594results about "Circuit board tools positioning" patented technology

The invention discloses a high-precision drilling control method and system for a multi-layer PCB, and relates to the technical field of intelligent control. The method comprises the following steps: scanning and analyzing to obtain layered material characteristics and structural size information of a multi-layer PCB, and carrying out clamping fixation and positioning hole processing on the multi-layer PCB to obtain a PCB positioning hole; a drilling machining three-dimensional coordinate axis is constructed; a PCB drilling strategy space is constructed, the PCB drilling strategy space is adopted to conduct drilling analysis on the layered material characteristics and the structure size information in sequence according to the PCB drilling machining requirement, and layered drilling strategy parameters are obtained; and the layered drilling strategy parameters are mapped to a drilling processing three-dimensional coordinate axis for space route fusion, layered drilling processing parameters are determined, and high-precision drilling and quality detection closed-loop control are executed on the multi-layer PCB. The technical problem that in the prior art, the positioning precision is low in the drilling process of the multi-layer PCB is solved, and the technical effect of improving the drilling machining precision of the multi-layer PCB is achieved.

The invention relates to the technical field of PCB machining, in particular to a full-automatic integrated vacuum hole plugging machine which comprises a bottom frame, a hole plugging device, an ink scraping device and a transferring mechanism, the hole plugging device is used for completing the hole plugging process of a PCB, the ink scraping device is used for completing the oil coating and ink scraping process of the PCB, and the transferring mechanism is used for transferring the PCB to the bottom frame. And the transferring mechanism is used for moving the PCB to be plugged into the clamping mechanism in the hole plugging device or moving the PCB subjected to hole plugging into the clamping mechanism of the ink scraping device. According to the full-automatic integrated vacuum hole plugging machine, the hole plugging and ink scraping processes of the PCB can be completed, meanwhile, the PCB is moved into the clamping mechanisms of the hole plugging device and the ink scraping device through the transferring mechanism, the feeding action of the hole plugging process or the ink scraping process of the PCB is automatically completed, and therefore the efficiency, quality and yield of the hole plugging process and the ink scraping process of the PCB are ensured.

The invention relates to the technical field of circuit board processing, and discloses an intelligent dust collector customized circuit board positioning device which comprises an operation table. The positioning and clamping assembly is used for clamping the circuit board in a centered positioning mode; the protection assembly is used for preventing the clamped circuit board from falling off during movement; the positioning and clamping assembly comprises a locking part used for switching the two clamping states of elastic clamping and rigid clamping. Through the arrangement of the positioning and clamping assembly, the four mounting boxes can synchronously perform centering movement, and clamping pieces on the four mounting boxes can perform centering positioning and clamping on a rectangular circuit board, so that the effect of automatic positioning is achieved, the positioning accuracy is high, and the positioning accuracy is high in cooperation with the rotation of an annular frame. And an operator can detect and assemble the rectangular circuit board, so that the number of operable procedures on the operation table is increased, and the overall working efficiency is improved.

The invention discloses a manufacturing method of a multi-layer thermoelectric separation buried copper plate, which comprises the steps of preparing an inner-layer core plate, slotting and burying a copper block, roughly drilling a through hole, filling resin, manufacturing a secondary outer-layer pattern, preparing an outer-layer core plate, drilling a conductive hole and a heat dissipation hole and the like, and is characterized in that the copper block is divided into a heat dissipation area and a conductive area; thermoelectric separation is achieved through the design of independent through holes and blind holes, components needing to conduct electricity and components needing to conduct heat can be added on the copper block at the same time, and meanwhile efficient heat conduction and stable signal transmission are achieved and do not interfere with each other. Due to the partition design, the copper block is not only used for heat dissipation, but also used for electric conduction, the utilization rate of the copper block is improved, the design area of the PCB is reduced, and the development requirements of high-density and miniaturized electronic equipment are met.

