FPC flexible circuit board automatic bending device and bending method thereof

Abstract

The invention discloses an FPC flexible circuit board automatic bending device and a bending method thereof, and relates to the technical field of FPC bending, the FPC flexible circuit board automatic bending device comprises a bending box, a curing mechanism is arranged in the middle of the upper end of the bending box, an air pipe frame is arranged on one side of the upper end of the bending box, and four FPC substrate mechanisms distributed in an annular array are arranged in the curing mechanism; and one side of the upper end of the bending box is provided with a film covering mechanism which is matched with the curing mechanism to carry out dispensing pre-pressing treatment on the FPC in the FPC substrate mechanism. The air guide sheet extracts air above the substrate plate, so that the thin sheet film can be tightly attached to the surface of the FPC circuit board, glue is helped to be quickly diffused on the surface of the FPC circuit board, flowing and diffusion of the glue are accelerated through the negative pressure effect, it is ensured that the glue can uniformly cover an area needing to be bonded, and the bonding efficiency is improved. And particularly, line connection points in complex shapes or narrow spaces are provided.

Description

Technical Field

[0001] The present invention relates to the technical field of FPC bending, and particularly relates to an automatic bending device for an FPC flexible circuit board and a bending method thereof. Background Art

[0002] For example, the publication number is CN116056345B, and the name is an automatic bending mechanism for an FPC flexible circuit board. This invention solves the problems that in the process of automatic bending of existing FPCs, it is not easy to bend or it is easy to rebound after bending; it realizes the automatic bending of FPC flexible circuit boards, without too much manual participation, can quickly bend the FPC according to actual needs, is not easy to displace, is not easy to rebound, and ensures that the shape and size of each FPC are the same after bending.

[0003] In the above-mentioned bending process of the FPC flexible circuit board, there are problems such as low positioning accuracy, and the bending area is prone to copper foil fracture or structural damage due to stress concentration. Especially when bending an FPC with a complex circuit layout, the internal circuit is prone to deformation or even failure due to lack of effective support, affecting the circuit performance. To solve the above problems and improve the accuracy, stability and automation level of FPC bending processing, therefore, the present application provides an automatic bending device for an FPC flexible circuit board and a bending method thereof. Through technical means such as precise adsorption positioning, pre-pressing forming, automatic bonding of reinforcement sheets and hot air assisted bending, the mechanical strength of the bending area is enhanced to prevent stress concentration damage to meet the requirements. Summary of the Invention

[0004] The purpose of the present application is to provide an automatic bending device for an FPC flexible circuit board and a bending method thereof, which can effectively solve the problems proposed in the above background art.

[0005] To achieve the above purpose, the present application provides the following technical solution: An automatic bending device for an FPC flexible circuit board, including a bending box. A curing mechanism is arranged in the middle of the upper end of the bending box. An air pipe rack is arranged on one side of the upper end of the bending box. Four FPC substrate mechanisms are arranged in the curing mechanism in an annular array distribution. A film covering mechanism for performing dispensing and pre-pressing treatment on the FPC inside the FPC substrate mechanism is arranged on one side of the upper end of the bending box. A bending mechanism for providing additional support to the bending area of the FPC is arranged on one side of the upper end of the bending box; The FPC substrate mechanism includes a base plate for providing a bending path for the FPC flexible circuit board. A pressing groove is opened on the upper end of the base plate. An FPC circuit board is arranged on the outer surface of the base plate. A reinforcement sheet for providing additional support for the FPC circuit board is pasted on the bending area of the outer surface of the FPC circuit board.

[0006] Among them, the curing mechanism includes a rotating disk. A rotating component is arranged at the bottom of the rotating disk, and the rotating component is installed in the middle of the upper end of the bending box. The substrate plate is installed inside the rotating disk. An installation shell is arranged at the upper end of the rotating disk. A plurality of control valves are arranged inside the installation shell, and an air suction pipe and a retractable air pipe are arranged on one side of the control valve. A control air box is arranged at the upper end of the installation shell, and the control air box is communicated with the control valve. A connecting pipe is arranged at the upper end of the control air box, and one end of the connecting pipe extends into the inside of the air pipe rack.

[0007] Among them, an adsorption cavity is opened inside the substrate plate. A plurality of ventilation holes are opened on the upper surface of the substrate plate. A gas guide sheet is arranged at the upper end of the substrate plate. The air suction pipe penetrates through the substrate plate and is communicated with the inside of the adsorption cavity. The retractable air pipe is communicated with the inside of the gas guide sheet.

