3366results about "Printed circuit details" patented technology

The invention discloses a circuit module, an electric control heat dissipation assembly and heating and ventilation equipment, and the circuit module comprises a circuit board and a heat conduction assembly. The circuit board comprises a substrate and at least one first electronic element mounted on the substrate, the substrate comprises a first board and a second board which are oppositely arranged, and the at least one first electronic element is mounted on the first board; the heat conduction assembly is arranged on the second plate surface, the heat conduction assembly is in heat conduction contact with the second plate surface and the at least one first electronic element, and the projection of the at least one first electronic element is within the projection range of the heat conduction assembly when observed in the direction perpendicular to the plate surface. According to the technical scheme, the heat dissipation problem of the circuit module can be effectively solved, and meanwhile cost is reduced.

The invention relates to the technical field of flexible circuit board manufacturing and packaging, in particular to an FPC assembly injection molding packaging structure and method based on dynamic mold flow control, and the structure comprises an FPC assembly, a first injection molding layer wrapping a welding spot area of the FPC assembly, and a second injection molding layer wrapping the first injection molding layer and the FPC assembly. The second injection molding layer is provided with an anchoring column penetrating through the reserved channel of the first injection molding layer or the through hole of the FPC assembly, and the anchoring column and the FPC assembly or the first injection molding layer form a mechanical interlocking structure. According to the FPC assembly injection molding packaging structure and method based on dynamic mold flow control, the electronic equipment and the storage medium, through a sandwich structure and in-situ mechanical interlocking design, the process control of a non-Newtonian fluid shear model and an unsteady state heat conduction equation is combined; the technical problems that in the prior art, procedures are tedious, stress concentration is caused by CTE mismatching, and welding spots are prone to being damaged in the injection molding process are solved.

The invention discloses a piezoelectric air cooling device based on a piezoelectric film PZT technology, and relates to the technical field of MEMS. The device adopts a two-layer packaging structure of a piezoelectric cantilever beam MEMS chip and a PCB (Printed Circuit Board) with a vent hole. A cantilever beam of the MEMS chip is integrated with an SOI top silicon layer and an ultrathin PZT driving stack, low rigidity and high driving force are achieved, and the surface of the cantilever beam is covered with a PDMS flexible sealing layer to achieve dynamic sealing. When the device works, the cantilever beam is driven to resonate in an ultrasonic frequency band, and efficient synthetic jet is generated at the vent hole by periodically changing the volume of the pump cavity. The technical bottleneck that miniaturization and high performance are difficult to consider at the same time is broken through, and the device has the advantages of being compact in structure, mute and efficient and is suitable for precise heat dissipation of miniature electronic equipment.

The invention discloses a board card level thermoelectric collaborative management and control system, and relates to the technical field of board card level thermoelectric management and control, and the system comprises a heat flow dynamic mapping model construction module, a self-adaptive fluid disturbance injection module, a phase conjugate flow velocity compensation control module, a Hamiltonian variation heat diffusion regulation and control module, and a multi-layer coupling cooling path reconstruction module. And the heat flow dynamic mapping model construction module is used for constructing a heat flow density dynamic mapping model based on space-time multi-field coupling, and carrying out multi-physical field joint solution by taking the temperature gradient, the power distribution and the flow velocity vector of the cooling medium collected in real time in the board card as input parameters. Through multi-field coupling heat flow dynamic mapping and self-adaptive fluid regulation and control, cooling flow and the heat conduction direction are synchronized, local heat resistance is reduced, and heat stability is improved; through Hamiltonian variation control and multi-layer cooling path reconstruction, heat flux unidirectional diffusion and energy self-balance are realized, and the heat dissipation efficiency and operation reliability of the board card are significantly improved.

This application relates to a light-emitting device and a manufacturing method thereof, comprising a substrate, a plurality of light-emitting chips arranged on the front side of the substrate, and an encapsulation layer disposed on the substrate to cover each light-emitting chip. The encapsulation layer allows light emitted by the LED chips to pass through.

The invention relates to the technical field of PCB production, in particular to a high-precision PCB press-fit board and a warping compensation device thereof, the warping compensation device is adopted to process the PCB press-fit board, the warping compensation device comprises a supporting frame, and the supporting frame is provided with a detection unit used for detecting the edge warping degree of the PCB press-fit board; the device further comprises a compensation unit movably connected to the supporting frame, the compensation unit comprises a moving part, the two ends of the moving part are movably connected with connecting frames, the outer ends of the connecting frames are fixedly provided with frame bodies, the frame bodies are internally and movably connected with adjusting mechanisms, and the adjusting mechanisms are used for applying external force to the edges of the two sides of the PCB pressing plate to achieve warping compensation. The warping degree of the edges of the two sides of the PCB press-fit plate can be accurately detected when the PCB press-fit plate is compensated, and the subsequent extrusion force on the PCB press-fit plate can be adaptively adjusted according to the warping degrees of different PCB press-fit plates, so that accurate warping compensation of the PCB press-fit plate is realized, and the high-precision PCB press-fit plate with low warping degree is obtained.

