19results about "Light absorption dielectrics" patented technology

Methods, systems, and apparatuses for grounding of integrated external electromagnetic interference (EMI) shields are provided. A portion of a module substrate, different from a circuit board substrate, may protrude past the module as a location for one or more grounding pads to which the EMI shield is grounded. The EMI shield may cover at least a portion of the thickness of the module substrate. The EMI shield may be comprised of one or more parts, which may be coupled to one another. The module substrate may include conductive vias. The EMI shield may include a sprayed and / or printed coating. The EMI shield may include a darkened coating.

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.

A semiconductor package of an embodiment includes: a wiring substrate having a first surface and a second surface on a side opposite to the first surface; at least one semiconductor chip provided in plurality at different heights from the first surface in a vertical direction; a sealing resin covering the first surface of the wiring substrate and surfaces of the at least one semiconductor chip; a layer formed over a top layer of the at least one semiconductor chip; and an external terminal provided on the second surface of the wiring substrate. The wiring substrate is electrically connectable with a printed wiring board through the external terminal.

A semiconductor package of an embodiment includes a wiring substrate, a semiconductor chip provided on an upper surface of the wiring substrate, a sealing resin covering surfaces of the wiring substrate and the semiconductor chip, an infrared reflection layer containing any of aluminum, aluminum oxide, and titanium oxide, and an external terminal provided on a lower surface of the wiring substrate. The wiring substrate is electrically connectable with a printed wiring board through the external terminal. The infrared reflection layer is provided to the sealing resin on an upper side of a surface of the semiconductor chip on a side opposite to an upper surface of the wiring substrate.

The present disclosure relates to a system. There is provided a system comprising: an optical module comprising: one or more optical components; an optical module substrate, in which the optical module substrate protrudes on at least one side of the module, in which a protruding portion of the module substrate includes one or more ground pads; and an EMI shield, where the EMI shield includes at least one shielding member.

An electronic device comprising a stack with a circuit layer (15) covered by at least one delamination layer (12). A graphic layer (13) with a pattern of one or more light reflecting areas (13f) and one or more light absorbing areas (13s) is provided at a first side (S1). The one or more light reflecting areas (13f) are arranged to cover circuit parts (15c) of the circuit layer (15). The one or more light absorbing areas (13s) are arranged at areas without the circuit parts (15c) and without the at least one delamination layer (12), and are configured to delaminate under the influence of light transmitted through a first substrate (11) and absorbed by the one or more light absorbing areas (13s), while the one or more light reflecting areas (13f) are configured to reflect said light.

The chip-embedded printed circuit board 100 includes a cavity 110 in the printed circuit board, a chip 104 in the cavity of the printed circuit board, and a thixotropic dielectric filler 106 in a gap in the cavity to encapsulate the chip in the printed circuit board.

The electronic device 100 is designed to maintain its usefulness during use and to be more easily recycled at the end of its life. The electronic device includes a first substrate 11, an encapsulation layer 19, and a set of electronic devices 15 disposed therebetween. One or more release layers 12, 18 cover at least one, preferably both sides, of the set of electronic devices 15 so as to separate the set of electronic devices 15 from at least one, preferably both, of the first substrate 11 and the encapsulation layer 19. The set of electronic devices 15 covered by the one or more release layers 12, 18 is encapsulated between the encapsulation layer 19 and the first substrate 11. At least one of the release layers 12, 18 includes a set of passages 12p, 18p filled with the material of the encapsulation layer 19, and the set of passages forms a set of interconnects 19p between the encapsulation layer 19 and the first substrate 11.

The invention relates to grounding of an integrated external EMI shield of an optical sensor module. Methods, systems, and apparatus are provided for integrating grounding of an external electromagnetic interference (EMI) shield. A portion of the module substrate, different from the circuit board substrate, may protrude beyond the module, as a location of one or more ground pads for EMI shield grounding. The EMI shield may cover at least a portion of a thickness of the module substrate. The EMI shield may include one or more portions, which may be coupled to each other. The module substrate may include conductive vias. The EMI shield may include a sprayed and / or printed coating. The EMI shield may include a darkened coating.

