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11results about "Light absorption dielectrics" patented technology
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Contact option for a conductor arrangement integrated in a multilayer composite article
PendingDE102024210286A1Light absorption dielectricsCircuit arrangements on support structuresElectrical conductorEngineering physics
The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.
Owner:CONTITECH DEUTSCHLAND GMBH
Semiconductor package and semiconductor device
PendingUS20260011657A1Printed circuit assemblingLight absorption dielectricsDevice materialSemiconductor package
A semiconductor package of an embodiment includes: a wiring substrate having a first surface and a second surface on a side opposite to the first surface; at least one semiconductor chip provided in plurality at different heights from the first surface in a vertical direction; a sealing resin covering the first surface of the wiring substrate and surfaces of the at least one semiconductor chip; a layer formed over a top layer of the at least one semiconductor chip; and an external terminal provided on the second surface of the wiring substrate. The wiring substrate is electrically connectable with a printed wiring board through the external terminal.
Owner:KIOXIA CORP
System
ActiveCN224006982ULight absorption dielectricsCross-talk/noise/interference reductionOptical ModuleMaterials science
The present disclosure relates to a system. There is provided a system comprising: an optical module comprising: one or more optical components; an optical module substrate, in which the optical module substrate protrudes on at least one side of the module, in which a protruding portion of the module substrate includes one or more ground pads; and an EMI shield, where the EMI shield includes at least one shielding member.
Owner:STMICROELECTRONICS INT NV
Recyclable electronic devices and methods and apparatus for making and recycling such devices
PendingCN121003011ALight absorption dielectricsPrinted circuits repair/correctingHemt circuitsMaterials science
Owner:NEDERLANDSE ORG VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO
Recyclable electronic device, and method and apparatus for manufacturing and recycling the device
An electronic device comprising a stack with a circuit layer (15) covered by at least one delamination layer (12). A graphic layer (13) with a pattern of one or more light reflecting areas (13f) and one or more light absorbing areas (13s) is provided at a first side (S1). The one or more light reflecting areas (13f) are arranged to cover circuit parts (15c) of the circuit layer (15). The one or more light absorbing areas (13s) are arranged at areas without the circuit parts (15c) and without the at least one delamination layer (12), and are configured to delaminate under the influence of light transmitted through a first substrate (11) and absorbed by the one or more light absorbing areas (13s), while the one or more light reflecting areas (13f) are configured to reflect said light.
Owner:NEDERLANDSE ORG VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO
Joint structure
ActiveUS12588151B2Printed circuit assemblingLight absorption dielectricsHigh electronElectronic component
A joint structure, in which an electronic component and a wiring substrate are joined to each other, includes: a base material of the electronic component; a base material of the wiring substrate; and a joint portion that includes at least an electrode of the electronic component and an electrode of the wiring substrate, and that joins the base material of the electronic component and the base material of the wiring substrate. The joint portion includes a material having an absorption coefficient of 2×10{circumflex over ( )}5 cm−1 or more for light of a wavelength of 250 to 1000 nm. The base material of at least one component of the electronic component and the wiring substrate consists of a material having an absorption coefficient of 1.5×10{circumflex over ( )}5 cm−1 or less for the light of a wavelength of 250 to 1000 nm.
Owner:TDK CORP
Recyclable electronic devices, as well as methods and apparatus for manufacturing and recycling such devices.
Owner:NEDERLANDSE ORG VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO
Contacting possibility for a conductor arrangement integrated in a multi-layer composite article
The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.
Owner:CONTITECH DEUTSCHLAND GMBH
Pattern transfer printing of multi-layered features
Pattern transfer sheets and methods are provided, providing multi-layer paste stack lines that are printed on a receiving substrate in a single illumination step. The paste is filled layer-by-layer, possibly having different materials in different layers, with layer thickness controlled by parameters of the filling elements, e.g., in case of blades, the pressure, angle, velocity and flexibility (material) of the blade. Specifically, a bottom layer of the stack may be configured to interface the receiving substrate while one or more top layers may be configured to optimize the quality of the printed features. For example, bottom layers may comprise to bind to the substrate, to modify the substrate (e.g., forming selective emitter (SE) therein) and / or provide a barrier from top layer(s) which may not be compatible with the substrate (e.g., copper on silicon). Releasing material may be used to support the single step release of the stack line.
Owner:WUHAN DR LASER TECH CORP LTD
Electronic device including shielding member including structure for reducing deformation
ActiveUS12538412B2Light absorption dielectricsPrinted circuit groundingOptical transducersElectric devices
An electronic device according to an embodiment includes a printed circuit board including a ground pad, an optical sensor disposed on the printed circuit board, and a shielding member covering the optical sensor. The shielding member includes a first adhesive layer attached on the optical sensor and the ground pad, a first shielding layer electrically connected to the ground pad and disposed on the first adhesive layer, and a first cover layer disposed on the first shielding layer, the first cover layer including a plurality of first particles configured to reflect or scatter light, a plurality of second particles configured to absorb the light, and a binder covering the plurality of first particles and the plurality of second particles.
Owner:SAMSUNG ELECTRONICS CO LTD
Contacting possibility for a conductor arrangement integrated in a multi-layer composite article
The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.
Owner:CONTITECH DEUTSCHLAND GMBH