123results about "Light absorption dielectrics" patented technology

Disclosed are a printed wiring board having micro-via holes highly reliable for conduction and a method of making the micro-via hole by providing a coating or sheet of an organic substance containing 3 to 97% by volume of at least one selected from a metal compound powder, a carbon powder or a metal powder having a melting point of at least 900° C. and a bond energy of at least 300 kJ/mol on a copper foil as an outermost layer of a copper-clad laminate having at least two copper layers, or providing a coating or sheet of the same after oxidizing a copper foil as an outermost layer, irradiating the coating or sheet with a carbon dioxide gas laser at an output of 20 to 60 mJ/pulse, thereby removing a micro-via-hole-forming portion of at least the copper foil as the outermost layer, then irradiating micro-via-hole-forming portions of the remaining layers with a carbon dioxide gas laser at an output of 5 to 35 mJ/pulse to make a micro-via hole which does not penetrate through the copper foil in a bottom of the micro-via hole, and electrically connecting the copper foil as the outermost layer and the copper foil in the bottom of the micro-via hole with a metal plating or an electrically conductive coating composition.

An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.

A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer.

Disclosed herein are double-sided transparent conductive films suitable for patterning by laser ablation.

A high relative-permittivity B-staged sheet obtained by incorporating an insulating inorganic filler having a relative permittivity of at least 500 at room temperature into a solvent-less resin component so as to have an insultaing inorganic filler content of 80 to 99% by weight, a high relative-permittivity prepreg obtained from the above high relative-permittivity B-staged sheet, a process for the production of the high relative-permittivity prepreg, and a printed wiring board obtained from any one of the above high relative-permittivity B-staged sheet and the high relative-permittivity prepreg.

A method of forming a pattern of electrical conductors on a substrate (18) consists of forming metal nanoparticles on a conductive material. A light absorbing dye is mixed with the metal nanoparticles. The mixture is then coated on the substrate. The pattern is formed on the coated substrate with laser light (14). Unannealed material is removed from the substrate.

The invention relates to a single- or multilayer, oriented film comprised of a polyester which comprises an additive which when irradiated with electromagnetic radiation forms metal nuclei on which further metal can be accumulated in further steps of the process. The film also comprises another, radiation-absorbing material. The invention further relates to a process for the production of this film and to its use in printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, and film-based circuits of any type.

A copper-clad board suitable for making a hole with a carbon dioxide gas laser, which copper-clad board is obtained by disposing a double-side-treated copper foil provided with a metallic-treatment layer having a high absorption rate of a carbon dioxide gas laser energy on at least one surface, at least on an outer layer of a thermosetting resin composition layer such that the metallic-treatment layer is formed on a shiny surface of the copper foil which shiny surface is to be a surface layer, and laminate-forming the double-side-treated copper foil and the thermosetting resin composition layer under heat and pressure, to make an alloy of the metallic-treatment layer and the copper by the above heating, a method of making hole in the above copper-clad board and a printed wiring board comprising the above copper-clad board.

Providing a method of manufacturing a laser processed part by using a protective sheet for laser processing capable of effectively suppressing contamination of surface of workpiece by decomposition product, and processing at high precision, when processing the workpiece by optical absorption ablation of laser beam. It is also an object to present a protective sheet for laser processing for use in the manufacturing method of laser processed part.

A flexible circuit board and a liquid crystal display having the same prevents emission of light from a light source to peripheral undesired areas, and firmly connects the board to a mold frame. The board includes a first insulating film, conductive patterns formed on the first insulating film, a second insulating film formed on the first insulating film to cover the conductive patterns, a light source coupled to the conductive patterns, and a light absorbing layer formed on the outer circumference of the light source to absorb light from the light source. Also, a mold frame includes an outer frame, an inner frame, and a guide boss. The board is connected to the mold frame, the light guide plate is connected to the mold frame and optically coupled to the board, and the liquid crystal display panel is placed on the light guide plate and coupled to the board.

