2586results about "Printed circuit details" patented technology

The invention discloses a circuit module, an electric control heat dissipation assembly and heating and ventilation equipment, and the circuit module comprises a circuit board and a heat conduction assembly. The circuit board comprises a substrate and at least one first electronic element mounted on the substrate, the substrate comprises a first board and a second board which are oppositely arranged, and the at least one first electronic element is mounted on the first board; the heat conduction assembly is arranged on the second plate surface, the heat conduction assembly is in heat conduction contact with the second plate surface and the at least one first electronic element, and the projection of the at least one first electronic element is within the projection range of the heat conduction assembly when observed in the direction perpendicular to the plate surface. According to the technical scheme, the heat dissipation problem of the circuit module can be effectively solved, and meanwhile cost is reduced.

The invention relates to the technical field of flexible circuit board manufacturing and packaging, in particular to an FPC assembly injection molding packaging structure and method based on dynamic mold flow control, and the structure comprises an FPC assembly, a first injection molding layer wrapping a welding spot area of the FPC assembly, and a second injection molding layer wrapping the first injection molding layer and the FPC assembly. The second injection molding layer is provided with an anchoring column penetrating through the reserved channel of the first injection molding layer or the through hole of the FPC assembly, and the anchoring column and the FPC assembly or the first injection molding layer form a mechanical interlocking structure. According to the FPC assembly injection molding packaging structure and method based on dynamic mold flow control, the electronic equipment and the storage medium, through a sandwich structure and in-situ mechanical interlocking design, the process control of a non-Newtonian fluid shear model and an unsteady state heat conduction equation is combined; the technical problems that in the prior art, procedures are tedious, stress concentration is caused by CTE mismatching, and welding spots are prone to being damaged in the injection molding process are solved.

The invention discloses a piezoelectric air cooling device based on a piezoelectric film PZT technology, and relates to the technical field of MEMS. The device adopts a two-layer packaging structure of a piezoelectric cantilever beam MEMS chip and a PCB (Printed Circuit Board) with a vent hole. A cantilever beam of the MEMS chip is integrated with an SOI top silicon layer and an ultrathin PZT driving stack, low rigidity and high driving force are achieved, and the surface of the cantilever beam is covered with a PDMS flexible sealing layer to achieve dynamic sealing. When the device works, the cantilever beam is driven to resonate in an ultrasonic frequency band, and efficient synthetic jet is generated at the vent hole by periodically changing the volume of the pump cavity. The technical bottleneck that miniaturization and high performance are difficult to consider at the same time is broken through, and the device has the advantages of being compact in structure, mute and efficient and is suitable for precise heat dissipation of miniature electronic equipment.

The invention discloses a board card level thermoelectric collaborative management and control system, and relates to the technical field of board card level thermoelectric management and control, and the system comprises a heat flow dynamic mapping model construction module, a self-adaptive fluid disturbance injection module, a phase conjugate flow velocity compensation control module, a Hamiltonian variation heat diffusion regulation and control module, and a multi-layer coupling cooling path reconstruction module. And the heat flow dynamic mapping model construction module is used for constructing a heat flow density dynamic mapping model based on space-time multi-field coupling, and carrying out multi-physical field joint solution by taking the temperature gradient, the power distribution and the flow velocity vector of the cooling medium collected in real time in the board card as input parameters. Through multi-field coupling heat flow dynamic mapping and self-adaptive fluid regulation and control, cooling flow and the heat conduction direction are synchronized, local heat resistance is reduced, and heat stability is improved; through Hamiltonian variation control and multi-layer cooling path reconstruction, heat flux unidirectional diffusion and energy self-balance are realized, and the heat dissipation efficiency and operation reliability of the board card are significantly improved.

The invention relates to the technical field of manufacturing of electronic components, and discloses an LCM (liquid crystal module) backlight FPC (flexible printed circuit) micro-deformation prevention method, which comprises the following specific steps: S1, implementing large-area copper laying design on an element surface of a flexible printed circuit board, and covering a main area of the element surface with uniformly distributed copper foils to form a continuous conductive layer with consistent thickness, while the conductive layer bears electrical connection of the LED light source, the surface reflection characteristic of the conductive layer is optimized, and the phenomenon of uneven light reflection caused by surface fluctuation is reduced. Through the large-area copper laying design of the element surface and the S-shaped isolation interval layout, thermal stress is effectively guided to be symmetrically distributed in multiple directions and offset each other, plane micro-deformation of the FPC under thermal circulation is remarkably restrained, the deformation quantity is controlled within 50 micrometers, the problems of stress concentration and deformation amplification caused by linear intervals in the prior art are solved, and the reliability of the FPC is improved. And long-term stability and optical performance of the backlight module are ensured.

