930 results about "Thermal contact" patented technology

A foot massage device includes a housing, a foot receiving pocket coupled to the housing, a massage assembly disposed in the housing, and a thermal application assembly which is assembled to the foot receiving pocket, wherein the thermal application assembly has a top thermal contact surface which is exposed in the foot receiving pocket, wherein the thermal application assembly has a cooling mode for allowing the top thermal contact surface to provide a cooling treatment to the foot of the user.

The embodiment of the invention provides a robot which comprises a trunk, the trunk comprises a trunk shell, the trunk shell forms a first containing cavity and is provided with a first opening, and the first opening communicates with the first containing cavity; the motor is arranged in the first accommodating cavity; the leg structure is arranged outside the first accommodating cavity and is in transmission connection with the output end of the motor, and the leg structure is configured to move under the driving of the motor; at least part of the heat dissipation piece is arranged outside the first containing cavity and penetrates through the first opening to be in thermal contact with the motor.

Disclosed herein is a medical pad for exchanging thermal energy between a targeted temperature management (TTM) fluid and a patient. The medical pad includes a fluid compartment configured for circulation of a TTM fluid therein. The pad is configured for expansion by providing compressed air to one or more air compartments of the pad, where the expansion defines an increased patient contact area of the pad. An air control module provides air pressure to one or more pads of a TTM system, and the air control module may be incorporated into a TTM system module. The pad further includes a hydrogel layer disposed across an under side of the pad.

A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material bonded to the thermal-interface surface. The composite thermal-interface material comprises a particulate filler material dispersed within a metallic carrier material having a solid-to-liquid phase-change temperature between about 60° C. and about 90° C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials. The particulate filler material can have a higher bulk thermal conductivity than that of the metallic carrier material and can be wetted by the metallic carrier material, providing a bulk thermal conductivity of the composite thermal-interface material that is higher than that of the carrier material without the particulate filler material. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.

The invention discloses a transformer oil tank, and relates to the technical field of power transformers, the transformer oil tank comprises an oil tank body and a plurality of groups of fin mechanisms, and each group of fin mechanism comprises radiating fins with cavities formed inside. The cooling fins with the cavities are arranged on the outer side of the oil tank body, the slidable adjusting plate and the driving assembly are matched, the effective oil storage volume of the cooling fins can be flexibly adjusted according to the environment temperature, the maximum cooling area is guaranteed in the non-low-temperature environment so that efficient cooling can be achieved, the cooling contact area is reduced in the low-temperature environment, and the service life of the oil tank is prolonged. Wax precipitation and viscosity increase caused by excessive cooling of the cooling oil are avoided, so that the insulating property and the circulating fluidity of the cooling oil are maintained, the circulating stirring mechanism can promote efficient circulation of the cooling oil between the oil tank and the fins under driving of the driving mechanism, and the heat dissipation efficiency is further improved; the problems of heat dissipation and insulation performance of the oil-immersed transformer in a low-temperature environment are effectively solved, and the operation reliability and environmental adaptability of equipment are improved.

Provided are a contact pin and a socket for inspection that can improve contact reliability to an IC package. An embodiment includes: an electrically conductive electrical contact extending from a base end to a tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; and an electrically conductive thermal contact extending from a base end to a tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip, and the electrical contact and the thermal contact are laterally stacked adjacent to each other and are movable independently of each other.

The present invention discloses a connector and a connector assembly. The connector comprises: a housing (1); a conductive terminal (2) provided in the housing (1); an electrical power transmission component (3) inserted into the housing (1) and welded to the conductive terminal (2); a fastening assembly (4) for fastening the conductive terminal (2) to a mating terminal of a mating connector; an insulating support (5) installed in the housing (1) for holding the conductive terminal (2); and a temperature measuring device (6) installed on the insulating support (5).The conductive terminal (2) and the electrical power transmission component (3) have welded parts that are welded together, and the temperature measuring device (6) is in thermal contact with the welded part of the conductive terminal (2) and / or the electrical power transmission component (3) to detect the temperature of the welded part. In the present invention, the temperature measuring device is in direct thermal contact with the welded part of the electrical power transmission component and / or the conductive terminal, thus enabling early and accurate detection of the temperature of the connector.

