356results about "Circuit board tools positioning" patented technology

The invention discloses a high-precision drilling control method and system for a multi-layer PCB, and relates to the technical field of intelligent control. The method comprises the following steps: scanning and analyzing to obtain layered material characteristics and structural size information of a multi-layer PCB, and carrying out clamping fixation and positioning hole processing on the multi-layer PCB to obtain a PCB positioning hole; a drilling machining three-dimensional coordinate axis is constructed; a PCB drilling strategy space is constructed, the PCB drilling strategy space is adopted to conduct drilling analysis on the layered material characteristics and the structure size information in sequence according to the PCB drilling machining requirement, and layered drilling strategy parameters are obtained; and the layered drilling strategy parameters are mapped to a drilling processing three-dimensional coordinate axis for space route fusion, layered drilling processing parameters are determined, and high-precision drilling and quality detection closed-loop control are executed on the multi-layer PCB. The technical problem that in the prior art, the positioning precision is low in the drilling process of the multi-layer PCB is solved, and the technical effect of improving the drilling machining precision of the multi-layer PCB is achieved.

The invention relates to the technical field of circuit board processing, and discloses an intelligent dust collector customized circuit board positioning device which comprises an operation table. The positioning and clamping assembly is used for clamping the circuit board in a centered positioning mode; the protection assembly is used for preventing the clamped circuit board from falling off during movement; the positioning and clamping assembly comprises a locking part used for switching the two clamping states of elastic clamping and rigid clamping. Through the arrangement of the positioning and clamping assembly, the four mounting boxes can synchronously perform centering movement, and clamping pieces on the four mounting boxes can perform centering positioning and clamping on a rectangular circuit board, so that the effect of automatic positioning is achieved, the positioning accuracy is high, and the positioning accuracy is high in cooperation with the rotation of an annular frame. And an operator can detect and assemble the rectangular circuit board, so that the number of operable procedures on the operation table is increased, and the overall working efficiency is improved.

The invention relates to a glass substrate hole plugging clamp system which comprises a flange clamp module, a lower flange module and a sliding clamping plate module, the flange clamp module comprises a flange assembly, a rack assembly and a clamping assembly, the clamping assembly is arranged on the rack assembly, the flange assembly is arranged on the clamping assembly, and the sliding clamping plate module is arranged on the rack assembly. The flange assembly comprises a flange frame and an elastic clamping flange piece, the glass substrate is fixed to the flange frame through the elastic clamping flange piece, the flange frame is clamped through the clamping assembly, the elastic clamping flange piece is driven to clamp and loosen the glass substrate, and the lower flange module and the sliding clamping plate module are arranged in the hole plugging machine. The lower flange assembly is used for clamping the lower end of the glass substrate located on the flange frame, and the sliding clamping plate module is used for clamping the upper end of the flange frame where the glass substrate is fixed. According to the clamping device, the glass substrate can be automatically clamped and fixed, and the machining efficiency and the operation convenience are improved.

The invention relates to the technical field of automatic plug-in mounting equipment, in particular to a double-reference-point correction method, which comprises the following steps of: acquiring image information of a first reference point and a second reference point arranged on a lower camera module, and determining an actual coordinate when an upper camera is aligned with the first reference point based on the image information of the first reference point; comparing with a preset fixed coordinate value to generate a coordinate system translation correction parameter; calculating an included angle between a connecting line of two points and the X-axis direction based on the image information of the two datum points, and generating a coordinate system rotation correction parameter; according to the method, two correction parameters are integrated to update a plug-in machine coordinate system, a lead screw back clearance elimination operation is adopted to improve the basic positioning precision, a correction effect verification and historical data analysis mechanism is established, a double-reference-point design is adopted for the first time, the problems of coordinate system origin offset and X-axis orthogonality change are solved at the same time, and the precision of the plug-in machine is improved. And the long-term stable operation of the plug-in machine and the consistency among different machines are ensured.

