9274results about "Printed circuit details" patented technology

The invention discloses a circuit module, an electric control heat dissipation assembly and heating and ventilation equipment, and the circuit module comprises a circuit board and a heat conduction assembly. The circuit board comprises a substrate and at least one first electronic element mounted on the substrate, the substrate comprises a first board and a second board which are oppositely arranged, and the at least one first electronic element is mounted on the first board; the heat conduction assembly is arranged on the second plate surface, the heat conduction assembly is in heat conduction contact with the second plate surface and the at least one first electronic element, and the projection of the at least one first electronic element is within the projection range of the heat conduction assembly when observed in the direction perpendicular to the plate surface. According to the technical scheme, the heat dissipation problem of the circuit module can be effectively solved, and meanwhile cost is reduced.

The invention provides electronic equipment and a circuit connection assembly, the electronic equipment comprises a first fixed part, a rotating part, a second fixed part and at least one layer of flexible circuit board, and the second fixed part and the first fixed part are respectively located at two sides of the rotating part along a first direction; the two ends, in the first direction, of the flexible circuit board are connected to the first fixing part and the second fixing part respectively, and at least part of the portion, located between the first fixing part and the second fixing part, of the flexible circuit board is connected to the rotating part. The flexible circuit board is provided with at least one strip-shaped hole, the strip-shaped hole extends in the first direction, and at least part of the strip-shaped hole is located between the first fixing part and the second fixing part. According to the flexible circuit board, the strip-shaped holes are formed in the flexible circuit board, the part, located between the first fixing part and the second fixing part, of the flexible circuit board can be divided into the multiple transmission sections with the small widths, and therefore excessive twisting of the flexible circuit board in the bending process can be avoided, and the service life of the flexible circuit board can be prolonged.

The invention discloses a processing method of a millimeter wave radar circuit board, which adopts a continuous blind slot to replace a plurality of independent blind hole structures in a traditional structure, so that a continuous radio frequency circuit pattern can be formed, the signal shielding area is effectively increased, and the millimeter wave radar circuit board has a better signal shielding effect. Besides, the processing method of the embodiment of the invention also cancels the procedures of repeated electroplating, single-side copper reduction, circuit etching and the like in the traditional processing method, and can directly realize the manufacturing of the outer circuit, the first copper layer and the second copper layer through activation and copper deposition, thereby greatly shortening the processing flow of the millimeter wave radar circuit board, and improving the production efficiency of the millimeter wave radar circuit board. And the production efficiency of the millimeter wave radar circuit board is improved. In addition, the invention further discloses the millimeter-wave radar circuit board formed by the processing method of the millimeter-wave radar circuit board.

The invention provides a ceramic rigid-flex circuit substrate and a preparation method thereof, and the method comprises the specific steps: S1, cleaning a ceramic substrate, and arranging a brazing metal transition layer on the surface of the ceramic substrate; s2, low-melting-point brazing filler metal is sprayed to the surface of the brazing metal transition layer of the ceramic substrate, and a multi-layer flexible circuit board is attached to the surface, sprayed with the low-melting-point brazing filler metal, of the aluminum nitride ceramic substrate to obtain an attached plate; and S3, placing the laminated board in a vacuum or protective atmosphere for welding to obtain the ceramic rigid-flex circuit substrate. The ceramic substrate is adopted, the brazing metal transition layer is introduced to the surface of the ceramic substrate, the welding process of the flexible circuit board and the ceramic substrate is optimized, the problems that heat conduction is difficult, interface thermal resistance is large and uneven or bonding strength is insufficient are effectively solved, and the overall performance and quality of a product are improved.

An electronic apparatus includes a main circuit board, an electronic device, side circuit boards, and a pressure applying unit. The electronic device is installed on and electrically connected to the main circuit board. The side circuit boards are positioned at edges of the electronic device on a side of the electronic device away from the main circuit board and electrically connected to the electronic device. The pressure applying unit is positioned on a side of the electronic device and on each of the side circuit boards away from the main circuit board. The pressure applying unit applies pressure: 1) to the side circuit boards to maintain an electrical connection between the side circuit boards and the electronic device; and 2) to side regions of the electronic device to maintain an electrical connection between the main circuit board and the electronic device.