The invention discloses a phased array radar antenna array plane and air-cooled uniform-temperature heat dissipation structure, which optimizes the structure and layout of a heat dissipation air duct of the antenna array plane, and overall designs component modules and the heat dissipation air duct to achieve the effect that the temperatures of components at symmetrical positions of four quadrants of the antenna array plane are consistent; an independent fan is designed for each heat dissipation air duct, and the air volume is determined according to the heat power consumption of each air duct; a heat pipe is designed on a heat exchange contact surface at the bottom of the heat dissipation air duct to reduce the temperature difference of the assembly along the air duct direction; the heat dissipation air channel is completely sealed and isolated from each functional module in the antenna array plane; the inner surface of the heat dissipation air channel is coated with the infrared ceramic radiation heat dissipation coating, salt spray corrosion can be resisted, heat dissipation is facilitated, and the outdoor environment requirement can be met. Through the design, the temperature difference of the components on the antenna array plane is reduced, and the phase consistency requirement of the antenna array plane components is met.

The utility model provides a charging waste heat platform for secondary aluminum production, and relates to the field of secondary aluminum production. The charging waste heat platform for secondary aluminum production comprises a platform body and supporting legs installed at the bottom of the platform body, the charging waste heat platform body comprises a fixed platform body, a fixed cover and a fixed shell, a feeding device used for smashing aluminum raw materials is installed on the fixed shell, and a conveying mechanism is installed in the fixed cover and the fixed shell. Feeding holes are formed in an outer cylinder and a fixed shell of the conveying mechanism; according to the feeding waste heat platform for secondary aluminum production, flue gas is wrapped by the fixing cover and can flow in the specific direction, the heat loss amount in the preheating process is reduced, energy is saved, aluminum raw materials are crushed through the two crushing cutters, the contact area of the aluminum raw materials and air is increased, the subsequent preheating effect is improved, and the service life of the aluminum raw materials is prolonged. And the conveying mechanism can intermittently supply materials and is matched with the inner cylinder and the outer cylinder to rotate, so that the aluminum raw materials continuously roll, the retention time and the heated contact area are increased, and the preheating effect is improved.

A pluggable module cage assembly includes a heatsink that is fastened, joined, or otherwise securely fixed to the cage or host board, making the heatsink substantially immovable relative to the cage or host board. A portion of the surface of the heatsink is exposed to the interior volume of the cage so that it can physically and thermally contact the pluggable module. The cage assembly includes a lifting mechanism that operates to lift a pluggable module when the module is plugged into the cage. The lifting mechanism lifts the module toward the heatsink to push the module with a controlled force against the exposed portion of the surface of the heatsink to make thermal contact.

A heat dissipation assembly includes a liquid-cooling module including a liquid-cooling plate, a bottom surface of the liquid-cooling plate has a locking structure, and an air-cooling module including a plurality of heat dissipation fins. A top surface of each of the plurality of heat dissipation fins is welded to the bottom surface of the liquid-cooling plate. The locking structure engages a locking spring piece on a side wall of a shielding shell of a connector to lock the heat dissipation assembly to the shielding shell. When the heat dissipation assembly is locked onto the shielding shell, a bottom of the air-cooling module protrudes into the shielding shell through an opening in a top wall of the shielding shell to make thermal contact with a mating connector inserted into the shielding shell.

A flow detection device (10) and method for detecting fluid flow in a pipe system, comprising: a heating element (103) for supplying heat into the pipe system, a first temperature sensor (104a) and a second temperature sensor (104b) positioned either side of the heating element (103), and a processor (101), wherein: the heating element (103) and the first and second temperature sensors (104a, 104b) are configured to be mounted to an outer surface of a pipe contained in the pipe system, with the heating element (103), the first temperature sensor (104a) and the second temperature sensor (104b) being in thermal contact with the outer surface of the pipe, and the processor (101) is configured to detect fluid flow within the pipe system by monitoring the temperature difference between the first and second temperature sensors (104a, 104b) over a predetermined period of time.