The invention relates to the technical field of PCB drilling positioning, and particularly provides a PCB drilling positioning method and system.The method comprises the steps that structured light pattern images corresponding to different reference mark points are obtained, and the structured light pattern images comprise preset structured light patterns with projection areas covering the reference mark points; for each reference mark point, actual Z-axis height information is obtained according to the structured light pattern image, and then the focusing depth of the laser scanning system is adjusted according to the actual Z-axis height information; for each reference mark point, acquiring original two-dimensional coordinate information of the reference mark point by using a laser scanning system, and then correcting the original two-dimensional coordinate information according to the actual Z-axis height information and preset optical geometric parameters of the laser scanning system to obtain corrected two-dimensional coordinate information; correcting a preset drilling target point position according to all the corrected two-dimensional coordinate information to obtain a final drilling position of the drilling target point; according to the method, the problems of defocusing and projection errors caused by unevenness of the PCB can be effectively solved.

The invention provides a drilling method for a laser X-shaped through hole of a circuit board and the circuit board, and the drilling method for the laser X-shaped through hole of the circuit board comprises the steps: covering a dry film on the surface of a copper-clad plate; patterning the dry film to form a mask coverage area and a non-mask area corresponding to the position of the preset positioning target; removing the dry film in a non-mask area; carrying out brownification treatment to change the color of the copper surface of the copper-clad plate in the non-mask area; and performing laser drilling on the copper-clad plate based on a positioning target by using the characteristic difference between the non-mask region and the mask coverage region as the positioning target. The characteristic difference between the color-changing copper surface in the non-mask area and the non-color-changing copper surface below the mask covering area is used as a positioning target of laser drilling. A traditional low-precision mechanical drilling positioning mode is replaced, the positioning reference is directly generated on the plate surface by utilizing the high-precision characteristic of the photoetching technology, the manufacturing precision of the positioning target is fundamentally improved, and the positioning target is particularly suitable for drilling scenes with strict position precision requirements and is beneficial for improving the product yield and reliability.

The invention relates to the technical field of artificial intelligence and electronic manufacturing detection, and discloses an ultra-thin printed circuit board defect detection method and system based on AI vision. The objective of the invention is to solve the technical problems of poor imaging quality, high missed detection and false detection rate, weak generalization ability and difficulty in consideration of efficiency and precision caused by buckling deformation, surface reflection and tiny and diverse defects of an ultrathin printed circuit board in the existing detection technology. The method comprises the following steps: performing multi-angle image acquisition through a composite illumination module and a high-resolution linear array camera; geometric correction is carried out on the image by using an SIFT algorithm and affine transformation, and the image contrast is enhanced by using a CLAHE algorithm; generating a defect candidate region through the lightweight full convolutional network; and carrying out accurate classification and identification on the candidate region by using a deep residual network. According to the technical scheme, high-precision, high-efficiency and low-false-alarm detection of the tiny defects of the ultrathin printed circuit board can be achieved, and the automation level and adaptability of detection are remarkably improved.

The invention relates to a modularized PCB laser imaging device, and belongs to the field of PCB machining, the modularized PCB laser imaging device comprises a supporting seat, a mounting groove is formed in the supporting seat, a conveying belt and a fixing block are mounted in the mounting groove, and a first support, a second support, a third support and a second guide plate are mounted on the supporting seat; the first support, the second support and the third support are each provided with an electric lifting sliding base, an electric translation sliding base and a laser machining head, a guide assembly is installed on each electric lifting sliding base, a diagonal plane is formed in each electric lifting sliding base, a connecting frame is installed on the fixing block, and protruding blocks are installed on the two sides of each connecting frame. A first magnetic block is installed on the protruding block, and a sliding groove is formed in the conveying belt. The PCB laser imaging device solves the problems that an existing PCB laser imaging device cannot shrink and clamp after being centered, cannot automatically release after being processed, and cannot concentrate a PCB production line in the same longitudinal space.

The invention discloses a circuit board collaborative assembly station which comprises an assembly initial detection station used for automatic assembly and initial detection of a circuit board. The temperature test station is used for testing the long-term stability of the circuit board and is arranged on the conveying and discharging side of the assembly initial test station; and the final testing station is used for performing final performance testing and packaging on the circuit board and is arranged on the conveying and discharging side of the temperature testing station. According to the assembly initial station, intelligent dispatching of materials among nine stations is achieved through a speed chain transmission device (RFID binding material boxes / trays) and a truss robot (magnetic railing ruler positioning + / -0.1 mm), and the time consumed by manual transfer is shortened by 30%; a composite robot (AGV + mechanical arm) of a temperature test station automatically grabs a storage, transportation and measurement integrated clamp, incubator butt joint (the three-level positioning precision is + / -0.25 mm) is completed, and 72-hour continuous temperature cycle unattended operation is achieved; the speed chain and the transfer robot of the final station are linked, and automatic butt joint of the vibration clamp and the test equipment is supported.

