16results about "Circuit board tools positioning" patented technology

A stencil printer for printing assembly materials on an electronic substrate includes a frame, a stencil coupled to the frame, the stencil having an aperture formed therein, a support assembly coupled to the frame, the support assembly configured to support the electronic substrate, a print head gantry coupled to the frame, and a print head assembly supported by the print head gantry in a manner such that the print head assembly is configured to traverse the stencil during a print stroke. The stencil printer further includes a verification system for determining whether an item placed within the stencil printer is properly installed within the stencil printer.

The application provides a laminated hot melting automation device for a PCB, and relates to the technical field of PCB production equipment. The laminated hot melting automation device for the PCB comprises a transplanting module, which is used to move a core plate or a first pre-lamination combination to be subjected to hot melting treatment to a hot melting module to form a second pre-lamination combination, the first pre-lamination combination and the second pre-lamination combination comprising the core plate and PP laminated in sequence; the hot melting module is used to perform CCD positioning on the second pre-lamination combination and perform hot melting treatment on the second pre-lamination combination after the CCD positioning to form a hot melting finished product; and a core plate receiving module is arranged on the discharge side of the hot melting module and is used to receive and stack the hot melting finished product. The embodiment of the application can realize the automation of the core plate and PP pre-lamination process, thereby effectively eliminating the manual feeding and discharging errors and avoiding the lamination errors, improving the PCB production process stability, being high in production efficiency and speed, greatly reducing the labor cost, and effectively meeting the production requirements.

The application discloses a kind of for semi-finished circuit board dividing board dividing board device and method, the present application relates to the technical field of semi-finished circuit board dividing board, the table top of workbench is provided with two for positioning and fixedly attaching semi-finished circuit board positioning and fixed assembly, positioning and fixed assembly in left side includes fixedly attached on the upright of workbench table top, it is hinged to the top end portion of upright first pin shaft rotating plate, rotating plate bottom surface left end portion is hinged to one connecting rod on second pin shaft, connecting rod is located in the left side of upright, and the top surface of rotating plate is fixedly attached with one strip positioning table and one vacuum chuck B;The spacer plate is provided with for pulling down two positioning and fixed assembly connecting rod pulling-down assembly.The beneficial effects of the present application are: greatly improve the efficiency of semi-finished circuit board dividing board, and no powdery waste in dividing board process.

A lid for pressing a printed circuit board against a heat sink is provided, the lid comprising a metal sheet and one or more domes arranged in the metal sheet, wherein each dome is associated with one or more slits of an annular segment shape in the metal sheet, the annular segment-shaped slits being arranged side by side in the metal sheet and spaced apart from each other, the annular segment-shaped slits surrounding the dome associated therewith. At least at one end of each annular segment-shaped slit, a slit extension can be provided in the metal sheet, the slit extension pointing at least partially away from the dome associated with the annular segment-shaped slit. An electronic appliance is also provided, the electronic appliance comprising such a lid, a heat sink and an electronic circuit board sandwiched therebetween.

A separating machine for separating individual printed circuit boards from a printed circuit board panel has a separating head and a separating tool movable on a machine frame. The separating head is movable by axis drives and has base plates movable by linear direct drives on the machine frame between loading and separating positions. A printed circuit board panel is arrangeable on each of the base plates. Linear direct drives comprise a motor part and a magnetic rail that interacts with the motor part. A control unit actuates the axis drives, the separating head, and the linear direct drives. The separating tool separates individual printed circuit boards from a printed circuit board panel during the separation processing. The linear direct drives can be controlled independently of one another.

A method of manufacturing a flexible circuit comprised of conducting and insulating layers in an extended length format using multi-point registration to benefit subsequent processing and utilizing one pass printing for up to 110 inches in conjunction with a large format press or alternatively a combination of step press cycles.