The present disclosure relates to a BDU unit, a battery pack, and a vehicle, including a circuit board, a relay having a connection terminal extending in a thickness direction of the circuit board, and a connector having a first connection portion connected to the circuit board, a second connection portion connected to the circuit board, and a deformation portion connected to the circuit board. The second connecting part is connected with the connecting terminal, and the deformation part is used for adjusting the position of the second connecting part in the plate thickness direction through self deformation. According to the technical scheme, the BDU unit provided by the utility model can reduce the tolerance size matching requirement of relay installation.

A foldable electronic device includes a display including a first and second areas; a first and second housings; a hinge structure foldably connecting the first housing and the second housing to each other on a folding axis; a flexible printed circuit board (FPCB) extending across the folding axis from a first space between the first housing and the display to a second space between the second housing and the display and including a first bending portion and a second bending portion; a sensor configured to identify an impedance in the FPCB; and a processor configured to identify a folding angle between the first housing and the second housing based on the impedance. The first bending portion includes a first sensing pattern part including a first pattern forming a first electrical path and a second pattern forming a second electrical path.

According to the circuit board structure of the board edge embedded copper block provided by the utility model, at least one side surface of the copper block is exposed out of the board edge of the circuit board structure, and the embedded copper block is designed at the board edge of the circuit board for heat dissipation, so that the layout welding area of the circuit board is increased, and the heat dissipation efficiency is improved. The problem that no enough space is provided for arranging the embedded copper block in the board in the prior art is solved. By arranging the bump on the copper block, the adhesive force between the bump and the insulating dielectric layer in the circuit board is increased, and the problem that the binding force is weak when the copper block is embedded at the edge of the board in the prior art is solved.

The invention relates to the technical field of manufacturing of electronic components, and discloses an LCM (liquid crystal module) backlight FPC (flexible printed circuit) micro-deformation prevention method, which comprises the following specific steps: S1, implementing large-area copper laying design on an element surface of a flexible printed circuit board, and covering a main area of the element surface with uniformly distributed copper foils to form a continuous conductive layer with consistent thickness, while the conductive layer bears electrical connection of the LED light source, the surface reflection characteristic of the conductive layer is optimized, and the phenomenon of uneven light reflection caused by surface fluctuation is reduced. Through the large-area copper laying design of the element surface and the S-shaped isolation interval layout, thermal stress is effectively guided to be symmetrically distributed in multiple directions and offset each other, plane micro-deformation of the FPC under thermal circulation is remarkably restrained, the deformation quantity is controlled within 50 micrometers, the problems of stress concentration and deformation amplification caused by linear intervals in the prior art are solved, and the reliability of the FPC is improved. And long-term stability and optical performance of the backlight module are ensured.

The utility model relates to an anti-tin-climbing PIN bonding pad power module substrate, which comprises a substrate body and a Pin assembly, the Pin assembly is welded on the substrate body, each Pin comprises a pin seat and a pin body, the pin seat is provided with a through hole, the pin body is matched with the through hole and is inserted in the through hole, the pin seat comprises a column body, a solder resisting ring is formed on the circumferential surface of the upper end of the column body, and the solder resisting ring is connected with the pin body. The solder mask ring is arranged at the upper end of the needle seat, so that tin liquid can be blocked by the solder mask ring when moving from the bottom of the needle seat to the needle body in the tin soldering process, tin is prevented from climbing onto the needle body, the needle body is prevented from being free of tin, and a power module and a PCB (printed circuit board) can be assembled smoothly at a client.

Methods, systems, and devices for a wearable ring device are described. In some cases, a printed circuit board (PCB) of a wearable ring device may include a first wing extruding from the PCB in a first direction and in accordance with a first angle between a bottom face of the first wing and a top face of the PCB, and a second wing extruding from the PCB in a second direction and in accordance with a second angle between a bottom face of the second wing and the top face of the PCB. In such cases, a light emitting component may be positioned on the first wing and a light detecting component may be positioned on the second wing, such that a first optical path may be defined between the first light emitting component and the first light detecting component based on the first angle and the second angle.