The invention discloses a probe integrated device and a preparation method and a control method of the probe integrated device. The device comprises a probe array, a silicon electrode substrate, a recording chip bare chip and a rigid printed circuit substrate. The preparation method comprises the following steps: preparing a probe array and a silicon electrode substrate; carrying out balling on the bare chip of the recording chip, aligning the bare chip with one end of the silicon electrode substrate, and inversely mounting the bare chip on the probe array and the silicon electrode substrate to obtain a substrate with the bare chip; and adhering to a rigid printed circuit substrate, and connecting through a metal wire to obtain the probe integrated device. The control method comprises the following steps: acquiring a brain neuron signal; and carrying out amplification and analog-to-digital conversion processing on the cerebral neuron signal to obtain a cerebral neuron digital signal. According to the embodiment of the invention, miniaturization of the device can be promoted, acquisition of high-flux signals is facilitated, and three-dimensional space neurons can be recorded. The probe array can be widely applied to the technical field of probe arrays.

An illustrative system may include a radio frequency (“RF”) transmitter electrically coupled to a first electrical circuit and electrically isolated from a second electrical circuit; an RF receiver having a top surface that is parallel with a top surface of the RF transmitter, the RF receiver electrically coupled to the second electrical circuit and electrically isolated from the first electrical circuit; and a waveguide between the RF transmitter and the RF receiver and configured to guide an RF signal representative of data between the RF transmitter and the RF receiver, the data provided by the first electrical circuit, the waveguide comprising an input port that at least partially covers the top surface of the RF transmitter, and an output port that at least partially covers the top surface of the RF receiver.

The invention discloses an electromagnetic shielding film and a circuit board, the battery shielding film comprises a protective layer, the tensile strength of the protective layer is greater than or equal to 40MPa, and the elongation of the protective layer is greater than or equal to 50%. According to the electromagnetic shielding film, the tensile strength of the protective layer is controlled to be larger than or equal to 40 MPa, and the elongation is controlled to be larger than or equal to 50%, so that the protective layer can bear large tension and has good flexibility and ductility, the tear resistance of the electromagnetic shielding film can be effectively improved, and the service life of the electromagnetic shielding film is prolonged. Therefore, the electromagnetic shielding film can be prevented from being damaged when being pressed on an area with offset on the circuit board while ensuring the complex effect and the shielding effectiveness of pressing.

A display panel and a display apparatus. One end of a first signal transmission part (21) is connected to a binding part (12), and the other end thereof is bent towards the side of the binding part (12) away from the display part (11) and is connected to a second signal transmission part (22), the orthographic projection of the second signal transmission part (22) on the display part (11) at least partially overlapping with the orthographic projection of the binding part (12) on the display part (11). The second signal transmission part (22) comprises a connection surface (220) connected to the first signal transmission part (21), and the first signal transmission part (21) is connected to the side of the connection surface (220) close to the binding part (12).

A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin layer disposed to cover a side surface of the first component and the first surface; and a redistribution layer covering a surface of the first sealing resin layer on a side far from the substrate. The redistribution layer includes: a first metal film disposed to correspond to a projection area of the first component; a first insulating film covering a surface of the first metal film on a side far from the substrate; and a first group of conductor vias passing through the first insulating film and protruding from the first metal film in a direction away from the substrate.

The invention discloses an electromagnetic shielding film and a circuit board, the electromagnetic shielding film comprises a first shielding layer, a flexible conductive adhesive layer and a second shielding layer which are stacked in sequence, and the flexible conductive adhesive layer is arranged between the first shielding layer and the second shielding layer, so that the bending resistance of the electromagnetic shielding film is effectively improved, interference signals are effectively weakened, and the electromagnetic shielding effect is improved. According to the electromagnetic shielding film, the shielding performance is improved, the elastic modulus of the flexible conductive adhesive layer is set between 80 MPa and 120 MPa, the elastic modulus of the flexible conductive adhesive layer is limited within a reasonable range, the bending resistance of the electromagnetic shielding film is better improved, and the electromagnetic shielding film is suitable for products needing to be folded or opened and closed for a long time and at high frequency.