The invention discloses a double-station circuit board beveling machine, and relates to the technical field of circuit board processing equipment.The double-station circuit board beveling machine comprises a first base and a first tool apron, and the first tool apron is supported on the first base through a tool apron displacement assembly; the tool apron displacement assembly comprises a first left-right translation module, a first height adjusting module and two first front-back displacement modules which are symmetrically arranged, and the first left-right translation module and the first height adjusting module drive the two first tool aprons to integrally displace in the Y-axis direction and the Z-axis direction; each first front-back displacement module can independently drive a first worm and gear rotation device to move in the Y-axis direction, the first worm and gear rotation device rotates the angle of a first tool apron, angle adjustment is completed, a double-tool-apron structure which is symmetrically arranged up and down can synchronously cut the upper edge and the lower edge of a circuit board at the same time, and a three-axis movement system is matched, so that the machining efficiency is improved. And a worm and gear angle adjusting mechanism is combined, so that positioning is more accurate, and precision is higher.

The invention relates to a membrane removing and collecting integrated device suitable for SMT mounting, a connector is mounted on a circuit board, a membrane is attached to the connector from the top surface, the membrane protrudes out of the connector from the edge of one side, and the integrated device comprises a transmission line; a film uncovering device; provided is a waste film collecting device. On the one hand, on the basis of cooperation of the driving part and the power device, the upper clamping jaw and the lower clamping jaw accurately clamp a membrane with one side face of the connector as the reference and conduct uncovering, transferring and collecting, the stable and continuous membrane uncovering and collecting procedures are achieved, and efficiency is effectively improved; on the other hand, a traditional discharging mode is abandoned, the material belt with the adhesive layer is adopted, the waste film is placed on the adhesive layer along with the clamping component, the waste film is pressed and pasted to the adhesive layer through the pressing rod, and the waste film transferring success rate and the waste film collecting rate are greatly increased.

The invention relates to the technical field of automatic feeding, in particular to special automatic feeding equipment for Plasma, which comprises a fixing frame, a first plate feeding device, a second plate feeding device, a plugging and unplugging device, a transmission device and a distributed cooperative control system are arranged on the fixing frame, and the devices are electrically connected with a central controller; the first plate feeding device and the second plate feeding device are arranged side by side, the plugging and unplugging device is located on one side of the second plate feeding device, and the conveying device passes through the lower portion of the plugging and unplugging device. The distributed cooperative control system comprises a distributed control node triggered by a dynamic event, a digital twin cooperative optimization platform and a fault-tolerant self-healing module. And the distributed control node optimizes an actuator action strategy through a reinforcement learning algorithm. Plugging positioning precision of a clamping plate frame reaches + / -0.02 mm, the dislocation rate of a PCB is smaller than or equal to 0.1%, efficiency is optimized, production changing time is shortened by 83%, productivity is improved by 25%, reliability is enhanced, single-node fault recovery time is smaller than or equal to 5 s, and system availability is larger than or equal to 99.99%.

The invention discloses a method for manufacturing a surface flexible layer rigid-flexible combined board for an intelligent video module, which comprises the following steps of: taking a double-sided flexible copper-clad plate, and windowing a first surface copper layer corresponding to a first via hole to form a flexible core board; taking the first cover film and windowing corresponding to the first via hole to form a windowing cover film; correspondingly attaching the windowing covering film to one side of the second copper layer of the flexible core plate to form a covering film core plate; taking a prepreg, manufacturing a glue-blocking film corresponding to a flexible area of the prepreg, forming a glue-blocking prepreg, and manufacturing a rigid core plate; sequentially stacking and laminating the plates from top to bottom, enabling the glue blocking film to face the covering film core plate, then manufacturing a through hole in the rigid region, performing laser ablation on an insulating medium layer corresponding to a copper layer windowing pattern, electroplating, performing uncovering processing, removing a second copper layer at the bottom of a blind hole, forming a first via hole, and performing molding to form the rigid-flexible combined plate. The metallization process of the flexible area and the metallization process of the rigid area are combined into one-time electroplating, so that the consistency of the thickness of a copper plating layer is ensured.