[0008] Among them, the substrate plate is in the shape of a quarter disk, and the gas guide sheet is in the shape of a quarter ring.

[0009] Among them, the bending mechanism includes a support frame. The support frame is installed at the upper end of the bending box. An electric push rod is arranged on one side of the support frame. An installation plate is arranged at the lower end of the electric push rod. Support pieces are respectively arranged on both sides of the installation plate.

[0010] Among them, a pressing block is arranged at the bottom of the support piece. A winding reel and a film unwinding reel are respectively rotatably installed on both sides of the bottom of the support piece and located on both sides of the pressing block. A patch film is wound around the outer surfaces of the film unwinding reel and the winding reel together. The patch film covers the lower surface of the pressing block. A driving motor is arranged on one side of the winding reel, and the driving motor is installed on one side of the support piece.

[0011] Among them, the film covering mechanism includes an installation frame. The installation frame is installed at the upper end of the bending box. A lead screw assembly is arranged at the upper end of the installation frame. An installation frame is arranged at the upper end of the lead screw assembly. A top cover is arranged at the upper end of the installation frame. A push rod is arranged at the lower end of the top cover. A cover plate is arranged at the lower end of the push rod. A wedge block is arranged at the lower end of the cover plate.

[0012] Among them, a thin film is arranged on the inner wall of the installation frame. A plastic frame is arranged at the center position of the thin film. A plurality of through holes are opened at equal intervals at the lower end of the plastic frame. Rubber sheets are arranged on both sides of the plastic frame.

[0013] Among them, a capsule package is arranged inside the plastic frame. Leakage holes corresponding to the positions of the through holes are opened at the lower end of the capsule package. An osmosis sheet is arranged at the lower end of the capsule package.

[0014] The present invention also provides an automatic bending method for an FPC flexible circuit board. The specific bending method is as follows: S1. When the FPC flexible circuit board is bent, place the FPC flexible circuit board on the surface of the FPC substrate mechanism, and the film laminating mechanism pre-presses the FPC flexible circuit board. Moreover, during the process of pre-pressing and bending the FPC flexible circuit board by the film laminating mechanism, glue will also be applied to the surface of the FPC flexible circuit board. S2. The curing mechanism rotates and transfers out the FPC flexible circuit board processed by the film laminating mechanism, and then the curing mechanism raises the temperature of the surface of the FPC flexible circuit board, so that the glue coated on the surface of the FPC flexible circuit board by the film laminating mechanism is cured to provide additional support for the circuit. S3. The FPC flexible circuit board processed by the curing mechanism will move to the lower part of the bending mechanism, and the bending mechanism performs the final bending treatment on the FPC flexible circuit board. During the process of bending the FPC flexible circuit board by the bending mechanism, flexible support will also be added at the bending position of the FPC flexible circuit board.

[0015] In summary, the technical effects and advantages of the present invention are as follows: 1. The air guide piece in the present invention extracts the air above the substrate board, so that the thin film can be closely attached to the surface of the FPC circuit board, ensuring that there are no bubbles or voids between the thin film and the FPC, improving the uniformity and consistency of the subsequent glue application process. Through the structural design of the permeation sheet and the through holes, the glue can be more evenly distributed on the surface of the FPC circuit board. Especially for the coating requirements at the internal circuit wiring, the air guide piece continues to extract air to help the glue quickly spread on the surface of the FPC circuit board. Through the negative pressure effect, the flow and diffusion of the glue are accelerated to ensure that the glue can evenly cover the area to be bonded, especially the circuit connection points in complex shapes or narrow spaces. When the cover plate moves downward, the wedge block squeezes into the rubber sheet and squeezes a part of the area of the FPC circuit board into the pressing sheet groove. By applying pressure to specific areas, preliminary shape adjustment can be completed before bending. The pre-pressing treatment helps to improve the mechanical strength of these areas, especially in places that need to bear greater stress, such as near the connector or in the high-density wiring area.

[0016] 2. The present invention opens the communication pipeline between the air intake and exhaust pipe and the suction pipe through a control valve, enabling the two to share the suction channel. The air intake and exhaust pipe extracts the air above the FPC circuit board through the air guiding piece to achieve negative pressure adsorption and fixation. This method can accurately position the FPC, avoid displacement or damage caused by mechanical jigs, and is suitable for high cleanliness scenarios. When the substrate board moves under the film laminating mechanism, the air guiding piece continuously extracts air to form a negative pressure environment, which helps the film laminating material to closely adhere and improves the glue adhesion effect to ensure uniform dispensing. Subsequently, the system switches to the blowing mode, and hot air is guided by the air guiding piece to preheat the FPC, softening the material for bending and forming, reducing stress concentration, and preventing copper foil fracture. At the same time, the hot air activates the glue molecules and enhances their bonding force with the FPC surface. The design of the air guiding piece ensures uniform heat distribution, avoids local overheating or uneven curing, and improves the curing quality of the colloid and the structural stability.