The utility model discloses a battery pack and a power utilization device, the battery pack has a first direction and a second direction which are intersected, the battery pack comprises a shell, a plurality of electrode assemblies and a switching circuit board, the shell is provided with an accommodating cavity, the plurality of electrode assemblies are arranged along the first direction and arranged in the accommodating cavity, and each electrode assembly comprises a battery cell and a tab which are in conductive connection; tabs of the plurality of electrode assemblies are arranged along a first direction; the switching circuit board comprises a board body and a plurality of first bonding pads arranged at intervals in the first direction, the board body is provided with a plurality of first channels, and the first channels penetrate through the board body in the second direction; the first bonding pad is arranged on one side, far away from the battery cell, of the plate body in the second direction and is connected with the plate body; the plurality of first bonding pads and the plurality of first channels are alternately arranged along a first direction; and at least two adjacent tabs are arranged in one first channel in a penetrating manner and are conductively connected with one first bonding pad. The battery pack structure can be simplified, the integration level is improved, and the short-circuit risk is reduced.

The present application relates to the technical field of display, and discloses a light panel and a display device. The light panel comprises a substrate, a conductive layer, a light-emitting unit, and an electrode connection portion. An electrode pad in the conductive layer is electrically connected to an electrode of the light-emitting unit by means of the electrode connection portion. Furthermore, the electrode pad has a hollow area exposing a portion of the substrate, so that the flattened state of the electrode connection portion can be observed through the hollow area from the back surface of the substrate, thereby detecting the overlapping state between the electrode pad and the electrode. Therefore, prompt detection of a light-emitting unit having a poor connection yield can be facilitated, so that the light-emitting unit can be promptly replaced, thereby improving the yield of the light panel.

Circuitry and method are described for enabling multiple loads on a differential low voltage differential signaling pair (M-LVDS). A printed circuit board (PCB) contains a M-LVDS driver and leads that route a main channel that carries a differential signal from the driver to an area in which loads are populated. The main channel is split into branches that contain application-specific integrated circuits (ASICs) as the loads. The branches have the same characteristic impedance as the main channel. Filters are disposed in each branch and are coupled between the driver and the ASICs. Each filter is a first order or higher filter. Fewer filters than ASICs are on each branch, with the filters being disposed between the driver and ASICs closest to the driver (with smaller propagation delay). The filters are configured differently at each ASIC input to compensate for the delay.

The invention discloses a flexible deep sea pressure sensor, a corresponding fully-integrated temperature-depth sensing system and a temperature compensation algorithm. The invention relates to the technical field of ocean detection sensors, and the structural design of the flexible deep sea pressure sensor constructs a composite structure with high-pressure sensitivity and mechanical flexibility through the collaborative optimization of multiple parameters of LIG (laser-induced graphene) thickness, cross-linking agent proportion of PDMS (polydimethylsiloxane) and packaging thickness. And the contradiction between the sensitivity and the measuring range of the flexible material in the deep sea high-pressure environment is broken through. A fully-integrated temperature-depth sensing system adopting the pressure sensor and a corresponding temperature compensation algorithm also have the same technical effects.

The invention discloses a precise liquid feeding structure control method applied to a single-phase immersion liquid cooling data center box body, which comprises the following steps: step 1, data acquisition and modeling: acquiring parameters by using a sensor, and simulating a cooling liquid flow path and temperature field distribution through thermal analysis; 2, simulation analysis and problem positioning are carried out, the flow velocity, flow distribution and temperature field of cooling liquid under different loads are simulated, and an unsmooth flow area, a hot spot area and a high-energy-consumption node are positioned; 3, hardware deployment and debugging: adjusting the installation position of a mainboard water pump to optimize the initial axial direction of a cooling liquid, simulating different server loads, and comparing test data with a simulation result to perform fine tuning optimization; 4, dynamically controlling the flow, executing multi-mode control logic based on the temperature parameters, and dynamically adjusting the rotating speed of a main board water pump and the rotating speed of a circulating pump; cooling liquid is forced to flow through the mainboard water pump, flow distribution is optimized in combination with the heat-flow coupling model, and forced flowing of the cooling liquid is achieved.

One aspect of the disclosure can provide a printed circuit board (PCB). The PCB may include one or more layers and at least a differential pair including a first transmission line and a second transmission line. The first transmission line may include a plurality of skew-compensation structures, each skew-compensation structure tuned to reduce an impedance mismatch along the differential pair. The first transmission line may be longer than the second transmission line to reduce a mismatch of signal flight times associated with the first and second transmission lines.

