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3026results about How to "Reduce crosstalk" patented technology
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Method and apparatus for reducing coupling between signals
InactiveUS7003338B2Reduces crosstalk and other contaminationCrosstalk in the multi-channel demodulator is reducedDiagnostic recording/measuringOptical sensorsComputer moduleSignal processing
A method and an apparatus for separating a composite signal into a plurality of signals is described. A signal processor receives a composite signal and separates a composite signal in to separate output signals. Feedback from one or more of the output signals is provided to a configuration module that configures the signal processor to improve a quality of the output signals. In one embodiment, the signal processor separates the composite signal by applying a first demodulation signal to the composite signal to generate a first output signal. In one embodiment, the signal processor also applies a second demodulation signal to the composite signal to generate a second output signal. In one embodiment, a phase and / or amplitude of the first demodulation signal and a phase and / or amplitude of the second demodulation signal are selected to reduce crosstalk. In one embodiment, the composite signal is obtained from a detector in a system for measuring one or more blood constituents.
Owner:CERCACOR LAB INC
Low noise cable providing communication between electronic sensor components and patient monitor
ActiveUS9245668B1Reduce crosstalkNot hindering sensor placementDiagnostics using lightConductive materialLow noiseEngineering
A physiological measurement system can include a low noise patient cable that connects a monitor and a noninvasive optical sensor. The cable has a plurality of emitter wires configured to communicate a drive signal between the monitor and at least one emitter. The cable also has a plurality of detector wires configured to communicate a physiological signal between at least one detector responsive to the emitter and the monitor. The emitter and detector wires are orthogonally disposed so that crosstalk between the two functionally different wires is mitigated.
Owner:MASIMO CORP
Magnetic element utilizing spin-transfer and half-metals and an MRAM device using the magnetic element
InactiveUS6958927B1Reduce high switching currentReduce power consumptionMagnetic-field-controlled resistorsSemiconductor/solid-state device manufacturingHigh densityHalf-metal
A magnetic element that can be used in a memory array having high density includes a pinned layer, a half-metallic material layer, a spacer (or a barrier) layer and a free layer. The half-metallic material layer is formed on the pinned layer and preferably has a thickness that is less than about 100 Å. The half-metallic material layer can be formed to be a continuous layer or a discontinuous on the pinned layer. The spacer (or barrier) layer is formed on the half-metallic material layer, such that the spacer (or barrier) layer is nonmagnetic and conductive (or insulating). The free layer is formed on the spacer (or barrier) layer and has a second magnetization that changes direction based on the spin-transfer effect when a write current passes through the magnetic element.
Owner:SAMSUNG SEMICON
Single inductor dual output buck converter with frequency and time varying offset control
ActiveUS7061214B2Convenient sourcePromote conversionDc-dc conversionElectric variable regulationBuck converterTransverter
A single-inductor dual-output buck converter and control method that facilitates power conversion by converting a single DC power source / supply into two separate DC outputs, each of which can be configured to provide a selected / desired voltage by selection of respective duty cycles. The topology of the inverter includes a pair of diodes or switches that can selectively re-circulate inductor current. The converter is generally operated at a fixed frequency with four stages of operation. A first and third stage of operation provide power to a first and second output, respectively. A second and fourth stage of operation re-circulate inductor current and can partially recharge a battery type power source. The power output for each stage (voltage and current) can be selectively obtained by computing and employing appropriate time periods for the stages of operation that correspond to appropriate duty cycles.
Owner:TEXAS INSTR INC
High performance imaging system for diffuse optical tomography and associated method of use
ActiveUS7983740B2High bandwidthImprove performanceDiagnostics using tomographySensorsOptical tomographyImaging quality
A high performance imaging system for diffuse optical tomography is disclosed. A dense grid utilizing sources, e.g., light emitting diodes (“LEDs”), that achieve high performance at high speed with a high dynamic range and low inter-channel crosstalk are complemented by a system of discrete, isolated receivers, e.g., avalanche photodiodes (“APDs”). The source channels have dedicated reconfigurable encoding control signals, and the detector channels have reconfigurable decoding, allowing maximum flexibility and optimal mixtures of frequency and time encoding and decoding. Each detector channel is analyzed by dedicated, isolated, high-bandwidth receiver circuitry so that no channel gain switching is necessary. The resulting improvements to DOT system performance, e.g., increased dynamic range and decreased crosstalk, enable higher density imaging arrays and provide significantly enhanced DOT image quality. A processor can be utilized to provide sophisticated three dimensional modeling as well as noise reduction.