The invention relates to a fixed connection method and device for a cable and a circuit board, and the method comprises the following steps: S1, carrying out the positioning of a wiring harness in the circuit board and the cable, and enabling the bonding wires of the wiring harness to be separated from each other; s2, performing visual inspection on the positioned wire harness and the circuit board, distinguishing a bonding wire and a bonding pad, and calibrating coordinate points of the bonding wire and the bonding pad; then, according to the calibrated coordinate points of the bonding wire and the bonding pad, the set welding movement track is compensated; s3, according to the compensated welding movement track, welding wires of the wire harness are sequentially moved to the corresponding welding disc positions for welding; s4, after welding is completed, glue dispensing is carried out on the wire harness and the circuit board in sequence, so that glue overflows between the wire harness and the circuit board; and S5, after dispensing is completed, the glue is subjected to curing treatment. According to the invention, the connection efficiency and quality of the cable and the circuit board can be improved, and the connection strength of the cable and the circuit board is high.

The invention belongs to the technical field of PCB (printed circuit board) processing, particularly relates to a multifunctional PCB labeling device, and provides the following scheme aiming at solving the problems that a PCB is not provided with a mark, so that the PCB may deflect during conveying, the deviation of the PCB during labeling processing is caused, the labeling precision of the PCB is influenced, and the subsequent processing operation is influenced. Comprising two guide rail bases, and a center plate table and a center stand column are arranged between the two guide rail bases; and the two guide rail plate tables are respectively arranged on the two guide rail bases. The multifunctional PCB labeling device disclosed by the invention has the effect of improving the labeling processing precision of the PCB, and during labeling operation, the device can restore the deflection angle of the PCB so as to ensure that the posture of the PCB is parallel to the posture of the device during processing, so that the deviation of the PCB during labeling processing is avoided, and the production efficiency of the PCB is improved. And the use effect of the device is improved.

The invention relates to the technical field of plate turnover machine alignment control, and provides a turnover alignment control method and system of a single-face and double-face plate turnover machine. The method comprises the following steps: carrying out structure analysis on a turnover target, and identifying an alignment key point and a structure feature; establishing a pre-overturning / post-overturning coordinate transformation relation, and calculating a post-overturning theoretical position based on the current pose; predicting the overturning deviation based on the theoretical position, and analyzing the compensation parameter and controlling the compensation when the deviation exists; and obtaining a time sequence process alignment parameter, carrying out secondary alignment on the overturning target by using the time sequence process alignment parameter, confirming completion and joining the next process. The technical problems that the alignment precision is low and the turnover deviation cannot be effectively compensated due to the structural difference or inaccurate target pose recognition when a traditional plate turnover machine performs single-face and double-face turnover are solved, and the technical effects that the turnover alignment precision is improved through secondary alignment and procedure connection treatment, and automatic procedure connection is achieved are achieved.

The invention relates to the field of integrated circuit manufacturing, in particular to a high-precision positioning jig for an SMT (surface mount technology) mounting line, which comprises a tray for bearing a circuit board, the positioning mechanism is arranged on the tray and comprises a pressing assembly and a wedge-shaped assembly, and the wedge-shaped assembly is used for triggering the pressing assembly to press and position the circuit board before solder paste printing; according to the invention, the tray is used for bearing the circuit board, and the wedge-shaped assembly in the positioning mechanism is used for triggering the pressing assembly to carry out horizontal pressing positioning on the circuit board, so that the assembly is ensured to be flush with the upper surface of the tray in a non-working state, and the requirement of solder paste printing and component surface mounting for no projection interference is met; the steel mesh attaching gap or visual identification interference is avoided; and a limiting assembly is triggered by a shifting assembly in the reinforcing mechanism to tightly press the circuit board in the vertical direction, so that the fixed dimension is supplemented, and multidirectional stress generated by thermal expansion of the circuit board at high temperature in reflow soldering is effectively counteracted.