This invention discloses an automatic design method and auxiliary files for rigid-flex PCBs. First, the shapes of flexible and rigid PCBs are distinguished, corresponding shape areas are selected and converted into copper foil attributes. Then, by increasing or decreasing the size of the copper foil and using negative stacking of copper foil, the required spacing between different shapes is created. This allows for the rapid creation of auxiliary files for rigid-flex PCBs that meet process requirements. The invention can quickly and automatically generate auxiliary files, improving the efficiency of auxiliary file processing, reducing errors caused by missing requirements, increasing the yield of rigid-flex PCBs, reducing production scrap rates, and improving the quality of rigid-flex PCBs.

The utility model discloses a battery pack and a power utilization device, the battery pack has a first direction and a second direction which are intersected, the battery pack comprises a shell, a plurality of electrode assemblies and a switching circuit board, the shell is provided with an accommodating cavity, the plurality of electrode assemblies are arranged along the first direction and arranged in the accommodating cavity, and each electrode assembly comprises a battery cell and a tab which are in conductive connection; tabs of the plurality of electrode assemblies are arranged along a first direction; the switching circuit board comprises a board body and a plurality of first bonding pads arranged at intervals in the first direction, the board body is provided with a plurality of first channels, and the first channels penetrate through the board body in the second direction; the first bonding pad is arranged on one side, far away from the battery cell, of the plate body in the second direction and is connected with the plate body; the plurality of first bonding pads and the plurality of first channels are alternately arranged along a first direction; and at least two adjacent tabs are arranged in one first channel in a penetrating manner and are conductively connected with one first bonding pad. The battery pack structure can be simplified, the integration level is improved, and the short-circuit risk is reduced.

The domain controller comprises a first shell and a second shell which define a containing cavity; the circuit board is arranged in the containing cavity and provided with a chip, and a plug hole is formed in the circuit board; the soaking plate is arranged in the accommodating cavity, a plug-in end matched with the plug-in hole is formed on the soaking plate, a limiting part expanding outwards is formed on the plug-in end, and the soaking plate is plugged on the circuit board and is limited by the limiting part to move, so that the first surface of the soaking plate is tightly pressed on the chip; and the fastener is connected with the first shell, the circuit board and the second shell, so that the second surface of the vapor chamber is attached to the inner wall of the first shell. The invention also provides a manufacturing method of the movable platform and the domain controller. Wherein the vapor chamber is inserted and fixed in an insertion hole of the circuit board by using an insertion end, and the movement is limited by a limiting part, so that the distance between the vapor chamber and the chip is only determined by the manufacturing tolerance of the vapor chamber and the process tolerance of welding the chip on the circuit board, and the precompression formed on the chip by the vapor chamber can be kept unchanged by strictly controlling the tolerances.

The invention relates to the technical field of electromagnetic shielding devices, and discloses an electromagnetic shielding structure for a keyboard chip, a manufacturing method of the electromagnetic shielding structure and a wireless keyboard applying the electromagnetic shielding structure, and the method comprises the following steps: a first circuit layer is provided with a signal wire and a grounding wire, and is connected to a second circuit layer provided with a welding pad and a false welding pad through a via hole; the chip is welded on the welding pad, and the false welding pad is electrically connected with the grounding wire; an insulating layer and a third circuit layer are formed outside the chip, and a coverage area is connected with the false welding pad through a via hole; the electromagnetic shielding layer is arranged on the solder mask layer, and the electromagnetic shielding layer is electrically connected with the grounding wire through the conductive adhesive layer, so that the chip is wrapped and shielded in all directions. The structure can effectively reduce electromagnetic interference and improve the stability of wireless keyboard signals, and is suitable for thin keyboard circuit design.

The present invention provides a liquid-cooling heat dissipation apparatus for a power device, and an on-board charger. The liquid-cooling heat dissipation apparatus comprises a circuit board, a power device, and a heat dissipation assembly which are sequentially stacked. One side of the power device is connected to the circuit board by means of pins on the power device, and the other side of the power device is installed on a heat dissipation surface of the heat dissipation assembly. In the present invention, the power device is directly installed on the heat dissipation surface of the heat dissipation assembly, so that compared with the prior art, the present invention omits an intermediate heat transfer layer such as an aluminum substrate, reducing thermal contact resistance, thereby improving heat dissipation performance; additionally, the aluminum substrate is not used, so that no additional pressing strip is required to press the aluminum substrate, thereby reducing the complexity of installation, and reducing the installation space required for the power device.

