88results about How to "Reduce crosstalk" patented technology

This invention provides a coolant flow channel plate, relating to the technical field of vehicle thermal management. It includes a cover plate fixed to the top of a main board, with the main board and cover plate welded together at their side edges to form an internal flow channel cavity. The cover plate has refrigeration unit inlet / outlet assemblies on its surface. The main board has, from left to right, a heater pump mounting port, a battery pump mounting port, and a motor pump mounting port. The circuits between the heater pump and battery pump mounting ports, and between the heater pump and motor pump mounting ports, within the internal flow channel cavity are each equipped with a first anti-heat-spreading section. The circuit between the motor pump and battery pump mounting ports forms a variable-diameter section, with a second anti-heat-spreading section at its front end. A guide section is provided on the circuit of the battery pump mounting port. This invention solves the problem of lacking anti-heat-spreading structures at the connection points of circuits in different temperature ranges, achieving the technical effects of reducing vehicle weight, reducing vehicle connection piping, reducing heat loss in the thermal management system, and improving thermal management efficiency.

The application relates to the technical field of image sensors, and provides an image sensor and a manufacturing method.The image sensor comprises a semiconductor substrate, a plurality of pixel regions, a metal interconnection layer and a blocking structure.The blocking structure is composed of an isolation structure arranged in the semiconductor substrate, a crosstalk modulation structure and a first contact hole structure which are sequentially arranged in a dielectric layer and correspond to the isolation structure.The blocking structure can form an effective light blocking wall structure on one hand, preventing light of one pixel region from being reflected by the metal interconnection layer and crosstalking into an adjacent pixel region; and on the other hand, the blocking structure can prevent over-etching of the isolation structure during processing of the first contact hole structure, thereby reducing the enrichment and diffusion of charges in the isolation structure, effectively improving the dark current performance of the device, and simultaneously reducing optical crosstalk and electrical crosstalk of the image sensor, which is conducive to improving the imaging quality of the image sensor.

This application discloses a sensor assembly, including an insulating substrate comprising a first surface and a second surface disposed opposite to each other; a surface acoustic wave (SAW) pressure sensor disposed on the first surface, the SAW pressure sensor comprising a piezoelectric lithium niobate layer and two pairs of interdigital transducers disposed on the surface of the piezoelectric lithium niobate layer, the piezoelectric lithium niobate layer having a cavity and a corresponding thinned sensitive membrane region, the two pairs of interdigital transducers being disposed around the thinned sensitive membrane region in mutually perpendicular directions; and a platinum resistance temperature sensor and an interdigital capacitance humidity sensor disposed on the second surface. By having the SAW pressure sensor, platinum resistance temperature sensor, and interdigital capacitance humidity sensor disposed opposite to each other on the insulating substrate, combined with the cavity formed on the piezoelectric lithium niobate layer, and the two pairs of interdigital transducers disposed in mutually perpendicular directions, the detection accuracy is improved and crosstalk is reduced.

This utility model relates to the field of circuit board packaging technology, and in particular to a circuit board and a solid-state drive. The circuit board provided by this utility model sets high-speed differential line pairs as inner layer traces, and uses vias / through holes through the pads of the high-speed differential lines to electrically connect the high-speed connector and the controller. Since the vias / through holes only need to pass through the pads, the number of wiring layers through which the vias / through holes pass is greatly reduced, which makes it possible to use back drilling process to better reduce the number of residual posts and shorten the length of residual posts, effectively reduce signal reflection or crosstalk, and improve signal quality.

The application provides a heart rate detection module and an electronic device; wherein the heart rate detection module comprises a light emitting element, a light receiving element and a Fresnel film; the light emitting element and the light receiving element are arranged in optical isolation, the Fresnel film is located on the same side of the light emitting element and the light receiving element, and the light emitting surface of the light emitting element faces the Fresnel film; the Fresnel film has a light absorbing medium therein, and the light absorbing medium is located between the light emitting element and the light receiving element in the direction perpendicular to the Fresnel film. According to the heart rate detection module and the electronic device provided by the application, the crosstalk phenomenon of the detection light emitted by the light emitting element in the Fresnel film can be reduced / attenuated, that is, the light leakage in the Fresnel film can be effectively inhibited to weaken the light noise of the heart rate measurement, and the signal-to-noise ratio of the heart rate detection module can be improved.

