The
heat pipe structure disclosed by the invention relates to the technical field of heat dissipation of electronic components, the
heat pipe structure comprises a
heat pipe body and a microfluidic
assembly, and the heat
pipe body is provided with a condensation section, an
evaporation section and a transportation section arranged between the condensation section and the
evaporation section. The micro-fluidic
assembly comprises a control piece and a micro-fluidic
chip, the control piece is electrically connected with the micro-fluidic
chip, and the micro-fluidic
chip is arranged on the transportation section of the heat
pipe body and used for replacing driving force of a conventional heat
pipe through the
dielectric wetting effect in the micro-fluidic technology to achieve transportation of a liquid heat exchange working medium in the direction from the condensation section to the
evaporation section. According to the heat pipe structure disclosed by the invention, the microfluidic technology and the heat pipe technology are combined, the problems of insufficient working medium
transportation capacity, low anti-gravity capacity, difficulty in starting or poor stability of various heat pipes in the prior art are solved, the microfluidic
assembly is used as the driving force of the liquid heat exchange working medium, the larger transportation amount of the liquid heat exchange working medium can be obtained, and the heat exchange efficiency is improved. The heat dissipation effect is better, and the heat dissipation device can be suitable for heat dissipation of high-heat-flux elements in electronic heat dissipation.