To produce a multilayer substrate with an integrated conductor structure, a layer 103 of an organic dielectric and a metal layer 104 are applied to one side 101a of a layered substrate 101 made of a dielectric inorganic material. The layered substrate 101 has at least one through-hole 102, which is thereby sealed, with the two layers 103 and 104 forming at least one bottom of the sealed hole and an inner side of the at least one bottom being formed by the layer 103 of the organic dielectric. The latter is removed in a subsequent step, so that the metal layer 104 of the at least one bottom is exposed.This is followed by filling the at least one sealed through-hole 102 with a metal by electrochemical deposition and subsequently structuring the metal layer 104 to form the conductor structure, or alternatively, removing the metal layer 104 and subsequently building the conductor structure on layer 103 from the organic dielectric. In addition to the process, multilayer substrates with the integrated conductor structure produced using this method are also described.

The present application relates to the technical field of display, and discloses a light panel and a display device. The light panel comprises a substrate, a conductive layer, a light-emitting unit, and an electrode connection portion. An electrode pad in the conductive layer is electrically connected to an electrode of the light-emitting unit by means of the electrode connection portion. Furthermore, the electrode pad has a hollow area exposing a portion of the substrate, so that the flattened state of the electrode connection portion can be observed through the hollow area from the back surface of the substrate, thereby detecting the overlapping state between the electrode pad and the electrode. Therefore, prompt detection of a light-emitting unit having a poor connection yield can be facilitated, so that the light-emitting unit can be promptly replaced, thereby improving the yield of the light panel.

Circuitry and method are described for enabling multiple loads on a differential low voltage differential signaling pair (M-LVDS). A printed circuit board (PCB) contains a M-LVDS driver and leads that route a main channel that carries a differential signal from the driver to an area in which loads are populated. The main channel is split into branches that contain application-specific integrated circuits (ASICs) as the loads. The branches have the same characteristic impedance as the main channel. Filters are disposed in each branch and are coupled between the driver and the ASICs. Each filter is a first order or higher filter. Fewer filters than ASICs are on each branch, with the filters being disposed between the driver and ASICs closest to the driver (with smaller propagation delay). The filters are configured differently at each ASIC input to compensate for the delay.

The invention discloses a flexible deep sea pressure sensor, a corresponding fully-integrated temperature-depth sensing system and a temperature compensation algorithm. The invention relates to the technical field of ocean detection sensors, and the structural design of the flexible deep sea pressure sensor constructs a composite structure with high-pressure sensitivity and mechanical flexibility through the collaborative optimization of multiple parameters of LIG (laser-induced graphene) thickness, cross-linking agent proportion of PDMS (polydimethylsiloxane) and packaging thickness. And the contradiction between the sensitivity and the measuring range of the flexible material in the deep sea high-pressure environment is broken through. A fully-integrated temperature-depth sensing system adopting the pressure sensor and a corresponding temperature compensation algorithm also have the same technical effects.

The invention discloses a precise liquid feeding structure control method applied to a single-phase immersion liquid cooling data center box body, which comprises the following steps: step 1, data acquisition and modeling: acquiring parameters by using a sensor, and simulating a cooling liquid flow path and temperature field distribution through thermal analysis; 2, simulation analysis and problem positioning are carried out, the flow velocity, flow distribution and temperature field of cooling liquid under different loads are simulated, and an unsmooth flow area, a hot spot area and a high-energy-consumption node are positioned; 3, hardware deployment and debugging: adjusting the installation position of a mainboard water pump to optimize the initial axial direction of a cooling liquid, simulating different server loads, and comparing test data with a simulation result to perform fine tuning optimization; 4, dynamically controlling the flow, executing multi-mode control logic based on the temperature parameters, and dynamically adjusting the rotating speed of a main board water pump and the rotating speed of a circulating pump; cooling liquid is forced to flow through the mainboard water pump, flow distribution is optimized in combination with the heat-flow coupling model, and forced flowing of the cooling liquid is achieved.

The invention discloses a thick copper circuit production method of a circuit board and the circuit board. The method comprises the following steps: carrying out fine carving treatment on a first copper layer and a second copper layer of a to-be-treated circuit board to obtain a first thick copper circuit and a second thick copper circuit; resin filling processing is carried out between the first thick copper circuits and the second thick copper circuits to obtain a first circuit board, first hole filling resin between the first thick copper circuits is provided with a first groove after being cooled, and second hole filling resin between the second thick copper circuits is provided with a second groove after being cooled; grinding and polishing the first hole filling resin and the second hole filling resin to obtain a third circuit board; and performing line forming processing on the third circuit board to obtain a target circuit board. The first copper layer and the second copper layer are subjected to fine carving treatment, so that the forming of the thick copper circuit is quickly completed, and the production efficiency is high; and the resin is filled between the thick copper circuits, so that the interference between the thick copper circuits is reduced, and the production quality of the circuit board is improved.