[0017] 3. In the present invention, before the pressure block applies pressure, the reinforcing piece has been pre-placed on the surface of the FPC circuit board. The reinforcing piece can provide additional support before bending, reduce stress concentration and cracks that may occur during the bending process, increase the mechanical strength of the FPC in the bending area, and after the reinforcing piece has contacted the FPC, the pressure block continues to apply pressure to complete the bending action. The design of the pressure block cooperates with the reinforcing piece to ensure uniform pressure distribution during the bending process of the FPC circuit board, avoiding problems of local overpressure or underpressure. Through uniform pressure distribution, the risk of internal copper foil fracture or other damages caused by excessive bending is reduced. After bending is completed, the reinforcing piece is firmly adhered to the bending area of the FPC, providing long-term support for it. The reinforcing piece enhances the tensile resistance of the bending area and prevents the FPC from deforming or being damaged during subsequent use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 It is a first perspective three-dimensional structural schematic diagram of an automatic bending device for FPC flexible circuit boards; Figure 2 It is a partial first perspective three-dimensional structural schematic diagram of an automatic bending device for FPC flexible circuit boards; Figure 3 It is a partial second perspective three-dimensional structural schematic diagram of an automatic bending device for FPC flexible circuit boards; Figure 4 It is a partial third perspective three-dimensional structural schematic diagram of an automatic bending device for FPC flexible circuit boards; Figure 5 Schematic diagram of the three-dimensional connection structure of the curing mechanism; Figure 6 Schematic diagram of the internal three-dimensional connection structure of the curing mechanism; Figure 7 Schematic diagram of the three-dimensional connection structure of the film laminating mechanism; Figure 8 Schematic diagram of the three-dimensional connection structure of the thin film and the plastic frame; Figure 9 Schematic diagram of the partial three-dimensional connection structure of the film laminating mechanism; Figure 10 Schematic diagram of the three-dimensional connection structure of the cover plate and the wedge block; Figure 11 Schematic diagram of the three-dimensional connection structure of the thin film and the capsule package; Figure 12 Schematic diagram of the three-dimensional connection structure of the through hole and the rubber sheet; Figure 13 Schematic diagram of the three-dimensional connection structure of the capsule package and the osmotic tablet; Figure 14 Schematic diagram of the three-dimensional connection structure of the FPC substrate mechanism from the first perspective; Figure 15 Schematic diagram of the three-dimensional connection structure of the FPC substrate mechanism from the second perspective; Figure 16 Cross-sectional view of the three-dimensional connection structure of the FPC substrate mechanism; Figure 17 Schematic diagram of the three-dimensional connection structure of the FPC circuit board; Figure 18 Schematic diagram of the three-dimensional connection structure of the bending mechanism from the first perspective; Figure 19 Schematic diagram of the three-dimensional connection structure of the bending mechanism from the second perspective; Figure 20 Schematic diagram of the three-dimensional connection structure of the patch film lamination and the pressing block; Figure 21 Schematic diagram of the three-dimensional connection structure of the pressing block.

[0020] In the figure: 1, bending box; 2, film laminating mechanism; 21, mounting frame; 22, lead screw assembly; 23, top cover; 24, push rod; 25, cover plate; 26, mounting frame; 27, thin film; 28, rubber sheet; 29, plastic frame; 211, through hole; 212, wedge block; 213, capsule package; 214, leakage hole; 215, permeation sheet; 3, bending mechanism; 31, support frame; 32, electric push rod; 33, support sheet; 34, mounting plate; 35, drive motor; 36, winding drum; 37, patch film laminating; 38, pressing block; 39, film unwinding cylinder; 5, FPC substrate mechanism; 51, substrate board; 52, FPC circuit board; 53, reinforcing sheet; 54, air guiding sheet; 55, ventilation hole; 56, pressing groove; 57, adsorption cavity; 6, curing mechanism; 61, air control box; 62, connecting pipe; 63, mounting shell; 64, rotating disk; 65, suction pipe; 66, air intake and exhaust pipe; 67, control valve; 7, air pipe rack. Detailed implementation mode

