807results about "Circuit board tools positioning" patented technology

The invention discloses a high-precision drilling control method and system for a multi-layer PCB, and relates to the technical field of intelligent control. The method comprises the following steps: scanning and analyzing to obtain layered material characteristics and structural size information of a multi-layer PCB, and carrying out clamping fixation and positioning hole processing on the multi-layer PCB to obtain a PCB positioning hole; a drilling machining three-dimensional coordinate axis is constructed; a PCB drilling strategy space is constructed, the PCB drilling strategy space is adopted to conduct drilling analysis on the layered material characteristics and the structure size information in sequence according to the PCB drilling machining requirement, and layered drilling strategy parameters are obtained; and the layered drilling strategy parameters are mapped to a drilling processing three-dimensional coordinate axis for space route fusion, layered drilling processing parameters are determined, and high-precision drilling and quality detection closed-loop control are executed on the multi-layer PCB. The technical problem that in the prior art, the positioning precision is low in the drilling process of the multi-layer PCB is solved, and the technical effect of improving the drilling machining precision of the multi-layer PCB is achieved.

The invention relates to the field of circuit board processing, and discloses a printed circuit board splitting device, which comprises a workbench, the top end of the workbench is fixedly provided with a protective cover, and the outer wall of the protective cover is connected with an opening and closing door through a hinge; the movable cleaning assembly is arranged on the workbench and used for cleaning dust on the surface of the circuit board while moving the circuit board; the supporting and collecting assembly is arranged on the workbench and used for limiting the circuit board and collecting impurities generated during machining; the processing assembly is arranged on the workbench and used for cutting and splitting the circuit board; the auxiliary assembly is arranged on the workbench and used for assisting the machining assembly; and the placing assembly is arranged on the workbench and is used for placing the unprocessed circuit board and the processed circuit board. And through cooperation of internal structures of the movable cleaning assembly, the effect that residual dust and chippings on the surface of the circuit board are effectively cleaned through the cleaning device while the circuit board is accurately moved is achieved.

The invention discloses a fixing device for automatic circuit board production equipment, which comprises a base, and the bottom of the base is supported by supporting legs. The invention relates to the technical field of circuit board production, two ends of a circuit board are erected on a conveying belt, the conveying belt drives the circuit board to move, when the circuit board moves to a processing position, a driving mechanism drives sliding blocks on two sides to get close to each other, and the sliding blocks drive clamping rods to get close to each other synchronously; the clamping rods overcome the elastic force of the springs to move upwards when getting close to each other through the slopes, the tops of the clamping rods move to the position above the circuit board, the clamping rods can clamp the two sides of the circuit board, the four sides of the circuit board can be limited at the same time in cooperation with the limiting wheels, and then the four sides of the circuit board can be fixed after the circuit board is conveyed to a machining position; and the circuit board can be fixed to the dead center of a machining position, the stability of the circuit board during machining is effectively improved, the circuit board is prevented from shaking during machining, and the percent of pass of circuit board machining is effectively improved.

The invention discloses an automatic screw welding device, and belongs to the field of welding devices.The automatic screw welding device comprises a case, a welding cavity is formed in the case, an auxiliary observation mechanism is arranged on the inner wall of one side of the welding cavity, a case door is movably connected to one side face of the case, and a dustproof feeding assembly is fixedly connected to the inner side face of the case door; a base plate clamping and fixing assembly is fixedly connected to the position, close to the middle, of the bottom end face of the welding cavity, a welding robot is arranged on one side of the base plate clamping and fixing assembly, a material taking robot is arranged on the other side of the base plate clamping and fixing assembly, and an impurity collecting mechanism is arranged below the base plate clamping and fixing assembly. The base plate clamping and fixing assembly specifically comprises two side plates oppositely fixed to the bottom end face of the welding cavity, and a supporting frame is rotationally connected between the two side plates. According to the multi-angle welding device, the angle of the fixed base plate can be adjusted on the horizontal plane and the vertical plane according to needs, then multi-angle more comprehensive welding can be conveniently conducted on the welding position, and the welding effect is improved.