The invention provides a lighting arrangement (1) comprising a light generating device (100), a heat spreader (200), and a ceiling arrangement (301); wherein (I) the light generating device (100) comprises (i) a first device portion (120) comprising a first side (121) of the light generating device (100) and (ii) a second device portion (140) comprising a second side (141) of the light generating device (100); wherein the first device portion (120) comprises a heat dissipating surface (130); wherein the light generating device (100) is configured to emit device light (101) from the second side (141); (II) the heat spreader (200) comprises a thermally conductive material having a thermal conductivity of at least 150 W / m / K in-plane; (III) the ceiling arrangement (301) comprises (a) a ceiling board (310) and (b) a cavity (350), configured at a first ceiling board side (311); wherein the board (310) comprises a through-hole (360); (IV) the light generating device (100) is at least partly configured in the ceiling arrangement (301), wherein the first device portion (120) is at least partly configured in the cavity (350) and wherein the second device portion (140) is at least partly configured in the through-hole (360); wherein the light generating device (100) is configured for illuminating a space (500) arranged at a second ceiling board side (312) with the device light (101); and (V) the heat spreader (200) is configured in the cavity (350); and wherein the heat dissipating surface (130) and the heat spreader (200) are configured in thermal contact with each other.

An electronic device is described to monitor a temperature of an ambient environment. The electronic device comprises an enclosure that defines an internal volume and a plurality of external surfaces. The enclosure comprises a thermal member exposed to the ambient environment at an opening defined through a first external surface. The thermal member has a greater thermal conductivity than other portions of the enclosure, which have a greater transmissibility of wireless signals than the thermal member. The plurality of external surfaces and the thermal member are disposed to prevent liquids from entering the internal volume. The electronic device further comprises a temperature sensor disposed in the internal volume, thermally contacted with the thermal member, and connected with wireless transmitter circuitry to wirelessly transmit measurements of the temperature of the ambient environment.

A hybrid integrated heat spreader suitable for an integrated circuit (IC) die package. The hybrid integrated heat spreader includes a top sheet material and a sealant interface material located where the heat spreader is to contact an assembly substrate. The sealant interface material may offer greater adhesion to a sealant employed between the interface material and the package substrate. In some examples, the sealant interface material has a greater surface roughness and / or a different composition than a surface of the integrated heat spreader that is in close thermal contact with an IC die through a thermal interface material. With the sealant interface material improving adhesion, the sealant may have a higher bulk modulus, enabling the integrated heat spreader to impart greater stiffness to the IC die package assembly.

An optical transceiver includes a case including a heat sink, one or more heat generating bodies disposed in the case, one or more heat conducting portions protruding from an inner wall surface of the case and thermally contacting the one or more heat generating bodies, and a heat pipe that transfers heat from the one or more heat conducting portions to the heat sink.

The application provides a heat dissipation structure and an electronic device. The heat dissipation structure can include a circuit board, a magnetic device, a heat sink and a heat conducting medium, and the magnetic device can be located between the circuit board and the heat sink. The magnetic device can include a magnetic core and a film-wrapped wire, the magnetic core includes a fixedly connected stopper and a center magnetic column, the film-wrapped wire is wound around the center magnetic column, and the film-wrapped wire is electrically connected with the circuit board. In the heat dissipation structure, at least part of the side surface of the stopper can be provided with a heat conducting film, which can effectively improve the temperature uniformity of the magnetic device to solve the problem of local high temperature of the magnetic device. In addition, the heat conducting medium can be arranged between the magnetic device and the heat sink, and the heat conducting medium is in heat conducting contact with at least part of the magnetic device and the heat sink, so that the heat generated by the magnetic device can be conducted to the heat conducting medium and then transmitted to the heat sink for heat dissipation, which can effectively improve the heat dissipation efficiency of the heat dissipation structure, thereby improving the performance of the electronic device provided with the heat dissipation structure.

The present invention provides a liquid-cooling heat dissipation apparatus for a power device, and an on-board charger. The liquid-cooling heat dissipation apparatus comprises a circuit board, a power device, and a heat dissipation assembly which are sequentially stacked. One side of the power device is connected to the circuit board by means of pins on the power device, and the other side of the power device is installed on a heat dissipation surface of the heat dissipation assembly. In the present invention, the power device is directly installed on the heat dissipation surface of the heat dissipation assembly, so that compared with the prior art, the present invention omits an intermediate heat transfer layer such as an aluminum substrate, reducing thermal contact resistance, thereby improving heat dissipation performance; additionally, the aluminum substrate is not used, so that no additional pressing strip is required to press the aluminum substrate, thereby reducing the complexity of installation, and reducing the installation space required for the power device.

