6058results about "Printed circuit details" patented technology

The invention discloses a circuit module, an electric control heat dissipation assembly and heating and ventilation equipment, and the circuit module comprises a circuit board and a heat conduction assembly. The circuit board comprises a substrate and at least one first electronic element mounted on the substrate, the substrate comprises a first board and a second board which are oppositely arranged, and the at least one first electronic element is mounted on the first board; the heat conduction assembly is arranged on the second plate surface, the heat conduction assembly is in heat conduction contact with the second plate surface and the at least one first electronic element, and the projection of the at least one first electronic element is within the projection range of the heat conduction assembly when observed in the direction perpendicular to the plate surface. According to the technical scheme, the heat dissipation problem of the circuit module can be effectively solved, and meanwhile cost is reduced.

The invention discloses a processing method of a millimeter wave radar circuit board, which adopts a continuous blind slot to replace a plurality of independent blind hole structures in a traditional structure, so that a continuous radio frequency circuit pattern can be formed, the signal shielding area is effectively increased, and the millimeter wave radar circuit board has a better signal shielding effect. Besides, the processing method of the embodiment of the invention also cancels the procedures of repeated electroplating, single-side copper reduction, circuit etching and the like in the traditional processing method, and can directly realize the manufacturing of the outer circuit, the first copper layer and the second copper layer through activation and copper deposition, thereby greatly shortening the processing flow of the millimeter wave radar circuit board, and improving the production efficiency of the millimeter wave radar circuit board. And the production efficiency of the millimeter wave radar circuit board is improved. In addition, the invention further discloses the millimeter-wave radar circuit board formed by the processing method of the millimeter-wave radar circuit board.

The invention discloses a probe integrated device and a preparation method and a control method of the probe integrated device. The device comprises a probe array, a silicon electrode substrate, a recording chip bare chip and a rigid printed circuit substrate. The preparation method comprises the following steps: preparing a probe array and a silicon electrode substrate; carrying out balling on the bare chip of the recording chip, aligning the bare chip with one end of the silicon electrode substrate, and inversely mounting the bare chip on the probe array and the silicon electrode substrate to obtain a substrate with the bare chip; and adhering to a rigid printed circuit substrate, and connecting through a metal wire to obtain the probe integrated device. The control method comprises the following steps: acquiring a brain neuron signal; and carrying out amplification and analog-to-digital conversion processing on the cerebral neuron signal to obtain a cerebral neuron digital signal. According to the embodiment of the invention, miniaturization of the device can be promoted, acquisition of high-flux signals is facilitated, and three-dimensional space neurons can be recorded. The probe array can be widely applied to the technical field of probe arrays.

The invention discloses an electromagnetic shielding film and a circuit board, the battery shielding film comprises a protective layer, the tensile strength of the protective layer is greater than or equal to 40MPa, and the elongation of the protective layer is greater than or equal to 50%. According to the electromagnetic shielding film, the tensile strength of the protective layer is controlled to be larger than or equal to 40 MPa, and the elongation is controlled to be larger than or equal to 50%, so that the protective layer can bear large tension and has good flexibility and ductility, the tear resistance of the electromagnetic shielding film can be effectively improved, and the service life of the electromagnetic shielding film is prolonged. Therefore, the electromagnetic shielding film can be prevented from being damaged when being pressed on an area with offset on the circuit board while ensuring the complex effect and the shielding effectiveness of pressing.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin layer disposed to cover a side surface of the first component and the first surface; and a redistribution layer covering a surface of the first sealing resin layer on a side far from the substrate. The redistribution layer includes: a first metal film disposed to correspond to a projection area of the first component; a first insulating film covering a surface of the first metal film on a side far from the substrate; and a first group of conductor vias passing through the first insulating film and protruding from the first metal film in a direction away from the substrate.

The invention discloses an electromagnetic shielding film and a circuit board, the electromagnetic shielding film comprises a first shielding layer, a flexible conductive adhesive layer and a second shielding layer which are stacked in sequence, and the flexible conductive adhesive layer is arranged between the first shielding layer and the second shielding layer, so that the bending resistance of the electromagnetic shielding film is effectively improved, interference signals are effectively weakened, and the electromagnetic shielding effect is improved. According to the electromagnetic shielding film, the shielding performance is improved, the elastic modulus of the flexible conductive adhesive layer is set between 80 MPa and 120 MPa, the elastic modulus of the flexible conductive adhesive layer is limited within a reasonable range, the bending resistance of the electromagnetic shielding film is better improved, and the electromagnetic shielding film is suitable for products needing to be folded or opened and closed for a long time and at high frequency.

