5818results about "Printed circuit details" patented technology

Embodiment relate to a structure for supporting a bending portion of a flexible display panel in an unfolded state so that the bending portion does not flex when pressed. The structure also enables the bending portion of the flexible display panel to bend at a predetermined curvature in a folded state. The structure includes two rotating plates rotating about two axes that slide relative to flexible supporting members extending from portions of the flexible display panel that do not bend as the flexible display panel is bent. As the flexible display panel is bent, the distance between ends of the rotating plates are increased so that the bending portion of the flexible display panel would have an increased radius of curvature.

The present invention relates to a system for retrieving data from remote difficult to reach terrain, such as wilderness areas, etc. and in particular to a system comprised of one or more surface based data collectors in communication with one or more wireless transceivers adapted to transmit the collected data to an unmanned aerial vehicle adapted to fly within a predetermined distance from the data collector and receive data collected therefrom. The present invention further relates to an unmanned aerial vehicle adapted to fly a flight pattern relative to a moveable surface object or for controlling the position of a moveable surface object relative to the flight path of the unmanned aerial vehicle. Finally, the present invention relates to an improved unmanned aerial vehicle having airframe structural elements with electrical circuits adhered to the surfaces of the structural elements.

An interconnect apparatus for providing a communication path for data signals in a predetermined frequency band, that includes a first and a second sections of a transmission line, connected at one end to first and second data transceiving devices, respectively. A switch, such as a mechanical, electro-mechanical, electronic, electro-magnetic and electro-optical switch, having conductive / non-conductive states, is provided for connecting / disconnecting between the other ends of the first and the second sections, for providing a data communication path between the data transceiving devices while being in its conductive state a third and a fourth sections of a transmission line, each of which connected at one end to a contact of the switch and at the other end to a first and a second connector, respectively. A compensation circuitry is provided for compensating, within the frequency band, parasitic effects caused by the switch and / or cord, while the switch is in its conductive state or, while the switch is in its non-conductive state and while a connection between the first and the second connectors is provided by a cord having predetermined characteristics, such that the compensation circuitry compensates the influence of parasitic effects introduced along the communication path by the switch while being in its non-conductive state and while the cord is a part of the communication path or, by the combination of the third and a fourth sections and the connectors while the switch is in its conductive state.

Method and apparatus are provided for thermally coupling one or more electronic devices to a heatsink. The apparatus comprises a heatsink having a substantially planar upper surface, a wiring board (PWB) with a through-hole for receiving the device such that a principal face thereof is in thermal contact with the heatsink, its electrical leads are captured between at least a portion of the wiring board and the heatsink, and a top of the device protrudes through the PWB. The method comprises placing the device in the through-hole with its base exposed on and protruding from the underside of the PWB, attaching its electrical leads to contacts on the wiring board and pressing the PWB toward the heatsink with the leads captured there between. An electrically insulating thermally conducting layer is desirably placed between the wiring board and the heatsink.

A multi-layer device comprising a first substrate and a first electrically conductive layer on a surface thereof, the first electrically conductive layer having a sheet resistance to the flow of electrical current through the first electrically conductive layer that varies as a function of position.

Method and apparatus are provided for thermally coupling one or more electronic devices to a heatsink. The apparatus comprises a heatsink having a substantially planar upper surface, a wiring board (PWB) with a through-hole for receiving the device such that a principal face thereof is in thermal contact with the heatsink, its electrical leads are captured between at least a portion of the wiring board and the heatsink, and a top of the device protrudes through the PWB. The method comprises placing the device in the through-hole with its base exposed on and protruding from the underside of the PWB, attaching its electrical leads to contacts on the wiring board and pressing the PWB toward the heatsink with the leads captured there between. An electrically insulating thermally conducting layer is desirably placed between the wiring board and the heatsink.

Discussed is a flexible display device with a reduced bezel width. The flexible display device according to an embodiment includes a display panel configured to display images, and including a flexible first substrate having a plurality of pixels disposed therein and a second substrate coupled to the flexible first substrate, the flexible first substrate including a display area, a bent part extending from the display area, and a pad part extending from the bent part; a panel driver connected to the pad part, and configured to supply signals to the respective pixels; and a supporting member configured to support the flexible first substrate, and including a bent part for guiding the bent part of the first substrate.

A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively connected, as by forming solder bridges, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses. The individual units desirably are thin and directly abut one another so as to provide a low-height assembly with good heat transfer from chips within the stack.