Owner:WASHINGTON UNIV IN SAINT LOUIS
Self-aligned filter for an image sensor
ActiveUS20090200622A1Without increasing overall heightCrosstalk among pixels may be reducedSolid-state devicesSemiconductor/solid-state device manufacturingElectrical conductorSemiconductor
An image sensor includes at least one photosensitive element disposed in a semiconductor substrate. Metal conductors may be disposed on the semiconductor substrate. A filter may be disposed between at least two individual metal conductors and a micro-lens may be disposed on the filter. There may be insulator material disposed between the metal conductors and the semiconductor substrate and / or between individual metal conductors. The insulator material may be removed so that the filter may be disposed on the semiconductor substrate.
Owner:OMNIVISION TECH INC
Method and apparatus for calibration to reduce coupling between signals in a measurement system
ActiveUS20180153448A1Reduces crosstalk and other contaminationCrosstalk in the multi-channel demodulator is reducedDiagnostic recording/measuringOptical sensorsData setCoupling
Owner:MASIMO CORP
System for inductive transfer of power, communication and position sensing to a guideway-operated vehicle
InactiveUS6499701B1The method is simple and effectiveSimple and effective structureSpeed controllerElectric machinesElectricityEngineering
Inductive transfer methods and structures combine, in a single system, at least two of the three functions of transferring power, communicating data, and sensing position with a vehicle on a guideway. A set of conductors is installed on the guideway to inductively couple a multiplicity of diverse signals with a corresponding set of conductors on the vehicle. The vehicle may be moving or stationary, and signals may be coupled in one or both directions. Coupling is effected without direct electrical contact, through a common region or gap, and the structures provide suitable and precise air gap control for the conductors effecting coupling of each signal. In addition, the windings are arranged with a topology and / or symmetry to cancel crosstalk between different signals.
Owner:MAGNEMOTION INC
Transmission unit with reduced crosstalk signal
ActiveUS20130015922A1Reduce crosstalk occurredHigh dielectric constantCurrent interference reductionElectrical conductorBiomedical engineering
A transmission unit with reduced crosstalk signal includes a first conductor group having at least one first conductor surrounded by a first sheath and at least one second conductor surrounded by a second sheath. The first and the second conductor are axially arranged corresponding to one another. The first sheath has a dielectric coefficient higher than that of the second sheath, so that a difference in dielectric property exists between the first and the second conductor to enable reduction of crosstalk occurred during high-speed signal transmission over the transmission unit.
Owner:YES WAY ENTERPRISE CORP
High-density, robust connector
ActiveUS20070021002A1Promote broadside couplingHigh terminal densityCoupling protective earth/shielding arrangementsInternal cavityElectrical and Electronics engineering
A high speed connector includes a plurality of wafer-style components in which two columns of conductive terminals are supported in an insulative support body, the body including an internal cavity disposed between the two columns of conductive terminals. The terminals are arranged in horizontal pairs, and the internal cavity defines an air channel between each horizontal pair of terminals arranged in the two columns of terminals. The terminals are further aligned with each other in each row so that horizontal faces of the terminals in the two rows face each other to thereby promote broadside coupling between horizontal pairs of terminals.
Owner:MOLEX INC
High speed, high density electrical connector with selective positioning of lossy regions
ActiveUS7581990B2Reduce crosstalkSelective positioning of lossy regionsElectrically conductive connectionsTwo-part coupling devicesUltrasound attenuationElectrical conductor
An electrical interconnection system with high speed, high density electrical connectors. The connectors incorporate electrically lossy material, selectively positioned to reduce crosstalk without undesirably attenuating signals. The lossy material may be molded through ground conductors that separate adjacent differential pairs within columns of conductive elements in the connector. However, regions of lossy material may be set back from the edges of the ground conductors to avoid undesired attenuation of signals. Also, the lossy material may be positioned in multiple regions along the length of signal conductors. The regions may be separated by holes, notches, gaps or other openings in the lossy material, which can be simply formed as part of a molding operation.
