3882 results about "Electrical bonding" patented technology

An LED lamp may be made with a heat sink optic. The lamp has a base having a first electrical contact and a second electrical contact for receiving current. At least one LED is mounted on a thermally conductive support; that supports electrical connections for the LED and provides thermal conduction of heat from the LED to the optic. The LED support mounted in the base and electrically coupled through the first electrical contact to electrical current. The light transmissive, and heat diffusing optic has an external an internal wall defining a cavity with the LED positioned in the cavity. The optic is in thermal contact with the LED support and mechanically coupled to the base. The snap together structure enables rapid manufacture while allowing numerous variations.

An electrical connector with reduced cross talk and controlled impedance. The connector comprises hybrid shields with lossy portions and conductive portions. The synergistic effect of the lossy portions and the conductive portions allows the hybrid shields to be relatively thin such that they can be incorporated into the mating interface regions or other mechanically constrained regions of the connector to provide adequate crosstalk suppression without undesirably impacting impedance. The conductive portions may be shaped to preferentially position the conductive regions adjacent signal conductors susceptible to cross talk to further contribute to the synergy. The conductive regions may include holes to contribute to desired electrical properties for the connector.

Interconnects for electronic devices. More specifically, stacked photoelectric devices, such as parallel tandem photovoltaic devices are provided. Each of the photovoltaic devices comprises photovoltaic cells formed between two substrates. Each of the substrates may include one or more interconnects to route a voltage from one side of the substrate to another. Each substrate includes an edge portion extending beyond the edge portion of an immediately adjacent substrate. All interconnects are exposed to one side of the device for easy and flexible electric connectivity and fabrication. The interconnects, which may include conductive vias or conductive edge wraps, are formed in the edge portion of the substrates.

An electrical connection system designed to connect electrical conductors to a junction box containing a receptacle. The system incorporates a junction box, a supply connector, a distribution connector, and a receptacle. The junction box includes a line bus, a ground bus, and a neutral bus. The supply connector adapts the incoming electrical wire having a line conductor, a ground conductor, and a neutral conductor for connection to the line bus, the ground bus, and the neutral bus. The electrical receptacle is formed with a line blade, a ground blade, and a neutral blade which, respectively, electrically connect to the line bus, the ground bus, and the neutral bus. Electrical energy may be supplied through the electrical conductors to the electrical receptacle. A distribution connector may be incorporated to supply electrical energy to downstream receptacles.

There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin. A plurality of terminals 8 for electrical connection are provided in a grid pattern in a region inside the first external terminal portions and exposed on a lower surface of the encapsulating resin. A plurality of semiconductor elements or coils and resistors can be incorporated, and further semiconductor devices can be stacked.

There is provided a lighting unit whose area is implemented into a large area by assembling a plurality of lighting modules in a flat-surface-like manner. Moreover, a plurality of electrical connectors are positioned in each lighting module in such a manner that the electrical connectors face each side of each lighting module. Here, the plurality of electrical connectors are mutually connected to the plurality of lighting modules adjacent thereto.

Vias (210, 210B) are formed in a surface of a substrate. At least portions of contact pads (139, 350) are located in the vias. Contact pads (150, 340) of an integrated circuit structure are inserted into the vias and attached to the contact pads (139, 350) of the substrate. The vias provide a strong, reliable mechanical and electrical connection. A via may expose not only a contact pad (350) in the substrate but also a surrounding region. Solder (930) wets the contact pad better than the surrounding region, resulting in a stronger solder joint and better electrical conductivity. Alternatively, the contact may include multiple conductive layers (910.1, 910.2), with the top layer (910.2) being more solder wettable than the bottom layer (910.1) and the top layer covering only a portion of the bottom layer.

The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external point of electrical connection to buried package leads. Lead carriers are formed with apertures that partially surround each lead and electrically and thermally couple conductive elements or traces in the lead carrier to each package lead. Optionally thin layers of thermally conductive adhesive located between the lead carrier and adjacent packages facilitates the transfer of heat between packages and to the lead carrier. Lead carriers may be formed of custom flexible circuits having multiple layers of conductive material separated by a substrate to provide accurate impedance control and providing high density signal trace routing and ball-grid array connection to a printed wiring board.

An interchangeable hearing aid control panel with at least one activation zone arranged in connection with a layered structure. The layered structure has an electrically non-conducting substrate, an electrically conducting path arranged in connection with the substrate, and an electrically conducting member, such as a conducting foil, arranged at a predetermined distance from the activation zone. The activation zone can be either in a deactuated or in an actuated state. In the actuated state the conducting member and the conducting path are electrically connected while disconnected in the deactuated state. Electrical connection to an associated hearing aid is by means of a connector, such as a plug, enabling the control panel to be easily changed. Preferably, the connector is formed by a piece of flexprint. The layered structure may comprise a second conducting path. In preferred embodiments activation zones are indicated by “poppel domes” formed by a surface layer covering the layered structure. The activation zones may form an MTO control or a volume control. To fit BTE hearing aids, the layered structure preferably has an elongated structure with a length of 1-4 cm. Other shapes can be formed to fit ITE, ITC and CIC hearing aids. In preferred embodiments, the control panel comprises one or more Silicon-based microphones protected behind a surface layer of the control panel.

