2571results about "Printed circuit details" patented technology

Embodiment relate to a structure for supporting a bending portion of a flexible display panel in an unfolded state so that the bending portion does not flex when pressed. The structure also enables the bending portion of the flexible display panel to bend at a predetermined curvature in a folded state. The structure includes two rotating plates rotating about two axes that slide relative to flexible supporting members extending from portions of the flexible display panel that do not bend as the flexible display panel is bent. As the flexible display panel is bent, the distance between ends of the rotating plates are increased so that the bending portion of the flexible display panel would have an increased radius of curvature.

The present invention relates to a system for retrieving data from remote difficult to reach terrain, such as wilderness areas, etc. and in particular to a system comprised of one or more surface based data collectors in communication with one or more wireless transceivers adapted to transmit the collected data to an unmanned aerial vehicle adapted to fly within a predetermined distance from the data collector and receive data collected therefrom. The present invention further relates to an unmanned aerial vehicle adapted to fly a flight pattern relative to a moveable surface object or for controlling the position of a moveable surface object relative to the flight path of the unmanned aerial vehicle. Finally, the present invention relates to an improved unmanned aerial vehicle having airframe structural elements with electrical circuits adhered to the surfaces of the structural elements.

Method and apparatus are provided for thermally coupling one or more electronic devices to a heatsink. The apparatus comprises a heatsink having a substantially planar upper surface, a wiring board (PWB) with a through-hole for receiving the device such that a principal face thereof is in thermal contact with the heatsink, its electrical leads are captured between at least a portion of the wiring board and the heatsink, and a top of the device protrudes through the PWB. The method comprises placing the device in the through-hole with its base exposed on and protruding from the underside of the PWB, attaching its electrical leads to contacts on the wiring board and pressing the PWB toward the heatsink with the leads captured there between. An electrically insulating thermally conducting layer is desirably placed between the wiring board and the heatsink.

Discussed is a flexible display device with a reduced bezel width. The flexible display device according to an embodiment includes a display panel configured to display images, and including a flexible first substrate having a plurality of pixels disposed therein and a second substrate coupled to the flexible first substrate, the flexible first substrate including a display area, a bent part extending from the display area, and a pad part extending from the bent part; a panel driver connected to the pad part, and configured to supply signals to the respective pixels; and a supporting member configured to support the flexible first substrate, and including a bent part for guiding the bent part of the first substrate.

A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that the light-sensitive side is optically accessible through the window. A second chip can be bonded to the backside of the first chip, with the second chip being wirebonded to the second level of the bi-level package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed.

A vehicular control device includes a trim member having a plurality of graphics for identifying a plurality of manual activation regions and a printed circuit board having a plurality of proximity sensors. Each of the plurality of proximity sensors generates a respective electromagnetic field within a respective manual activation region and is responsive to an object disposed in the respective manual activation region. The printed circuit board is semi-translucent and includes a plurality of illumination elements for illuminating light away from the printed circuit board. A back cover member is adaptable to the trim member for encasing the printed circuit board therebetween. A sealing member is disposed between the trim member and the back cover member. The illuminating light from the plurality of illumination elements is reflected toward the printed circuit board. The printed circuit board receives the illuminating light and diffuses the illuminating light therethrough for backlighting the plurality of graphics.

A flexible display device including a flexible display panel including a folding area and a peripheral area, and a first outer member including a groove pattern is disclosed. The groove pattern includes a flat surface and inclined portions connected to the flat surface and symmetrical with each other about the flat surface.

An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.

The present invention relates to RJ45 modular inserts that are connected to a printed circuit board used to transfer high speed signals for telecommunication interface media connections. The printed circuit board is configured to reduce near-end cross-talk (“NEXT”) without compromising impedance. NEXT is substantially reduced by utilizing a low reactance dielectric insert with a two-stage combination positive and negative compensation removal technique. By utilizing this method, the pair-to-pair NEXT is substantially reduced and differential pair impedance are controlled in a simple and cost effective manner.