An antenna apparatus includes a multi-layer printed circuit board, an antenna, and a floating patch group. The multi-layer printed circuit board includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer. The antenna is formed from at least one of the first metal layer, the second metal layer, and the third metal layer. The floating patch group is located in the multi-layer printed circuit board and includes a plurality of floating patches. The floating patch has a width. There is a gap between the floating patch and an adjacent floating patch. The floating patches have the same or similar width and the same or similar gap. The floating patch group is arranged in a metal layer where the antenna is located. There is a spacing between the floating patch group and the antenna.

The embodiment of the invention provides a light-emitting diode chip set, a backlight module of a display and an illumination module, and relates to the technical field of semiconductors, the light-emitting diode chip set generates white light and comprises at least one multi-wavelength chip, the multi-wavelength chip comprises an N-type semiconductor layer, a P-type semiconductor layer, a first light-emitting layer and a second light-emitting layer, wherein the first light-emitting layer and the second light-emitting layer are arranged between the N-type semiconductor layer and the P-type semiconductor layer and are stacked. The first light-emitting layer generates light of a first wave band through electroluminescence and excites the second light-emitting layer to generate light of a second wave band, the number of wavelengths contained in the light of the first wave band and the number of wavelengths contained in the light of the second wave band are both larger than or equal to 1 and smaller than or equal to 10, and a hole isolation area exists between the first light-emitting layer and the second light-emitting layer. The multi-wavelength chip has higher external quantum efficiency, the limitation of a traditional white light scheme (blue chip + yellow fluorescent powder or blue chip + green fluorescent powder + red fluorescent powder) can be broken through, the reliability is improved, and the service life is prolonged.

The invention relates to the technical field of interface impedance adjustment, and discloses an impedance matching adjustment method and device for an FPC high-performance computing chip interface. The method comprises: collecting impedance parameters of the FPC high-performance computing chip interface and establishing an impedance characteristic mathematical model; constructing a scalar differential equation group including an impedance change rate, a temperature change rate and a signal characteristic change rate, and solving the scalar differential equation group to obtain a dynamic compensation parameter matrix; adjusting and controlling the interlayer relative positions of an FPC multilayer structure, adjusting impedance gradient parameters in an interlayer transition region of the FPC multilayer structure, and obtaining initial impedance optimization data; inputting the initial impedance optimization data and historical temperature data into a recurrent neural network model to perform impedance matching parameter optimization calculation, and generating an impedance matching optimization parameter group. The invention improves the adaptability of the FPC high-performance computing chip interface to complex working conditions and improves the convergence speed of the impedance matching parameters.

The invention discloses a manufacturing method of a PCB (Printed Circuit Board) embedded with a copper block, which comprises the following steps of: manufacturing the copper block according to the size of a milling groove of the PCB; milling the core plate and the PP sheet corresponding to the copper block embedding position; embedding a copper block; performing press fit; ceramic plate grinding is conducted, and residual glue on the surface of the copper block is removed; performing laser ablation and drilling; and electroplating and post-process. According to the manufacturing method of the PCB embedded with the copper block, the flatness of the copper block and the board surface and the surface quality of the copper block can be improved, so that the quality of the PCB embedded with the copper block is improved.

The invention discloses a substrate with a non-metallization step blind slot and a processing method thereof, and the processing method comprises the steps: providing a laminated plate, manufacturing an inner-layer circuit, an inner-layer target and a first window on an outer-layer copper foil of the laminated plate, and then arranging an insulation adding layer and a copper foil adding layer on the outer-layer copper foil in a laminated manner; a second window is manufactured on the copper foil added layer in the mode of grabbing the inner layer target for alignment; laser groove burning is carried out based on the second window and the first window in sequence, a first-order blind groove with the second window as a groove opening and the local part of the outer-layer copper foil as the groove bottom and a second-order blind groove with the first window as the groove opening and the local part of the inner-layer copper foil of the laminated plate as the groove bottom are manufactured, and the first-order blind groove and the second-order blind groove form a stepped blind groove together; and preparing an outer circuit on the copper foil added layer, and removing the bottoms of the first-order blind groove and the second-order blind groove to prepare a non-metallization step blind groove, thereby obtaining the substrate. The processing method is simple and reasonable, the processing cost is low, the obtained substrate is high in size precision and good in appearance quality, and the production requirements in the field of circuit boards are met.