This invention provides a specially structured PCB for a 77GHz millimeter-wave radar used in automobiles. The PCB includes a copper foil metal shielding layer, vias, high-frequency signal lines, grounding protection lines, low-frequency signal lines, power supply lines, and intermediate-frequency signal lines. By classifying and arranging signal transmission lines according to frequency in different areas and employing corresponding line structures and protection measures, this invention effectively reduces crosstalk between different signal lines, improves the accuracy and stability of signal transmission, and thus enhances the radar's detection accuracy. The metal shielding layers covering the top and bottom layers of the PCB, along with the metal shielding frame at the edges, form a robust electromagnetic shielding structure, effectively shielding against external electromagnetic interference and improving the radar board's anti-interference capability in complex electromagnetic environments, ensuring the normal operation of the radar system.

The invention relates to the technical field of semiconductors, and discloses a double-gate two-dimensional transistor for multifunctional storage and logic calculation, which comprises a substrate, a floating gate layer, a tunneling layer, a channel layer, a top gate insulating layer, a bottom gate electrode, a top gate electrode, a source electrode and a drain electrode, the substrate is an N-type single-polished silicon oxide wafer, the floating gate layer is a graphene layer, the tunneling layer is a hexagonal boron nitride layer, the channel layer is a molybdenum disulfide layer, and the top gate insulating layer is a hexagonal boron nitride layer; the floating gate layer is arranged on the upper surface of the substrate, the tunneling layer covers the upper surface of the floating gate layer, the channel layer is arranged on the upper surface of the tunneling layer, and the top gate insulating layer covers the upper surface of the channel layer. By means of a heterogeneous stack structure of h-BN / MoS graphene and a double-gate independent regulation and control mechanism, single device integration of light perception, nonvolatile storage and logic operation is achieved, additional splicing links of sensing, storage and calculation units in a traditional system are omitted, and a hardware architecture is greatly simplified.

The application discloses a cut-off filter based on a microstructure array, which comprises a substrate, a dielectric film and a two-dimensional grating array structure arranged on the substrate in sequence; the substrate material is a high-refractive-index material; the dielectric film material is a low-refractive-index material; and the two-dimensional grating material is a high-refractive-index material. The application further provides a preparation method of the cut-off filter based on the microstructure array. The preparation method of the cut-off filter based on the microstructure array is simple in preparation, low in cost and convenient for large-scale and batch production. Therefore, the application can be widely applied in the fields of surveying and mapping remote sensing, environmental monitoring, sensing detection and clinical image analysis.

The utility model provides a backboard connector belongs to connecting device field, this backboard connector includes insulator, sets up signal terminal and ground shield piece on insulator, signal terminal sets up in differential pair form, differential pair is arranged along the longitudinal direction array on the insulator, signal terminal includes the signal fish eye of plug -in part and the one end of plug -in part, each differential pair is all configured with the shielded cavity surrounded by ground shield piece, two plug -in parts in the same differential pair are located in the same shielded cavity, the shielded cavity has the symmetry axis of longitudinal extension and the symmetry axis of lateral extension, the center of two plug -in parts in the same differential pair is located on both sides of the symmetry axis of longitudinal extension, also is located on both sides of the symmetry axis of lateral extension, two plug -in parts are centrally symmetric arrangement with the intersection point of two symmetry axes as the center. The utility model improves the shielding effect of backboard connector.

The application provides a display device and an electronic equipment, the display device comprises a backlight module, the backlight module comprises a lamp plate, a plurality of light emitting assemblies and a supporting assembly, the lamp plate is arranged at intervals with the supporting assembly, the plurality of light emitting assemblies are arranged in an array on the surface of the lamp plate facing the supporting assembly, the supporting assembly is formed with a plurality of light transmission areas corresponding to the light emitting assemblies, each light transmission area comprises a dielectric reflection layer and a light transmission substrate, the dielectric reflection layer is arranged on the periphery of the light transmission substrate, and the position of the light transmission substrate corresponds to the position of the light emitting assembly. The light transmission substrate transmits part of the light emitted by the light emitting assembly and emits from the light transmission area, the dielectric reflection layer reflects part of the light irradiated to the dielectric reflection layer by the light emitting assembly and reflects the light to the light transmission area corresponding to the light emitting assembly. Therefore, the display device blocks the crosstalk path between adjacent light emitting assemblies through the dielectric reflection layer, thereby preventing the light crosstalk between adjacent light emitting assemblies and improving the uniformity of the backlight light.

