438 results about "Multi-chip module" patented technology

A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.

A computer processing system having memory and processing facilities for processing data with a computer program is a Hybrid Transactional Memory multiprocessor system with modules 1 . . . n coupled to a system physical memory array, I/O devices via a high speed interconnection element. A CPU is integrated as in a multi-chip module with microprocessors which contain or are coupled in the CPU module to an assist thread facility, as well as a memory controller, cache controllers, cache memory, and other components which form part of the CPU which connects to the high speed interconnect which functions under the architecture and operating system to interconnect elements of the computer system with physical memory, various 1/0, devices and the other CPUs of the system. The current hybrid transactional memory elements support for a transactional memory system that has a simple/cost effective hardware design that can deal with limited hardware resources, yet one which has a transactional facility control logic providing for a back up assist thread that can still allow transactions to reference existing libraries and allows programmers to include calls to existing software libraries inside of their transactions, and which will not make a user code use a second lock based solution.

A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The intermediate substrate has an opening. The first carrier and the second carrier are electrically connected to the first package and the second package respectively. The second package is accommodated in the opening and electrically connected to the first package via the first carrier, the second carrier and the intermediate carrier. The cap-like heat spreader has a supporting portion and an alignment portion wherein the supporting portion is connected to the alignment portion to define a cavity. The cavity not only accommodates the first package, the first carrier, the second package, the second carrier and the intermediate substrate but also provides alignment mechanism by the supporting portion and the alignment portion to prevent the dislocation after all the components of the thermal enhance MCM package are connected with each other. Furthermore, the first carrier has a first side and the second carrier has a second side. The first side and the second side both have grounding portions, for example recessed portions and metal layers, for providing a ground shielding of the first package and the second package against the outside. In addition, the grounding portions also provide thermal paths to increase the ability of the heat dissipation. Besides, a method for manufacturing the thermal enhance MCM package is provided.

Exemplary embodiments provide systems and methods for portable medical ultrasound imaging. Preferred embodiments utilize a tablet touchscreen display operative to control imaging and display operations without the need for using traditional keyboards or controls. Certain embodiments provide ultrasound imaging system in which the scan head includes a beamformer circuit that performs far field sub array beamforming or includes a sparse array selecting circuit that actuates selected elements. Exemplary embodiments also provide an ultrasound engine circuit board including one or more multi-chip modules, and a portable medical ultrasound imaging system including an ultrasound engine circuit board with one or more multi-chip modules. Exemplary embodiments also provide methods for using a hierarchical two-stage or three-stage beamforming system, three dimensional ultrasound images which can be generated in real-time.

In a multi-chip module (MCM), a “super” chip (110N) is attached to multiple “plain” chips (110F′“super” and “plain” chips can be any chips). The super chip is positioned above the wiring board (WB) but below at least some of plain chips (110F). The plain chips overlap the super chip. Further, the plain chips' low speed IOs can be connected to the WB by long direct connections such as bond wires (e.g. BVAs) or solder stacks; such connections can be placed side by side with the super chip. Such connections can be long, so the super chip is not required to be thin. Also, if through-substrate vias (TSVs) are omitted, the manufacturing yield is high and the manufacturing cost is low. Other structures are provided that combine the short and long direct connections to obtain desired physical and electrical properties.

A method for deplating defective capacitors comprising forming a plurality of capacitors on a semiconductor substrate, forming a plurality of metal contacts on the plurality of capacitors, and depositing a layer of photoresist on the semiconductor substrate. The photoresist layer is patterned so that the plurality of metal contacts are exposed, which are then contacted with an electrically conductive solution. The metal contacts, which are disposed over defective capacitors, are subsequently deplated. A method for forming a multi-chip module comprising forming a thin-film polymeric interconnect structure having a pair of sides, one of which is disposed on a silicon substrate having active or passive devices and the other of which has a computer chip mounted thereon. A multi-chip module formed by the method.

A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer.

The present invention relates to a system and methodology to reduce size, weight and cost, improve data processing rates and serviceability, and accommodate higher I/O multi-chip modules (MCMs) for printed circuit board (PCB) assemblies employed in the electronics industry. This is accomplished by selecting low cost, pre-assembled, plastic chip type MCMs for constructing a daughter card where the daughter card material can accommodate high density lines and spaces. Optical interconnects are employed between the daughter card and the motherboard to provide a high speed interface that is substantially not effected by contaminates or limitations associated with electrical lead wires and solder bonds. The result is a high performance card that meets current and projected future demands in signal processing.