Disclosed are a display module and a display device capable of minimizing a pressed stain defect while reducing a bezel area. To this end, a thickness of a cushion portion of a cushion plate closer to a bent portion may be reduced, thereby reducing a bending radius of curvature such that the bezel area may be reduced. Further, placing a support layer having a strong supporting force formed of PET into the cushion plate such that the support layer is in contact with the heat-dissipation layer may allow minimizing an unevenness defect on the cushion plate even when a bent pad portion of a display panel presses the cushion portion. Thus, visibility of an internal pressed stain to a user may be minimized.

An antenna apparatus includes a multi-layer printed circuit board, an antenna, and a floating patch group. The multi-layer printed circuit board includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer. The antenna is formed from at least one of the first metal layer, the second metal layer, and the third metal layer. The floating patch group is located in the multi-layer printed circuit board and includes a plurality of floating patches. The floating patch has a width. There is a gap between the floating patch and an adjacent floating patch. The floating patches have the same or similar width and the same or similar gap. The floating patch group is arranged in a metal layer where the antenna is located. There is a spacing between the floating patch group and the antenna.

The embodiment of the invention provides a light-emitting diode chip set, a backlight module of a display and an illumination module, and relates to the technical field of semiconductors, the light-emitting diode chip set generates white light and comprises at least one multi-wavelength chip, the multi-wavelength chip comprises an N-type semiconductor layer, a P-type semiconductor layer, a first light-emitting layer and a second light-emitting layer, wherein the first light-emitting layer and the second light-emitting layer are arranged between the N-type semiconductor layer and the P-type semiconductor layer and are stacked. The first light-emitting layer generates light of a first wave band through electroluminescence and excites the second light-emitting layer to generate light of a second wave band, the number of wavelengths contained in the light of the first wave band and the number of wavelengths contained in the light of the second wave band are both larger than or equal to 1 and smaller than or equal to 10, and a hole isolation area exists between the first light-emitting layer and the second light-emitting layer. The multi-wavelength chip has higher external quantum efficiency, the limitation of a traditional white light scheme (blue chip + yellow fluorescent powder or blue chip + green fluorescent powder + red fluorescent powder) can be broken through, the reliability is improved, and the service life is prolonged.

The invention relates to the technical field of interface impedance adjustment, and discloses an impedance matching adjustment method and device for an FPC high-performance computing chip interface. The method comprises: collecting impedance parameters of the FPC high-performance computing chip interface and establishing an impedance characteristic mathematical model; constructing a scalar differential equation group including an impedance change rate, a temperature change rate and a signal characteristic change rate, and solving the scalar differential equation group to obtain a dynamic compensation parameter matrix; adjusting and controlling the interlayer relative positions of an FPC multilayer structure, adjusting impedance gradient parameters in an interlayer transition region of the FPC multilayer structure, and obtaining initial impedance optimization data; inputting the initial impedance optimization data and historical temperature data into a recurrent neural network model to perform impedance matching parameter optimization calculation, and generating an impedance matching optimization parameter group. The invention improves the adaptability of the FPC high-performance computing chip interface to complex working conditions and improves the convergence speed of the impedance matching parameters.

The invention discloses a manufacturing method of a PCB (Printed Circuit Board) embedded with a copper block, which comprises the following steps of: manufacturing the copper block according to the size of a milling groove of the PCB; milling the core plate and the PP sheet corresponding to the copper block embedding position; embedding a copper block; performing press fit; ceramic plate grinding is conducted, and residual glue on the surface of the copper block is removed; performing laser ablation and drilling; and electroplating and post-process. According to the manufacturing method of the PCB embedded with the copper block, the flatness of the copper block and the board surface and the surface quality of the copper block can be improved, so that the quality of the PCB embedded with the copper block is improved.