This invention proposes a method to reduce crosstalk from vertical drive pulses in a TDI CCD. The method includes: controlling the TDI CCD to be in continuous transfer mode and acquiring the continuous transfer timing signal in this mode; adjusting the phases of multiple vertical drive pulses based on a preset number of vertical transfer phases within the horizontal transfer row period, thereby generating multiple vertical drive level transition moments; and controlling the horizontal drive pulses and reset pulses to be in a horizontal transfer stopped state based on the vertical drive level transition moments, thereby reducing crosstalk generated by the vertical drive pulse transition edges on the currently horizontally readout pixels. This method eliminates the reliance on independent debugging of individual circuits, achieving active suppression of crosstalk at its source, possessing good reproducibility and portability, and fully meeting the engineering consistency requirements of mass production of modules.

The invention relates to an ear level part (2) for a hearing device (1), the ear level part (2) comprising: - a body (3) containing at least two microphones (13) acoustically connected to at least two microphone openings (5), the at least two microphone openings (5) arranged in a microphone line (ML), the body (3) further comprising a flange (12), wherein a receiver (14) is arranged within the body (3), wherein the flange (12) has a sound exit (17) for the receiver (14), - an upper tab (8) generally protruding in a lateral direction from the body (3) and configured to be positioned above the tragus (22) of a user's ear (20) and a lower tab (9) generally protruding in a lateral direction from the body (3) and configured to be positioned beneath the tragus (22) of the user's ear (20) thereby aligning the ear level part (2) in such a way that the microphone line (ML) is horizontal or deviates by an angle (A) of at most + / - 15 degrees from a horizontal direction (HD) when the user maintains an upright head posture and / or in such a way that the microphone line (ML) lies on the tragus (22) and / or in such a way that a perpendicular on the microphone line (ML) in the middle between the two microphones lies on the antitragus (24) of the user's ear (20).

This utility model relates to the field of vacuum pump technology, specifically a reciprocating vacuum pump. It includes: a first housing with an inlet and an outlet; a first cavity formed on the first housing and connected to the inlet; a second cavity formed on the first housing and connected to the outlet; a valve plate located at the lower end of the first housing and equipped with a one-way valve; a second housing located at the lower end of the valve plate and equipped with a third cavity and a fourth cavity; the third cavity is connected to the first and second cavities via a one-way valve, and the fourth cavity is connected to the first and second cavities via a one-way valve. A cylindrical cavity is provided inside the second housing, with its two ends connected to the third and fourth cavities respectively, and a piston is slidably disposed within the cylindrical cavity. A rotatable crank and a slidable slide rod are provided inside the second housing, with a connecting rod between the crank and the slide rod, and the slide rod connected to the piston. The reciprocating motion of the piston can generate a vacuum, resulting in higher working efficiency.

This application relates to a semiconductor device and a method for fabricating the same. The semiconductor device includes: a first substrate, comprising a main body portion and at least one protrusion disposed on the main body portion; at least two second substrates disposed on the main body portion, with a protrusion located between any two adjacent second substrates; at least two isolation regions, corresponding one-to-one within the at least two second substrates; each isolation region enclosing a device region within its corresponding second substrate; at least two first well regions, corresponding one-to-one with the at least two second substrates, each first well region being located within its corresponding device region on the second substrate; and a first conductive structure electrically connected to the first substrate; wherein the first substrate, second substrates, and first well regions are of a first conductivity type, and the doping concentration of the first substrate is greater than the doping concentration of the first well regions; the isolation regions are of a second conductivity type. This application can improve the latch-up effect of semiconductor devices.

This invention discloses a self-service printing device, comprising a housing with an observation window and a temporary storage mechanism and a release mechanism located within the housing. The temporary storage mechanism consists of multiple parallel and inclined support units arranged sequentially along the normal direction of the observation window; the front support unit and its paper obscure the content area of ​​the rear paper, with only the side serial number area exposed. Each support unit has a support plate, a holding member, and a conductive bead. The release mechanism has electrical contacts aligned with the conductive beads. When the contact is activated, it drives the corresponding holding member to switch from holding to releasing, allowing the target paper to slide out along the support plate. This structure achieves physical obscuring of the content area and visibility of the serial number during the temporary storage stage, supporting accurate single-page release; the side serial number is permanently exposed for easy identification and position mapping; the number of contacts is small, the wiring is simple, and the paper is fed by gravity, reducing the risk of missorting and jamming, improving confidentiality, efficiency, and reliability; the structure is modular and easy to maintain.