The invention discloses a connector and a connector assembly. The connector includes: a housing; the conductive terminal is arranged in the shell; the electric transmission piece extends into the shell and is welded to the conductive terminal; the fastening assembly is used for fastening the conductive terminal to a mating terminal of a mating connector; the insulating bracket is arranged in the shell and is used for holding the conductive terminals; and the temperature measuring device is mounted on the insulating bracket. The conductive terminal and the electric transmission piece are provided with welding parts which are welded together, and the temperature measuring device is in thermal contact with the welding parts so as to detect the temperature of the welding parts. According to the connector, the temperature measuring device is in direct thermal contact with the welding parts of the power transmission piece and the conductive terminals, so that the temperature of the connector can be detected timely and accurately.

A method for manufacturing an integrated circuit includes forming an active area in a substrate, forming a gate structure on the active area, depositing an insulating layer, etching electrical contact openings to the gate structure and the active area, depositing a first conductive composition in the electrical contact openings to form an electrical contact layer that partially fills the electrical contact openings, filling a remainder of the electrical contact openings to form a plurality of electrical contacts. The method includes etching thermal contact openings to the active area, depositing a second conductive composition in the thermal contact openings to form a thermal contact layer that partially fills the thermal contact openings, wherein the first conductive composition differs from the second conductive composition, filling a remainder of the thermal contact openings to form a plurality of thermal contacts, and thermally connecting the plurality of thermal contacts and a heat dissipation structure.

A sensor module for a motor vehicle may have a see-through area, an environmental sensor, which can detect the vehicle surroundings through the see-through area, and a climate control device (28) for the climate control of the environmental sensor, wherein the climate control device has a cooling device having a contact element for in particular thermally contacting and cooling the environmental sensor and a heating device having at least one heating element, wherein the at least one heating element is arranged at the contact element or is integrated in the contact element.

A cooling assembly is configured for at least one electronic module. The cooling assembly includes at least one thermally conductive plate and at least one cooling pipe. The thermally conductive plate is configured to be attached on one surface of the electronic module. The cooling pipe is configured to be in thermal contact with one side of the thermally conductive plate located farther away from the electronic module. The cooling pipe comprises a pipe wall, and the pipe wall surrounds and forms a fluid channel. The pipe wall of the at least one cooling pipe has a thermally conductive characteristic, and the pipe wall of the at least one cooling pipe is elastically deformable in response to a pressure variation in the fluid channel.

Various embodiments of the teachings herein include a stator housing for an axial flux machine with a rotor to rotate about an axis of rotation, a stator spaced apart from the rotor along the axis of rotation, and a fluidtight interior space containing coil receiving locations in a circumferential direction around the axis of rotation to receive electromagnetic coil assemblies, wherein each coil assembly has at least one coil wound axially around a stator tooth. An example includes: a liquid cooling system having a first cooling channel extending circumferentially in the stator housing; and a second cooling channel separate from the first and extending circumferentially in the stator housing; wherein the interior space holds a cooling liquid in thermal contact with cooling liquid in the first and the second cooling channel.

According to the ship waste heat multi-source coordinated recovery method and system, ship multi-source temperature signals and heat exchange pipeline layout are collected, and heat value rating is carried out on the temperature signals to form heat grade distribution; high-quality hot spots are positioned to establish heat exchange contact, and a dense heating area is formed through cascade strengthening; constructing a thermal load fluctuation curve to identify an intermittent heat supply source, and establishing a thermal circuit intersection to form a flexible heat supply field; dividing effective temperature levels, configuring hierarchical heat exchange to generate a stepped utilization chain, and forming a heat storage and release network output coordination control table; exporting a flow direction guide field, identifying a heat loss node, setting a compensation channel, remodeling a network thermal state through gradient utilization network mapping to obtain a whole network thermal spectrum, and identifying heat flow convergence characteristics to determine a convergence center; and carrying out supply-demand coordination analysis to identify a supply-demand difference value and a reserve capacity, carrying out fluctuation evaluation to generate a coordination margin configuration regulation and control response strategy, completing waste heat multi-source coordination recovery, and improving the ship energy utilization efficiency and the system operation stability.

