447 results about "Multi-chip module" patented technology

A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms, such as "hybrid" or "hybrid integrated circuit", also refer to MCMs. The individual ICs that make up an MCM are known as Chiplets. Intel and AMD are using MCMs to improve performance and reduce costs, as splitting a large monolithic IC into smaller chiplets allows for more ICs per wafer, and improved yield, as smaller dies have a reduced risk of getting destroyed by dust particles during semiconductor fabrication. Each chiplet is physically smaller than a conventional monolithic IC die, (A monolithic IC is an IC package contining a single IC). An example of MCMs in use for mainstream CPUs is AMD's Zen 2 design.