One aspect of the disclosure can provide a printed circuit board (PCB). The PCB may include one or more layers and at least a differential pair including a first transmission line and a second transmission line. The first transmission line may include a plurality of skew-compensation structures, each skew-compensation structure tuned to reduce an impedance mismatch along the differential pair. The first transmission line may be longer than the second transmission line to reduce a mismatch of signal flight times associated with the first and second transmission lines.

The invention relates to a device for protection against an attack on an electronic component (IC) mounted on a printed circuit board (PCB), the protection device (PM) comprising: a multilayer printed circuit board comprising upper and lower layers, the lower layers being machined to form two pillars (S1, S2) of a bridge, the pillars delimiting between each other and with a lower face (LF) of the upper layers a volume configured to house the component, the pillars having a height such that the lower face delimits an empty space with an upper face of the component when the component and the protection device disposed above the component are fixed on the printed circuit board (PCB), and conductive tracks formed in the upper and lower layers and connecting together connection elements of the protection device formed in a lower conductive layer of each of the pillars.Figure 2.

The utility model discloses a circuit board and a display device. The circuit board comprises a base layer and a wiring layer located on one side of the base layer. The wiring layer comprises a plurality of signal lines, the signal lines are arranged in the first direction and extend in the second direction, and the first direction and the second direction intersect; the signal line comprises a wiring part, a transition part and a connecting part which are sequentially arranged along a second direction; the signal lines comprise a first signal line, a second signal line and a third signal line, the first signal line and the second signal line are adjacent, and signals of the first signal line and the second signal line are the same in size and opposite in phase; the first shielding layer is located on the side, away from the base layer, of the wiring layer; the first shielding layer covers the wiring part and part of the transition part, and orthographic projections of the first shielding layer and the connecting part on the base layer are not overlapped; the first edge of the first shielding layer in the area where the transition part is located comprises a straight line section and an arc line section, and the straight line section is at least perpendicular to and crossed with orthographic projections of the first signal line and the second signal line on the base layer; the arc segment intersects with the orthographic projection of at least part of the third signal line on the base layer.

The utility model discloses a circuit board with high voltage resistance, which relates to the field of circuit boards and comprises a bottom frame and a circuit board, a rectangular storage groove is arranged at the top of the inner wall of the bottom frame, the circuit board is positioned in the storage groove on the bottom frame, and a rectangular frame-shaped top cover is arranged above the bottom frame. The bottom of the top cover makes contact with the top of the bottom frame and presses the top of the circuit board, vertical fixing pipes are inserted into the four corners of the storage groove in the bottom frame in a penetrating mode, first through holes are formed in the four corners of the top cover, and the four first through holes in the top cover are connected to the upper half portions of the four fixing pipes in a sleeving mode respectively. The upper half portions of the four fixing pipes are sleeved with nuts abutting against the top of the top cover in a threaded mode, a side plate is arranged at the bottom of one end of the bottom frame, and a plurality of through openings are evenly formed in the side face of the side plate. According to the utility model, when the circuit board is installed, the circuit board can be prevented from being damaged by bolts, the installation of the circuit board can be rapidly completed, and the heat of the circuit board can be effectively dissipated.

The present invention provides a substrate that improves the functionality of the space enclosed by the frame, which includes the element mounting area. [Solution] The substrate comprises a base portion and a frame portion located on the upper surface of the base portion. The base portion has an element mounting area on its upper surface on which elements are mounted. The frame portion has a first inner surface, a second inner surface, and a first corner surface connecting the first inner surface and the second inner surface to each other. The surface roughness of the first corner surface is greater than the surface roughness of at least a portion of the first inner surface.

The present application relates to display device, backlight module and its light source module positioning structure. The light source module positioning structure includes: backplate, the side wall of the backplate is equipped with guide part, the guide part is towards the accommodation space and extends obliquely downward, the front end of the guide part is equipped with positioning convex part; light source module, the side of the flexible circuit board of the light source module is provided with positioning notch, the positioning notch corresponds to the positioning convex part, and the positioning convex part is engaged in the positioning notch and carries out positioning assembly. Therefore, the light source module does not need to stick glue and can be positioned, thereby achieving the effect of shortening assembly or rework time.