissipation of the power semiconductor device. The first fan is arranged in the second cavity, the air inlet side of the first fan faces the first air inlet, the air outlet side of the first fan faces the first air outlet, and the evaporator and the magnetic device share the first fan, which is beneficial to reduce the floor area of the inverter.

The application relates to the technical field of drying equipment, and discloses a high-efficiency quicklime drying equipment which comprises a base, a top cover and an annular ring, the base is provided with supporting columns and a supporting frame, the top ends of the supporting columns are connected with a first motor, the output end of the first motor is connected with a rotating shaft I, the rotating shaft I is connected with a connecting rod I, the upper portion of the side, away from the rotating shaft I, of the connecting rod I is connected with a connecting seat, and a connecting rod II is arranged between the connecting seat and the annular ring. In the application, the first motor drives the connecting rod II to rotate through the connecting rod I, and in turn drives a connecting rod III to shake the material cylinder; meanwhile, a second motor is arranged, the output end of the second motor drives a rotating shaft II to rotate, and the rotating shaft II drives stirring blades to rotate, so that the agglomerated quicklime in the material cylinder is crushed and stirred, the surface area of the quicklime can be increased, the mixing and stirring of some hygroscopic substances in the quicklime are more uniform, the heated contact area is increased, and the drying capacity is enhanced.

Described herein is a refrigerant loop heat sink. The heat sink may be provided in contact with refrigerant tubing that is connected to an existing refrigerant loop of the heating and / or cooling appliance. The heat sink may then be provided in thermal contact with electronic components (or a printed circuit board (PCB) to which the electronic components are mounted) of the heating and / or cooling appliance). In this manner, any heat that is produced as a byproduct of the operation of the electronic components may be transferred from the electronic components into the heat sink and the refrigerant tubing. The heat may then be transferred to the refrigerant that is flowing through the refrigerant tubing to cool the electronic components. This provides an alternative to an air cooled system by which heat from the electronic components is dissipated by blowing cooler air from a fan within the heating and / or cooling appliance over the electronic components.

The invention relates to an electric pump (200) for pumping a medium, in particular a liquid, comprising a stator (210) with a stator winding (212) arranged in a dry chamber (202), a rotor (220) arranged in a wet chamber (201), a conveying unit (230) non-rotatably connected to the rotor (220) for drawing in and discharging the medium, and a housing component (240) in thermal contact with components (210, 350) of the pump (200) to be cooled, wherein the housing component (240) at least partially surrounds the stator (210) on a side of the stator (210) facing away from the rotor (220), and wherein the housing component (240) is provided as a deep-drawn component. Furthermore, a temperature control system (300) with such a pump (200) is proposed.

This invention relates to the field of power battery technology, and more particularly to a cell assembly, a battery pack, and an electrical device. The cell assembly includes a heat sink, a heat insulation structure, and a cell. Two heat sinks are spaced apart along a first direction. Each heat sink includes a main body. The main body has a first folded edge and a second folded edge on opposite sides along a second direction, and a third folded edge on one side along a third direction. The first, second, and third folded edges are all bent toward the other heat sink to cooperate with the main body to form an accommodating space. A cell is correspondingly disposed within an accommodating space, and the cell is in thermal contact with the main body, the first folded edge, the second folded edge, and the third folded edge. The heat insulation structure is at least partially disposed between the two cells to separate them. By partially enclosing the cell with the heat sink, the thermal contact area between the cell and the heat sink is increased, improving the heat dissipation efficiency of the cell. Furthermore, the folded edges can also be in thermal contact with the casing to transfer heat to the casing for heat dissipation, improving the heat dissipation efficiency of the battery pack.

A power supply 100 is described. The power supply 100 has a first electrical outlet 110 and comprises: optionally a set of hydrogen storage devices 200, including a first hydrogen storage device 200A, a set of heaters 300, including a first heater 300A, a first releasable fluid inlet coupling 410 and / or a first releasable fluid outlet coupling 510; wherein the first hydrogen storage device 200A comprises: a pressure vessel 230A, having a first fluid inlet 210A and a first fluid outlet 220A, comprising therein a thermally conducting network 240A optionally thermally coupled to the first heater 300A, wherein the pressure vessel 230A is arranged to receive therein a hydrogen storage material 250A in thermal contact, at least in part, with the thermally conducting network 240A, wherein the first fluid inlet 210A and / or the first fluid outlet 220A are in fluid communication with the first releasable fluid inlet coupling 410 and / or the first releasable fluid outlet coupling 510, respectively; and preferably, wherein the thermally conducting network 240A has a lattice geometry and / or a fractal geometry in two and / or three dimensions.