The invention relates to the technical field of PCB machining, in particular to a full-automatic integrated vacuum hole plugging machine which comprises a bottom frame, a hole plugging device, an ink scraping device and a transferring mechanism, the hole plugging device is used for completing the hole plugging process of a PCB, the ink scraping device is used for completing the oil coating and ink scraping process of the PCB, and the transferring mechanism is used for transferring the PCB to the bottom frame. And the transferring mechanism is used for moving the PCB to be plugged into the clamping mechanism in the hole plugging device or moving the PCB subjected to hole plugging into the clamping mechanism of the ink scraping device. According to the full-automatic integrated vacuum hole plugging machine, the hole plugging and ink scraping processes of the PCB can be completed, meanwhile, the PCB is moved into the clamping mechanisms of the hole plugging device and the ink scraping device through the transferring mechanism, the feeding action of the hole plugging process or the ink scraping process of the PCB is automatically completed, and therefore the efficiency, quality and yield of the hole plugging process and the ink scraping process of the PCB are ensured.

The invention relates to the technical field of circuit board processing, and discloses an intelligent dust collector customized circuit board positioning device which comprises an operation table. The positioning and clamping assembly is used for clamping the circuit board in a centered positioning mode; the protection assembly is used for preventing the clamped circuit board from falling off during movement; the positioning and clamping assembly comprises a locking part used for switching the two clamping states of elastic clamping and rigid clamping. Through the arrangement of the positioning and clamping assembly, the four mounting boxes can synchronously perform centering movement, and clamping pieces on the four mounting boxes can perform centering positioning and clamping on a rectangular circuit board, so that the effect of automatic positioning is achieved, the positioning accuracy is high, and the positioning accuracy is high in cooperation with the rotation of an annular frame. And an operator can detect and assemble the rectangular circuit board, so that the number of operable procedures on the operation table is increased, and the overall working efficiency is improved.

The invention discloses a manufacturing method of a multi-layer thermoelectric separation buried copper plate, which comprises the steps of preparing an inner-layer core plate, slotting and burying a copper block, roughly drilling a through hole, filling resin, manufacturing a secondary outer-layer pattern, preparing an outer-layer core plate, drilling a conductive hole and a heat dissipation hole and the like, and is characterized in that the copper block is divided into a heat dissipation area and a conductive area; thermoelectric separation is achieved through the design of independent through holes and blind holes, components needing to conduct electricity and components needing to conduct heat can be added on the copper block at the same time, and meanwhile efficient heat conduction and stable signal transmission are achieved and do not interfere with each other. Due to the partition design, the copper block is not only used for heat dissipation, but also used for electric conduction, the utilization rate of the copper block is improved, the design area of the PCB is reduced, and the development requirements of high-density and miniaturized electronic equipment are met.

The invention discloses a double-station circuit board beveling machine, and relates to the technical field of circuit board processing equipment.The double-station circuit board beveling machine comprises a first base and a first tool apron, and the first tool apron is supported on the first base through a tool apron displacement assembly; the tool apron displacement assembly comprises a first left-right translation module, a first height adjusting module and two first front-back displacement modules which are symmetrically arranged, and the first left-right translation module and the first height adjusting module drive the two first tool aprons to integrally displace in the Y-axis direction and the Z-axis direction; each first front-back displacement module can independently drive a first worm and gear rotation device to move in the Y-axis direction, the first worm and gear rotation device rotates the angle of a first tool apron, angle adjustment is completed, a double-tool-apron structure which is symmetrically arranged up and down can synchronously cut the upper edge and the lower edge of a circuit board at the same time, and a three-axis movement system is matched, so that the machining efficiency is improved. And a worm and gear angle adjusting mechanism is combined, so that positioning is more accurate, and precision is higher.

The invention relates to the technical field of circuit board welding, and in particular to a circuit board fixing device for PCB circuit board welding, comprising a main body plate, an upper end of the main body plate is provided with an adjustable grinding and welding mechanism for drilling and welding the circuit board at any curvature, the adjustable grinding and welding mechanism comprises two first limit grooves symmetrically arranged on the upper end of the main body plate, a transmission shaft end of a third motor is fixedly connected with a second fixing body, a side surface of the second fixing body is fixedly connected with a first rotating shaft, an end of the first rotating shaft is rotatably arranged with a second connecting plate, and a clamping and fixing mechanism for clamping and adjusting a flexible circuit board is provided at the upper end of the main body plate; a support body at a telescopic end of a fourth electric telescopic rod has the same curvature as that of the circuit board installation, and then the first motor drives a roller to tighten the circuit board, so as to ensure that the circuit board can be completely fitted on the upper ends of a plurality of support bodies, and to ensure that the circuit board can be drilled and electronic components can be welded according to the curvature during installation.