A thermosetting adhesive and pressure-sensitive adhesive composition containing 100 parts by weight of an acrylic polymer (X) containing, as monomer components, a (meth)acrylic acid alkyl ester (a) where the alkyl group has 2 to 14 carbon atoms in an amount of 60 to 75% by weight relative to the total amount of monomer components, a cyano group-containing monomer (b) in an amount of 20 to 35% by weight relative to the total amount of monomer components, and a carboxyl group-containing monomer (c) in an amount of 0.5 to 10% by weight relative to the total amount of monomer components and 1 to 20 parts by weight of a carbolic acid-based resorcinol-type phenol resin (Y) represented by the following formula (1), and further containing an ultraviolet absorbent (Z).

wherein R¹ represents —CH₂— or —CH₂—O—CH₂—, n is a positive integer, and m is an integer of 1 to 4.

This invention provides a method for forming a micro blind via on a copper clad laminate (CCL) substrate. A CCL substrate having a dielectric layer sandwiched by a first copper layer and a second copper layer is prepared. A laser absorbing layer is formed on the first copper layer. The laser absorbing layer is subjected to laser drilling. A micro blind via is drilled into the first copper layer and the dielectric layer in one step.

A method for manufacturing a multilayer printed circuit board is disclosed. First a composite foil (10) including a functional copper foil (16) mounted on a carrier foil (12) is laminated on a core board (20). The functional copper foil (16) is less than 10 mu m thick, and has a front side facing the carrier foil (12) and a back side coated with a resin (18). Next, the carrier foil (12) is removed from the functional copper foil (16), in order to uncover the front side of the functional copper foil (16). Then, a CO2 laser source is used to drill holes through the functional copper foil (16) and the resin (18) in order to form micro holes (24). It is also disclosed a composite foil (10) comprising four different layers for use in the manufacture of a multilayer printed circuit board.

The present invention is directed to non-lithographic patterning by laser (or similar-type energy beam) ablation, where the ablation system ultimately results in circuitry features that are relative free from debris induced over-plating defects (debris relating to the ablation process) and fully additive plating induced over-plating defects. Compositions of the invention include a circuit board precursor having an insulating substrate and a cover layer. The insulating substrate is made from a dielectric material and also a metal oxide activatable filler. The cover layer can be sacrificial or non-sacrificial and is used to remediate unwanted debris arising from the ablation process.

An anisotropic conductive film bonding apparatus and a method using a laser beam instead of thermal welding using a hot bar are disclosed. The apparatus includes a light source for generating a laser beam, a laser beam transmitter for guiding the laser beam from the light source to project the laser beam onto a connecting portion, a jig, on which the substrate, the ACF, and the material are accumulated, for projecting the laser beam on the accumulated material, a manipulation panel, and a controller for setting intensity and projection manner of the laser beam and pressure and for controlling overall operation of the apparatus. The process using the hot bar as a heat source for the connection of the anisotropic conductive film is replaced with the process using a diode laser, so that reliability and precision of the process can be achieved, the processing time can be also reduced, and full-automated process can enhance productivity

The present invention relates to a multilayer ceramic board and manufacturing method thereof. The multilayer ceramic board includes: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias; diffused reflection preventing patterns which expose the vias provided on each of the uppermost ceramic layer and the lowermost ceramic layer, and are disposed on each of a top surface and a bottom surface of the ceramic stacked structure; and contact pads which are electrically connected to the vias exposed by the diffused reflection preventing patterns.

A flexible circuit board of a liquid crystal display includes a first insulating film having an ink layer, one or more conductive patterns formed on the first insulating film, a second insulating film formed on the first insulating film and covering the one or more conductive patterns, at least one light source which is electrically coupled to the one or more conductive patterns, and a light absorbing layer formed on the outer circumference of the light source to absorb light from the light source.