A water-cooled heat dissipation and monitoring system includes a pump, water-cooled piping, a water-cooling block, a water-cooling radiator, multiple temperature sensors, and a microcontroller. The pump and water-cooled piping are used to transfer the coolant. The water-cooling block is in thermal contact with a power element. The water-cooling radiator is used to facilitate heat exchange between the coolant and the surrounding environment. Multiple temperature sensors are located at at least two different points along the water-cooling path. The microcontroller is connected to the multiple temperature sensors and the pump, and is used to obtain at least one temperature difference at at least two different points and a measured flow rate of the coolant. Based on the at least one temperature difference, the measured flow rate, the specific heat capacity and density of the coolant, the microcontroller obtains an estimated power consumption and an estimated temperature of the power element, and controls the pump's rotation speed to adjust the coolant flow rate based on the estimated temperature.

This electronic control unit comprises: a housing; a cooling jacket disposed within the housing; and a first board having a first semiconductor device mounted thereon, the first board being in thermal contact with at least one of the housing and the cooling jacket, wherein the housing includes: a housing body in thermal contact with the first board and having a first space defined therein; and a heat dissipation member that seals the first space and has heat dissipation fins formed thereon, wherein a first phase-change material may be accommodated in the first space.

To provide an energy storage device capable of lowering the temperature of gases discharged into the atmosphere. [Solution] The energy storage device 10 comprises at least one energy storage cell 100, a cooling plate 150, a lower case 210 including a bottom wall 212, a panel member 230 that defines a smoke exhaust path together with the bottom wall, and a refrigerant pipe 400 through which a cooling medium supplied to the cooling plate flows. A safety valve SV is provided on the lower surface of each energy storage cell 100. The lower case 210 has a contact portion 215 that is in contact with the smoke exhaust path S. The refrigerant pipe 400 is in thermal contact with the contact portion 215.

A device including: a substrate; a chip module coupled to the substrate; a first thermal material disposed on the chip module; a second thermal material disposed on the chip module; a lid structure disposed over the chip module and coupled to the substrate with adhesive along a perimeter of the lid structure, wherein a central portion of the lid structure is in thermal contact with the first thermal material and the second thermal material; and a support structure arranged around the chip module and covered by the lid structure, the support structure extending vertically from the substrate to the lid structure.

The present application relates to a tubular heater, one aspect of which includes a tubular housing enclosing a heated portion and at least one first connection portion adjacent the heated portion; an electric heating element disposed within the heated portion of the tubular housing; an electric power transmission element extending between the heated portion and the first connection portion for transmitting electric power from an external power source to the electric heating element; a sensor assembly disposed within the first connection portion of the tubular housing and including at least a first temperature sensor; and a thermally conductive element provided in thermal contact with the first temperature sensor and extending from the first connection portion into the heated portion, wherein the thermally conductive element is electrically insulated from the electric heating element and the electric power transmission element.

The present invention provides an electrochemical apparatus (300a) comprising an electrolytic cell (100) for producing an electrolysis product (50, 60) and a reaction vessel (200) for consuming at least some of the electrolysis product (50, 60) as a reagent in an exothermic chemical reaction. The electrolytic cell (100) comprises an electrochemical device, itself comprising an electrode (10) and a conduit (20). The electrode (10), which is configured as an electrode (10, 70) of the electrolytic cell (100), has a first part for immersion in an electrolyte, a second part for making electrical contact with a current-carrying conductor, and a third part between the first and second parts for making thermal contact with a heat transfer fluid (HTF). The conduit (20) is arranged to bring the heat transfer fluid (HTF) into thermal contact with the third part of the electrode (10). The electrode (10) is made of carbon, which has reduced electrical resistivity and thermal conductivity at temperatures above ambient. Therefore, if the third part of the electrode (10) is heated by means of the HTF, its electrical resistivity and thermal conductivity are reduced. The former enables more efficient flow of electrical current between the first and second parts of the electrode and therefore reduces the total internal resistance of the electrolytic cell (100). The latter reduces the flow of heat between the first and second parts of the electrode (10) and therefore helps to prevent heat loss from the electrolytic cell (100) via the electrode (10) to the current-carrying conductor. Both effects make the electrolytic cell (100) more energy efficient. The apparatus (300a) further comprises a product transfer pathway (110) arranged to transfer the electrolysis product (50, 60) from the electrolytic cell (100) to the reaction vessel (200), and a first heat exchanger (210) arranged to transfer heat (Q) from the reaction vessel (200) to the heat transfer fluid (HTF) in the conduit (20). The electrochemical device may therefore be used to inject waste heat from the exothermic chemical reaction into the electrolytic cell (100). This reduces the electrical power consumption of the electrolytic cell and also makes the combination of the electrolytic cell (100) with the exothermic chemical reaction supplying the heat (Q) more energy efficient overall. The invention also provides methods of operating such an electrochemical apparatus. The invention is particularly suited to producing Group 1 and Group 2 metals by electrolysis with increased energy efficiency.