The present invention comprises methods for making three-dimensional (3-D) liquid crystalline polymer (LCP) interconnect structures using a high temperature singe sided liquid crystalline polymer, and low temperature single sided liquid crystalline polymer, whereas both the high temperature LCP and the low temperature LCP are drilled using a laser or mechanical drill or mechanically punch to form a z-axis connection. The single sided Conductive layer is used as a bus layer to form z axis conductive stud conductive stud within the high temperature and low temperature LCP, followed by deposition of a metallic capping layer of the stud that serves as the bonding metal between the conductive interconnects to form the z-axis electrical connection. High temperature and low temperature LCP circuit layers are etched or built up to form circuit patterns and subsequently bonded together to form final 3-D multilayer circuit pattern whereas the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond, whereas, metal to metal bonding occurs with high temperature metal capping layer bonding to conductive metal layer. The resultant structure is then packaged using two metallized organic cores that are laminated onto either side of the device using a low temperature adhesive with similar electrical properties and subsequently metallized to form the input output terminals and EM shielding.

A foldable display device includes a flexible display panel including a bendable area and flat areas on both sides of the bendable area, and a lower case housing the flexible display panel and including a hinge corresponding to the bendable area and including a first rotation point connected to a first link having a first radius of rotation and a second rotation point connected to a second link having a second radius of rotation, the second radius of rotation being different from the first radius of rotation, and supports on both sides of the hinge and corresponding to the flat areas, wherein the first link has an end connected to the first rotation point and a first guide opening connected to each of the supports, and the second link has a first end connected to the second rotation point and a second end engaging the first guide opening.

The invention is a magnetic transducer with separated read and write heads for perpendicular recording. The write head has a trailing shield that extends from the return pole piece toward the main pole piece to form the write gap at the air-bearing surface. One embodiment of the trailing shield is a two part structure with a pedestal and a much smaller tip that confronts the main pole piece at the gap. In one embodiment a sink of non-magnetic, electrically conductive material is disposed in the separation gap between the read head and the flux bearing pole piece. The sink is preferably made of copper and does not extend to the ABS.

To provide a configuration including a first sheet substrate, on which a first thin film electronic component is formed on at least one main face, and an external connection terminal for connecting to an external circuit is formed one main face or the other face; a second sheet substrate, on which a second thin film electronic component is formed on at least one face; an insulator connection resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component; and an interlayer connection conductor for electrically connecting electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component.

An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing the display with bent edge portions having neutral plane adjustment features that facilitate bending of the bent edge portions while minimizing damage to the bent edge portions. The neutral plane adjustment features may include a modified backfilm layer of the display in which portions of the backfilm layer are removed in a bend region. A display device may include a substrate, a display panel on the substrate having display pixels, and peripheral circuitry proximate the display panel and configured to drive the display pixels. A portion of the periphery of the substrate may be bent substantially orthogonal to the display panel to reduce an apparent surface area of the display device. The bent portion may include an electrode for communication with the peripheral circuitry.

A display device includes a display panel that can be switched to a plane state or a bent state, and the curvature of the display panel can be easily controlled. The display device includes a display panel configured to display an image and a bend control unit located in the rear of the display panel. The bend control unit bends the display panel toward the front of the display panel by pressurizing two regions on the display panel located on different sides based on the center of the display panel.