Glass interposer panels and methods for forming the same are described herein. The interposer panels include a glass substrate core formed from an ion-exchangeable glass. A first layer of compressive stress may extend from a first surface of the glass substrate into the thickness T of the glass substrate core to a first depth of layer D1. A second layer of compressive stress may be spaced apart from the first layer of compressive stress and extending from a second surface of the glass substrate core into the thickness T of the glass substrate core to a second depth of layer D2. A plurality of through-vias may extend through the thickness T of the glass substrate core. Each through-via is surrounded by an intermediate zone of compressive stress that extends from the first layer of compressive stress to the second layer of compressive stress adjacent to a sidewall of each through-via.

A radio frequency IC device includes a radio frequency IC chip, a feeder circuit substrate, and a radiating plate. The feeder circuit substrate includes a feeder circuit that electrically connects to the radio IC chip and that includes a resonance circuit and / or a matching circuit including inductance elements. The feeder circuit substrate is bonded to the radiating plate, which radiates a transmission signal supplied from the feeder circuit and supplies a received signal to the feeder circuit. The inductance elements are arranged in spiral patterns wound in opposite directions and couple to each other in opposite phases. The radio frequency IC device is able to obtain a radio frequency IC device that is not susceptible to being affected by a usage environment, minimizes variations in radiation characteristics, and can be used in a wide frequency band.

An electrical power system that can be used to interconnect a plurality of generators to a plurality to loads while being rated at less than a total power consumed. The system is preferably used to distribute power for a Liquefied Natural Gas (LNG) facility. The system broadly comprises a primary bus connected between the generators and the loads, such as electrical compressor motors used in the LNG facility. The generators and the loads are arranged along the primary bus in order to distribute the power from the generators to the loads, without overloading the primary bus.

The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided LCP, where both the high and low temperature LCP are provided with a z-axis connection. The single sided conductive layer is a bus layer to form z-axis conductive stud within the high and low temperature LCP. High and low temperature LCP layers are etched or built up to form circuit patterns and subsequently bonded together to form final multilayer circuit pattern where the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond.

A vehicular control device includes a trim member having a plurality of graphics for identifying a plurality of manual activation regions and a printed circuit board having a plurality of proximity sensors. Each of the plurality of proximity sensors generates a respective electromagnetic field within a respective manual activation region and is responsive to an object disposed in the respective manual activation region. The printed circuit board is semi-translucent and includes a plurality of illumination elements for illuminating light away from the printed circuit board. A back cover member is adaptable to the trim member for encasing the printed circuit board therebetween. A sealing member is disposed between the trim member and the back cover member. The illuminating light from the plurality of illumination elements is reflected toward the printed circuit board. The printed circuit board receives the illuminating light and diffuses the illuminating light therethrough for backlighting the plurality of graphics.

A mirror assembly includes a housing, an angularly adjustable power pack, wires for supplying power and mirror angle control, an electrochromic mirror subassembly including a heater, and a turn signal device. The components include individual connectors that plug into a multi-prong connector on the bundle of wires, or that piggyback into each other. Optionally, the heater incorporates an internal wire with end connectors for communicating power to opposite sides of the heater, and also includes layers of light-transmitting / diffusing material for diffusing light passing from the turn signal device through the diffusing material. A printed circuit board fits into a pocket in the panel-shaped carrier, and an integral retainer releasably secures the printed circuit board. The power pack is attached to the carrier via a ring of resilient fingers, and a continuous hoop flange prevents distortion of the carrier and in turn of the glass elements in the mirror subassembly.

A flexible display device including a flexible display panel including a folding area and a peripheral area, and a first outer member including a groove pattern is disclosed. The groove pattern includes a flat surface and inclined portions connected to the flat surface and symmetrical with each other about the flat surface.

An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.

To provide a technology, which enable carrying out an optical position alignment precisely and easily in apparatus and the like used in optical communication, a method of manufacturing an optical module includes forming a guide pin in either a transparent substrate or an optical transmission line support member; forming a guide hole, in which the guide pin is to be inserted, to the other one of the transparent substrate and the optical transmission line support member such that the diameter of the guide hole is made larger as compared with the diameter of the hole; arranging a jig having a protruding portion, of which diameter is substantially the same as the diameter of the guide pin, over the transparent substrate such that the protruding portion is being inserted into the guide hole; filling the gap between the protruding portion and the guide hole with a filler material, which is cured by carrying out a predetermined processing; adjusting a position of the jig; curing the filler material, which is filled in the gap between the protruding portion and the guide pin; and pulling out the protruding portion from the guide hole.

The invention is a magnetic transducer with separated read and write heads for perpendicular recording. The write head has a trailing shield that extends from the return pole piece toward the main pole piece to form the write gap at the air-bearing surface. One embodiment of the trailing shield is a two part structure with a pedestal and a much smaller tip that confronts the main pole piece at the gap. In one embodiment a sink of non-magnetic, electrically conductive material is disposed in the separation gap between the read head and the flux bearing pole piece. The sink is preferably made of copper and does not extend to the ABS.