The invention provides bending equipment and method for reducing the forming damage rate of FPC products, the bending equipment comprises a rack, an upper driving assembly, a lower driving assembly and a workbench, the upper driving assembly is arranged above the workbench, the lower driving assembly is arranged below the workbench, an adsorption device is arranged at the bottom of the workbench, and the adsorption device is arranged on the rack. More than two pressing devices, limiting assemblies and openings are arranged on the workbench in the length direction of the workbench, the pressing devices and the limiting assemblies are arranged at intervals, the openings penetrate from the upper end face to the lower end face of the workbench, and the upper driving assembly drives bending blades arranged on the upper driving assembly to move to the positions above the openings; the lower driving assembly drives the soft cushion block arranged on the lower driving assembly to move to the position below the opening, and the bending blade penetrates through the opening and then abuts against the soft cushion block so that the FPC product arranged on the workbench can be bent and formed.

The invention relates to a membrane removing and collecting integrated device suitable for SMT mounting, a connector is mounted on a circuit board, a membrane is attached to the connector from the top surface, the membrane protrudes out of the connector from the edge of one side, and the integrated device comprises a transmission line; a film uncovering device; provided is a waste film collecting device. On the one hand, on the basis of cooperation of the driving part and the power device, the upper clamping jaw and the lower clamping jaw accurately clamp a membrane with one side face of the connector as the reference and conduct uncovering, transferring and collecting, the stable and continuous membrane uncovering and collecting procedures are achieved, and efficiency is effectively improved; on the other hand, a traditional discharging mode is abandoned, the material belt with the adhesive layer is adopted, the waste film is placed on the adhesive layer along with the clamping component, the waste film is pressed and pasted to the adhesive layer through the pressing rod, and the waste film transferring success rate and the waste film collecting rate are greatly increased.

The invention relates to the technical field of automatic feeding, in particular to special automatic feeding equipment for Plasma, which comprises a fixing frame, a first plate feeding device, a second plate feeding device, a plugging and unplugging device, a transmission device and a distributed cooperative control system are arranged on the fixing frame, and the devices are electrically connected with a central controller; the first plate feeding device and the second plate feeding device are arranged side by side, the plugging and unplugging device is located on one side of the second plate feeding device, and the conveying device passes through the lower portion of the plugging and unplugging device. The distributed cooperative control system comprises a distributed control node triggered by a dynamic event, a digital twin cooperative optimization platform and a fault-tolerant self-healing module. And the distributed control node optimizes an actuator action strategy through a reinforcement learning algorithm. Plugging positioning precision of a clamping plate frame reaches + / -0.02 mm, the dislocation rate of a PCB is smaller than or equal to 0.1%, efficiency is optimized, production changing time is shortened by 83%, productivity is improved by 25%, reliability is enhanced, single-node fault recovery time is smaller than or equal to 5 s, and system availability is larger than or equal to 99.99%.

The invention discloses a method for manufacturing a surface flexible layer rigid-flexible combined board for an intelligent video module, which comprises the following steps of: taking a double-sided flexible copper-clad plate, and windowing a first surface copper layer corresponding to a first via hole to form a flexible core board; taking the first cover film and windowing corresponding to the first via hole to form a windowing cover film; correspondingly attaching the windowing covering film to one side of the second copper layer of the flexible core plate to form a covering film core plate; taking a prepreg, manufacturing a glue-blocking film corresponding to a flexible area of the prepreg, forming a glue-blocking prepreg, and manufacturing a rigid core plate; sequentially stacking and laminating the plates from top to bottom, enabling the glue blocking film to face the covering film core plate, then manufacturing a through hole in the rigid region, performing laser ablation on an insulating medium layer corresponding to a copper layer windowing pattern, electroplating, performing uncovering processing, removing a second copper layer at the bottom of a blind hole, forming a first via hole, and performing molding to form the rigid-flexible combined plate. The metallization process of the flexible area and the metallization process of the rigid area are combined into one-time electroplating, so that the consistency of the thickness of a copper plating layer is ensured.