The embodiment of the invention discloses a double-sided packaging structure, a power supply device and electronic equipment. The power devices are arranged on the two side plate surfaces of the PCB substrate of the double-face packaging structure, and the heat conduction piece is inserted into the PCB substrate and packaged to form a packaging body. The packaging body comprises a heat dissipation surface, and the heat dissipation surface is opposite to one side plate surface of the PCB substrate. The PCB substrate is provided with a via hole and a through hole which are connected through a copper foil, the via hole is at least connected with a power device arranged on the other side plate surface of the PCB substrate, the heat conduction piece is inserted into the through hole, and one end of the heat conduction piece extends to the heat dissipation surface of the packaging body. Through the arrangement, the power device on the non-heat-dissipation surface side can be led out through a low-heat-resistance heat dissipation path formed by the via hole, the copper foil, the through hole and the heat conduction piece in sequence, and the heat dissipation performance of the power device on the non-heat-dissipation surface side is effectively improved; meanwhile, based on the structural characteristics of the inserted heat conduction piece, the packaging width can be reduced, and the trend requirement of high-density layout is met.

The present invention discloses an electromagnetic shielding film and a circuit board. The electromagnetic shielding film comprises: a first shielding layer, an interlayer and a second shielding layer which are stacked in sequence; the thickness of the first shielding layer, the thickness of the second shielding layer and the thickness of the interlayer satisfy: 0.05≤d3 / (d1+d2)≤6.5. The interlayer is provided to increase the flexibility of the electromagnetic shielding film, and the provision of two shielding layers further enhances the shielding effect. The ratio of the thickness of the interlayer to the sum of the thickness of the two shielding layers is limited within a certain range, so that the thickness of the interlayer is within a suitable thickness range, which can have better stress, the device is resistant to bending, and the overall thickness of the electromagnetic shielding film is not too thick, which is conducive to the thinning of the device. At the same time, the thickness of the interlayer is relatively close to the sum of the thicknesses of the two shielding layers, which improves the stress transmission performance, makes the stress transmission more uniform, and avoids the breakage of the electromagnetic shielding film.

The utility model discloses a high-efficiency air-cooled radiator, which is provided with a radiating plate and a plurality of fins arranged at the bottom of the radiating plate, the plurality of fins are distributed in parallel along the length direction of the radiating plate to form a radiating fin group, and a fan is arranged at the bottom of the radiating plate along the direction of the fins; air guide windows are formed in the heat dissipation plate in a penetrating mode and distributed between the draught fan and the fins, and beveled corners are arranged on the sides, facing the heating devices, of the tops of the air guide windows. Air flow generated by the fan passes through the air guide window and then forms turbulent flow to be blown to the heating device. According to the utility model, the air guide window is arranged on the heat dissipation plate, air flow can be directly blown to a heating device from the air guide window, secondary heat conduction of the heat dissipation plate is reduced, the air flow is in a turbulent flow shape, air molecules move irregularly, and heat exchange is sufficient, so that heat exchange is greatly enhanced, rapid heat transfer can be better realized, and the service life of the heat dissipation plate is prolonged. Therefore, the heat dissipation effect is improved.

The invention relates to the technical field of flexible circuit board manufacturing and packaging, in particular to an FPC assembly injection molding packaging structure and method based on dynamic mold flow control, and the structure comprises an FPC assembly, a first injection molding layer wrapping a welding spot area of the FPC assembly, and a second injection molding layer wrapping the first injection molding layer and the FPC assembly. The second injection molding layer is provided with an anchoring column penetrating through the reserved channel of the first injection molding layer or the through hole of the FPC assembly, and the anchoring column and the FPC assembly or the first injection molding layer form a mechanical interlocking structure. According to the FPC assembly injection molding packaging structure and method based on dynamic mold flow control, the electronic equipment and the storage medium, through a sandwich structure and in-situ mechanical interlocking design, the process control of a non-Newtonian fluid shear model and an unsteady state heat conduction equation is combined; the technical problems that in the prior art, procedures are tedious, stress concentration is caused by CTE mismatching, and welding spots are prone to being damaged in the injection molding process are solved.