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] Embodiment 1. Refer to Figures 1 to 21 An automatic bending device for FPC flexible printed circuit boards as shown, including a bending box 1, a curing mechanism 6 is arranged in the middle of the upper end of the bending box 1, an air pipe rack 7 is arranged on one side of the upper end of the bending box 1, four FPC substrate mechanisms 5 are arranged in the curing mechanism 6 in an annular array distribution, a film laminating mechanism 2 for performing spot gluing and pre-pressing treatment on the FPC inside the FPC substrate mechanism 5 is arranged on one side of the upper end of the bending box 1, and a bending mechanism 3 for providing additional support to the bending area of the FPC is arranged on one side of the upper end of the bending box 1; It should be noted that when the FPC flexible printed circuit board is bent, the FPC flexible printed circuit board is placed on the surface of the FPC substrate mechanism 5, and the film laminating mechanism 2 pre-presses the FPC flexible printed circuit board, and the film laminating mechanism 2 also applies glue on the surface of the FPC flexible printed circuit board during the process of pre-pressing and bending the FPC flexible printed circuit board; The curing mechanism 6 rotates and transfers out the FPC flexible printed circuit board processed by the film laminating mechanism 2, and then the curing mechanism 6 performs a heating treatment on the surface of the FPC flexible printed circuit board, so that the glue coated on the surface of the FPC flexible printed circuit board by the film laminating mechanism 2 is cured to provide additional support for the circuit; Among them, by coating glue on the surface of the FPC and curing it after heating, additional mechanical support can be provided for the FPC, especially in the bending area. This helps prevent damage caused by repeated bending or external pressure. The added glue layer can help disperse stress and reduce the risk of fracture due to local stress concentration. The FPC processed in the above manner can withstand more bending cycles without failure, thereby extending its service life.

[0023] The pre-pressing process ensures that the FPC maintains the correct shape and position during bending, reducing errors caused by material springback or other factors. Moreover, the uniform heating provided by the curing mechanism 6 ensures that the glue can be fully cured.

[0024] The FPC flexible circuit board processed by the curing mechanism 6 will move below the bending mechanism 3. The bending mechanism 3 performs the final bending process on the FPC flexible circuit board. During the bending process of the bending mechanism 3 on the FPC flexible circuit board, flexible support will also be added at the bending position of the FPC flexible circuit board.

[0025] Among them, adding flexible support at the bending position can help disperse stress and prevent cracks or fractures caused by excessive local stress. The flexible support can effectively relieve the fatigue damage caused by repeated bending and extend the service life of the FPC.

[0026] The flexible support not only provides physical strengthening but also serves as an additional protective layer to avoid the influence of external environmental factors such as moisture and dust on the internal circuit. When subjected to external impacts, the flexible support can play a certain buffering role to protect the fragile internal circuit from damage. By synchronously adding flexible support during the bending process, the bending angle and shape can be more precisely controlled to ensure that each FPC can meet the standards required by the design.

[0027] The flexible support can appropriately increase its local stiffness without sacrificing the flexibility of the FPC, making the entire structure more stable and reliable. For FPCs that need to form complex three-dimensional shapes, this approach can better support these special requirements and ensure that the finished product meets the expected design.

[0028] Embodiment 2: Based on the curing mechanism 6 and the FPC substrate mechanism 5 proposed in Embodiment 1, this embodiment provides a further technical solution for the curing mechanism 6 and the FPC substrate mechanism 5.

[0029] The FPC substrate mechanism 5 includes a substrate plate 51 that provides a bending path for the FPC flexible circuit board. A pressing groove 56 is opened at the upper end of the substrate plate 51. An FPC circuit board 52 is arranged on the outer surface of the substrate plate 51. A reinforcing sheet 53 that provides additional support for the FPC circuit board 52 is pasted on the bending area of the outer surface of the FPC circuit board 52.

[0030] An adsorption cavity 57 is provided inside the substrate plate 51. A plurality of vent holes 55 are provided on the upper surface of the substrate plate 51. A gas guide plate 54 is provided at the upper end of the substrate plate 51. The suction pipe 65 penetrates through the substrate plate 51 and communicates with the inside of the adsorption cavity 57. The retractable air pipe 66 communicates with the inside of the gas guide plate 54. The substrate plate 51 is in the shape of a quarter disc, and the gas guide plate 54 is in the shape of a quarter ring.

[0031] It should be noted that first, the FPC circuit board 52 is placed on the substrate plate 51. Then, the curing mechanism 6 extracts the air in the adsorption cavity 57 through the ventilation pipe, and adsorbs and fixes the FPC circuit board 52 on the surface of the substrate plate 51 through the vent holes 55. Subsequently, the FPC circuit board 52 adsorbed on the surface of the substrate plate 51 rotates together with the curing mechanism 6 and is sent below the film laminating mechanism 2 for pre-pressing and curing treatment.

