6results about How to "Increase functional density" patented technology

The utility model discloses a composite multi-channel connector, which adopts an innovative structural design of a plug assembly and a socket assembly to realize power supply signal integrated transmission. The plug assembly comprises a nested insulator and a split type shell structure, a fixed shell and a sleeve shell are assembled and linked through a clamping ring groove and a clamping protrusion, and the side face of the shell is provided with a double-buckle structure (a first buckle is arranged on the fixed shell, and a second buckle is arranged on the sleeve shell). The socket assembly is correspondingly provided with a double-clamping-groove system, and when connection is in place, double mechanical locking is formed, the first clamping buckle is embedded into the first clamping groove to achieve main fixing, and the second clamping buckle is embedded into the second clamping groove to form auxiliary locking. According to the design, through cooperative action of the split type shell and a double-buckle system, the connection stability is remarkably improved, and accidental loosening is effectively prevented. And meanwhile, the design of the limiting channel not only ensures the insertion guide precision, but also provides an assembly space for the clamping groove mechanism, so that the connector has high functional density and reliable connection performance, and is suitable for the multi-channel transmission requirement under complex working conditions.

The application discloses a kind of radio frequency power amplifier-shunt switch compact coupling device structures, comprising: radio frequency power amplifier structure and shunt switch structure based on active region coupling mode realizes integrated structure design;Wherein, radio frequency power amplifier structure includes the first source electrode of ground, as input end or output end first gate, as the second gate of first voltage source input end;Shunt switch structure includes the second source electrode of ground, as output end or input end drain, as the second gate of first voltage source input end, as the third gate of second voltage source input end;First voltage source input end, second voltage source input end respectively connect with large resistance.The application has ordinary radio frequency power amplifier signal amplification function, and has high isolation switch performance, solves the problem of circuit isolation deterioration under high frequency, solves the contradiction between low integration level and high frequency performance difficult to consider with minimum area cost.

This invention discloses a field-of-view extended solar sensor based on diffraction order multiplexing, comprising a dual-band bandpass filter, a diffractive light introducer, and a color CMOS image sensor. The dual-band bandpass filter selects two separate, preset wavelengths of sunlight for incidence, while the diffractive light introducer diffracts the transmitted sunlight into multi-order beams. The color CMOS image sensor acquires diffraction spot images containing spectral information from both wavelengths. The current effective diffraction order is determined by the mapping relationship between the centroid positions and spot spacing of the spots in the two corresponding wavelength channels and the diffraction order. Finally, the solar vector is calculated using a diffraction optics model. This invention resolves the inherent contradiction between large field of view and high precision in traditional digital solar sensors, effectively overcoming the order ambiguity problem in diffraction-extended field of view. Its lightweight design adapts to high-density integration requirements, providing technical support for spacecraft attitude measurement.

The application relates to the technical field of spacecraft electronic systems, and provides a high-function-density integrated electronic system for micro-nano satellites, which comprises the following: a core heterogeneous computing unit formed by adopting system-level packaging technology; a multifunctional radio frequency and communication unit which integrates a radio frequency transceiver front end, a baseband processing circuit, a power amplifier module and a radio frequency switch by adopting heterogeneous integration technology; an intelligent power management unit which adopts a wide-band semiconductor power device to improve conversion efficiency; a three-dimensional mother board which internally integrates a signal layer, a power supply layer, a ground layer and embedded passive components; a multi-mode hybrid bus which is composed of a high-speed serial bus, a low-speed control bus and an on-chip high-speed interconnection bus; a driving unit which realizes overcurrent protection and state monitoring; and a heat management structure which comprises a heat conduction path embedded in the mother board, a heat spreading plate in contact with high-power chips and a phase change heat storage material. The problems of low function density, insufficient processing capacity, large volume and weight and high power consumption of a traditional architecture are solved.

The invention provides a modular redundancy digital electronic controller hardware architecture. The electronic controller hardware architecture comprises a backboard, a computer board, a switching board, a power board, a signal acquisition board and an output driving board, the computer board, the switching board, the power board, the signal acquisition board and the output driving board are functional board cards; each functional board card adopts a single 6U VPX board card; the backboard is provided with a plurality of board card mounting slots, and each functional board card is mounted on the backboard; the functional board cards perform data interaction through the Ethernet, and the architecture of the electronic controller adopts a dual-redundancy structure; the power board is used for supplying power to the computer board, the switching board, the signal acquisition board and the output driving board. According to the invention, the problems of complex hardware structure and poor expansibility, maintainability and reusability of the redundancy electronic controller of the aero-engine can be solved.

The invention discloses an attitude control cooperation integrated microsystem architecture which comprises a NOR FLASH, a CPU, an SRAM, an FPGA, a DDR and a radio frequency transceiver chip. The NOR FLASH serves as configuration storage and is used for storing configuration programs of the CPU and the FPGA; the CPU adopts a serial working mode to complete attitude control of the microsystem; the SRAM serves as a cache of the CPU and is used for storing data generated in the running process of the CPU; the FPGA is used as a computing core, determines a working mode through programming, and performs serial or parallel processing on communication data; the DDR serves as a cache unit of the FPGA to complete data storage; the radio frequency transceiver chip is used as a communication chip and is controlled by the FPGA to realize communication functions of different working frequency points and different working modes. According to the invention, a configuration storage chip of an FPGA is reduced, and the functional density of the microsystem is improved by 15%. According to the mode, a standby program of the FPGA can be stored in the FLASH, overall reconfiguration and partial dynamic reconfiguration of the microsystem can be achieved through configuration of the CPU on the FPGA, and application flexibility is improved.