To provide a compact voice-activated electronic device with speakers, electronic components and a dual-purpose waveguide / heatsink structure that directs sound from the speakers to an outside of the device and to dissipate heat from the electronic components to the outside of the device.SOLUTION: A compact voice-activated electronic device 404 comprises: a speaker assembly 436; a bottom housing 408 on which the speaker assembly is mounted; an upper housing 406 serving as a speaker grill; a printed circuit board 432 on which electronic components are mounted; and an acoustic waveguide / heatsink 434 configured to direct sound from the speaker assembly to an outside of the voice-activated electronic device and to dissipate heat generated in the electronic components to the outside of the device.SELECTED DRAWING: Figure 4E

The invention discloses a method for manufacturing a flexible circuit board with a high-precision induction circuit, and the method comprises the steps: taking a flexible copper-clad plate to manufacture a first coil circuit pattern and a bonding pad pattern, and carrying out the AOI detection, and forming a first flexible core board; windowing the first cover film corresponding to the bonding pad pattern, and attaching the first cover film to the first flexible core plate to form an attached plate; a single-face copper-clad plate is taken to manufacture a second coil circuit pattern, and a second flexible core plate is formed; the first coil circuit pattern corresponds to the second coil circuit pattern; manufacturing an adhesive layer for a second flexible core plate, and attaching the second flexible core plate to the attaching plate to form a flexible back attaching plate; carrying out induction circuit testing and post-process processing to form a flexible circuit board; aOI detection and a four-wire circuit testing machine are combined to form dual detection, so that the comprehensiveness and the accuracy of detection are improved; the glue layer is arranged to bond the second flexible core plate and the attaching plate, a physical supporting effect is provided for the detection process, and a processing basis is provided for subsequent depth-controlled laser cutting board splitting structure operation.

The invention discloses an efficient heat dissipation system of a new energy automobile circuit board, and the system comprises a composite heat dissipation substrate which is formed by compounding a ceramic substrate layer, a graphene heat conduction layer and a copper alloy supporting layer through vacuum hot pressing, and the surface of the graphene heat conduction layer is provided with a micron-sized groove array; the dynamic heat dissipation assembly comprises a thermoelectric refrigeration module and a temperature sensor which are embedded in the composite heat dissipation substrate, the thermoelectric refrigeration module is linked with the temperature sensor through a PID controller, and active refrigeration based on temperature rise of the circuit board is achieved; the multi-layer heat dissipation channel comprises a micro-channel and a bionic fin structure, the micro-channel vertically penetrates through the composite heat dissipation substrate, the bionic fin structure covers the surface of the substrate, and the micro-channel is filled with a phase change material and is communicated with an external liquid cooling circulation system; the airflow adjusting module comprises a rotatable flow guide plate and a piezoelectric fan array, the flow guide plate dynamically adjusts the heat dissipation airflow direction according to the vehicle speed, and the frequency response range of piezoelectric fans is larger than or equal to 100 Hz.

The invention discloses a manufacturing method for enhancing heat dissipation by electroplating a groove body and plugging a copper block for a PCB (Printed Circuit Board), which comprises the following steps of: manufacturing target holes: after a multi-layer board is formed through browning and pressing, designing alignment target holes of the multi-layer board among patterns of a board body through punching equipment; a drilling step: drilling pattern holes of the board body by using drilling equipment to form conduction among layers, and drilling four conduction holes in a copper block groove; a groove milling step: performing groove milling on the copper block groove after positioning by using the target hole through a numerical control milling machine; a copper deposition and electroplating step: performing copper deposition in the copper block groove and the via hole, and performing thick copper plating in the copper block groove and the via hole through primary copper electroplating; hole plugging: plugging a copper block into a copper block groove matched with the copper block, and plugging copper paste into a gap between the copper block groove and the copper block; and a high-temperature baking step: baking and curing the copper paste and the copper block at a high temperature. The problems that in the prior art, the heat dissipation function of a PCB cannot be maximized, and a board with the high heat dissipation requirement cannot be met are solved.