Owner:AMPHENOL CORP
High resolution 2D-3D switchable autostereoscopic display apparatus
ActiveUS20070008406A1Reduce degradationReduce crosstalkTelevision system detailsColor television detailsPhysicsPolarizer
A high resolution 2D-3D switchable autostereoscopic display apparatus includes: a backlight unit emitting light; a polarizer sheet changing the light emitted from the backlight unit so that the light has only a specific polarization direction; a polarization switch converting the direction of the polarization of incident light; a birefringent element array comprising a plurality of alternating first and second birefringent elements and changing the polarization direction of incident light so that the polarization of light transmitted by the first birefringent elements is perpendicular to the polarization of light transmitted by the second birefringent elements; a lenticular lens sheet separating and emitting incident light to a first eye viewing zone and a second eye viewing zone; and a display panel displaying an image.
Owner:SAMSUNG ELECTRONICS CO LTD
Seismic acquisition using narrowband seismic sources
ActiveUS20120155217A1Reduce crosstalkSpeed up the processSeismic data acquisitionSeismic signal processingMonochromatic colorFull waveform
There is provided herein a system and method of seismic data collection for land and marine data that utilizes narrowband to monochromatic low-frequency non-impulsive sources designed to optimize the ability of migration / inversion algorithms to image the subsurface of the Earth, in particular, full-waveform inversion.
Owner:BP CORP NORTH AMERICA INC
High-frequency oscillation element, magnetic information recording head, and magnetic storage device
ActiveUS20050023938A1Increase temperatureIncrease speedPiezoelectric/electrostriction/magnetostriction machinesSolid-state devicesMagnetic storageResonance
A high-frequency oscillation element has a ferromagnetic material which exhibits thermal fluctuation of magnetization and generates spin fluctuations in conduction electrons, a nonmagnetic conductive material which is laminated on the first magnetic material and transfers the conduction electrons, a magnetic material which is laminated on the nonmagnetic conductive material, generates magnetic resonance upon injection of the conduction electrons, and imparts magnetic dipole interaction to magnetization of a neighboring magnetic area by means of magnetic vibration stemming from the magnetic resonance, a first electrode electrically coupled with the first magnetic material, and a second electrode electrically coupled with the second magnetic material.
Owner:KK TOSHIBA
Magnetic element utilizing spin-transfer and half-metals and an MRAM device using the magnetic element
InactiveUS7227773B1Reduce high switching currentHigh densityMagnetic-field-controlled resistorsSemiconductor/solid-state device manufacturingHigh densityHalf-metal
A magnetic element that can be used in a memory array having high density includes a pinned layer, a half-metallic material layer, a spacer (or a barrier) layer and a free layer. The half-metallic material layer is formed on the pinned layer and preferably has a thickness that is less than about 100 Å. The half-metallic material layer can be formed to be a continuous layer or a discontinuous on the pinned layer. The spacer (or barrier) layer is formed on the half-metallic material layer, such that the spacer (or barrier) layer is nonmagnetic and conductive (or insulating). The free layer is formed on the spacer (or barrier) layer and has a second magnetization that changes direction based on the spin-transfer effect when a write current passes through the magnetic element.
Owner:SAMSUNG SEMICON
Method of displaying three-dimensional image data and an apparatus of processing three-dimensional image data
InactiveUS20100238274A1Reduce crosstalkReducing luminance deteriorationStatic indicating devicesSteroscopic systemsComputer graphics (images)3d image
A method is provided that includes receiving a three-dimensional (3D) image signal, generating image data from the 3D image signal, wherein said image data includes a plurality of left image data and a plurality of right image data, configuring the generated 3D image data to a 3D format, wherein the configured 3D image data includes black data and displaying the configured 3D image data at an output frequency, wherein the output frequency is synchronized with a shutter glasses.