The invention belongs to the technical field of electronic circuit design, and discloses a differential signal Fanout structure for improving the integrity of a high-speed signal, and the structure comprises a PCB substrate; the differential signal pair is arranged on the PCB substrate, the differential signal pair comprises a P signal wire and an N signal wire, and the P signal wire and the N signal wire are respectively used for connecting chip pins; and a ground shield unit. By adopting layered fan-out and large-spacing decoupling design, crosstalk of high-speed differential signals is remarkably reduced, the limitation that tight coupling wiring must be conducted on the same layer in a traditional Fanout structure is broken through, P signals and N signals are arranged on the surface layer and the inner layer of a PCB respectively, and therefore the signal transmission efficiency is improved. By means of isolation of a vertical space, maximization of horizontal projection spacing is achieved (a decoupling spacing area is formed), inter-line coupling capacitance is remarkably reduced, far-end crosstalk is remarkably reduced through the structure, and the signal-to-noise ratio and eye pattern opening of a high-speed link are improved.

The utility model discloses a grounding structure, an electric connector and a connector assembly, belonging to the connector field, the grounding structure is used for grounding a contact member, and comprises a first grounding member and a second grounding member, the first grounding member is inserted in the second grounding member, the first grounding member is electrically connected with the second grounding member, and the second grounding member is electrically connected with the electric connector. And the second grounding piece and / or the first grounding piece are / is electrically connected with the grounding unit of the contact piece. According to the grounding structure, the electric connector and the connector assembly provided by the utility model, the first grounding piece and the second grounding piece are in plug-in fit to form a low-impedance conduction path and a closed shielding loop, so that stable connection and vibration impact resistance can be realized, interference current can be discharged, electromagnetic coupling and crosstalk can be reduced, and the stability and accuracy of signal transmission can be effectively guaranteed.

The invention discloses a broadband dual-channel magnetic coupling wireless power and data transmission slip ring, which adopts a non-contact magnetic coupling mode and solves the problems of short service life, unstable transmission, frequent maintenance and the like caused by mechanical wear of a traditional contact slip ring. Through the bipolar structure of the data coupling antenna, the magnetic flux sum of an inner ring and an outer ring is zero, and complete decoupling of power and data airspace is realized; the bandwidth of a data channel is expanded by adopting multi-stage L-shaped impedance matching, and mutual inductance of power and data coupling parts is stable in the 360-degree rotation process. The slip ring improves the transmission reliability, the rotation adaptability and the data throughput capacity, and is suitable for rotary connection systems in the fields of petroleum drilling, aerospace equipment and the like.

This invention belongs to the field of image transmission fiber technology and discloses a bend-insensitive high-resolution image transmission fiber and its fabrication method. The image transmission fiber provided by this invention comprises several image transmission cores and a co-cladding layer between the image transmission cores; each image transmission core includes, from the inside out, a core layer, a recessed layer, an inner cladding layer, and a light-absorbing layer; the light-absorbing layer is quartz glass containing absorber ions and fluorine. The fabrication method of the image transmission fiber provided by this invention includes preparing a light-absorbing core rod, drawing the light-absorbing core rod to obtain a light-absorbing capillary rod, stacking several light-absorbing capillary rods in a pure quartz glass sleeve to obtain an image transmission fiber preform, and drawing the image transmission fiber preform to obtain a bend-insensitive high-resolution image transmission fiber. This invention can improve the imaging resolution of the image transmission fiber, and the fabrication method has the advantages of simple and convenient process and strong production stability.

The utility model relates to an anti-pad structure for optimizing a PCB high-speed via hole, which comprises a via hole pile, the via hole pile penetrates through a multi-layer PCB, and two ends of the via hole pile are respectively connected with differential signal pair wires; the combined elliptical anti-bonding pads are distributed at the wire inlet and the wire outlet of the via hole pile and are composed of a large elliptical bonding pad and a small elliptical bonding pad which are tangent, the long axis length of the large ellipse is D1, the short axis length of the large ellipse is d1, the long axis length of the small ellipse is D2, and the short axis length of the small ellipse is d2; the single circle anti-bonding pad is arranged in the copper column area of the via hole pile, the diameter of the single circle anti-bonding pad is d3, and d3 is larger than the diameter d0 of the via hole and smaller than d1. According to the anti-bonding pad structure for optimizing the PCB high-speed via hole, the combined elliptical anti-bonding pad realizes impedance gradual change from differential routing to a copper column area by means of a specific size proportion, and signal reflection at the two ends of a via hole pile is reduced; a single circle anti-bonding pad optimizes impedance in a copper column area and is matched with a U-shaped shunting groove to shield electromagnetic interference, and meanwhile, a diversion groove is communicated with the U-shaped shunting groove to form a three-stage backflow path, so that crosstalk is reduced.