The invention relates to the field of PCB (printed circuit board) printing, in particular to a high-precision multi-layer lamination and alignment PCB printing process which comprises a substrate pretreatment stage, a substrate preassembly stage, a dynamic lamination stage and a finished product output stage, the dynamic lamination stage comprises preheating treatment and resonance impurity removal treatment, and the lamination stage is divided into multi-stage lamination. And air bubbles and resin between the laminated bodies are optimized in the second pressing stage. According to the method, the inner-layer core plate and the copper foil are pretreated, so that positioning of the multi-layer core plate is more accurate and detection is facilitated, meanwhile, nanoscale micropores are formed in the copper foil through a laser technology to improve the flowing property of subsequent resin, and in the pressing process, pre-pressing and multi-stage pressing are set to improve the pressing accuracy; and in the second-stage pressing process, the dispersion direction of internal bubbles and the flowing direction of resin are improved through an ultrasonic device, a radiation heating device, a magnetic field assisting device and the like, the alignment accuracy and the pressing precision of the plate are further improved, and the machining efficiency is guaranteed.

The invention relates to the technical field of element bonding pad matching, in particular to a method for automatically matching a component and a bonding pad, which comprises the following steps of: directly and dynamically calculating a coverage area according to the size of the component, and detecting a bonding pad layer in real time without pre-storing a mapping relation; the electrical feasibility verification that the number of bonding pads is greater than or equal to the number of pins is increased to solve the risk of insufficient solder or solder skips; the coordinate correction is matched with the mean correction coordinate of the central point of the bonding pad, and the angle correction is realized by identifying a silk-screen polarity identifier through AI to realize a dual-stage correction technology; polarity identification consistency verification is newly added, so that the installation correctness of a high-reliability device is ensured, and polarity direction guarantee is realized; the workload of a client for pre-storing the template is reduced, and the matching precision is improved through dynamic detection and closed-loop correction.

The invention provides a correction method of a pneumatic clamp assembly, which comprises the following steps: controlling a main shaft assembly to move to a preset position, controlling a positioning piece to extend into a first positioning area of a first positioning part of the pneumatic clamp assembly and move in the first area, and controlling the first positioning part to clamp the positioning piece so as to correct the position of the first positioning part; detecting the position deviation between a main shaft of the main shaft assembly and a detection piece on the air clamping assembly; and determining the position of a first positioning point of the first positioning part based on the position deviation. The invention further provides a detection method of the positioning piece and circuit board processing equipment. According to the correction method of the air clamp assembly, the detection method of the positioning piece and the circuit board processing equipment, the position of the air clamp assembly can be accurately adjusted and corrected, so that the processing precision of the circuit board processing equipment is improved.

The invention relates to the field of voltage dependent resistor welding equipment, in particular to a voltage dependent resistor welding device which is characterized in that a triangular block, a pushing block, a driving assembly and a lifting assembly are matched with one another, in the fixing and butt joint process of the voltage dependent resistor, the voltage dependent resistor is extruded, and pins of the voltage dependent resistor are expanded, supported and bent through the triangular block; and the pins of the piezoresistor are aligned with the jacks on the circuit board, so that the piezoresistor and the circuit board can be quickly butted, and the welding efficiency of the piezoresistor is improved. According to the invention, the triangular block, the pushing block, the driving assembly and the lifting assembly cooperate with each other, and the piezoresistor is extruded in the process of fixing and butting the piezoresistor, so that the triangular block expands and bends the pins of the piezoresistor, and the pins of the piezoresistor are aligned with the jacks in the circuit board; rapid butt joint of the piezoresistor and the circuit board is facilitated, and the welding efficiency of the piezoresistor is improved.

The invention relates to a glass substrate hole plugging clamp system which comprises a flange clamp module, a lower flange module and a sliding clamping plate module, the flange clamp module comprises a flange assembly, a rack assembly and a clamping assembly, the clamping assembly is arranged on the rack assembly, the flange assembly is arranged on the clamping assembly, and the sliding clamping plate module is arranged on the rack assembly. The flange assembly comprises a flange frame and an elastic clamping flange piece, the glass substrate is fixed to the flange frame through the elastic clamping flange piece, the flange frame is clamped through the clamping assembly, the elastic clamping flange piece is driven to clamp and loosen the glass substrate, and the lower flange module and the sliding clamping plate module are arranged in the hole plugging machine. The lower flange assembly is used for clamping the lower end of the glass substrate located on the flange frame, and the sliding clamping plate module is used for clamping the upper end of the flange frame where the glass substrate is fixed. According to the clamping device, the glass substrate can be automatically clamped and fixed, and the machining efficiency and the operation convenience are improved.