The invention discloses a substrate with a non-metallization step blind slot and a processing method thereof, and the processing method comprises the steps: providing a laminated plate, manufacturing an inner-layer circuit, an inner-layer target and a first window on an outer-layer copper foil of the laminated plate, and then arranging an insulation adding layer and a copper foil adding layer on the outer-layer copper foil in a laminated manner; a second window is manufactured on the copper foil added layer in the mode of grabbing the inner layer target for alignment; laser groove burning is carried out based on the second window and the first window in sequence, a first-order blind groove with the second window as a groove opening and the local part of the outer-layer copper foil as the groove bottom and a second-order blind groove with the first window as the groove opening and the local part of the inner-layer copper foil of the laminated plate as the groove bottom are manufactured, and the first-order blind groove and the second-order blind groove form a stepped blind groove together; and preparing an outer circuit on the copper foil added layer, and removing the bottoms of the first-order blind groove and the second-order blind groove to prepare a non-metallization step blind groove, thereby obtaining the substrate. The processing method is simple and reasonable, the processing cost is low, the obtained substrate is high in size precision and good in appearance quality, and the production requirements in the field of circuit boards are met.

Power module (10) with a heat sink element (1), comprising - a ceramic element (25) - a component metallization (20) and - the heat sink element (1), wherein the ceramic element (25), the component metallization (20) and the heat sink element (1) each extend substantially along a plane parallel to a principal extension plane (HSE) and are arranged one above the other in a stacking direction (S) perpendicular to the principal extension plane (HSE), wherein the ceramic element (25) is arranged between the component metallization (20) and the heat sink element (25), wherein the component metallization (20) has a first thickness (D1) dimensioned in the stacking direction (S) and the heat sink element (1) has a second thickness (D2) dimensioned in the stacking direction (S), wherein a ratio between the first thickness (D1) to the second thickness (D2) is less than 0.4, preferably less than 0.3 and particularly preferably less than 0.2, wherein the heat sink element (1) is designed such that a deflection of the power module (10) is five times smaller, preferably eight times smaller and particularly preferably ten times smaller than for a reference power module with a dimension corresponding to the power module (10), wherein the reference power module has a solidly formed heat sink element (1).

The invention relates to the technical field of automobiles and industrial electronics, in particular to a power device embedded circuit board integrated with a ceramic plate and a preparation method of the power device embedded circuit board, and the power device embedded circuit board comprises the ceramic plate, a power device, a conductor layer, an insulating layer, a metal conduction blind hole, a bottom copper plating layer, an assembly welding layer and a blind groove. Compared with a traditional power module, the switching speed is higher, the switching loss is smaller, and the design is more flexible; compared with a power device embedded circuit board in the market, the circuit board has the advantages of lower thermal resistance, lower temperature rise and higher current output capability. The advantages of a traditional power module and an embedded circuit board are integrated, switching loss is small, thermal resistance is small, and the current output capacity can be greatly improved.

The embodiment of the invention discloses a double-sided packaging structure, a power supply device and electronic equipment. The power devices are arranged on the two side plate surfaces of the PCB substrate of the double-face packaging structure, and the heat conduction piece is inserted into the PCB substrate and packaged to form a packaging body. The packaging body comprises a heat dissipation surface, and the heat dissipation surface is opposite to one side plate surface of the PCB substrate. The PCB substrate is provided with a via hole and a through hole which are connected through a copper foil, the via hole is at least connected with a power device arranged on the other side plate surface of the PCB substrate, the heat conduction piece is inserted into the through hole, and one end of the heat conduction piece extends to the heat dissipation surface of the packaging body. Through the arrangement, the power device on the non-heat-dissipation surface side can be led out through a low-heat-resistance heat dissipation path formed by the via hole, the copper foil, the through hole and the heat conduction piece in sequence, and the heat dissipation performance of the power device on the non-heat-dissipation surface side is effectively improved; meanwhile, based on the structural characteristics of the inserted heat conduction piece, the packaging width can be reduced, and the trend requirement of high-density layout is met.