The application generally relates to reflective display apparatus having a flexible display panel and driver electronics to drive the flexible display panel and methods of forming a flexible display unit for a reflective display apparatus having a flexible display panel and driver electronics to drive the flexible display panel, and more particularly to tiled displays comprising reflective, e.g., electrophoretic, display medium. One embodiment is a reflective display apparatus having a flexible display panel and driver electronics to drive the flexible display panel, the flexible display panel comprising at least first and second flexible display units, the driver electronics configured to drive said flexible display units to display respective image regions, wherein said first and second said flexible display units are adjacent and each comprise: a display layer comprising display medium; and a control layer having a backplane and a substrate to support the backplane, the backplane to control said display layer to display an image region, wherein: the driver electronics comprises a first drive electronics unit to control the backplane of said first display unit and a second drive electronics unit to control the backplane of said second display unit, said first drive electronics unit disposed on said first display unit and said second drive electronics unit disposed on said second display unit, a said drive electronics unit is mounted behind a said substrate of a said adjacent display unit to thereby substantially hide the said drive electronics unit from a user viewing a said image region displayed on the said adjacent display unit, wherein the display layer of the said adjacent display unit is in front of the said substrate, the said drive electronics unit attached to a said adjacent display unit.

A insulation displacement connector (IDC) patch panel includes a circuit (PC) board with interdigitated capacitance for balancing out inherent capacitance found within IDCs of the panel. Unwanted cross-talk signals are reduced as a consequence.

A printed circuit assembly, along with a server and method incorporating such printed circuit assembly, are disclosed for determining a storage configuration for use in a computer system via a simple hardware change. The printed circuit assembly may comprise a paddle board slot for connection to a paddle board for determining a storage configuration; a bus coupled to the paddle board; and a southbridge coupled to the bus, the southbridge comprising signal lines coupled to the paddle board slot through the bus. The storage configuration of the printed circuit assembly may be determined via the paddle board when the paddle board is connected to the paddle board slot.

Provided is a portable device having such a configuration that a plurality of housings are connected functionally, wherein the thickness of a connection section between the housings is reduced so that the portability is improved. The portable device comprising: a first housing; a first board provided in the first housing; a second housing; a second board provided in the second housing; a connection section for connecting the first housing with the second housing in such a manner that the irrelative position can be changed; and an optical waveguide film having at least one optical waveguide for connecting the first board with the second board through optical wiring.

A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the process of forming a conductive pattern 3 on a surface of the elongate substrate 1 by the semi-additive process using electrolysis plating and then annealing the elongate substrate 1 with the conductive pattern 3 in its wound up state, a stiffener sheet 9 having a width narrower than the elongate substrate 1 is bonded to the back side of the elongate substrate 1. Thereafter, an oxidized film formed on a surface of the conductive pattern 3 is removed and then a solder resist 11 is formed thereon. This prevents the strip of the stiffener sheet 9 from the elongate substrate 1 and in turn prevents etching solution or developing solution from entraining in a gap therebetween.

Disclosed is a substrate for a flexible device which, when a TFT is produced on a flexible substrate in which a metal layer and a polyimide layer are laminated, can suppress deterioration of the electrical performance of the TFT due to the surface irregularities of the metal foil surface and can suppress detachment or cracks of the TFT. Also disclosed is a substrate for a thin film element which has excellent surface smoothness and is capable of suppressing deterioration of the characteristics of thin film elements. Also disclosed are methods for manufacturing substrates for thin film elements.

The invention discloses a flexible circuit board convenient for efficient heat dissipation and mainly used in a high-power LED illumination array, belonging to the semiconductor illumination technical field. The flexible circuit board of an LED illumination array is characterized in that: the circuit board is provided with a flexible substrate, a connection circuit, an insulating film-covered layer, a heat-conducting rubber pad and an LED light source; the connection circuit is arranged on the surface of the flexible substrate; the surfaces of the flexible substrate and the connection circuit are covered with the insulating film-covered layer to form a circuit board module; the LED light source is packaged inside the circuit board module in an array mode; the bottom surface of the flexible substrate is adhered to the surface of the heat-conducting rubber pad. Therefore, the entire flexible circuit board module has certain elasticity and flexibility and can adapt to bending, twisting and crimp deformation of certain strength; moreover, the invention can also be arranged on non-flat surfaces not more than a certain curvature such as a cylindrical surface or a spherical surface. The invention has wider application scope, better heat dissipation performance, less production cost, convenient installation and substantially increased production efficiency.