Methods and systems for grounding of integrated external electromagnetic interference (EMI) shields are provided. A portion of a module substrate 102 protrudes on at least one side of the module 100A. The protruding portion of the module substrate comprises one or more grounding pads 103a...N to which the EMI shield 101 is grounded. The EMI shield may cover at least a portion of the thickness of the module substrate. The EMI shield may be comprised of one or more parts, which may be coupled to one another. The module substrate may include conductive vias. The EMI shield may include a sprayed and / or printed coating. The EMI shield may include a darkened coating.

A joint structure, in which an electronic component and a wiring substrate are joined to each other, includes: a base material of the electronic component; a base material of the wiring substrate; and a joint portion that includes at least an electrode of the electronic component and an electrode of the wiring substrate, and that joins the base material of the electronic component and the base material of the wiring substrate. The joint portion includes a material having an absorption coefficient of 2×10{circumflex over ( )}5 cm−1 or more for light of a wavelength of 250 to 1000 nm. The base material of at least one component of the electronic component and the wiring substrate consists of a material having an absorption coefficient of 1.5×10{circumflex over ( )}5 cm−1 or less for the light of a wavelength of 250 to 1000 nm.

The invention relates to an electronic device in automation technology, comprising an electronic circuit board (EP) overmolded twice with plastic, on which at least one plug connection (12) and a plurality of light sources (14) are arranged. In a first manufacturing state (16a), the electronic circuit board (EP) is embedded in a first plastic injection-molded part (T1), and in a second manufacturing state (16b), the first plastic injection-molded part (T1) is at least partially encased by a second plastic injection-molded part (T2). A plurality of recesses (20) are formed between the electronic circuit board (EP) and an upper side (18) of the first plastic injection-molded part (T1), and the electronic device (10) comprises a plurality of light-guiding elements (22) which, in the first manufacturing state (16a), can be or are inserted selectively into the recesses (20) for light guidance in order to form light-guiding sections above the light sources (14).Furthermore, the invention also relates to a manufacturing method.

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.

Pattern transfer sheets and methods are provided, providing multi-layer paste stack lines that are printed on a receiving substrate in a single illumination step. The paste is filled layer-by-layer, possibly having different materials in different layers, with layer thickness controlled by parameters of the filling elements, e.g., in case of blades, the pressure, angle, velocity and flexibility (material) of the blade. Specifically, a bottom layer of the stack may be configured to interface the receiving substrate while one or more top layers may be configured to optimize the quality of the printed features. For example, bottom layers may comprise to bind to the substrate, to modify the substrate (e.g., forming selective emitter (SE) therein) and / or provide a barrier from top layer(s) which may not be compatible with the substrate (e.g., copper on silicon). Releasing material may be used to support the single step release of the stack line.

An electronic device according to an embodiment includes a printed circuit board including a ground pad, an optical sensor disposed on the printed circuit board, and a shielding member covering the optical sensor. The shielding member includes a first adhesive layer attached on the optical sensor and the ground pad, a first shielding layer electrically connected to the ground pad and disposed on the first adhesive layer, and a first cover layer disposed on the first shielding layer, the first cover layer including a plurality of first particles configured to reflect or scatter light, a plurality of second particles configured to absorb the light, and a binder covering the plurality of first particles and the plurality of second particles.

The invention relates to an electronic device used in automation technology, comprising an electronics circuit board (EP) which is doubly overmolded with plastics material and on which at least one plug connector (12) and a plurality of light sources (14) are arranged, wherein the electronics circuit board (EP), in a first production state (16a), is embedded in a first plastics injection-molded part (T1), and wherein, in a second production state (16b), the first plastics injection-molded part (T1) is at least partly encased by a second plastics injection-molded part (T2). A plurality of recesses (20) are formed between the electronics circuit board (EP) and an upper face (18) of the first plastics injection-molded part (T1), wherein the electronic device (10) comprises a plurality of light-guiding elements (22) which in the first production state (16a) are selectively insertable or inserted, for the purposes of light guidance, into the recesses (20) in order to form light-guiding portions above the light sources (14). The invention also relates to a production method.

The invention relates to a method (100) for manufacturing a multilayer composite article (10) with an integrated conductor arrangement (20). It is proposed to integrate a laser radiation-reflecting reflector element (30) under a cover layer (13) of the multilayer composite article (10). The reflector element (30) thus defines a processing path along which the cover layer (13) can be reliably ablated by means of laser ablation.