The application discloses an electric connector and a connector combination, the electric connector comprising: a plurality of first conductive terminals arranged along the left-right direction, the first conductive terminals having a first contact part, a first connecting part and a first lead-in part connected in sequence, the first contact part being located in front of the first lead-in part, the plurality of first conductive terminals comprising a first differential signal pair, a first ground terminal and a second differential signal pair arranged in sequence, the first contact part of the first differential signal pair and the first contact part of the second differential signal pair being arranged staggered along the front-back direction, the first contact part of the first ground terminal being between the first contact parts of the two, and the first lead-in part of the first differential signal pair and the first lead-in part of the second differential signal pair being arranged staggered along the front-back direction, the first lead-in part of the first ground terminal being between the first lead-in parts of the two, the distance between the signal pairs being enlarged, thereby reducing crosstalk and improving high frequency.

The invention provides a semiconductor packaging structure and a manufacturing method thereof. The semiconductor packaging structure comprises the components of a substrate which is provided with a first surface and a second surface which are oppositely arranged along the thickness direction of the substrate, the first surface is provided with a groove, the substrate is also internally provided with a first via hole, and the first via hole penetrates through the first surface and the second surface and is located at the side of the groove; the first shielding layer covers the bottom wall and the side wall of the groove; the chip is arranged in the groove, the chip is provided with a pin, and the pin is electrically connected with the first via hole; and the second shielding layer covers at least part of the surface, deviating from the bottom wall of the groove, of the chip. The semiconductor packaging structure is used for achieving the effect of improving magnetic shielding comprehensiveness and storage density.

The utility model discloses a shielding structure and a high frequency high speed signal connector, a shielding structure includes ground wire board and with ground wire terminal of ground wire board connection, the ground wire board on corresponding ground wire terminal place is provided with metal convex structure, the ground wire terminal is provided with the first recess that adapts with metal convex structure, metal convex structure is in the first recess with ground wire board and ground wire terminal connection is connected. In the utility model, through the cooperation of metal convex structure and first recess, the connection of ground wire terminal and ground wire board is realized, the contact resistance is reduced, the stability of connection is improved, the shielding effect is enhanced, and the growing high speed data transmission demand can be better satisfied.

The application provides a tile phased array transceiving assembly integrating two-dimensional and difference beam forming networks, which comprises a fastening screw, a radio frequency and port connector, a radio frequency elevation port connector, a radio frequency azimuth port connector, a low frequency connector, an upper cavity, a welding ring, a pin, a lower cavity, a high and low frequency mixed pressure printed board, a radio frequency branch port connector, a multi-channel amplitude and phase control chip and a transceiving integrated multifunctional chip, the multi-channel amplitude and phase control chip and the transceiving integrated multifunctional chip are attached on the high and low frequency mixed pressure printed board, the radio frequency branch port connector is installed on the upper cavity, a mounting position of a wave absorbing material is reserved on the upper cavity, the low frequency connector, the pin, the radio frequency and port connector, the radio frequency elevation port connector, the radio frequency azimuth port connector and the high and low frequency mixed pressure printed board are installed on the lower cavity. The application integrates two-dimensional and difference beam forming networks, so that the transceiving assembly has the advantages of high integration, light weight, low assembly difficulty, high airtightness packaging and small size.

This disclosure describes a sensing capability resistant to crosstalk. A current sensor is provided for a target conductor among a plurality of conductors. The current sensor includes at least one magnetic sensor configured to provide two signals representing two different parameters of a field, the two different parameters being different components or their directional derivatives (e.g., gradients). The current sensor also includes a processor configured to derive a signal indicating a current based on a linear combination of a first signal and at least a second signal. At least one of these signals is weighted by coefficients that are constants selected based on the distance between the sensor and at least one of the plurality of conductors in at least a first or second direction. The coefficients are selected to reduce the contribution of parasitic magnetic fields to the signal indicating a current in the first conductor, wherein the parasitic magnetic field is generated by at least one other conductor.