The invention relates to a device for protection against an attack on an electronic component (IC) mounted on a printed circuit board (PCB), the protection device (PM) comprising: a multilayer printed circuit board comprising upper and lower layers, the lower layers being machined to form two pillars (S1, S2) of a bridge, the pillars delimiting between each other and with a lower face (LF) of the upper layers a volume configured to house the component, the pillars having a height such that the lower face delimits an empty space with an upper face of the component when the component and the protection device disposed above the component are fixed on the printed circuit board (PCB), and conductive tracks formed in the upper and lower layers and connecting together connection elements of the protection device formed in a lower conductive layer of each of the pillars.Figure 2.

The utility model discloses a circuit board and a display device. The circuit board comprises a base layer and a wiring layer located on one side of the base layer. The wiring layer comprises a plurality of signal lines, the signal lines are arranged in the first direction and extend in the second direction, and the first direction and the second direction intersect; the signal line comprises a wiring part, a transition part and a connecting part which are sequentially arranged along a second direction; the signal lines comprise a first signal line, a second signal line and a third signal line, the first signal line and the second signal line are adjacent, and signals of the first signal line and the second signal line are the same in size and opposite in phase; the first shielding layer is located on the side, away from the base layer, of the wiring layer; the first shielding layer covers the wiring part and part of the transition part, and orthographic projections of the first shielding layer and the connecting part on the base layer are not overlapped; the first edge of the first shielding layer in the area where the transition part is located comprises a straight line section and an arc line section, and the straight line section is at least perpendicular to and crossed with orthographic projections of the first signal line and the second signal line on the base layer; the arc segment intersects with the orthographic projection of at least part of the third signal line on the base layer.

The utility model discloses a circuit board with high voltage resistance, which relates to the field of circuit boards and comprises a bottom frame and a circuit board, a rectangular storage groove is arranged at the top of the inner wall of the bottom frame, the circuit board is positioned in the storage groove on the bottom frame, and a rectangular frame-shaped top cover is arranged above the bottom frame. The bottom of the top cover makes contact with the top of the bottom frame and presses the top of the circuit board, vertical fixing pipes are inserted into the four corners of the storage groove in the bottom frame in a penetrating mode, first through holes are formed in the four corners of the top cover, and the four first through holes in the top cover are connected to the upper half portions of the four fixing pipes in a sleeving mode respectively. The upper half portions of the four fixing pipes are sleeved with nuts abutting against the top of the top cover in a threaded mode, a side plate is arranged at the bottom of one end of the bottom frame, and a plurality of through openings are evenly formed in the side face of the side plate. According to the utility model, when the circuit board is installed, the circuit board can be prevented from being damaged by bolts, the installation of the circuit board can be rapidly completed, and the heat of the circuit board can be effectively dissipated.

The present invention provides a substrate that improves the functionality of the space enclosed by the frame, which includes the element mounting area. [Solution] The substrate comprises a base portion and a frame portion located on the upper surface of the base portion. The base portion has an element mounting area on its upper surface on which elements are mounted. The frame portion has a first inner surface, a second inner surface, and a first corner surface connecting the first inner surface and the second inner surface to each other. The surface roughness of the first corner surface is greater than the surface roughness of at least a portion of the first inner surface.

The present application relates to display device, backlight module and its light source module positioning structure. The light source module positioning structure includes: backplate, the side wall of the backplate is equipped with guide part, the guide part is towards the accommodation space and extends obliquely downward, the front end of the guide part is equipped with positioning convex part; light source module, the side of the flexible circuit board of the light source module is provided with positioning notch, the positioning notch corresponds to the positioning convex part, and the positioning convex part is engaged in the positioning notch and carries out positioning assembly. Therefore, the light source module does not need to stick glue and can be positioned, thereby achieving the effect of shortening assembly or rework time.

The utility model relates to the field of circuit boards, in particular to a PCB which comprises an interface circuit board and a USB interface, the interface circuit board is provided with a plurality of first wiring terminals and a plurality of second wiring terminals, and the number of the first wiring terminals is larger than or smaller than that of the second wiring terminals. And the USB interface is connected to the first wiring terminal or the second wiring terminal. The USB wiring board has the effect of improving the universality of the interface circuit board of the USB wiring board.