The distance between a discrete or passive electrical component and an electrical semiconductor device and substrate or carrier is minimized by shortening the lead length connections of the passive component. One or more passive electronic components are mounted within the body of a carrier or board by creating a cavity in the substrate or carrier that is directly below a semiconductor device. The passive component is electrically connected to the substrate and device using solder bump technology resulting in much shorter lead length connections to and from the passive component.

A wiring board (package) includes: a cavity formed at a position corresponding to a chip mounting area of the outermost insulating layer on one side of both surfaces of the wiring board; a pad exposed from the surface of the insulating layer in the cavity; and a pad exposed from the surface of the insulating layer in a peripheral region of the cavity. A chip is flip-chip bonded to the pads in the cavity of the package, and another package is bonded to the pads in the peripheral region of the cavity, to thereby form a semiconductor device having a package on package (POP) structure.

The present disclosure relates to a mobile terminal, and there is provided a mobile terminal including a terminal body having a front surface and a rear surface, a rear input unit comprising a first button portion externally exposed from the rear surface to receive a push input with a first function and a second button portion provided with keys disposed at both sides, respectively, around the first button portion to receive a push input with a second function different from the first function, and a sensor disposed at a lower portion of the first button portion, wherein the second button portion is provided with a through hole accommodating the first button portion to dispose the first button portion between the keys, and the sensor is disposed to overlap with an inner region of the through hole, and at least part thereof is formed to overlap with a first switch for activating the first button portion.

An RF interconnect is incorporated in RF module packages for direct attachment onto a multi-layer PWB using compressible center conductor (fuzz button) interconnects. The module has circuitry operating at microwave frequencies. The module package includes a metal housing including a metal bottom wall structure. The module includes a plurality of RF interconnects, which provide RF interconnection between the package and the PWB. Each interconnect includes a feedthrough center pin protruding through an opening formed in the metal bottom wall, with isolation provided by a dielectric feedthrough insulator. The center pin is surrounded with a ring of shield pins attached to the external surface of the bottom wall of the module housing. The pins are insertable in holes formed in the PWB, and make contact with fuzz button interconnects disposed in the holes. Circuitry connects the fuzz button interconnects to appropriate levels of the PWB for grounding and RF signal conduction.

An electrical connector with improved crosstalk compensation is disclosed. By including at least one coupling with a different frequency dependency than other couplings in the connector, crosstalk compensation performance is improved over a greater frequency range. The different frequency dependency may, for example, be used to compensate for phase shifts caused by distances between compensation circuitry and the plug/jack interface. Embodiments for decreasing these distances are also disclosed.

A high-speed, high-power modular router is disclosed. As opposed to conventional designs using optical backplane signaling and/or bus bars for power distribution, the disclosed embodiments combine high-power, low-noise power distribution with high-speed signal routing in a common backplane. Disclosed backplane features allow backplane signaling at 2.5 Gbps or greater on electrical differential pairs distributed on multiple high-speed signaling layers. Relatively thick power distribution layers are embedded within the backplane, shielded from the high-speed signaling layers by digital ground layers and other shielding features. A router using such a backplane provides a level of performance and economy that is believed to be unattainable by the prior art.

The present invention provides a flexible printed circuit that is less likely to suffer from erosion (corrosion) of electrode terminals even in severe environments and a display device using the flexible printed circuit. According to the present invention, a flexible printed circuit includes a flexible FPC film, FPC interconnections formed of a given pattern on the FPC film, a solder resist covering the FPC interconnections, and FPC terminals provided at ends of the FPC interconnections to make external connection. According to the invention, the FPC terminals include at least one terminal that has an end located inside of an outline of the FPC film.

A foldable display device includes: a display panel having a folded portion bendable along a fold line; and a cover window disposed on the display panel, wherein the cover window includes: at least a soft pattern disposed on the folded portion of the display panel; and a hard coating layer disposed on the display panel having the soft pattern formed thereon, and the soft pattern has a triangular cross section.