The invention discloses a clamping jig capable of double-sided processing of a PCB (Printed Circuit Board), and relates to the technical field of PCB processing, the clamping jig comprises a fixed plate, a first groove is formed in the side wall of one end of the fixed plate, the inner wall of the first groove is rotatably connected with a rotating ring, and the inner wall of the rotating ring is fixedly connected with a first gear. When the PCB needs to be processed, the inclination angle of the clamping groove clamping plate can be adjusted according to the inclination angle of the inner walls of the clamping grooves formed in the side walls of the two short ends of the PCB, and the inner walls of the clamping grooves can be fixed conveniently; meanwhile, the inclination angle of a first clamping plate can be adjusted according to the inclination angle of the inner walls of the two ends of a trapezoidal mounting opening formed in the side walls of the two long ends of the PCB, so that the inner walls of the two ends of the trapezoidal mounting opening are conveniently fixed through the first clamping plate, and subsequent processing of the PCB is facilitated; and the reliability and the stability during the welding processing of the PCB are greatly improved.

The invention relates to the field of PCB (printed circuit board) printing, in particular to a high-precision multi-layer lamination and alignment PCB printing process which comprises a substrate pretreatment stage, a substrate preassembly stage, a dynamic lamination stage and a finished product output stage, the dynamic lamination stage comprises preheating treatment and resonance impurity removal treatment, and the lamination stage is divided into multi-stage lamination. And air bubbles and resin between the laminated bodies are optimized in the second pressing stage. According to the method, the inner-layer core plate and the copper foil are pretreated, so that positioning of the multi-layer core plate is more accurate and detection is facilitated, meanwhile, nanoscale micropores are formed in the copper foil through a laser technology to improve the flowing property of subsequent resin, and in the pressing process, pre-pressing and multi-stage pressing are set to improve the pressing accuracy; and in the second-stage pressing process, the dispersion direction of internal bubbles and the flowing direction of resin are improved through an ultrasonic device, a radiation heating device, a magnetic field assisting device and the like, the alignment accuracy and the pressing precision of the plate are further improved, and the machining efficiency is guaranteed.

The invention relates to the technical field of element bonding pad matching, in particular to a method for automatically matching a component and a bonding pad, which comprises the following steps of: directly and dynamically calculating a coverage area according to the size of the component, and detecting a bonding pad layer in real time without pre-storing a mapping relation; the electrical feasibility verification that the number of bonding pads is greater than or equal to the number of pins is increased to solve the risk of insufficient solder or solder skips; the coordinate correction is matched with the mean correction coordinate of the central point of the bonding pad, and the angle correction is realized by identifying a silk-screen polarity identifier through AI to realize a dual-stage correction technology; polarity identification consistency verification is newly added, so that the installation correctness of a high-reliability device is ensured, and polarity direction guarantee is realized; the workload of a client for pre-storing the template is reduced, and the matching precision is improved through dynamic detection and closed-loop correction.

The invention relates to the technical field of circuit board processing, in particular to a manufacturing process of a high-performance inner-layer ultra-thick copper circuit board which comprises a bearing table, a back plate and the like. A back plate is arranged on the bearing table. Printing ink is stored through the storage box, the situation that printing ink is not evenly printed due to printing ink diffusion is avoided, and the printing ink printing effect of equipment is improved; through the structure that the middle of the flow dividing rod is high and the two sides of the flow dividing rod are low, ink is slowly collected into the storage box along the flow dividing rod in cooperation with flowability of the ink, the problem that the ink utilization rate is low is solved, and meanwhile the situation that the ink is accumulated and hardened for a long time is avoided. The circuit board is ejected upwards through the ejector rod, then a worker can hold the lower side of the circuit board with hands to take out the circuit board, and the circuit board is prevented from being damaged while the worker conducts discharging conveniently. And the circuit board is accurately placed on the upper side of the fixing frame through cooperation of a guide plate and a limiting block, so that feeding by workers is more convenient.