The invention relates to the technical field of automatic plug-in mounting equipment, in particular to a double-reference-point correction method, which comprises the following steps of: acquiring image information of a first reference point and a second reference point arranged on a lower camera module, and determining an actual coordinate when an upper camera is aligned with the first reference point based on the image information of the first reference point; comparing with a preset fixed coordinate value to generate a coordinate system translation correction parameter; calculating an included angle between a connecting line of two points and the X-axis direction based on the image information of the two datum points, and generating a coordinate system rotation correction parameter; according to the method, two correction parameters are integrated to update a plug-in machine coordinate system, a lead screw back clearance elimination operation is adopted to improve the basic positioning precision, a correction effect verification and historical data analysis mechanism is established, a double-reference-point design is adopted for the first time, the problems of coordinate system origin offset and X-axis orthogonality change are solved at the same time, and the precision of the plug-in machine is improved. And the long-term stable operation of the plug-in machine and the consistency among different machines are ensured.

The invention relates to the technical field of PCB drilling positioning, and particularly provides a PCB drilling positioning method and system.The method comprises the steps that structured light pattern images corresponding to different reference mark points are obtained, and the structured light pattern images comprise preset structured light patterns with projection areas covering the reference mark points; for each reference mark point, actual Z-axis height information is obtained according to the structured light pattern image, and then the focusing depth of the laser scanning system is adjusted according to the actual Z-axis height information; for each reference mark point, acquiring original two-dimensional coordinate information of the reference mark point by using a laser scanning system, and then correcting the original two-dimensional coordinate information according to the actual Z-axis height information and preset optical geometric parameters of the laser scanning system to obtain corrected two-dimensional coordinate information; correcting a preset drilling target point position according to all the corrected two-dimensional coordinate information to obtain a final drilling position of the drilling target point; according to the method, the problems of defocusing and projection errors caused by unevenness of the PCB can be effectively solved.

The invention discloses a circuit board semi-automatic welding system, and relates to the technical field of circuit board production and processing, the circuit board semi-automatic welding system comprises a processing table, the top end of the processing table is rotatably connected with a welding table driven by a stepping motor to rotate, the top end of the welding table is symmetrically provided with circuit board adsorption grooves, and the welding table is internally provided with an air suction positioning mechanism matched with the circuit board adsorption grooves; through cooperative operation of the multi-station rotary welding table and the double clamping boxes at the bottom end of the cross beam, a high-precision stepping motor and a transverse movement adjusting mechanism are integrated, a feeding, welding and discharging full-process automatic linkage mechanism is achieved, the automation degree is improved, and the production efficiency is improved. A multi-sensor fusion control structure comprising a smoke measurement purification mechanism and a temperature measurement regulation and control mechanism is adopted, meanwhile, through visual monitoring of a high-definition camera, the welding process can be monitored in real time, welding smoke is sucked away in time, a welded circuit board is rapidly cooled, and multi-dimensional monitoring and intelligent emergency response in the welding process of the circuit board are achieved.

The invention discloses a novel silicon carbide embedded core-embedded module packaging circuit board sintering device and method, and relates to the technical field of sintering processes. The device comprises a machine table, and a plurality of stations distributed at intervals are arranged on the machine table and sequentially comprise a feeding station, a plurality of preheating stations, a sintering station, a plurality of cooling stations and a discharging station; the lifting mechanisms are arranged on the machine table and located on the two sides of the multiple stations; the supporting mechanisms are located on the two sides of the multiple stations and movably connected with the lifting mechanism. The driving mechanism is arranged on the machine table and is in transmission connection with the supporting mechanism; and the sintering mechanism is arranged above the sintering station, the sintering mechanism can ascend and descend in the vertical direction, the sintering mechanism comprises a machining bin, an upper pressing die capable of ascending and descending is arranged in the machining bin, and a spray head used for providing inert gas is further arranged in the machining bin. According to the novel sintering device for the silicon carbide embedded core-embedded module packaging circuit board, the sintering quality and the sintering efficiency can be improved.