The invention discloses a chip mounting device for circuit board processing, and relates to the technical field of circuit board processing, and the chip mounting device comprises a conveying device, the bottom of the conveying device is fixedly provided with supporting legs, the front part of the conveying device is provided with a motor, the top of the conveying device is fixedly provided with a fixing frame, and the bottom of the fixing frame is provided with a lifting device. The bottom of the lifting device is provided with a chip mounting device, the top of the conveying device is provided with a clamping device, a protection device and a pushing device, clamping plates move to make contact with and clamp a circuit board, the circuit board is fixed to a workbench of the chip mounting device, and the circuit board is prevented from moving or deforming in the chip mounting or welding process; according to the invention, components can be accurately mounted at specified positions, errors are reduced, the circuit board is effectively prevented from warping due to temperature change or mechanical pressure, the circuit board is kept flat, and the mounting problem caused by warping is avoided.

A method and apparatus for multiple flexible circuit cable connections is described. Gold bumps are bonded on the interconnect pads of the substrate to form a columnar structure, and solder or conductive epoxy is dispensed on the flexible circuit cable. The substrate and flexible circuit cable are aligned and pressed together with force or by placing a weight on the substrate or flexible circuit cable. Appropriate heat is applied to reflow the solder or cure the epoxy. With the aid of the gold bumps, the solder wets to the substrate pads and has a reduced risk of bridging due to the columnar structure. Non-conductive underfill epoxy is applied to increase mechanical strength.

A display device includes a display panel, which includes a plurality of panel pads arranged along a first direction, and a flexible printed circuit board. The flexible printed circuit board includes a base portion, a first protrusion protruding in a second direction intersecting a first direction from one side of the base portion extending in the first direction, a second protrusion protruding in the second direction from the one side of the base portion and spaced apart from the first protrusion in the first direction, first connection pads disposed on the first protrusion, and second connection pads disposed on the second protrusion. At least some of the first connection pads extend in a direction inclined with respect to the first direction and the second direction, and at least some of the second connection pads extend in a direction inclined with respect to the first direction and the second direction.

An apparatus for printed circuit board manufacturing comprises a housing, a worktable containing multiple optical sensors and providing placement and fixation of a PCB blank, a laser unit containing a laser source, a collimator, a scanning system, and a focusing system, and configured to remove a material layer from the PCB blank, and a controller configured to determine position of the PCB blank and provide calibration of the laser unit using optical sensors. A method of calibrating the apparatus for printed circuit board manufacturing involves determining position of each optical sensor in the laser beam coordinate system with successive refinement of this position and determining a coordinate transformation function that links coordinates of the optical sensors in the laser beam coordinate system with coordinates of these sensors in the apparatus coordinate system.

The invention relates to the technical field of chip mounters, and discloses a circuit board chip mounter which comprises a chip mounter body, a circuit board body is placed in the chip mounter body, a base is installed in the chip mounter body and located below the circuit board body, mounting bolts are rotationally connected to the four corners of the base correspondingly, and the mounting bolts are in threaded connection with the middle of the chip mounter body. The top end of an output shaft of the motor is fixedly connected with a rotating shaft, the outer wall of the rotating shaft is provided with a connecting sleeve, the bottom of the chip mounter body is provided with an exhaust fan, the air inlet end of the exhaust fan is fixedly connected with an exhaust pipe, and the top surface of the connecting sleeve is fixedly connected with a plurality of air suction pipes; the bottom ends of the air suction pipes communicate with the exhaust pipe, the top end of each air suction pipe is fixedly connected with a suction nozzle, one side of the fixing base is fixedly connected with a fixing block, and a control module is fixedly connected into the fixing block. According to the circuit board chip mounter, accurate correction of the position of the circuit board body is realized.

A method for manufacturing a sheet (1) with a wiring circuit board includes: a first step of manufacturing an aggregate sheet (10) having a plurality of wiring circuit boards (3); a second step for cutting off the wiring circuit board (3) from the frame (11) of the aggregate sheet (10); and a third step in which the cut-off wiring circuit board (3) is arranged on the support sheet (2).

The invention relates to the field of circuit board hole plugging, in particular to automatic feeding and discharging vacuum hole plugging equipment which comprises a vacuum hole plugging machine and two storage mechanisms, two manipulators are fixedly mounted on the vacuum hole plugging machine, and the manipulators correspond to the storage mechanisms one to one; each storage mechanism comprises a storage frame, a first bearing plate and a plurality of second bearing plates are slidably connected into the storage frame, and the second bearing plates are located above the first bearing plates. Compared with the prior art, the full-automatic feeding and discharging operation of PCB plug hole machining is achieved, manual board taking and placing operation is not needed in the whole process, the labor cost of a production line is greatly reduced, meanwhile, the problems of PCB pollution, scraping, bending damage and the like caused by manual operation are fundamentally solved, and the machining yield of products is effectively improved.