Provided in the present application are a multilayer circuit board and an electronic device. The multilayer circuit board comprises a circuit unit layer, wherein the circuit unit layer comprises at least two circuit layers arranged parallel to and spaced apart from each other, and an insulating layer sandwiched between adjacent circuit layers; surfaces arranged opposite each other in the direction of thickness of the circuit unit layer are a first side surface and a second side surface; the circuit unit layer is provided with via holes penetrating the circuit unit layer in the direction of thickness thereof; the via holes are defined by inner side walls; the first side surface or the second side surface is provided with a first copper plating layer; second copper plating layers connected to the first copper plating layer are plated on the inner side walls; and the at least two circuit layers are connected in parallel by means of the second copper plating layers. The multilayer circuit board of the present application achieves parallel connection between the circuit layers, effectively controls the resistance value of the circuit board and meets performance requirements while reducing the overall thickness of the multilayer circuit board and lowering the space requirements for mounting the multilayer circuit board.

The application discloses a method for embedding heat-dissipating copper columns in a microwave printed circuit board, and relates to the technical field of embedding heat-dissipating copper columns in a microwave printed circuit board. The method comprises the following steps: S1, taking out a microwave printed circuit board; S2, taking out two heat-dissipating copper columns B; S3, supporting the two heat-dissipating copper columns B on the tabletop of a table; S4, making the two heat-dissipating copper columns B respectively in interference fit with two through holes of the microwave printed circuit board; S5, taking out a strip-shaped copper plate; S6, taking out a strip-shaped copper plate and a strip-shaped solidification sheet; S7, fixing the strip-shaped copper plate and the microwave printed circuit board together; S8, turning up the left and right end portions of the strip-shaped copper plate; S9, operating a spot welding machine so that the spot welding head on the spot welding machine touches the top surface of the turned-up portion; and S10, taking away the microwave printed circuit board embedded with the two heat-dissipating copper columns B from the table. The method has the advantages that the heat-dissipating efficiency of the microwave printed circuit board is improved, and the embedding quality of the heat-dissipating copper columns B is greatly improved.

To provide an interconnection member capable of enhancing reliability and a method of manufacturing the interconnection member.SOLUTION: An interconnection member includes: a substrate having a first surface, a second surface positioned on an opposite side with respect to the first surface in a first direction, and a first through hole; and an interconnection portion provided on the first surface of the substrate and having an insulating layer, an interconnection layer provided in the insulating layer, a second through hole continuous with the first through hole, and a conductive film provided on a side surface of the second through hole. A width of the first through hole is greater than a width of the second through hole in a direction orthogonal to the first direction. The first through hole also extends to a part of the interconnection portion in the first direction, and a side surface of the first through hole has a first side surface portion positioned on the substrate and a second side surface portion positioned on the part of the interconnection portion. The interconnection portion has a third surface facing the first surface of the substrate, a fourth surface positioned on an opposite side with respect to the third surface in the first direction, and a fifth surface continuous with the second side surface portion of the first through hole and a side surface of the conductive film and including an end surface of the conductive film in the first direction.SELECTED DRAWING: Figure 1

The present disclosure relates to an in-mold electronic (IME) component comprising at least one electrically conductive elastomer adapted to electrically connect at least one terminal end of the IME component to a power source. The present disclosure further relates to a method for manufacturing such an in-mold electronic component.

A capacitance sensor 1A comprises: a decorative layer 21 having a three-dimensional shape; and a wiring assembly 3 joined to the decorative layer 21. The wiring assembly 3 comprises: a molded base member 4 that has a three-dimensional shape and is joined to the decorative layer 21; and a wiring board 5 that has a circuit part 5a in which an electric circuit is formed, and that is stacked onto the molded base member 4 so as to face the inner surface 21b of the decorative layer 21. The circuit part 5a is not joined to the decorative layer 21.

The invention discloses an anti-breaking structure and method for arranging a buffer sheet on the edge of a circuit board, and the structure achieves the effective isolation between an electronic wire and the edge of the circuit board through arranging a polyimide (PI) thin film or a polyester film with the thickness of less than 0.1 mm on the edge of a PCB, a copper foil circuit board or an FPC flexible circuit board. The structure not only provides physical protection in a static state, but also remarkably reduces the cutting and breakage risks of electronic wires or heating materials under the dynamic stress conditions of the wearable heating clothes, such as washing, twisting and bending processes. Compared with a high-cost scheme using a more wear-resistant material or a complex process in the prior art, the problem of damage of the edge of the circuit board to a connecting part is solved in a more economical manner, and the durability and the safety of equipment are improved.

This substrate has a power semiconductor mounted thereon, the substrate including a plurality of conductors laminated with insulating layers interposed therebetween. The substrate includes: a drain / collector connection part formed by electrically connecting conductors arranged in different layers and connected to a drain terminal or a collector terminal of the power semiconductor; and a source / emitter connection part formed by electrically connecting conductors arranged in different layers and connected to a source / emitter terminal of the power semiconductor.