[0032] Among them, fixing the FPC circuit board 52 by adsorption can ensure its accurate position on the substrate plate 51, avoiding the slight displacement or deviation that may be caused by mechanical jigs. The high-precision positioning helps the consistency and accuracy of subsequent process steps such as film laminating, dispensing, and bending. The continuous operation from adsorption fixation to film laminating and then to curing is realized through the rotation mechanism, reducing the time loss in the intermediate links and improving the efficiency of the overall production line.

[0033] During the pre-pressing process, the adsorbed and fixed FPC can better adhere to the substrate plate 51, ensuring that there are no bubbles or other defects between the film laminating material and the FPC surface, guaranteeing the quality of the film lamination. Using adsorption rather than physical clamping to fix the FPC can avoid local deformation or damage caused by excessive clamping force, and the adsorption method will not cause scratches or contamination to the FPC surface.

[0034] The curing mechanism 6 includes a rotating disk 64. A rotating component is provided at the bottom of the rotating disk 64, and the rotating component is installed in the middle of the upper end of the bending box 1. The substrate plate 51 is installed inside the rotating disk 64. An installation shell 63 is provided at the upper end of the rotating disk 64. A plurality of control valves 67 are provided inside the installation shell 63, and a suction pipe 65 and a retractable air pipe 66 are provided on one side of the control valve 67. An air control box 61 is provided at the upper end of the installation shell 63, and the air control box 61 communicates with the control valve 67. A connecting pipe 62 is provided at the upper end of the air control box 61, and one end of the connecting pipe 62 extends into the inside of the air pipe rack 7.

[0035] It should be noted that the rotation component drives the rotating disk 64 to rotate, and then the rotating disk 64 drives the substrate plate 51 to rotate. When placing the FPC circuit board 52 on the surface of the substrate plate 51, the air inside the adsorption chamber 57 is extracted through the air suction pipe 65. When placing the FPC circuit board 52 on the substrate plate 51, the control valve 67 opens the connecting pipe between the retractable air pipe 66 and the air suction pipe 65, so that the retractable air pipe 66 can share an air suction pipe with the air suction pipe 65. The retractable air pipe 66 then extracts the air above the FPC circuit board 52 through the air guide piece 54. When the substrate plate 51 moves to the lower part of the film covering mechanism 2, the air guide piece 54 extracts the air above, which can cooperate with the film covering mechanism 2 to perform dotting glue treatment on the surface of the FPC circuit board 52. When the rotating disk 64 rotates and drives the substrate plate 51 to move out, the control valve 67 cuts off the connecting pipe between the retractable air pipe 66 and the air suction pipe 65. At this time, the retractable air pipe 66 is connected to the blowing air pipe inside the air control box 61, and air is blown into the retractable air pipe 66 through the blowing air pipe, so that the gas blown out by the retractable air pipe 66 is guided by the air guide piece 54 and blown on the surface of the FPC circuit board 52. The hot air blown out by the retractable air pipe 66 can cure the colloid on the surface of the FPC circuit board 52, and the hot air guided by the air guide piece 54 can preheat the surface of the FPC circuit board 52.

[0036] Among them, the control valve 67 opens the connecting pipe between the retractable air pipe 66 and the air suction pipe 65, so that the two share an air suction pipe. The retractable air pipe 66 extracts the air above the FPC circuit board 52 through the air guide piece 54 to realize the adsorption and fixation of the FPC. Through the negative pressure adsorption method, it is ensured that the position of the FPC on the substrate plate is accurate and error-free, avoiding the possible small displacement or deviation caused by mechanical jigs. Compared with mechanical clamping, the adsorption method will not cause scratches or damage to the surface of the FPC, and is particularly suitable for application scenarios that require high cleanliness.

[0037] When the substrate plate 51 moves to the lower part of the film covering mechanism 2, the air guide piece 54 continues to extract the air above, and cooperates with the film covering mechanism 2 to perform dotting glue treatment on the surface of the FPC circuit board 52. The negative pressure environment formed by air extraction helps the film covering material to closely adhere to the surface of the FPC. The negative pressure environment can help the glue better adhere to the surface of the FPC, ensuring that the dotting glue process is more uniform. Moreover, hot air preheating can soften the FPC material, making it easier to form in the subsequent bending process, reducing stress concentration, preventing copper foil fracture. The preheating treatment can activate the glue molecules, promoting their better combination with the surface of the FPC, thereby enhancing the bonding strength. By guiding the distribution of hot air through the air guide piece 54, it is ensured that the surface of the FPC is evenly heated, avoiding problems such as local overheating or uneven curing. The uniform distribution of hot air enables the colloid to be cured more thoroughly, reducing the possibility of uncured, and enhancing the stability of the overall structure.