A stencil printer for printing assembly materials on an electronic substrate includes a frame, a stencil coupled to the frame, the stencil having an aperture formed therein, a support assembly coupled to the frame, the support assembly configured to support the electronic substrate, a print head gantry coupled to the frame, and a print head assembly supported by the print head gantry in a manner such that the print head assembly is configured to traverse the stencil during a print stroke. The stencil printer further includes a verification system for determining whether an item placed within the stencil printer is properly installed within the stencil printer.

The application discloses a combined die for flexible circuit board processing and a use method thereof, and relates to the field of combined dies.The combined die comprises a bottom plate, a sealing cover is arranged on the top of the bottom plate to prevent impurities from entering, an insertion notch is arranged on the sealing cover, and a module storage bin is arranged on the outer surface of the sealing cover.The combined die further comprises a forming bottom die unit, which is used for limiting FPC material parts and providing basic support and positioning for the processing of the flexible circuit board;a shaping module, which is used for extruding the flexible circuit board material parts in a plastic state;and an adjusting module, which is used for adjusting the properties of the extruded flexible circuit board material parts.Firstly, the flexible circuit board is positioned and limited in the forming bottom die unit, then the shaping module is arranged on the access plate, then the flexible circuit board is pressed by starting the telescopic rod to move downwards, a bending part is formed, and then the adjusting module is replaced to adjust and reinforce the bending part.

The invention relates to the technical field of circuit board processing, and discloses a multi-layer circuit board processing technology based on a base plate combined structure, which comprises the following steps: S1, selecting a proper base plate according to the material and thickness of a circuit board, cutting a multi-layer circuit board, a cover plate and the base plate into proper sizes according to requirements, and ensuring that the edges are neat and free of burrs and impurities; and S2, cleaning the circuit board, and removing pollutants of oil stains on the surface of the circuit board. The multi-layer circuit board processing technology based on the base plate combined structure can effectively solve the problems that in the prior art, blind holes and buried holes in a multi-layer circuit board need to be manufactured before lamination, edges of a plurality of substrates, base plates and pressing plates need to be aligned manually before drilling of an unlaminated multi-layer circuit board, operation is tedious, production efficiency is low, and the production cost is high. The problem that the subsequent interlayer interconnection effect is affected due to the fact that manual alignment is difficult to achieve on a round special-shaped substrate is solved.

This invention relates to the field of desoldering technology for electronic components, specifically an auxiliary stripping device for electronic components. It includes a platform and a main frame fixedly connected to the top of the platform. A slide is installed on the inner side of the platform, and a fixed bracket is provided on the top of the slide. This invention provides an auxiliary stripping device for electronic components, which uses pushing components and clamps to clamp and fix the substrate. In use, the substrate can be placed between the two pushing components on both sides, and then water is added to the U-shaped tube. The water enters the inside of the pushing tube and pushes the driven slider. The driven rod connected to the driven slider extends from the inside of the pushing tube and fixes the substrate through the clamps. When the two left and two right clamps approach each other, they conform to the surface shape of the substrate through the arc-shaped clamp and contact pad, providing the advantage of stable fixation even for irregularly shaped or round substrates.

The invention discloses a PCB rubberizing device and a manufacturing method thereof, and belongs to the technical field of printed circuit boards, the PCB rubberizing device comprises a board body, a board placing area arranged on one side of the board body, a plurality of positioning holes arranged in the board placing area and corresponding to PCB alignment holes, and a plurality of locking mechanisms for limiting a PCB on one side of the board body through the positioning holes and the alignment holes; the board body is further provided with a plurality of adhesive tape attaching windows used for attaching adhesive tape to the PCB adhesive tape attaching area. When the PCB is limited in the board placing area, the PCB rubberizing area is located in the rubberizing window range. According to the invention, the board body is provided with a plurality of rubberizing windows for attaching the adhesive tape to the PCB rubberizing area, the PCB is limited at one side of the board body through the locking mechanism, the positioning hole and the alignment hole in the PCB, and the PCB rubberizing area is located in the range of the rubberizing windows, so that quick alignment of rubberizing personnel is facilitated, the adhesive tape is prevented from being aslant attached to the PCB, and the production efficiency is improved. And the alignment degree in PCB rubberizing is improved.