This invention relates to the field of circuit boards and discloses a power distribution circuit board for new energy vehicles, including a new energy battery box containing a new energy battery pack. The new energy battery pack is covered with a CCS integrated busbar. The CCS integrated busbar includes an FPC board, and the FPC board and the tabs of the new energy battery pack are connected by several terminal nickel plates. The FPC board includes an FPC information transmission main body and several cell acquisition terminals connected to the FPC information transmission main body, wherein the cell acquisition terminals are connected to the terminal nickel plates. Compared with the prior art, this application has advantages such as achieving overall temperature control of the FPC board and adaptive heat dissipation of the FPC board, solving problems such as local high temperature at the cell acquisition terminals, overall temperature control of the FPC board, high material fatigue, and short material life.

The invention provides a deep-sea high hydrostatic pressure resistant ionic polymer hydrophone structure and an assembly method, and belongs to the technical field of underwater acoustic sensing, the deep-sea high hydrostatic pressure resistant ionic polymer hydrophone structure comprises an upper shell, a shielding copper net, a substrate, a circuit board, a lower shell, a dry state sensitive film, a screw, a pressing plate, a positive electrode and a negative electrode, the shielding copper net is arranged at the top of the lower shell, a dry-state sensitive film is fixed on the front surface of the substrate, a circuit board is adhered to the back surface of the substrate, the substrate is inserted into the lower shell, a cavity at the lower part of the substrate is encapsulated and cured, and after the pressure-resistant shell is packaged, water is injected into the shell of the ionic polymer hydrophone and defoaming is performed. And finally, sealing and curing the water injection hole of the lower shell by using a sealant to form the ionic membrane polymer hydrophone. According to the invention, perfect packaging, low sound wave loss and good low-frequency sensitivity of the hydrophone in a deep water condition can be ensured, and the hydrophone has important popularization and application values for the work of the hydrophone in a deep sea level.

Methods, systems, and devices for manufacturing wearable ring devices (104) are described. A printed circuit board (PCB) including one or more sensors is disposed on or within an inner ring-shaped housing (105). A molding procedure is performed using a moldable material (115) to couple the PCB with the inner ring-shaped housing. Together the inner ring-shaped housing, the PCB, and the moldable material form a ring assembly, where the ring assembly includes a first passage configured to receive a finger of the user along a first axis. Then an outer ring-shaped housing (125) associated with a second passage and second axis is placed around the ring assembly such that the second axis of the outer ring-shaped housing is perpendicular to the first axis of the ring assembly. Then the outer ring-shaped housing may be rotated relative to the ring assembly to align the first axis and the second axis.

The application discloses an improved semi-additive process based on customized ultra-thin copper foil flexible copper-clad plate and a fine circuit board, and belongs to the technical field of flexible printed circuit boards. The process adopts a customized ultra-thin copper foil FCCL substrate, and the circuit is prepared through substrate selection pretreatment, pattern size pre-compensation, laser drilling and black shadow process hole metallization, pattern transfer and selective electroplating thickening, film stripping and flash etching forming. The micro-etching amount is cooperatively controlled throughout the process, and combined with optimized plasma cleaning and high hole filling electroplating, the fine circuit production with a minimum line width and line spacing of 45 microns or less can be stably realized, and the highest fine circuit production can reach 25 / 25 microns. The application solves the problems of traditional process, such as large side etching, low precision, poor yield and the like, and the circuit board prepared has the advantages of excellent size stability, strong heat resistance and uniform micro-hole filling, is suitable for high-density interconnection and high-end consumer electronic demand, and has significant advantages of precision, yield and reliability compared with existing processes.

This invention discloses a water-washable via-plugging resin composition and its preparation method, as well as a circuit board and its processing method. The water-washable via-plugging resin composition comprises a polymeric resin and an inorganic filler. The polymeric resin includes a structural resin and a reinforcing resin. The structural resin comprises a polymer having repeating units derived from at least one of vinyl alcohol and vinylpyrrolidone. The reinforcing resin comprises an alkali-soluble resin. The surface of the inorganic filler is modified with at least one functional group selected from the group consisting of aniline, alkyl, nitrogen-containing functional groups on the main chain or branches, and double-bonded functional groups. This invention achieves rigid protection of the circuit and via edges during the machining stage, effectively preventing burrs and circuit lifting defects, while ensuring rapid, gentle, and zero-residue peeling during the film removal stage.