[0038] Embodiment 3. Based on the film laminating mechanism 2 provided in Embodiment 1, this embodiment provides a further technical solution for the film laminating mechanism 2.

[0039] The film laminating mechanism 2 includes a mounting frame 21, the mounting frame 21 is mounted on the upper end of the bending box 1, a lead screw assembly 22 is arranged at the upper end of the mounting frame 21, a mounting frame 26 is arranged at the upper end of the lead screw assembly 22, a top cover 23 is arranged at the upper end of the mounting frame 26, a push rod 24 is arranged at the lower end of the top cover 23, a cover plate 25 is arranged at the lower end of the push rod 24, and a wedge block 212 is arranged at the lower end of the cover plate 25.

[0040] A thin film 27 is arranged on the inner wall of the mounting frame 26. A plastic frame 29 is arranged at the center position of the thin film 27. A number of through holes 211 are arranged at equal intervals at the lower end of the plastic frame 29. Rubber sheets 28 are arranged on both sides of the plastic frame 29.

[0041] A capsule package 213 is arranged inside the plastic frame 29. Leak holes 214 corresponding to the positions of the through holes 211 are arranged at the lower end of the capsule package 213. An osmosis sheet 215 is arranged at the lower end of the capsule package 213.

[0042] It should be noted that when the substrate plate 51 moves to the lower part of the mounting frame 26, the mounting frame 26 is pushed to move by the lead screw assembly 22. When the mounting frame 26 moves to the upper part of the substrate plate 51, the arranged push rod 24 will push the cover plate 25 to squeeze the capsule package 213, and the capsule package 213 will squeeze the plastic frame 29. Moreover, since the air above the substrate plate 51 is extracted by the air guiding sheet 54, and the thin film 27 also moves to the upper part of the substrate plate 51. Since the arranged thin film 27 is made of rubber material, the air in the gap between the thin film 27 and the FPC circuit board 52 is extracted by the air guiding sheet 54 and then adheres to the surface of the FPC circuit board 52. After the capsule package 213 is squeezed, the glue inside will leak onto the surface of the osmosis sheet 215 through the leak holes 214, and then the glue will flow into the through holes 211 through the osmosis sheet 215. Since the thin film 27 is adsorbed on the surface of the FPC circuit board 52, and the air between the thin film 27 is extracted by the air guiding sheet 54, the plastic frame 29 can be closely attached to the surface of the FPC circuit board 52. After the glue flowing out through the through holes 211 adheres to the surface of the FPC circuit board 52, extracting air by the air guiding sheet 54 can accelerate the diffusion of the glue on the surface of the FPC circuit board 52, so that the glue can be applied to the wiring of the internal circuit of the FPC circuit board 52; And when the cover plate 25 moves downward, it will also drive the wedge block 212 to squeeze into the inside of the rubber sheet 28, and then part of the area of the FPC circuit board 52 will be squeezed into the inside of the pressing groove 56 by the extrusion of the wedge block 212, realizing pre-pressing on the bent area of the pressing groove 56.

[0043] Among them, the air guide piece 54 extracts the air above the substrate board 51, enabling the thin film 27 to closely adhere to the surface of the FPC circuit board 52, ensuring that there are no bubbles or voids between the thin film 27 and the FPC, improving the uniformity and consistency of the subsequent dispensing process. Through the structural design of the permeation sheet 215 and the through holes 211, the glue can be more evenly distributed on the surface of the FPC circuit board 52. Especially for the coating requirements at the internal circuit wiring area, the air guide piece 54 continues to extract air to help the glue quickly spread on the surface of the FPC circuit board 52. Through the negative pressure effect, the flow and diffusion of the glue are accelerated, ensuring that the glue can evenly cover the areas to be bonded, especially the circuit connection points in complex shapes or narrow spaces.

[0044] When the cover plate 25 moves downward, the wedge block 212 squeezes into the inside of the rubber sheet 28 and squeezes a partial area of the FPC circuit board 52 into the pressing groove 56. By applying pressure to specific areas, preliminary shape adjustment can be completed before bending. The pre-pressing treatment helps to improve the mechanical strength of these areas, especially in places that need to withstand greater stress, such as near the connector or in the high-density wiring area.