When the vertical plate feeding device works, a vertical frame taking mechanism clamps a clamping plate frame and vertically moves the clamping plate frame upwards to the front portion of a supporting frame, a sliding frame slides forwards to be tightly attached to the clamping plate frame, a clamping frame assembly fixes the clamping plate frame, and then a butt joint assembly is in butt joint with a movable frame strip; the movable frame drives the movable frame strip and the movable plate suction piece to move so as to adjust the width of the plate clamping area and the width of the plate suction area, the clamp opening assembly opens the clamp head, the mechanical arm lifts the circuit board to the plate clamping frame, the plate suction piece sucks the circuit board, the circuit board is completely and flatly spread, then the clamp head is closed, and the circuit board is accurately fixed to the plate clamping frame and then makes contact and is fixed. The sliding frame retreats, the vertical frame taking mechanism downwards inserts the clamping plate frame into the carrier loader, and plate feeding is completed; according to the device, width adjustment of the clamping plate area and vertical plate feeding can be achieved at one station at the same time, the intelligent manufacturing efficiency is improved, the circuit board can be completely and flatly spread through the plate suction piece so that the clamping head can accurately clamp the circuit board, and the plate feeding quality is ensured.

The invention discloses PCB processing equipment which comprises a bottom plate, a swing arm assembly is arranged on one side of the top of the bottom plate, a swing plate is arranged at the swing end of the swing arm assembly, a plurality of suction cups distributed in an array mode are arranged at the bottom of the swing plate, the suction cups are connected with a negative pressure source through hoses, and a lead screw driving mechanism is arranged on the other side of the top of the bottom plate. A clamping frame is arranged at the execution position of the lead screw driving mechanism, and the arc track of the swing plate driven by the swing arm assembly to swing intersects or is tangent to the vertical direction of the initial position of the clamping frame. A copper-clad plate is sucked by arranging the swing plate and is rotated between the clamping plates through the rotating mechanism, then the clamping plates are driven by the clamping mechanism to clamp the copper-clad plate, and then the copper-clad plate is driven by the lead screw driving mechanism to move to the notch in the placement frame, so that damage to the copper-clad plate caused by manual clamping of a worker can be avoided; and the production quality of the copper-clad plate is effectively improved.

The invention discloses a processing method for improving picosecond cutting board warping of an FPCOIL product, which comprises the following steps that a circuit board containing the product and a laser carrier capable of containing the circuit board are provided, and the laser carrier comprises a lower jig and an upper jig; the lower jig is placed on a working table; the circuit board is placed in the lower jig, and then the upper jig is placed at the upper end of the lower jig; the working table board adsorbs a circuit board through a lower jig, and a plurality of exhaust holes are formed in the lower jig; and cutting the circuit board by using a picosecond laser. The structure that the lower jig and the upper jig are fixed in a magnetic attraction mode is adopted for improving warping of a product board, the lower jig is placed on the working table, the whole circuit board is placed in the lower jig, a plurality of exhaust holes distributed in the periphery of the product are formed in the lower jig, effective attraction of the working table to the circuit board is facilitated, and the follow-up laser cutting precision is improved; and the upper jig is pressed on the edge area of the circuit board, so that the warping of the product can be improved.

The application provides a laminated hot melting automation device for a PCB, and relates to the technical field of PCB production equipment. The laminated hot melting automation device for the PCB comprises a transplanting module, which is used to move a core plate or a first pre-lamination combination to be subjected to hot melting treatment to a hot melting module to form a second pre-lamination combination, the first pre-lamination combination and the second pre-lamination combination comprising the core plate and PP laminated in sequence; the hot melting module is used to perform CCD positioning on the second pre-lamination combination and perform hot melting treatment on the second pre-lamination combination after the CCD positioning to form a hot melting finished product; and a core plate receiving module is arranged on the discharge side of the hot melting module and is used to receive and stack the hot melting finished product. The embodiment of the application can realize the automation of the core plate and PP pre-lamination process, thereby effectively eliminating the manual feeding and discharging errors and avoiding the lamination errors, improving the PCB production process stability, being high in production efficiency and speed, greatly reducing the labor cost, and effectively meeting the production requirements.