The invention provides a correction method of a pneumatic clamp assembly, which comprises the following steps: controlling a main shaft assembly to move to a preset position, controlling a positioning piece to extend into a first positioning area of a first positioning part of the pneumatic clamp assembly and move in the first area, and controlling the first positioning part to clamp the positioning piece so as to correct the position of the first positioning part; detecting the position deviation between a main shaft of the main shaft assembly and a detection piece on the air clamping assembly; and determining the position of a first positioning point of the first positioning part based on the position deviation. The invention further provides a detection method of the positioning piece and circuit board processing equipment. According to the correction method of the air clamp assembly, the detection method of the positioning piece and the circuit board processing equipment, the position of the air clamp assembly can be accurately adjusted and corrected, so that the processing precision of the circuit board processing equipment is improved.

The invention relates to the field of voltage dependent resistor welding equipment, in particular to a voltage dependent resistor welding device which is characterized in that a triangular block, a pushing block, a driving assembly and a lifting assembly are matched with one another, in the fixing and butt joint process of the voltage dependent resistor, the voltage dependent resistor is extruded, and pins of the voltage dependent resistor are expanded, supported and bent through the triangular block; and the pins of the piezoresistor are aligned with the jacks on the circuit board, so that the piezoresistor and the circuit board can be quickly butted, and the welding efficiency of the piezoresistor is improved. According to the invention, the triangular block, the pushing block, the driving assembly and the lifting assembly cooperate with each other, and the piezoresistor is extruded in the process of fixing and butting the piezoresistor, so that the triangular block expands and bends the pins of the piezoresistor, and the pins of the piezoresistor are aligned with the jacks in the circuit board; rapid butt joint of the piezoresistor and the circuit board is facilitated, and the welding efficiency of the piezoresistor is improved.

The invention relates to a glass substrate hole plugging clamp system which comprises a flange clamp module, a lower flange module and a sliding clamping plate module, the flange clamp module comprises a flange assembly, a rack assembly and a clamping assembly, the clamping assembly is arranged on the rack assembly, the flange assembly is arranged on the clamping assembly, and the sliding clamping plate module is arranged on the rack assembly. The flange assembly comprises a flange frame and an elastic clamping flange piece, the glass substrate is fixed to the flange frame through the elastic clamping flange piece, the flange frame is clamped through the clamping assembly, the elastic clamping flange piece is driven to clamp and loosen the glass substrate, and the lower flange module and the sliding clamping plate module are arranged in the hole plugging machine. The lower flange assembly is used for clamping the lower end of the glass substrate located on the flange frame, and the sliding clamping plate module is used for clamping the upper end of the flange frame where the glass substrate is fixed. According to the clamping device, the glass substrate can be automatically clamped and fixed, and the machining efficiency and the operation convenience are improved.

The invention relates to the technical field of circuit board welding, in particular to a circuit board fixing device for PCB welding, which comprises a main body board, and an adjustable polishing and welding mechanism for drilling and welding a circuit board at any radian is arranged at the upper end of the main body board. The adjustable grinding and welding mechanism comprises two first limiting grooves symmetrically formed in the upper end of the main body plate, a second fixing body is fixedly connected to the transmission shaft end of the third motor, a first rotating shaft is fixedly connected to the side face of the second fixing body, and the end of the first rotating shaft and a second connecting plate are rotationally arranged. A clamping and fixing mechanism for clamping and adjusting the flexible circuit board is arranged at the upper end of the main body plate; supporting bodies at the telescopic ends of fourth electric telescopic rods are the same as the mounting radian of the circuit board, then a first motor drives a roller to tighten the circuit board, it is guaranteed that the circuit board can be completely attached to the upper ends of the multiple supporting bodies, and it is guaranteed that drilling and electronic element welding can be conducted on the circuit board according to the radian during mounting.

The invention relates to the technical field of circuit board processing, and particularly discloses an automatic film pasting process for a flexible circuit board, which comprises the steps of positioning feeding of the flexible circuit board, film pasting pretreatment and automatic film pasting processing. By adopting distributed positioning operation, accurate positioning of the flexible circuit board can be achieved, the flexible circuit board is calibrated and centralized at the center position of the top of the lifting plate, deviation and shaking of the flexible circuit board in the feeding process are effectively avoided, the feeding precision and stability are improved, and the production efficiency is improved. The stability of the flexible circuit board in the positioning process is further enhanced in cooperation with a multi-point adsorption mode, the flexible circuit board can keep the fixed position and posture in the film pasting machining process, the film pasting accuracy and completeness are guaranteed, meanwhile, due to the fact that the clamping blocks can move to the periphery of the bottom of the flexible circuit board when not carrying out clamping action, the clamping blocks can move to the periphery of the bottom of the flexible circuit board, and the clamping efficiency is improved. The film pasting process is not interfered, the smoothness of the film pasting process is ensured, and film pasting defects or process interruption caused by a positioning structure are avoided.