The present application relates to the technical field of circuit board processing, in particular to a kind of automatic control method and system for punching flexible circuit board.The method determines initial positioning point by preliminary analysis of image data through edge saliency analysis, establishes the association of physical FPC and ideal design coordinates, determines the position of more accurate initial hole position, for the second hole position, combined with initial positioning point and initial hole position quantitative deformation deviation, through the influence proportion of global error and local error, weight balance correction is carried out, and error correction value is obtained to dynamically compensate and correct hole position.The present application corrects error by balancing deviation weight from direction and distance through quantifying overall and local deformation, carries out continuous punching tracking dynamic correction, reduces batch error accumulation, and improves the accuracy of punching position in real time.

The application discloses a kind of plasma etching device and etching process for PCB board, including plasma etching machine body and feeding frame, the center of four around inner wall of feeding frame is welded with support column, and the shaft center of feeding frame is provided with the fixed connection of support column and placing disc, the inside of placing disc is rotatably connected with the bearing of carousel, and the top of carousel is equipped with the vortex groove of equidistance annular structure distribution.This application first motor drives driving gear to mesh with gear ring to rotate, gear ring drives carousel to rotate in the inside of placing disc by connecting block, the process of carousel rotation Column rod can be concentrated or away along vortex groove, so that column rod can drive sliding block to slide along sliding groove, and sliding block drives clamping block to clamp and position PCB board, so as to improve the stability in the process of PCB board etching, solve the complexity of conventional fixture in prior art for PCB board fixing or dismounting operation process.

This invention discloses a spray etching device for circuit board production, relating to the field of etching equipment technology. It includes a transport unit comprising a feeding component mounted on one side of a protective shell for feeding circuit boards, a conveying component mounted on the feeding component for conveying the circuit boards, a fixing component mounted on the conveying component for fixing the circuit boards, and a discharging component mounted on the other end of the protective shell for discharging. The discharging component and the fixing component cooperate to automatically unload the etched circuit boards. The feeding component precisely pushes the circuit boards into the protective shell, and the fixing component's squeezing mechanism secures the circuit boards, improving their stability during the etching process. Simultaneously, the rotational movement of the conveying component, combined with the flipping action of the fixing component, allows the circuit boards to automatically flip to a vertical position for etching without manual intervention, thus improving production efficiency.

The present application belongs to the technical field of circuit board manufacturing, and particularly relates to a circuit board manufacturing device, comprising a base and a soldering gun, wherein the base is provided with a mounting rack, the mounting rack is fixedly arranged on a support, and the mounting rack is provided with a mounting clamp and a displacement structure. The mounting clamp is used for clamping a circuit board, the middle part of the mounting clamp is penetrated from top to bottom, and the circuit board is arranged at the penetration position. The soldering gun is used for soldering the circuit board clamped on the mounting clamp. The displacement structure is arranged on the mounting clamp and used for moving the mounting clamp so that the soldering position of the circuit board corresponds to the position of the soldering gun. A turnover structure is arranged between the mounting rack and the support, the turnover structure can turn over the mounting rack, and the soldering gun can give way when the mounting rack is turned over. The present application can improve the processing precision and efficiency, liberate labor, and additionally, the turnover structure can turn over the mounting rack, the mounting clamp and the circuit board together, so that the secondary clamping of the circuit board can be avoided.

The present disclosure provides a printing system and a method for controlling a printing system. The printing system is used to print on a board, and includes at least one pair of adjustment assemblies. Each of the at least one pair of adjustment assemblies includes a carrying component, an alignment component and a drive component. The carrying component is configured to carry the board. The drive component is configured to be capable of driving the carrying component and the alignment component to move and is configured to adjust a distance between an upper surface of the carrying component and an upper surface of the alignment component to be equal to the thickness of the board. The structure of the printing system of the present disclosure enables a height difference between the upper surface of the alignment component and the upper surface of the carrying component to be adjusted according to the thickness of the board to be processed, such that the height difference between the upper surface of the alignment component and the upper surface of the carrying component is equal to the thickness of the board to be processed, so as to adapt to boards of different thicknesses to be processed.