The utility model discloses a battery device and a power utilization device. The battery device comprises a battery module, a control panel, an electrical assembly and a flexible circuit board, and the control panel is arranged at one end of the battery module; the electrical assembly is located on the control panel; the flexible circuit board comprises a first part and a second part, the first part is arranged on the battery module, the second part is connected between the first part and the electrical component, and at least part of the second part is bent and extends to increase the length of the second part. According to the battery device, the bent and extended part is arranged on the flexible circuit board, so that when the battery device is maintained, the bent and extended part of the flexible circuit board can extend under the action of tensile force, and the battery maintenance difficulty and the battery maintenance cost can be reduced.

The present invention discloses an electromagnetic shielding film and a circuit board. The electromagnetic shielding film comprises: a first shielding layer, an interlayer and a second shielding layer which are stacked in sequence; the thickness of the first shielding layer, the thickness of the second shielding layer and the thickness of the interlayer satisfy: 0.05≤d3 / (d1+d2)≤6.5. The interlayer is provided to increase the flexibility of the electromagnetic shielding film, and the provision of two shielding layers further enhances the shielding effect. The ratio of the thickness of the interlayer to the sum of the thickness of the two shielding layers is limited within a certain range, so that the thickness of the interlayer is within a suitable thickness range, which can have better stress, the device is resistant to bending, and the overall thickness of the electromagnetic shielding film is not too thick, which is conducive to the thinning of the device. At the same time, the thickness of the interlayer is relatively close to the sum of the thicknesses of the two shielding layers, which improves the stress transmission performance, makes the stress transmission more uniform, and avoids the breakage of the electromagnetic shielding film.

The invention relates to the technical field of liquid cooling, and discloses a flexible liquid cooling structure and a server, the flexible liquid cooling structure comprises a plurality of flexible substrates, a flexible connecting band is fixedly connected between two adjacent flexible substrates, the upper end surface of each flexible substrate is provided with a cooling groove, and the upper end surface of each flexible substrate is fixedly provided with a cover plate; the cooling groove and the cover plate form a cooling cavity; the jet flow assembly is arranged at the liquid inlet hole of the flexible liquid cooling structure, the flow speed of cooling liquid is effectively increased by utilizing the gradual shrinkage structures of the liquid inlet pipe part, the shrinkage pipe part and the diffusion pipe part of the jet flow assembly, when the cooling liquid passes through the shrinkage pipe part, the flow speed is obviously increased under the effect that the cross section of a channel is gradually reduced, and meanwhile, the cooling efficiency is improved. The air suction holes further guide air to be mixed into the cooling liquid through the negative pressure effect, a stronger jet flow effect is formed, the cooling liquid can rapidly flow through the whole cooling cavity, the problem of liquid retention caused by insufficient flow speed is effectively solved, and therefore uniform distribution of the cooling liquid is achieved.

The utility model discloses a high-efficiency air-cooled radiator, which is provided with a radiating plate and a plurality of fins arranged at the bottom of the radiating plate, the plurality of fins are distributed in parallel along the length direction of the radiating plate to form a radiating fin group, and a fan is arranged at the bottom of the radiating plate along the direction of the fins; air guide windows are formed in the heat dissipation plate in a penetrating mode and distributed between the draught fan and the fins, and beveled corners are arranged on the sides, facing the heating devices, of the tops of the air guide windows. Air flow generated by the fan passes through the air guide window and then forms turbulent flow to be blown to the heating device. According to the utility model, the air guide window is arranged on the heat dissipation plate, air flow can be directly blown to a heating device from the air guide window, secondary heat conduction of the heat dissipation plate is reduced, the air flow is in a turbulent flow shape, air molecules move irregularly, and heat exchange is sufficient, so that heat exchange is greatly enhanced, rapid heat transfer can be better realized, and the service life of the heat dissipation plate is prolonged. Therefore, the heat dissipation effect is improved.