The invention relates to the technical field of electronic manufacturing, and discloses a circuit board printing manufacturing device which comprises a conveying belt, one end of the conveying belt is provided with a board placing device used for storing solder resist ink needing to be coated, one side of the board placing device is provided with two brushing devices, and the two brushing devices are arranged on the conveying belt. A fixing plate is arranged between the two brushing devices, the fixing plate is fixedly mounted on a fixing mounting plate of the conveying belt, a square rod is arranged between the fixing plate, one end of the square rod is rotationally connected with a gear, the other side of the gear is fixedly connected with a sliding square block, the other end of the sliding square block is slidably connected with a clamping block, and the clamping block is fixedly connected with the clamping block. One side of the clamping block communicates with an air pipe used for adsorbing a copper-clad plate, the square rod is sleeved with a torsional spring, and one end of the torsional spring is fixedly connected with the square rod. The circuit board printing and manufacturing device can fix the position of the copper-clad plate after the copper-clad plate is turned over.

The invention provides a drilling method for a laser X-shaped through hole of a circuit board and the circuit board, and the drilling method for the laser X-shaped through hole of the circuit board comprises the steps: covering a dry film on the surface of a copper-clad plate; patterning the dry film to form a mask coverage area and a non-mask area corresponding to the position of the preset positioning target; removing the dry film in a non-mask area; carrying out brownification treatment to change the color of the copper surface of the copper-clad plate in the non-mask area; and performing laser drilling on the copper-clad plate based on a positioning target by using the characteristic difference between the non-mask region and the mask coverage region as the positioning target. The characteristic difference between the color-changing copper surface in the non-mask area and the non-color-changing copper surface below the mask covering area is used as a positioning target of laser drilling. A traditional low-precision mechanical drilling positioning mode is replaced, the positioning reference is directly generated on the plate surface by utilizing the high-precision characteristic of the photoetching technology, the manufacturing precision of the positioning target is fundamentally improved, and the positioning target is particularly suitable for drilling scenes with strict position precision requirements and is beneficial for improving the product yield and reliability.

The present invention relates to the technical field of PCB board processing, and more particularly to a fully automatic, integrated vacuum plugging machine, comprising a base frame, a plugging device, a scraping device, and a transfer mechanism. The plugging device is used to complete the plugging process of a PCB board, the scraping device is used to complete the oiling and scraping processes of the PCB board, and the transfer mechanism is used to move a PCB board to be plugged into a clamping mechanism within the plugging device, or to move a PCB board that has been plugged into the clamping mechanism of the scraping device. The fully automatic, integrated vacuum plugging machine of the present invention can complete the plugging and scraping processes of a PCB board, and simultaneously, through the transfer mechanism, enables the PCB board to be moved into the clamping mechanism of the plugging device and the scraping device, automatically completing the loading action of the PCB board for the plugging process or the scraping process, thereby ensuring the efficiency, quality, and yield of the plugging and scraping processes of the PCB board.

The invention discloses a mounting head assembly based on direct-drive technology rotation center alignment, which comprises a shell, a direct-drive rotating platform is arranged in the shell, and the direct-drive rotating platform is connected with a force control mounting head; the force control mounting head comprises a first connecting block, a suction nozzle mounting seat and at least one elastic piece, and the first connecting block and the suction nozzle mounting seat are connected to two opposite ends of the elastic piece; the first connecting block is fixedly connected to the direct-driven rotating platform; a suction nozzle assembly is arranged below the suction nozzle mounting base, a sensing block is arranged at the position, protruding out of the elastic piece, of the suction nozzle mounting base, and a displacement sensor which is connected to the direct-drive rotating platform and electrically connected with a controller of a mounting force control system is arranged over the sensing block. The displacement sensor is used for detecting the deformation displacement amount of the elastic piece connected with the mounting head and feeding back the deformation displacement amount to the controller, and only the suction nozzle mounting seat and the suction nozzle assembly are arranged on the elastic piece, so that the load pressure of the elastic piece is reduced, and the mounting pressure is controlled more accurately.

The invention relates to the technical field of image recognition, in particular to a circuit board ink screen printing method based on accurate positioning and a positioning device. The method comprises the following steps: acquiring circuit board placement data; detecting the edge and key positioning points of the circuit board based on the circuit board placement data, and adjusting a fine adjustment indexing rotating rod of a jig top plate to obtain accurate alignment data of the circuit board; the jig top plate is subjected to jig locking through the circuit board accurate alignment data, and the circuit board coining fixing position is obtained; a film pressing frame is installed according to the circuit board coining fixing position, and the pressing force of the film pressing frame is monitored in real time through a pressure sensor; and printing ink screen printing PID control is conducted on the scraper based on the pressing force, and printing ink screen printing control data are generated. Through accurate positioning, real-time pressure control, intelligent quality detection and automatic screen plate positioning, the positioning accuracy and pressure control stability of the circuit board ink screen printing process are improved.