The present invention comprises methods for making three-dimensional (3-D) liquid crystalline polymer (LCP) interconnect structures using a high temperature singe sided liquid crystalline polymer, and low temperature single sided liquid crystalline polymer, whereas both the high temperature LCP and the low temperature LCP are drilled using a laser or mechanical drill or mechanically punch to form a z-axis connection. The single sided Conductive layer is used as a bus layer to form z axis conductive stud conductive stud within the high temperature and low temperature LCP, followed by deposition of a metallic capping layer of the stud that serves as the bonding metal between the conductive interconnects to form the z-axis electrical connection. High temperature and low temperature LCP circuit layers are etched or built up to form circuit patterns and subsequently bonded together to form final 3-D multilayer circuit pattern whereas the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond, whereas, metal to metal bonding occurs with high temperature metal capping layer bonding to conductive metal layer. The resultant structure is then packaged using two metallized organic cores that are laminated onto either side of the device using a low temperature adhesive with similar electrical properties and subsequently metallized to form the input output terminals and EM shielding.

A desk lamp includes a docking station for media devices. The lamp has a support that houses a speaker and a docking structure for receiving the media device. An electrical connector and associated cable connect an output of the media player to the speaker. The desk lamp further includes a neck for coupling a terminal housing to the support. A bulb socket is attached to the terminal housing to receive a light bulb. A power cord electrically couples the bulb socket to a battery compartment or to an electrical plug. The lamp may in addition include a transformer and a charging circuit that are electrically coupled to contacts in the docking structure for providing power to the media device. Alternatively, the lamp may include a second socket at an exterior surface of the support for connecting to a media device compatible cable to receive power.

An electrical fitting in the form of a connector or coupler for connecting an electric metal tube to an electrical box or panel or to one another. The fitting includes a body having an inlet end portion, an outlet end portion and a bore extending therethrough. An unidirectional locking device is disposed in an outermost chamber and a sealing washer disposed in an intermediate chamber. A split ring having an angularly bent leading end is provided with a series of offset circumferentially spaced unidirectional gripping tangs. The locking device may also be provided with a series of tube support tangs at the trailing end. Also, the locking device includes a tang forming an electrical bonding or ground between tubes, locking device and connector body.

A microactuator assembly for a hard disk drive head suspension has an expandable base of stainless steel sheet material defining a negative lead affixed to the negative electrode on the bottom surface of a piezoelectric element, and a piece of stainless steel sheet material defining a positive lead attached to the positive electrode on the top surface of the piezoelectric element. The leads may be affixed directly to the piezoelectric element via conductive adhesive. The microactuator assembly can be assembled separately, and then laser welded into place on a suspension. A bond pad made of stainless steel sheet material extends from the flexible circuit, is electrically connected to the microactuator driving voltage conductor within the flexible circuit through a via, and is electrically isolated from the suspension substrate by an insulating film. The microactuator unit positive lead is mechanically and electrically connected to the bond pad via laser welding.

An electrical connector for mounting on a circuit board includes an insulative housing (11) having a pair of side walls (113), a pair of end walls (114) and defining a mating opening (115), and a mounting face and a number of contact receiving slots (112); a plurality of contacts (12) received in the contact receiving slots and each having a soldering portion (125) extending along the mounting face for surface mounting on the circuit board; a pair of shielding plates (13) each having a main portion (132) located outside tail ends of the soldering portion, a bent portion (131) bent from opposite ends of the main potion and attached to the end walls and a grounding pad (135) extending along the mounting face for surface mounting on the circuit board.

A directional sensor array system generally for remote audio collection applications that is modular, scalable, and robust with the modules assembled in layers. The invention can alternatively employ sensors other than microphones, such as ultrasonic transducers and accelerometers. In the preferred embodiment, the sensors are mounted on tiles, each of which performs its own local beamforming using a low-impedance resistive summation technique. The tiles are constructed in a layered, sandwiched fashion and incorporate integral protection from wind, sand, dust, moisture, radio frequency noise, vibration, ambient acoustic noise, and directional acoustic noise, as well as provide inter-sensor isolation. Multiple tiles can be joined together physically and electrically. When joined, a secondary parallel beamforming is performed on the bus using electrical summation. Due to the techniques employed, large scale arrays are feasible at low power consumption—for example, an array of 400 microphone elements can be powered for over 6 hours by a single 9 volt battery.

A system for providing an electrical interface across a sealed boundary may include a frame in sealed engagement with at least a portion of a substrate. The substrate may be in communication with an electrochromic device. The system may further include first and second conduits. The first conduit may be on a first side of the substrate and a second conduit may be on a second side of the substrate. The second conduit may be in communication with the first conduit through at least one of the seal, a space between the seal and the frame, and a space between the seal and the substrate.

The present invention realizes a small thickness and a low price while maintaining the sensitivity of an RFID antenna when setting a non-contact IC card function in a cellular phone. An RFID antenna is mounted on a battery pack of a cellular phone. In this case, by maintaining a predetermined clearance (1 to 2 mm) between the antenna and a battery cell, bad influence of a metallic plate of the battery cell is eliminated. Moreover, in the case of electrical connection with an RFID-function circuit portion, it is unnecessary to prepare a special connector by using a battery connection connector.

A method for fabricating semiconductor and electronic devices at the wafer level is described. In this method, dielectric material is used to wafer bond a device wafer to a submount wafer, after which vias can be structured into the submount wafer and dielectric bonding material to access contact pads on the bonded surface of the device wafer. The vias may subsequently be filled with electrically and thermally conducting material to provide electrical contacts to the device and improve the thermal properties of the finished device, respectively. The post-bonding process described provides a simple, cost-effective, non-alignment method for fabricating a variety of electronic and semiconductor devices, particularly light emitting diodes with electrical contacts at the bottom of the chip.

An electrical connector includes a housing and a lead frame held by the housing. The lead frame includes a terminal extending along a length between a mating end portion and a mounting end portion. The terminal is at least partially surrounded by a dielectric core extending a length along at least a portion of the length of the terminal. The dielectric core is metallized such that the core is at least partially surrounded by an electrically conductive shell.