The present application relates to a three-dimensional heat dissipation device and an immersion cooling system. The three-dimensional heat dissipation device comprises a base, a vapor chamber assembly and an evaporation structure layer. The vapor chamber assembly comprises a main vapor chamber and a plurality of fin vapor chambers. The main vapor chamber is disposed on the base and has a first internal space. The fin vapor chambers are disposed in parallel to each other and are connected to the main vapor chamber. The main vapor chamber and any two adjacent fin vapor chambers define a gap therebetween. Each of the fin vapor chambers has a second internal space which is in communication with the first internal space. The first internal space and the second internal spaces form an airtight chamber. The evaporation structure layer covers and is in thermal contact with the vapor chamber assembly. Through the above structure, the three-dimensional heat dissipation device and the immersion cooling system of the present application can effectively cool and dissipate heat from the component to be cooled, so as to maintain the working efficiency and service life of the component to be cooled.

A semiconductor package structure for enhanced cooling is provided. The semiconductor package includes a processor die powered by a front side or back side power supply network, a plurality of memory dies and control dies stacked on the processor die, a plurality of high thermal conductivity interconnects disposed alongside or between the dies, and a substrate that carries all the dies. The substrate has a first cavity that allows a liquid to pass through and a cooling plate that is in direct thermal contact with the uppermost die and has a second cavity configured to be connected to the first cavity and to allow the liquid to flow between the first and second cavities. The semiconductor package is configured to have a topology that surpasses conventional single-sided interconnects and heat spreading, enabling two-sided or multi-sided heat spreading, power supply, and signal transmission.

A thermal contact pad assembly configured for use in conjunction with a targeted temperature management (TTM) system module which circulates TTM fluid through the thermal contact pad assembly. The thermal contact pad assembly includes a plurality of thermal contact pads fluidly coupled together which, during use, can be decoupled from each other. Fluid connectors between the pads include valves that open and close upon connection and disconnection of the fluid connectors. Each of the pads is covered by a fabric wrap and connection mechanisms of the fabric wraps enable selective attachment and detachment of the fabric wraps to and from each other. A method of using the thermal contact pad assembly includes decoupling one of the thermal contact pads from the remaining thermal contact pads and coupling a replacement thermal contact pad in place thereof while maintaining circulation of the TTM fluid through the remaining pads.

This application relates to the field of battery technology, providing a battery device and an electrical device. The battery device includes a housing, multiple battery cells, multiple thermally conductive components, and a heat-absorbing bracket. The housing includes a first sidewall. Multiple battery cells are disposed within the housing. Multiple thermally conductive components are disposed within the housing, and the thermally conductive components are thermally connected to the battery cells. The heat-absorbing bracket is disposed within the housing and connected to the housing, and is thermally connected to the thermally conductive components, so that the heat-absorbing bracket absorbs and stores the heat transferred by the thermally conductive components. One end face of each of the multiple thermally conductive components forms a thermally conductive surface, which is in thermal contact with the first sidewall, allowing the first sidewall to exchange heat with the external environment. The heat dissipated by the battery cells has two heat dissipation channels: one is transferred to the heat-absorbing bracket inside the housing through the thermally conductive components, and the other is transferred to the first sidewall and then to the outside of the housing through the thermally conductive surface, which helps to improve the thermal management performance of the battery device.

This utility model relates to the field of air conditioning technology, and more specifically, to a novel rotary energy-saving air conditioning unit. The utility model includes: a unit casing; an air inlet at the top front end and an air outlet at the top rear end of the unit casing; multiple maintenance doors on the side of the unit casing; a four-stage coil structure inside the unit casing; all four-stage coil structures are rotary heat exchange structures, capable of self-controlled rotation to control the heat exchange contact area; primary and secondary filters are located at the front end of the coil structure; a dry steam humidifier and a blower are located at the rear end of the coil structure; a control cabinet is located at the rear of the unit casing, and the control cabinet is connected to the four-stage coil structure, primary and secondary filters, and the blower. The technical solution of this utility model solves the problem that traditional air conditioners have high energy consumption, and their energy efficiency drops significantly during long-term operation. In spaces requiring specific temperature, humidity, and cleanliness, continuous use of air conditioning makes it impossible to reduce operating costs.

The utility model discloses a modularization battery PACK device adopts side surface liquid cooling heat dissipation structure, including PACK base, battery module, square lithium iron phosphate battery cell monomer, integration side surface liquid cooling plate, cooling liquid import and export, internal flow channel, heat conduction filling layer, side plate locking mechanism, liquid cooling pipeline, external water nozzle and connecting copper bar, through the direct adhesion of integration side surface liquid cooling plate big side surface of battery cell monomer, eliminate interface thermal resistance in combination with heat conduction filling layer, realize battery cell temperature difference is less than or equal to 3 DEG C, through the bolt of side plate locking mechanism provides controllable pressure force, effectively compensates battery cell charge -discharge expansion, maintains long -term thermal contact stability.