The invention relates to the technical field of PCB processing, and particularly discloses an anti-offset PCB short slot processing device. Comprising a fixing square plate, an electric push rod is fixedly connected to the bottom of the fixing square plate, a driving shaft of the electric push rod penetrates through the fixing square plate and is fixedly connected with a pressing plate, a square rubber pad is fixedly connected to the bottom of the pressing plate, and a bottom penetrating rod is fixedly connected to the bottom of the pressing plate. The square rubber pad is used for fixing the plate body in an elastic pressing mode, the static friction force of the plate body is increased through the rubber face of the square rubber pad, and the situation that the machining precision of the short groove hole is affected by continuous slight deviation caused by shaking or shaking when the plate body is subjected to drilling machining is prevented. And a hollow area is arranged between the fixed square plate and the pressing plate, so that cleaned scraps can be conveniently discharged to the outer side, and the situation that the cleaned scraps are pushed to the position between the fixed square plate and the pressing plate by the cleaning device to be accumulated to affect subsequent placement of the PCB during drilling of the drill bit is prevented.

The invention relates to the technical field of artificial intelligence and electronic manufacturing detection, and discloses an ultra-thin printed circuit board defect detection method and system based on AI vision. The objective of the invention is to solve the technical problems of poor imaging quality, high missed detection and false detection rate, weak generalization ability and difficulty in consideration of efficiency and precision caused by buckling deformation, surface reflection and tiny and diverse defects of an ultrathin printed circuit board in the existing detection technology. The method comprises the following steps: performing multi-angle image acquisition through a composite illumination module and a high-resolution linear array camera; geometric correction is carried out on the image by using an SIFT algorithm and affine transformation, and the image contrast is enhanced by using a CLAHE algorithm; generating a defect candidate region through the lightweight full convolutional network; and carrying out accurate classification and identification on the candidate region by using a deep residual network. According to the technical scheme, high-precision, high-efficiency and low-false-alarm detection of the tiny defects of the ultrathin printed circuit board can be achieved, and the automation level and adaptability of detection are remarkably improved.

The invention relates to an electronic element surface mounting device and method with solder paste detection and compensation, and the device comprises a limiting plate which is provided with a through hole, and a pressing plate, a turnover motor and a first lifting unit are disposed right above the limiting plate. A solder paste scraping part is arranged on the edge of the pressing plate, and a transverse moving unit is further arranged over the limiting plate; a positioning groove is formed in the surface of the pressing plate, the bottom surface of the positioning groove is a mirror surface, the depth of the positioning groove is smaller than the thickness of a shell of the electronic component, and a vacuum adsorption unit is arranged on the pressing plate; a visual identification unit is arranged on one side of the hold-down plate, and a solder paste compensation unit is arranged on the other side of the hold-down plate; through photographing at two angles of the front surface and the side surface, a more accurate solder paste state can be obtained, solder paste compensation is set for the solder paste state which does not meet the condition, secondary positioning is carried out on an electronic element, the height position of pressing and mounting is precisely limited, and the mounting consistency of the electronic element is ensured.

The invention relates to a modularized PCB laser imaging device, and belongs to the field of PCB machining, the modularized PCB laser imaging device comprises a supporting seat, a mounting groove is formed in the supporting seat, a conveying belt and a fixing block are mounted in the mounting groove, and a first support, a second support, a third support and a second guide plate are mounted on the supporting seat; the first support, the second support and the third support are each provided with an electric lifting sliding base, an electric translation sliding base and a laser machining head, a guide assembly is installed on each electric lifting sliding base, a diagonal plane is formed in each electric lifting sliding base, a connecting frame is installed on the fixing block, and protruding blocks are installed on the two sides of each connecting frame. A first magnetic block is installed on the protruding block, and a sliding groove is formed in the conveying belt. The PCB laser imaging device solves the problems that an existing PCB laser imaging device cannot shrink and clamp after being centered, cannot automatically release after being processed, and cannot concentrate a PCB production line in the same longitudinal space.