The invention relates to the technical field of automatic plug-in mounting equipment, in particular to a double-reference-point correction method, which comprises the following steps of: acquiring image information of a first reference point and a second reference point arranged on a lower camera module, and determining an actual coordinate when an upper camera is aligned with the first reference point based on the image information of the first reference point; comparing with a preset fixed coordinate value to generate a coordinate system translation correction parameter; calculating an included angle between a connecting line of two points and the X-axis direction based on the image information of the two datum points, and generating a coordinate system rotation correction parameter; according to the method, two correction parameters are integrated to update a plug-in machine coordinate system, a lead screw back clearance elimination operation is adopted to improve the basic positioning precision, a correction effect verification and historical data analysis mechanism is established, a double-reference-point design is adopted for the first time, the problems of coordinate system origin offset and X-axis orthogonality change are solved at the same time, and the precision of the plug-in machine is improved. And the long-term stable operation of the plug-in machine and the consistency among different machines are ensured.

The invention relates to the technical field of PCB drilling positioning, and particularly provides a PCB drilling positioning method and system.The method comprises the steps that structured light pattern images corresponding to different reference mark points are obtained, and the structured light pattern images comprise preset structured light patterns with projection areas covering the reference mark points; for each reference mark point, actual Z-axis height information is obtained according to the structured light pattern image, and then the focusing depth of the laser scanning system is adjusted according to the actual Z-axis height information; for each reference mark point, acquiring original two-dimensional coordinate information of the reference mark point by using a laser scanning system, and then correcting the original two-dimensional coordinate information according to the actual Z-axis height information and preset optical geometric parameters of the laser scanning system to obtain corrected two-dimensional coordinate information; correcting a preset drilling target point position according to all the corrected two-dimensional coordinate information to obtain a final drilling position of the drilling target point; according to the method, the problems of defocusing and projection errors caused by unevenness of the PCB can be effectively solved.

The invention discloses a circuit board semi-automatic welding system, and relates to the technical field of circuit board production and processing, the circuit board semi-automatic welding system comprises a processing table, the top end of the processing table is rotatably connected with a welding table driven by a stepping motor to rotate, the top end of the welding table is symmetrically provided with circuit board adsorption grooves, and the welding table is internally provided with an air suction positioning mechanism matched with the circuit board adsorption grooves; through cooperative operation of the multi-station rotary welding table and the double clamping boxes at the bottom end of the cross beam, a high-precision stepping motor and a transverse movement adjusting mechanism are integrated, a feeding, welding and discharging full-process automatic linkage mechanism is achieved, the automation degree is improved, and the production efficiency is improved. A multi-sensor fusion control structure comprising a smoke measurement purification mechanism and a temperature measurement regulation and control mechanism is adopted, meanwhile, through visual monitoring of a high-definition camera, the welding process can be monitored in real time, welding smoke is sucked away in time, a welded circuit board is rapidly cooled, and multi-dimensional monitoring and intelligent emergency response in the welding process of the circuit board are achieved.

The invention discloses a novel silicon carbide embedded core-embedded module packaging circuit board sintering device and method, and relates to the technical field of sintering processes. The device comprises a machine table, and a plurality of stations distributed at intervals are arranged on the machine table and sequentially comprise a feeding station, a plurality of preheating stations, a sintering station, a plurality of cooling stations and a discharging station; the lifting mechanisms are arranged on the machine table and located on the two sides of the multiple stations; the supporting mechanisms are located on the two sides of the multiple stations and movably connected with the lifting mechanism. The driving mechanism is arranged on the machine table and is in transmission connection with the supporting mechanism; and the sintering mechanism is arranged above the sintering station, the sintering mechanism can ascend and descend in the vertical direction, the sintering mechanism comprises a machining bin, an upper pressing die capable of ascending and descending is arranged in the machining bin, and a spray head used for providing inert gas is further arranged in the machining bin. According to the novel sintering device for the silicon carbide embedded core-embedded module packaging circuit board, the sintering quality and the sintering efficiency can be improved.