Owner:LG ELECTRONICS INC
High-density, robust connector with castellations
ActiveUS20070021001A1High densityEnhanced couplingCoupling protective earth/shielding arrangementsInternal cavityElectrical isolation
A high speed connector includes a plurality of wafer-style components in which two columns of conductive terminals are supported in an insulative support body, the body including an internal cavity disposed between the two columns of conductive terminals. The terminals are arranged in horizontal pairs, and the internal cavity defines an air channel between each horizontal pair of terminals arranged in the two columns of terminals. The pairs of terminals are further aligned with each other so that horizontal faces of the terminals in each pair face each other to thereby promote broadside coupling between horizontal pairs of terminals. The components further include vertical castellations between adjacent terminals in order to provide electrical isolation to adjacent pairs of terminals.
Owner:MOLEX INC
Electrical connector with hybrid shield
ActiveUS20130109232A1Reduce crosstalkMechanical integrity is not compromisedContact member assembly/disassemblyCoupling protective earth/shielding arrangementsElectrical conductorElectrical bonding
An electrical connector with reduced cross talk and controlled impedance. The connector comprises hybrid shields with lossy portions and conductive portions. The synergistic effect of the lossy portions and the conductive portions allows the hybrid shields to be relatively thin such that they can be incorporated into the mating interface regions or other mechanically constrained regions of the connector to provide adequate crosstalk suppression without undesirably impacting impedance. The conductive portions may be shaped to preferentially position the conductive regions adjacent signal conductors susceptible to cross talk to further contribute to the synergy. The conductive regions may include holes to contribute to desired electrical properties for the connector.
Owner:AMPHENOL CORP
Impedance control in connector mounting areas
ActiveUS7731537B2Reduce crosstalkIncrease their edge-to-edgeElectrically conductive connectionsCoupling protective earth/shielding arrangementsDielectricDifferential signaling
A high speed connector with reduced crosstalk utilizes individual connector support frames that are assembled together to form a block of connector units. Each such unit supports a column of conductive terminals in two spaced-apart columns. The columns have differential signal terminal pairs separated from each other by larger intervening ground shields that serve as ground terminals. The ground shields are arranged in alternating fashion within the pair of columns and they are closely spaced together so as to face a differential signal terminal pair. In areas where the terminals are mounted to the connector units, window-like openings are formed in the large ground shield terminals to reduce the amount of broadside coupling between the differential signal terminal pair and the signal terminal pair are narrowed to increase their edge-to-edge distance to account for the change in dielectric constant of the connector unit material filing in the area between the signal terminal pair.
Owner:MOLEX INC
Electrical connector having improved terminal configuration
ActiveUS7549897B2Small sizeImproving impedanceElectric discharge tubesSecuring/insulating coupling contact membersElectrical performanceEngineering
An electrical terminal of the type to be inserted into an aperture of an electrical panel member is provided. The electrical terminal may include a base, an insertion portion extending from the base to a first end, a slit formed through the insertion portion and defining a compliant portion having a first leg and a second leg. Midpoints of each or both legs may be offset from the midpoint of the slit to achieve improved mechanical and electrical performance within a connector. Also provided is an electrical terminal having a tip that facilitates alignment with a panel member aperture and provides tactile feedback to a user, as well as an electrical terminal having a mounting end that is substantially smaller than its mating end, and connectors containing such terminals. Methods of routing electrical traces between adjacent electrical terminals are also provided.
Owner:TYCO ELECTRONICS LOGISTICS AG (CH)
Method and device for transmission with reduced crosstalk
InactiveUS7167019B2Accurately determinedOptimize locationReliability increasing modificationsElectrically conductive connectionsElectrical conductorInterconnection
The invention relates to a method and a device for transmission with reduced crosstalk in interconnections used for sending a plurality of signals, such as the interconnections made with flat multiconductor cables, or with the tracks of a printed circuit board, or inside an integrated circuit. An interconnection with four parallel transmission conductors plus a reference conductor has each of its ends connected to a termination circuit. The transmitting circuit receives at its input the signals of the four channels of the source and its output terminals are connected to the conductors of the interconnection. The receiving circuit's input terminals are connected to the conductors of the interconnection, and its four output channels are connected to the destination. The signals of the four channels of the source are sent to the four channels of the destination, without noticeable crosstalk.