The invention discloses an FPC flexible circuit board automatic bending device and a bending method thereof, and relates to the technical field of FPC bending, the FPC flexible circuit board automatic bending device comprises a bending box, a curing mechanism is arranged in the middle of the upper end of the bending box, an air pipe frame is arranged on one side of the upper end of the bending box, and four FPC substrate mechanisms distributed in an annular array are arranged in the curing mechanism; and one side of the upper end of the bending box is provided with a film covering mechanism which is matched with the curing mechanism to carry out dispensing pre-pressing treatment on the FPC in the FPC substrate mechanism. The air guide sheet extracts air above the substrate plate, so that the thin sheet film can be tightly attached to the surface of the FPC circuit board, glue is helped to be quickly diffused on the surface of the FPC circuit board, flowing and diffusion of the glue are accelerated through the negative pressure effect, it is ensured that the glue can uniformly cover an area needing to be bonded, and the bonding efficiency is improved. And particularly, line connection points in complex shapes or narrow spaces are provided.

The invention discloses a circuit board collaborative assembly station which comprises an assembly initial detection station used for automatic assembly and initial detection of a circuit board. The temperature test station is used for testing the long-term stability of the circuit board and is arranged on the conveying and discharging side of the assembly initial test station; and the final testing station is used for performing final performance testing and packaging on the circuit board and is arranged on the conveying and discharging side of the temperature testing station. According to the assembly initial station, intelligent dispatching of materials among nine stations is achieved through a speed chain transmission device (RFID binding material boxes / trays) and a truss robot (magnetic railing ruler positioning + / -0.1 mm), and the time consumed by manual transfer is shortened by 30%; a composite robot (AGV + mechanical arm) of a temperature test station automatically grabs a storage, transportation and measurement integrated clamp, incubator butt joint (the three-level positioning precision is + / -0.25 mm) is completed, and 72-hour continuous temperature cycle unattended operation is achieved; the speed chain and the transfer robot of the final station are linked, and automatic butt joint of the vibration clamp and the test equipment is supported.

The invention discloses motor controller circuit board manufacturing and processing equipment, and belongs to the field of circuit board manufacturing and processing. The electric track is assembled on the top of the base; the air exhaust assembly is assembled on the top of the base; the electric sliding block is assembled on the inner wall of the electric track; the heating cover is assembled at the bottom of the electric sliding block; an elastic telescopic rod is assembled at the top of the electric sliding block, a pressing plate is fixedly connected to the bottom of the elastic telescopic rod, and a moving block is slidably connected to the bottom of the inner wall of the base. Through the synergistic effect of the electric sliding block, the elastic telescopic rod, the pressing plate and other structures, it is ensured that the pressing plate evenly applies pressure to the circuit board at the downward pressing moment, the problems of small interlayer friction force and poor shearing force resistance are solved, therefore, movement of the top layer circuit board is avoided, it is ensured that prepregs can be fully melted before being heated, even heating of resin is ensured, and the service life of the circuit board is prolonged. And the production efficiency and the quality of the circuit board are improved.

The invention discloses a head pasting device and method capable of adjusting pressure through pneumatic control, and belongs to the technical field of head pasting, an upper rotating shaft and a lower rotating shaft are mounted on a rotating shaft mounting seat through rotating bearings, a power device used for driving the upper rotating shaft to rotate is arranged on the rotating shaft mounting seat, and the lower rotating shaft is connected with the upper rotating shaft through a bolt; a closed cavity is formed in the connecting position of the upper rotating shaft and the lower rotating shaft, an air bag diaphragm and a piston are arranged in the closed cavity, a hollow guide shaft is coaxially arranged on the piston, the hollow guide shaft is installed in the lower rotating shaft through a guide shaft sleeve and connected with the suction nozzle assembly, and the pneumatic control pressure assembly is communicated with the closed cavity and the hollow guide shaft. According to the scheme, an air control pressure assembly is adopted, air pressure input is dynamically adjusted through an electric proportional valve, flexible transmission of an air bag diaphragm and a piston is combined, air pressure is accurately converted into linear displacement, and suction nozzle contact pressure is driven to follow a set value in real time.