[0045] Embodiment 4: Based on the bending mechanism 3 provided in Embodiment 1, this embodiment provides a further technical solution for the bending mechanism 3.

[0046] The bending mechanism 3 includes a support frame 31. The support frame 31 is installed at the upper end of the bending box 1. An electric push rod 32 is arranged on one side of the support frame 31. The lower end of the electric push rod 32 is provided with a mounting plate 34. Support pieces 33 are respectively arranged on both sides of the mounting plate 34.

[0047] A pressing block 38 is arranged at the bottom of the support piece 33. A film winding drum 36 and a film unwinding drum 39 are respectively rotatably installed on both sides of the bottom of the support piece 33 and located on both sides of the pressing block 38. A patch film 37 is wound around the outer surfaces of the film unwinding drum 39 and the film winding drum 36 together. The patch film 37 covers the lower surface of the pressing block 38. A driving motor 35 is arranged on one side of the film winding drum 36, and the driving motor 35 is installed on one side of the support piece 33.

[0048] It should be noted that when the substrate plate 51 moves below the mounting plate 34, the mounting plate 34 is driven to move by the electric push rod 32. Then the mounting plate 34 will also drive the support piece 33 to move. Then the pressing block 38 is driven by the support piece 33 to squeeze the FPC circuit board 52 placed at the upper end of the substrate plate 51 downward. The provided patch film 37 will first contact the FPC circuit board 52, and a reinforcing piece 53 is provided on the surface of the patch film 37. When the reinforcing piece 53 pasted on the surface of the patch film 37 contacts the FPC circuit board 52, the pressing block 38 at this time will continuously squeeze the FPC circuit board 52 to bend the FPC circuit board 52. The reinforcing piece 53 will be pasted on the surface of the FPC circuit board 52 by the extrusion of the pressing block 38. The reinforcing piece 53 is used to support the bending area of the FPC circuit board 52. After bending the FPC circuit board 52, the provided drive motor 35 drives the winding drum 36 to rotate. The patch film 37 is wound by the winding drum 36 to drive the unused reinforcing piece 53 in the film unwinding cylinder 39 to move below the pressing block 38 to realize continuous bending support for the FPC circuit board 52.

[0049] Among them, before the pressing block 38 applies pressure, the reinforcing piece 53 has been pre-placed on the surface of the FPC circuit board 52. The reinforcing piece 53 can provide additional support before bending, reduce stress concentration and cracks that may occur during the bending process, increase the mechanical strength of the FPC in the bending area. Moreover, after the reinforcing piece 53 has contacted the FPC, the pressing block 38 continues to apply pressure to complete the bending action. The design of the pressing block 38 in cooperation with the reinforcing piece 53 ensures uniform pressure distribution during the bending process of the FPC circuit board 52, avoiding problems of local overpressure or underpressure. Through uniform pressure distribution, the risk of internal copper foil fracture or other damage caused by excessive bending is reduced.

[0050] After bending is completed, the reinforcing piece 53 is firmly pasted on the bending area of the FPC, providing long-term support for it. The reinforcing piece 53 enhances the tensile resistance of the bending area, preventing the FPC from deforming or being damaged during subsequent use.

[0051] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An automatic bending device for an FPC flexible circuit board, comprising a bending box (1), characterized in that: In the middle of the upper end of the bending box (1), a curing mechanism (6) is provided. On one side of the upper end of the bending box (1), an air pipe rack (7) is provided. Inside the curing mechanism (6), four FPC substrate mechanisms (5) are arranged in an annular array. On one side of the upper end of the bending box (1), a film covering mechanism (2) is provided to cooperate with the curing mechanism (6) to perform dotting and pre-pressing treatment on the FPC inside the FPC substrate mechanism (5). On one side of the upper end of the bending box (1), a bending mechanism (3) is provided to provide additional support for the FPC bending area; The FPC substrate mechanism (5) includes a substrate board (51) that provides a bending path for the FPC flexible circuit board. A pressing groove (56) is formed in the upper end of the substrate board (51). An FPC circuit board (52) is arranged on the outer surface of the substrate board (51). A reinforcing sheet (53) that provides additional support for the FPC circuit board (52) is pasted on the bending area of the outer surface of the FPC circuit board (52).