The utility model discloses a connector end cover, an end cover assembly and a connector. The connector end cover comprises a peripheral wall which is suitable for being sleeved on the rear end of a shell of the connector; the end wall is suitable for abutting against the rear end face of the shell of the connector. And the pressing part is connected with the end wall and is used for being inserted into a shell of the connector, and the pressing part is suitable for applying a preset pressing force on a temperature sensor of the connector under the extrusion of the inner wall surface of the shell of the connector, so that the temperature sensor is in reliable thermal contact with a terminal of the connector. According to the utility model, a fixing device for fixing the temperature sensor on the terminal does not need to be independently provided, the structure of the connector is simplified, and the manufacturing cost is reduced. Besides, in some exemplary embodiments of the utility model, the temperature sensor can be installed along with the connector end cover, thereby simplifying the installation process of the connector and reducing the installation cost.

Described herein are memory devices that include a cooling structure for cooling one or more memory arrays. The memory arrays may be static random access memory (SRAM) arrays formed in multiple layers as a stacked memory device. The cooling structure may cool one or more layers of an SRAM device. For example, a cooling structure may be formed around the SRAM device and coupled to a cooling device. Alternatively, a cooling layer may be included in a memory device and coupled to one or more thermal interface layers in thermal contact with a memory layer by cold vias. The cold vias transfer a cold temperature from the cooling layer to the thermal interface layer to cool the thermal interface layer and, in turn, the memory arrays.

The present disclosure is directed to a structure of a semiconductor package with a heat spreader structure and a method of forming the structure. The method includes providing a substrate with first and second dies on the substrate, dispensing a first thermal interface material (TIM) on the first die, and mounting a heat spreader structure on the first and second dies. A porous metal of the heat spreader structure can be aligned between the first and second dies. The method further includes forming a first thermal contact between the first die and the heat spreader structure via the first TIM, injecting a second TIM on the second die through a perforated hole in the heat spreader structure, and forming a second thermal contact between the second die and the heat spreader structure via the second TIM.

The invention relates to the technical field of load testing, in particular to a data center high-power liquid cooling load testing device which comprises a data processing box body and an operation interface arranged on one side of the data processing box body. The data processing box body is internally provided with a liquid cooling assembly for intensively cooling the data processing elements; the liquid cooling assembly comprises a conduction module. The conduction and cooling conduction module comprises a mounting cover for a heat concentration area in the working process of a data processing element. A plurality of sets of heat collecting pieces are arranged in the installation cover in an array mode and connected with a data processing element circuit in series. And the cooling efficiency and the load adaptability are greatly improved through structural optimization. A mounting cover and array heat collecting pieces are designed for a heat concentration area, a round cover body and concentric polygon arrangement are combined, a heat collecting blind area is eliminated, and the heat contact area is increased through the multiple sets of array heat collecting pieces. The combination of the heat-conducting shaft and the red copper heat-conducting frame shortens the heat transfer path and improves the heat conduction efficiency compared with the design without the heat-conducting shaft.

Interoperable systems for performing sample preparation and analysis in a closed environment include a fluidic cartridge, including chambers for sample and reagents and sample processing, reaction chambers, chamber-connecting channels, and fluid control valves, actuators for closing and selectively opening one or more valves of the cartridge, a syringe pump and syringe driver for effecting fluid movement between chambers of the cartridge, thermal modules for heating or cooling reaction chambers disposed between the thermal modules, a thermal module actuator for moving the thermal modules into and out of thermal contact with the reaction chambers, a contact detector for detecting the presence of a fluidic cartridge between the thermal modules, optical fibers for transmitting optical signals through openings in at least one of the thermal modules, and optical devices for transmitting optical signals through the fibers to the reaction chambers and / or receiving optical signals transmitted by the optical fibers from the reaction chambers.

A coolant leak detection and protection system for rack mounted servers is disclosed. The system includes an inlet coolant tube and a feeder coolant tube for supplying coolant to a cold plate that is thermally in contact with a heat generating component. An outlet coolant tube collects coolant from the cold plate. A three-way valve has a first port coupled to the inlet coolant tube, a second port coupled to the feeder coolant tube, and a third port coupled to a bypass tube fluidly connected to the outlet coolant tube. A controller is coupled to a leak sensor and the three-way valve. The controller is operable to detect a leak based on a signal from the leak sensor. The controller controls the three-way valve to fluidly connect the second port to the third port to cut off coolant flow from the inlet coolant tube when a leak is detected.