Semiconductor device 3 comprises semiconductor chip 11, Au ball bumps 21 formed on pad electrodes 12 with a stud bump method, and thermoplastic adhesive layer 22 provided on the surface of semiconductor chip 11 on which pad electrodes 12 are formed, in which the tops of Au ball bumps 21 project from the surface of adhesive layer 22. Reliable bonding can be realized by forming the bumps for electrical connection and the adhesive resin having an adhesion function on the semiconductor chip. In addition, the present invention provides a method of bonding a copper foil to a semiconductor wafer to form a wiring pattern, a multi chip module in which electrical connection is established by bumps bonded to each other through an adhesive layer, and the like.

An improved multi-chip module includes a circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes multiple IC packages, which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the circuit board. A variety of package carriers are used to create a number of different modules. One type of package carrier has a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. At least one IC package is surface mounted on each major planar surface, by interconnecting the connection elements, or leads, of the package with the contact pads on the planar surface, to form the IC package unit. Another type of package carrier substrate has a multiple recesses for back-to-back surface mounting of the IC packages. The package also includes in various versions heat sinks.

A power supply includes a non-isolated DC-DC converter for use in a power source system having a high side switch and a low side switch, in which HEMT or HFET or gallium nitride device with low capacity and low on-resistance is used for the high side switch and a vertical power MOSFET of silicon device with low on-resistance is used for the low side switch.

A method for fabricating copper-faced electronic modules is described. These modules are mechanically robust, thermally accessible for cooling purposes, and capable of supporting high power circuits, including operation at 10 GHz and above. An imprinting method is described for patterning the copper layers of the interconnection circuit, including a variation of the imprinting method to create a special assembly layer having wells filled with solder. The flip chip assembly method comprising stud bumps inserted into wells enables unlimited rework of defective chips. The methods can be applied to multi chip modules that may be connected to other electronic systems or subsystems using feeds through the copper substrate, using a new type of module access cable, or by wireless means. The top copper plate can be replaced with a chamber containing circulating cooling fluid for aggressive cooling that may be required for servers and supercomputers. Application of these methods to create a liquid cooled supercomputer is described.

A system and method for analyzing timing and noise effects in a hybrid circuit which contains a plurality of electrical components. The timing and noise effects for the hybrid circuit are generated by simulating electrical conditions within a hybrid circuit model. The hybrid circuit model is constructed by creating and integrating analog and behavioral models from the plurality of electrical components. The timing and noise effects remain accurate even at high printed circuit board/multi-chip module clock speeds, thereby ensuring that a user is able to construct an optimal design for any one of the plurality of electrical components.

Disclosed here is a multi-chip module enhanced in performance and reduced in size. A second semiconductor chip having bonding pads at the periphery of its surface is mounted over a first semiconductor chip laid out over a surface of a substrate back to back and a spacer is provided at a portion of the second semiconductor chip surface except for a predetermined area that includes the portion where the bonding pads are formed while a third semiconductor chip is mounted over the spacer, the third semiconductor having the same circuit function as the second semiconductor chip and oriented similarly to the second semiconductor chip. The bonding pads of the second and third semiconductor chips are connected to their corresponding electrodes formed over the substrate through bonding wires respectively, then the first to third semiconductor chips and the bonding wires provided over the substrate are all sealed by a sealing agent.

An interconnect for semiconductor components such as dice, wafers and chip scale packages is provided. The interconnect includes a substrate, and patterns of contacts formed on a face side of the substrate adapted to electrically engage external contacts (e.g., bond pads, solder bumps) on the components. The interconnect also includes insulated conductive members through the substrate, which provide direct electrical paths from the interconnect contacts to a backside of the substrate. The conductive members can be formed by laser machining openings in the substrate, and then filling the openings with a conductive material (e.g., metal, conductive polymer). The conductive members can also include pads with contact balls, configured for electrical interface with a test apparatus, such as test carrier or wafer handler. The interconnect can be used to construct test systems for testing semiconductor components, or to construct chip scale packages and multi chip modules.

A method and system in a multiprocessor data processing system (MDPS) that enable efficient load balancing between a first processor with idle processor cycles in a first MCM (multi-chip module) and a second busy processor in a second MCM, without significant degradation to the thread's execution efficiency when allocated to the idle processor cycles. A load balancing algorithm is provided that supports both stealing and borrowing of threads across MCMs. An idle processor is allowed to “borrow” a thread from a busy processor in another memory domain (i.e., across MCMs). The thread is borrowed for a single dispatch cycle at a time. When the dispatch cycle is completed, the thread is released back to its parent processor. No change in the memory allocation of the borrowed thread occurs during the dispatch cycle.

A multi-chip module instrument controller having various interface and operational capabilities. The controller incorporate a microprocessor and both volatile and non-volatile memories. The controller includes variable analog-to-digital conversion bit depths, with higher bit depths for some applications. Additionally, the controller includes a separately controllable field programmable gate array that acts as a parallel processor with internal or separate external clock. The FPGA preferably includes more than thirty thousand gates (30,000) and adds a freely re-configurable and separately programmable multi-purpose digital system that can run independent of the microprocessor.