2. The automatic bending device for an FPC flexible circuit board according to claim 1, characterized in that: The curing mechanism (6) includes a rotating disk (64). A rotating component is arranged at the bottom of the rotating disk (64), and the rotating component is installed in the middle of the upper end of the bending box (1). The substrate board (51) is installed inside the rotating disk (64). An installation shell (63) is arranged at the upper end of the rotating disk (64). A plurality of control valves (67) are arranged inside the installation shell (63), and an air suction pipe (65) and a retractable air pipe (66) are arranged on one side of the control valve (67). A control air box (61) is arranged at the upper end of the installation shell (63), and the control air box (61) is communicated with the control valve (67). A connecting pipe (62) is arranged at the upper end of the control air box (61), and one end of the connecting pipe (62) extends into the inside of the air pipe rack (7).

3. The automatic bending device for an FPC flexible circuit board according to claim 2, wherein: An adsorption cavity (57) is formed inside the substrate board (51). A plurality of ventilation holes (55) are formed in the upper surface of the substrate board (51). A gas guiding sheet (54) is arranged at the upper end of the substrate board (51). The air suction pipe (65) penetrates through the substrate board (51) and is communicated with the inside of the adsorption cavity (57). The retractable air pipe (66) is communicated with the inside of the gas guiding sheet (54).

4. An automatic bending device for an FPC flexible circuit board according to claim 3, characterized in that: The substrate board (51) is in the shape of a quarter disk, and the gas guiding sheet (54) is in the shape of a quarter ring.

5. An automatic bending device for an FPC flexible circuit board according to claim 1, characterized in that: The bending mechanism (3) includes a support frame (31). The support frame (31) is installed at the upper end of the bending box (1). An electric push rod (32) is arranged on one side of the support frame (31). An installation plate (34) is arranged at the lower end of the electric push rod (32). Support sheets (33) are respectively arranged on both sides of the installation plate (34).

6. The automatic bending device for an FPC flexible circuit board according to claim 5, characterized in that: A pressing block (38) is provided at the bottom of the support piece (33). A winding reel (36) and a film unwinding reel (39) are respectively rotatably installed on both sides of the pressing block (38) at the bottom of the support piece (33). A patch film (37) is wound around the outer surfaces of the film unwinding reel (39) and the winding reel (36) together. The patch film (37) covers the lower surface of the pressing block (38). A driving motor (35) is provided on one side of the winding reel (36), and the driving motor (35) is installed on one side of the support piece (33).

7. An automatic bending device for an FPC flexible circuit board according to claim 1, characterized in that: The film covering mechanism (2) includes a mounting frame (21). The mounting frame (21) is installed at the upper end of the bending box (1). A lead screw assembly (22) is provided at the upper end of the mounting frame (21). An installation frame (26) is provided at the upper end of the lead screw assembly (22). A top cover (23) is provided at the upper end of the installation frame (26). A push rod (24) is provided at the lower end of the top cover (23). A cover plate (25) is provided at the lower end of the push rod (24). A wedge block (212) is provided at the lower end of the cover plate (25).

8. An automatic bending device for an FPC flexible circuit board according to claim 7, characterized in that: A thin film (27) is provided on the inner wall of the installation frame (26). A plastic frame (29) is provided at the central position of the thin film (27). A plurality of through holes (211) are provided at equal intervals at the lower end of the plastic frame (29). Rubber sheets (28) are provided on both sides of the plastic frame (29).

9. An automatic bending device for an FPC flexible circuit board according to claim 8, characterized in that: A capsule package (213) is provided inside the plastic frame (29). Leak holes (214) corresponding to the positions of the through holes (211) are provided at the lower end of the capsule package (213). An osmosis sheet (215) is provided at the lower end of the capsule package (213).

10. An automatic bending method for an FPC flexible circuit board, which uses the automatic bending device for an FPC flexible circuit board described in any one of claims 1-9, is characterized in that, The specific bending method is as follows: S1. When the FPC flexible circuit board is bent, the FPC flexible circuit board is placed on the surface of the FPC substrate mechanism (5). The film covering mechanism (2) pre-presses the FPC flexible circuit board, and during the process of pre-pressing and bending the FPC flexible circuit board by the film covering mechanism (2), glue will also be applied to the surface of the FPC flexible circuit board. S2. The curing mechanism (6) rotates and transfers the FPC flexible circuit board processed by the film covering mechanism (2), and then the curing mechanism (6) performs a heating treatment on the surface of the FPC flexible circuit board, so that the glue coated on the surface of the FPC flexible circuit board by the film covering mechanism (2) is cured to provide additional support for the circuit. S3. The FPC flexible circuit board processed by the curing mechanism (6) will move to the lower part of the bending mechanism (3). The bending mechanism (3) performs the final bending treatment on the FPC flexible circuit board. During the process of the bending mechanism (3) performing the bending treatment on the FPC flexible circuit board, flexible support will also be added to the bending part of the FPC flexible circuit board.

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