Owner:RAMBUS INC +1
High Speed Bypass Cable Assembly
ActiveUS20140041937A1Loss of characteristicReduce Impedance DiscontinuitiesElectrically conductive connectionsCoupling device detailsElectrical conductorComputer terminal
A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar. The shield collar has an extension that engages the second end of the cable.
Owner:MOLEX INC
High speed bypass cable assembly
ActiveUS9011177B2Loss of characteristicReduce Impedance DiscontinuitiesRelieving strain on wire connectionElectrically conductive connectionsElectrical conductorComputer terminal
Owner:MOLEX INC
Image sensor having improved sensitivity and decreased crosstalk and method of fabricating same
ActiveUS20070194356A1High sensitivityReduce crosstalkSolid-state devicesRadiation controlled devicesTransducerEngineering
An image sensor is provided. The image sensor includes a substrate; a first isolation region, a second isolation region, a plurality of photoelectric transducer devices, a read element and a floating diffusion region. The second isolation region has a depth that is less than that of the first isolation region. The plurality of photoelectric transducer devices is isolated from one another by the first isolation region. The read element and the floating diffusion region are isolated from the photoelectric transducer devices by the second isolation region.
Owner:SAMSUNG ELECTRONICS CO LTD
Spectrometry system with diffuser
ActiveUS20150292948A1Reduce crosstalkShorten the lengthInterferometric spectrometryMaterial analysis by optical meansSensor arrayImage resolution
Owner:VERIFOOD
Directional Backlight with Reduced Crosstalk
InactiveUS20110285927A1Reduce crosstalkIncrease brightnessVessels or leading-in conductors manufactureOptical waveguide light guideOptoelectronicsStereo display
A backlight suitable for use in an autostereoscopic display includes a light guide and a first and second light source assembly. The light guide has opposed first and second major surfaces, and opposed first and second side surfaces. The first and second light source assemblies are disposed to inject visible light into the light guide through the first and second side surfaces, respectively. Substantially all of the first side surface highly transmits a second light portion out of the light guide into air, the second light portion originating from the second light source assembly, and substantially all of the second side surface highly transmits a first light portion in a corresponding fashion. One or more first non-emitting surfaces of the first light source assembly are disposed at least partially between two light-emitting surfaces of the first light source assembly, and are adapted to substantially absorb visible light to reduce crosstalk.
Owner:3M INNOVATIVE PROPERTIES CO
High speed, high density electrical connector
ActiveUS20120214344A1Smooth connectionLower insertion forceElectric discharge tubesCoupling contact membersPath lengthHigh density
A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the first and second sets of conductors and the blades are jogged in both an x- and y-coordinate to reduce crosstalk and improve electrical performance.
Owner:AMPHENOL CORP
Printed circuit board and method of reducing crosstalk in a printed circuit board
ActiveUS7239526B1Reduce crosstalkCross-talk/noise/interference reductionCoupling device detailsReturn currentGround plane
The embodiments of the present invention relate to an improved printed circuit board having additional rows of ground vias to reduce crosstalk in the board. A printed circuit board according to one embodiment of the present invention comprises a first row of vias and a second row of vias, each having a plurality of signal vias. The circuit board also comprises a plurality of rows of vias being coupled to a ground plane between the first row of signal vias and the second row of signal vias. According to one embodiment, the plurality of rows of vias being coupled to a ground plane comprise rows of vias having different sizes. Some of the vias are designed to receive a component, while others are generally smaller and designed to provide a return current path for the signal vias.
Owner:XILINX INC
Cable assembly having improved configuration for suppressing cross-talk
InactiveUS7654831B1Reduce crosstalkSimple structureElectrically conductive connectionsFixed connectionsElectrical and Electronics engineeringEngineering
Owner:HON HAI PRECISION IND CO LTD
Reduced crosstalk sensor and method of formation
ActiveUS20050184353A1Reduce crosstalkSolid-state devicesRadiation controlled devicesEngineeringConductive materials
Isolation methods and devices for isolating regions of a semiconductor device are disclosed. The isolation methods and structures include forming an isolating trench among pixels or other active areas of a semiconductor device. The trench extends through the substrate to the base layer, wherein a liner may be deposited on the side walls of the trench. A conductive material is deposited into the trench to block electrons from passing through.
Owner:MICRON TECH INC
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