An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.

The present invention relates to RJ45 modular inserts that are connected to a printed circuit board used to transfer high speed signals for telecommunication interface media connections. The printed circuit board is configured to reduce near-end cross-talk (“NEXT”) without compromising impedance. NEXT is substantially reduced by utilizing a low reactance dielectric insert with a two-stage combination positive and negative compensation removal technique. By utilizing this method, the pair-to-pair NEXT is substantially reduced and differential pair impedance are controlled in a simple and cost effective manner.

Disclosed herein are embodiments of LED-based lights for use in fluorescent fixtures that emanate light in a plurality of directions. One embodiment disclosed herein of an LED light for use in a fluorescent light fixture comprises a housing and a circuit board having a first surface configured to face an illumination area, the circuit board mounted in the housing and defining a plane conceptually dividing the housing into a first portion and a second portion. At least one LED is mounted on the first surface of the circuit board and is configured to emanate light in a first direction. Light distribution means is configured to distribute a portion of the light emanated in the first direction to at least a second direction different than the first direction.

The present invention comprises methods for making three-dimensional (3-D) liquid crystalline polymer (LCP) interconnect structures using a high temperature singe sided liquid crystalline polymer, and low temperature single sided liquid crystalline polymer, whereas both the high temperature LCP and the low temperature LCP are drilled using a laser or mechanical drill or mechanically punch to form a z-axis connection. The single sided Conductive layer is used as a bus layer to form z axis conductive stud conductive stud within the high temperature and low temperature LCP, followed by deposition of a metallic capping layer of the stud that serves as the bonding metal between the conductive interconnects to form the z-axis electrical connection. High temperature and low temperature LCP circuit layers are etched or built up to form circuit patterns and subsequently bonded together to form final 3-D multilayer circuit pattern whereas the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond, whereas, metal to metal bonding occurs with high temperature metal capping layer bonding to conductive metal layer. The resultant structure is then packaged using two metallized organic cores that are laminated onto either side of the device using a low temperature adhesive with similar electrical properties and subsequently metallized to form the input output terminals and EM shielding.

A vehicular control device includes a trim member having a plurality of graphics for identifying a plurality of manual activation regions and a printed circuit board having a plurality of proximity sensors. Each of the plurality of proximity sensors generates a respective electromagnetic field within a respective manual activation region and is responsive to an object disposed in the respective manual activation region. The printed circuit board is semi-translucent and includes a plurality of illumination elements for illuminating light away from the printed circuit board. A back cover member is adaptable to the trim member for encasing the printed circuit board therebetween. A sealing member is disposed between the trim member and the back cover member. The illuminating light from the plurality of illumination elements is reflected toward the printed circuit board. The printed circuit board receives the illuminating light and diffuses the illuminating light therethrough for backlighting the plurality of graphics.

A foldable display device includes a flexible display panel including a bendable area and flat areas on both sides of the bendable area, and a lower case housing the flexible display panel and including a hinge corresponding to the bendable area and including a first rotation point connected to a first link having a first radius of rotation and a second rotation point connected to a second link having a second radius of rotation, the second radius of rotation being different from the first radius of rotation, and supports on both sides of the hinge and corresponding to the flat areas, wherein the first link has an end connected to the first rotation point and a first guide opening connected to each of the supports, and the second link has a first end connected to the second rotation point and a second end engaging the first guide opening.

The invention is a magnetic transducer with separated read and write heads for perpendicular recording. The write head has a trailing shield that extends from the return pole piece toward the main pole piece to form the write gap at the air-bearing surface. One embodiment of the trailing shield is a two part structure with a pedestal and a much smaller tip that confronts the main pole piece at the gap. In one embodiment a sink of non-magnetic, electrically conductive material is disposed in the separation gap between the read head and the flux bearing pole piece. The sink is preferably made of copper and does not extend to the ABS.

Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.

To provide a configuration including a first sheet substrate, on which a first thin film electronic component is formed on at least one main face, and an external connection terminal for connecting to an external circuit is formed one main face or the other face; a second sheet substrate, on which a second thin film electronic component is formed on at least one face; an insulator connection resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component; and an interlayer connection conductor for electrically connecting electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component.

An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing the display with bent edge portions having neutral plane adjustment features that facilitate bending of the bent edge portions while minimizing damage to the bent edge portions. The neutral plane adjustment features may include a modified backfilm layer of the display in which portions of the backfilm layer are removed in a bend region. A display device may include a substrate, a display panel on the substrate having display pixels, and peripheral circuitry proximate the display panel and configured to drive the display pixels. A portion of the periphery of the substrate may be bent substantially orthogonal to the display panel to reduce an apparent surface area of the display device. The bent portion may include an electrode for communication with the peripheral circuitry.