Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Curved Surface Flexible Aerospace Multifunctional Structure Computer

A multi-functional, computer technology, applied in computing, instrumentation, electrical digital data processing, etc., can solve the problem of too many connecting parts in the internal space, and achieve the effects of reducing parasitic mass, weight reduction, and quality reduction

Active Publication Date: 2018-07-20
NAT UNIV OF DEFENSE TECH
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a curved-surface flexible aerospace multifunctional structure computer, which solves the technical problem in the prior art that after the spacecraft is assembled, the internal space is occupied too much by various connecting parts

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Curved Surface Flexible Aerospace Multifunctional Structure Computer
  • Curved Surface Flexible Aerospace Multifunctional Structure Computer
  • Curved Surface Flexible Aerospace Multifunctional Structure Computer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and the description thereof are used to explain the present invention, and do not constitute an improper limitation of the present invention.

[0023] In this article, MCM refers to multi-chip modules. The multi-chip module (MCM) in this article refers to the mounting of multiple exposed integrated circuit (IC) chips on a common high-density multilayer interconnection baseboard and high-density packaging. Its density, volume, and performance are unmatched by other current circuits.

[0024] See Figure 1~2 , The present invention provides a curved flexible aerospace multifunctional structure computer, a curved support structure 300, a flexible circuit board layer 4, an MCM substrate 8 and a plurality of multi-chip module layers 5, the curved support structure 300 includes a hollow sandwich materi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a curved surface type flexible astronautic multifunctional structure computer. Functional circuits of a power supply, a CPU, data storage, man-machine interaction, a field bus and the like are reconstructed into multiple multi-chip modules (MCM) and MCM plug-ins; topological configuration of the structure computer is determined by a curved surface structure of a spacecraft; flexible connection cables are designed based on the topological configuration to realize flexible connection among the MCMs; and finally a system is combined with the curved surface structure of the spacecraft to form the novel integrated flexible multifunctional structure computer fusing active electronic circuits and mechanical configuration of an astronautic structure. According to the computer, integrated design of electronic control, thermal control and a structure body is realized, so that the problem of large volume in an existing spaceborne computer device is effectively solved, the parasitic mass of the system can be greatly reduced, the function density is increased, and the internal loading space of the spacecraft is expanded; and the computer is especially suitable for a type of spacecrafts with lightweight structure and large loading space requirements.

Description

Technical field [0001] The invention relates to the technical field of spaceborne computers, in particular to a curved surface type flexible aerospace multifunctional computer. Background technique [0002] In the current design of spacecraft, electronic calculation and control functions, structural load-bearing functions, and thermal control functions are often implemented through a single functional module unit independently designed. For example, electronic equipment black boxes for electronic calculation and control, carrier plates, frames and shells for structural support and load-bearing, and functional components such as radiators and cooling plates for thermal control are all designed separately. The spacecraft uses mechanical interface methods such as threaded connections for surface assembly and integration. [0003] In the above-mentioned existing design methods, due to the irregular volume of the various equipment and functional module units used, the spacecraft will o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18
CPCG06F1/182G06F1/183
Inventor 李东旭杜金榜黄奕勇刘望
Owner NAT UNIV OF DEFENSE TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products