The invention relates to the technical field of electronic manufacturing, and discloses a circuit board printing manufacturing device which comprises a conveying belt, one end of the conveying belt is provided with a board placing device used for storing solder resist ink needing to be coated, one side of the board placing device is provided with two brushing devices, and the two brushing devices are arranged on the conveying belt. A fixing plate is arranged between the two brushing devices, the fixing plate is fixedly mounted on a fixing mounting plate of the conveying belt, a square rod is arranged between the fixing plate, one end of the square rod is rotationally connected with a gear, the other side of the gear is fixedly connected with a sliding square block, the other end of the sliding square block is slidably connected with a clamping block, and the clamping block is fixedly connected with the clamping block. One side of the clamping block communicates with an air pipe used for adsorbing a copper-clad plate, the square rod is sleeved with a torsional spring, and one end of the torsional spring is fixedly connected with the square rod. The circuit board printing and manufacturing device can fix the position of the copper-clad plate after the copper-clad plate is turned over.

The invention provides a drilling method for a laser X-shaped through hole of a circuit board and the circuit board, and the drilling method for the laser X-shaped through hole of the circuit board comprises the steps: covering a dry film on the surface of a copper-clad plate; patterning the dry film to form a mask coverage area and a non-mask area corresponding to the position of the preset positioning target; removing the dry film in a non-mask area; carrying out brownification treatment to change the color of the copper surface of the copper-clad plate in the non-mask area; and performing laser drilling on the copper-clad plate based on a positioning target by using the characteristic difference between the non-mask region and the mask coverage region as the positioning target. The characteristic difference between the color-changing copper surface in the non-mask area and the non-color-changing copper surface below the mask covering area is used as a positioning target of laser drilling. A traditional low-precision mechanical drilling positioning mode is replaced, the positioning reference is directly generated on the plate surface by utilizing the high-precision characteristic of the photoetching technology, the manufacturing precision of the positioning target is fundamentally improved, and the positioning target is particularly suitable for drilling scenes with strict position precision requirements and is beneficial for improving the product yield and reliability.

The present invention relates to the technical field of PCB board processing, and more particularly to a fully automatic, integrated vacuum plugging machine, comprising a base frame, a plugging device, a scraping device, and a transfer mechanism. The plugging device is used to complete the plugging process of a PCB board, the scraping device is used to complete the oiling and scraping processes of the PCB board, and the transfer mechanism is used to move a PCB board to be plugged into a clamping mechanism within the plugging device, or to move a PCB board that has been plugged into the clamping mechanism of the scraping device. The fully automatic, integrated vacuum plugging machine of the present invention can complete the plugging and scraping processes of a PCB board, and simultaneously, through the transfer mechanism, enables the PCB board to be moved into the clamping mechanism of the plugging device and the scraping device, automatically completing the loading action of the PCB board for the plugging process or the scraping process, thereby ensuring the efficiency, quality, and yield of the plugging and scraping processes of the PCB board.

The invention discloses a mounting head assembly based on direct-drive technology rotation center alignment, which comprises a shell, a direct-drive rotating platform is arranged in the shell, and the direct-drive rotating platform is connected with a force control mounting head; the force control mounting head comprises a first connecting block, a suction nozzle mounting seat and at least one elastic piece, and the first connecting block and the suction nozzle mounting seat are connected to two opposite ends of the elastic piece; the first connecting block is fixedly connected to the direct-driven rotating platform; a suction nozzle assembly is arranged below the suction nozzle mounting base, a sensing block is arranged at the position, protruding out of the elastic piece, of the suction nozzle mounting base, and a displacement sensor which is connected to the direct-drive rotating platform and electrically connected with a controller of a mounting force control system is arranged over the sensing block. The displacement sensor is used for detecting the deformation displacement amount of the elastic piece connected with the mounting head and feeding back the deformation displacement amount to the controller, and only the suction nozzle mounting seat and the suction nozzle assembly are arranged on the elastic piece, so that the load pressure of the elastic piece is reduced, and the mounting pressure is controlled more accurately.