The invention relates to the technical field of protection circuits, in particular to a voltage threshold dynamic detection earth leakage protection circuit and a circuit protection board. According to the technical scheme, the device comprises a differential current detection module which is used for collecting current difference signals of a live wire and a zero wire in real time; the dynamic threshold adjusting module is connected with the environment sensor and the processing module, and dynamically sets an electric leakage judgment threshold based on environment parameters and load current spectrum analysis; the time division multiplexing programmable analog front end is used for sequentially executing signal amplification, filtering and analog-to-digital conversion functions through time sequence control; the solid-state electronic switch breaking module responds to the electric leakage signal output by the processing module and realizes circuit breaking; and the self-checking and fault-tolerant module periodically generates analog leakage signals to verify the functional integrity of the system. The method adapts to environmental load change through dynamic threshold adjustment, improves signal processing efficiency through time division multiplexing, guarantees reliability of the system through self-checking fault tolerance, and realizes accurate and rapid leakage protection.

To provide a packaging substrate enabling easy detection of defects that may occur in a glass substrate, and a manufacturing method thereof.SOLUTION: A packaging substrate 20 includes a glass substrate 21 having an edge region and containing a first surface and a second surface facing each other, and an upper layer 70 laminated on the first surface or a lower layer 80 laminated under the second surface. The edge region of the glass substrate includes an edge of the glass substrate and a region of the glass substrate which protrudes beyond the upper layer or the lower layer. A manufacturing method of the packaging substrate includes a step of preparing the glass substrate and forming the upper layer on the first surface, a step of removing a part of the upper layer along a cutting line which is a cutting-planned position, thereby forming a removal line, a filamentation forming step of forming a filamentation in the glass substrate along the removal line, and a step of cutting the glass substrate using the filamentation.SELECTED DRAWING: Figure 9

The invention provides a circuit board and a preparation method thereof and a backlight module, the circuit board comprises a circuit substrate and a reflection structure layer located on at least one surface of the circuit substrate, the reflection structure layer covers at least part of a circuit layer of the circuit substrate, and the reflection structure layer comprises a reflection layer and a transparent photosensitive layer which are sequentially stacked on the surface of the circuit substrate. The transparent photosensitive layer covers the outer surface of the reflecting layer. According to the circuit board provided by the invention, the surface of the reflecting layer is coated with the transparent photosensitive layer, so that the thickness and flatness of the reflecting structure layer can be improved, the light loss is reduced, the reflectivity and uniformity are improved, the lateral erosion size of the bottom of the reflecting layer is reduced, and the risk that the reflecting layer falls off is reduced.

The invention discloses a piezoelectric air cooling device based on a piezoelectric film PZT technology, and relates to the technical field of MEMS. The device adopts a two-layer packaging structure of a piezoelectric cantilever beam MEMS chip and a PCB (Printed Circuit Board) with a vent hole. A cantilever beam of the MEMS chip is integrated with an SOI top silicon layer and an ultrathin PZT driving stack, low rigidity and high driving force are achieved, and the surface of the cantilever beam is covered with a PDMS flexible sealing layer to achieve dynamic sealing. When the device works, the cantilever beam is driven to resonate in an ultrasonic frequency band, and efficient synthetic jet is generated at the vent hole by periodically changing the volume of the pump cavity. The technical bottleneck that miniaturization and high performance are difficult to consider at the same time is broken through, and the device has the advantages of being compact in structure, mute and efficient and is suitable for precise heat dissipation of miniature electronic equipment.

The present invention relates to an antenna device and an electronic device using same, the antenna device having twice as many antennas arranged in the same area so as to be reduced in size by half and be capable of performing high power long-distance transmission. The antenna device according to the present invention comprises: a core printed circuit board having antenna circuits arranged therein; a Yagi-Uda antenna formed on a plurality of printed circuit boards arranged above the core printed circuit board, so as to transmit a single polarization signal; a monopole antenna connected to the Yagi-Uda antenna through a via; and a ground radiation unit arranged below the core printed circuit board so as to be symmetrical to the monopole antenna with respect to the core printed circuit board.