The utility model discloses an OLED display structure, which comprises an array substrate, a group of pixel units are arranged on the array substrate, each pixel unit comprises an anode, an organic light-emitting layer arranged on the anode and a cathode layer arranged on the organic light-emitting layer, a pixel definition layer is arranged around the anode of the pixel unit, and the cathode layer is arranged on the organic light-emitting layer. A partition structure used for disconnecting the organic light-emitting layer is arranged corresponding to the pixel definition layer, and a reflection structure used for increasing reflected light is arranged on the pixel definition layer. The OLED display is reasonable in structural design, the partition structure is used for disconnecting the OLED organic layer, the reflection structure is used for reflecting large-angle light, and the light emitting efficiency of the OLED is improved; the opening of the partition layer above the anode is smaller than that of the reflecting layer and plays a light extraction role; in the anode gap, the opening of the partition layer is larger than the opening of the reflecting layer, and the partition layer and the reflecting layer form an undercut structure which is used for disconnecting an electric conduction layer in the organic film layer and reducing crosstalk of the device.

This invention provides a demodulation method and system for free-space optical communication links based on helical fractional orbital angular momentum. N data streams are loaded onto a Gaussian beam, and at least one modulated beam of helical fractional OAM (Optical Aspect-Oriented Motion) is generated through a spatial optical phase modulation module. After coaxial beam combining, the beam is emitted in free space and imaged onto the demodulation phase modulation module plane via an optical relay imaging system. A conjugate helical phase map is loaded to demodulate the target OAM, and the focusing optics module is adjusted to couple the peak of the target OAM beam into a single-mode fiber, while non-target OAM beams are isolated. After verifying the demodulation isolation, the demodulation phase map is switched to sequentially recover each data stream. This invention achieves hybrid multiplexing of helical fractional and integer OAM, and achieves a mode isolation of ≥5dB through a dual isolation mechanism of phase conjugate demodulation and spatial optimal focusing. This improves fiber coupling efficiency and communication link robustness, significantly expanding the channel capacity and spectral efficiency of free-space optical communication.

The invention discloses a terahertz defect detection device based on a multiple-input-multiple-output array, and relates to the technical field of testing. The device comprises a portal frame, a transmission table, a defect detection array front end, a microwave signal generation module and a data acquisition and control module, the defect detection array front end is fixed on the portal frame, is connected with the microwave signal generation module and is used for detecting defects of a sample to be detected, and the data acquisition and control module is connected with the transmission table. Comprising a terahertz signal generating array, a terahertz signal receiving array and a transmitting and receiving antenna module, and array elements in the terahertz signal generating array and the terahertz signal receiving array are arranged at equal intervals in a staggered mode; the transmission table is positioned below the front end of the defect detection array and is used for placing a sample to be detected, and the portal frame, the transmission table, the front end of the defect detection array and the microwave signal generation module are respectively connected with the data acquisition and control module. The device disclosed by the invention is high in integration level, high in stability and high in imaging efficiency, and realizes rapid, efficient and nondestructive detection on the defects of the non-metallic material.

The invention discloses a low-crosstalk long-distance sensing integrated device and a very-low-frequency sensing method, and relates to the technical field of fusion of optical fiber sensing and optical fiber communication. The device comprises a laser, a coupler, a communication modulation device, a sensing modulation device, an optical fiber transmission and relay link, a communication receiving device, a sensing receiving device and a signal processing device. The communication modulation device adopts digital subcarrier multiplexing and reserves a guard interval in a frequency spectrum center, and residual carrier filtering is combined to reduce the inductance crosstalk; the sensing modulation device realizes high-extinction-ratio pulses through a cascade light modulator, and the signal-to-noise ratio is improved. The optical fiber link adopts a bidirectional amplification relay module to synchronously amplify forward and backward signals so as to realize ultra-long distance transmission. The signal processing device carries out high-density sampling and space-time dimension fusion on the sensing beat frequency signals, and very low frequency vibration information is effectively extracted. According to the invention, common-light-source, low-crosstalk, long-distance, very-low-frequency and high-sensitivity integrated transmission and detection of communication and sensing signals are realized.

The utility model discloses a kind of ball grid array packaging structure and PCB of guaranteeing impedance continuity, by the asymmetric spacing of control signal unit and two side ground unit, so that signal unit is offset to one side ground unit, the trace channel of the other side of signal unit is widened, the trace channel of widened not only can double trace, but also can be with thicker line width, so that the characteristic impedance of differential line is consistent on signal transmission path, significantly reduce signal reflection and waveform distortion risk, especially suitable for high-frequency, high-speed signal transmission scene, can ensure signal integrity.