The present invention provides equipment for cooling a data processing unit with a cooling fluid, an electronic device including said equipment, and a vehicle including said electronic device. [Solution] The device 10 for cooling one data processing unit includes an inlet 12 for receiving a cooling fluid and an outlet 14 for discharging a cooling fluid, an internal cavity 16 that fluidly connects the inlet and outlet, one or more thermally conductive plates 18 extending along the sides of the internal cavity and containing a thermally conductive material, and a plurality of individual thermally conductive objects 20, each of which contains a thermally conductive material and is arranged in a pattern within the internal cavity, each of which thermally conductive objects is in contact with one or more other thermally conductive objects within the internal cavity, one or more of which thermally conductive objects are in thermal contact with one or more thermally conductive plates, and the plurality of thermally conductive objects are arranged within the internal cavity such that the cooling fluid surrounds the thermally conductive objects at least partially when the device is in a fluid cooling operation.

This invention relates to a power electronic cooler (KL), comprising: a substrate (BP) and a cover plate (DP) forming a cooling channel (KN) through which coolant flows, wherein the cover plate (DP) is used for thermal contact with a power electronic device (LV); an insert plate (EP) disposed between the substrate (BP) and the cover plate (DP), dividing the cooling channel (KN) into a supply channel section (ZF) and a return channel section (RF); wherein the insert plate (EP) and the substrate (BP) together form the supply channel section (ZF), and together with the cover plate (DP) form the return channel section (RF); wherein the insert plate (EP) has a bypass opening (UO) between a coolant inlet (EL) and a transfer opening (DO), the bypass opening (UO) being fluidly separated from the return channel section (RF) by a partition wall (TW) surrounding the bypass opening (UO); wherein a bypass channel region (UB) is formed between the bypass opening (UO), the partition wall (TW), and the cover plate (DP). The present invention also relates to power electronic devices with the aforementioned cooler and inverters.

The present invention relates to a method for monitoring an electric heating device 2, particularly for use in a vehicle, especially a motor vehicle. The electric heating device 2 comprises an electrically operated heating element 4, which is in thermal contact with a heating chamber 6 through which a fluid can flow. A signal is generated via a temperature sensor 8, which correlates with the temperature of the heating chamber 6. From this signal, as well as from the operating state of the heating element 4 and the pump 8, a flow signal can be determined, which correlates with the flow through the heating chamber 6. Thus, the flow through the heating chamber 6 can be determined without a flow sensor, and in particular, a blockage of the flow through the heating chamber 6 can be detected.

A method of delivering light energy to a pathological tissue includes emitting light energy from a first optical element within a cannula, producing a substantially uniform irradiance profile from the light energy within the cannula, transmitting the light energy emitted from the first optical element through a second optical element in thermal contact with a distal end of the cannula to the pathological tissue without ablating the pathological tissue, and conducting thermal energy from the pathological tissue through the second optical element and to the cannula.

This invention discloses a chassis with high-power circuit boards, comprising a chassis and functional circuit board assemblies. A first energy storage plate is disposed on the top and bottom surfaces of the chassis, and a second energy storage plate is disposed on the inner wall of the chassis. The chassis is connected to the functional circuit board assemblies via the second energy storage plate. This invention utilizes a vapor chamber shell on the functional circuit board assembly to evenly and rapidly distribute the heat generated by the high-power components across the entire surface of the vapor chamber, preventing a sudden temperature rise due to continuous heat accumulation inside the functional circuit board assembly. The use of an indium foil pad ensures a tight fit between the vapor chamber shell and the first and second energy storage plates, significantly increasing the thermal contact area and shortening the heat conduction path, thereby improving the heat resistance of the functional circuit board assembly. This addresses the heat dissipation requirements of chassis with higher heat flux densities, ensuring the functional circuit board assembly operates normally under harsh thermal stress environments, and has practical engineering application value.

The utility model discloses a heat dissipation device and electronic device including the heat dissipation device. The heat dissipation device is used to cool the heat source on the mainboard. The heat dissipation device includes the main heat seat, a plurality of main heat plates and a plurality of main heat pipes. The main heat seat is fixed on the mainboard and is in thermal contact with the heat source. The plurality of main heat plates are respectively located on different sides of the main heat seat, and the plurality of main heat plates are respectively used to be in thermal contact with the heat dissipation member. Each main heat pipe in the plurality of main heat pipes is connected between the main heat seat and one main heat plate in the plurality of main heat plates, and the plurality of main heat pipes are used to transfer the heat on the main heat seat to the plurality of main heat plates. The electronic device includes the mainboard, at least one heat source and the aforementioned heat dissipation device. The heat dissipation device and the electronic device of the utility model effectively improve the overall heat dissipation efficiency.