The utility model provides an electrical connection structure of one or more sections of intelligent dimming films. The electrical connection structure specifically comprises a dimming film body, a flexible circuit board and a control unit. Wherein U-shaped long grooves are designed between independent circuits of the flexible circuit board, and air holes are formed in the conductive adhesive film layer connecting the dimming film body and the flexible circuit board. According to the design of the electrical conduction structure part of the dimming film, the ACF conductive adhesive lamination is used for replacing the solder paste welding technology, the risk of circuit pseudo soldering is avoided, special design is carried out on the FPC and the ACF conductive adhesive, the operation stability of the dimming film is improved, and the risks of short circuit and open circuit which are easily generated by circuit connection are avoided.

The invention discloses a board card level thermoelectric collaborative management and control system, and relates to the technical field of board card level thermoelectric management and control, and the system comprises a heat flow dynamic mapping model construction module, a self-adaptive fluid disturbance injection module, a phase conjugate flow velocity compensation control module, a Hamiltonian variation heat diffusion regulation and control module, and a multi-layer coupling cooling path reconstruction module. And the heat flow dynamic mapping model construction module is used for constructing a heat flow density dynamic mapping model based on space-time multi-field coupling, and carrying out multi-physical field joint solution by taking the temperature gradient, the power distribution and the flow velocity vector of the cooling medium collected in real time in the board card as input parameters. Through multi-field coupling heat flow dynamic mapping and self-adaptive fluid regulation and control, cooling flow and the heat conduction direction are synchronized, local heat resistance is reduced, and heat stability is improved; through Hamiltonian variation control and multi-layer cooling path reconstruction, heat flux unidirectional diffusion and energy self-balance are realized, and the heat dissipation efficiency and operation reliability of the board card are significantly improved.

The invention discloses a controller based on patch silicon carbide power tubes, a control circuit board and a control method. The controller comprises a plurality of patch silicon carbide power tubes, the control circuit board, an insulation pad and a shell. A pin of each patch silicon carbide power tube in the plurality of patch silicon carbide power tubes is welded on the control circuit board by adopting over-reflow soldering, and a welding point arranged on a heat dissipation surface of each patch silicon carbide power tube is welded with the control circuit board; one end of the insulating pad is attached to the bottom in the shell, and the other end of the insulating pad is coated with heat-conducting silicone grease; the control circuit board is arranged in the shell, and the heat dissipation face of each patch silicon carbide power tube abuts against the end, coated with the heat conduction silicone grease, of the insulation pad. The SMD silicon carbide power tube is adopted, so that the installation process of the controller becomes simple, the installation cost is low, and the temperature of the wafer of the SMD silicon carbide power tube can be monitored more accurately.

The invention provides a display module and a display device, and the display module comprises a flexible circuit board which is provided with a connection area; the display panel is located on one side of the flexible circuit board and comprises a binding area and a display area, the orthographic projection of the display panel on the flexible circuit board is located in the connecting area, and the orthographic projection of the flexible circuit board on the display panel is located in the binding area; the binding pad is located in the binding area, and the binding pad is located on the side, close to the flexible circuit board, of the display panel; the isolation structure is located on one side, away from the display area, of the binding pad; in the thickness direction of the display panel, the two ends of the isolation structure abut against the display panel and the flexible circuit board respectively. The circuit connecting material is arranged between the binding bonding pad and the flexible circuit board and located on the side, close to the display area, of the isolation structure. The isolation structure used for preventing the circuit connecting material from overflowing is arranged in the binding area of the flexible circuit board and the display panel, so that the situation that the binding area is corroded due to the fact that holes are formed in the back adhesive at the overflowing position due to overflowing is prevented.

A fan assembly includes a base with multiple layers with at least one layer formed from a relatively lightweight material to reduce the overall weight of the fan assembly. The base may include multiple metal layers and one or more core layers positioned between the metal layers. At least one of the core layers may include a PCB used to route electrical signals between components of the fan assembly and / or between components of an electronic device in which the fan assembly is positioned. Alternatively, at least one of the core layers may include a lightweight material (e.g., plastic) with a channel used to receive a flexible circuit. The base, having layers of different materials, may be lighter in weight as compared to a base consisting of a metal layer (or metal layers), while also substantially retaining flexural stiffness to counter against applied forces to the base.