The invention relates to the technical field of flexible circuit board manufacturing and packaging, in particular to an FPC assembly injection molding packaging structure and method based on dynamic mold flow control, and the structure comprises an FPC assembly, a first injection molding layer wrapping a welding spot area of the FPC assembly, and a second injection molding layer wrapping the first injection molding layer and the FPC assembly. The second injection molding layer is provided with an anchoring column penetrating through the reserved channel of the first injection molding layer or the through hole of the FPC assembly, and the anchoring column and the FPC assembly or the first injection molding layer form a mechanical interlocking structure. According to the FPC assembly injection molding packaging structure and method based on dynamic mold flow control, the electronic equipment and the storage medium, through a sandwich structure and in-situ mechanical interlocking design, the process control of a non-Newtonian fluid shear model and an unsteady state heat conduction equation is combined; the technical problems that in the prior art, procedures are tedious, stress concentration is caused by CTE mismatching, and welding spots are prone to being damaged in the injection molding process are solved.

The utility model provides a printed circuit board of a multi-level circuit and a power converter, the multi-level circuit comprises a plurality of bus capacitors, a plurality of switching devices and at least one thin-film capacitor, the plurality of bus capacitors and the plurality of switching devices are connected to form the multi-level circuit, the thin-film capacitor is connected in parallel with one bus capacitor, and the thin-film capacitor is connected in parallel with the other bus capacitor. The printed circuit board comprises a core device area, the switching devices and the thin-film capacitors are arranged in the core device area, and the bus capacitors are located outside the core device area. The thin-film capacitor is introduced and located in the core device area, the current path between the thin-film capacitor and each switching device is shorter, and the commutation path in the commutation process can be shortened, so that the path stray inductance is reduced, the inverse peak is reduced, and the service life of the device is prolonged.

The invention discloses a circuit board module and a server, and relates to the technical field of servers, the circuit board module comprises a circuit board, a first connecting piece and a second connecting piece, the first connecting piece and the second connecting piece are connected to the opposite ends of the circuit board in a clamping mode in the first direction, one side, deviating from the circuit board, of the first connecting piece is clamped with the inner wall of the case; and one side, deviating from the circuit board, of the second connecting piece is clamped with the inner wall of the case. According to the server, the circuit board is fixed and limited through the first connecting piece and the second connecting piece, the circuit board is prevented from moving in the first direction, the problem of abnormal electric connection between the electric appliance element and the circuit board caused by position movement of the circuit board is solved, the server runs stably, and the use performance of the server is improved. The first connecting piece and the second connecting piece are clamped on the circuit board, so that the number of connecting parts is reduced, the circuit board module is convenient to install and maintain, and the installation efficiency and the maintenance efficiency of the server are improved.

To provide a compact voice-activated electronic device with speakers, electronic components and a dual-purpose waveguide / heatsink structure that directs sound from the speakers to an outside of the device and to dissipate heat from the electronic components to the outside of the device.SOLUTION: A compact voice-activated electronic device 404 comprises: a speaker assembly 436; a bottom housing 408 on which the speaker assembly is mounted; an upper housing 406 serving as a speaker grill; a printed circuit board 432 on which electronic components are mounted; and an acoustic waveguide / heatsink 434 configured to direct sound from the speaker assembly to an outside of the voice-activated electronic device and to dissipate heat generated in the electronic components to the outside of the device.SELECTED DRAWING: Figure 4E

The invention discloses a method for manufacturing a flexible circuit board with a high-precision induction circuit, and the method comprises the steps: taking a flexible copper-clad plate to manufacture a first coil circuit pattern and a bonding pad pattern, and carrying out the AOI detection, and forming a first flexible core board; windowing the first cover film corresponding to the bonding pad pattern, and attaching the first cover film to the first flexible core plate to form an attached plate; a single-face copper-clad plate is taken to manufacture a second coil circuit pattern, and a second flexible core plate is formed; the first coil circuit pattern corresponds to the second coil circuit pattern; manufacturing an adhesive layer for a second flexible core plate, and attaching the second flexible core plate to the attaching plate to form a flexible back attaching plate; carrying out induction circuit testing and post-process processing to form a flexible circuit board; aOI detection and a four-wire circuit testing machine are combined to form dual detection, so that the comprehensiveness and the accuracy of detection are improved; the glue layer is arranged to bond the second flexible core plate and the attaching plate, a physical supporting effect is provided for the detection process, and a processing basis is provided for subsequent depth-controlled laser cutting board splitting structure operation.