This application provides a self-supporting piezoelectric nanofilm
microactuator and its fabrication method. The fabrication method includes: forming an insulating layer on the front side of a substrate; forming a bottom
electrode; forming a piezoelectric thin film with a submicron thickness;
thinning the back side of the substrate; forming a top
electrode with a nanometer thickness on the piezoelectric thin film; sequentially patterning the piezoelectric thin film, bottom
electrode, and insulating layer to define the device shape;
coating a continuous
polymer protective layer on the front side of the device; forming a
mask on the back side of the device to define a release window; temporarily bonding the front side of the device
wafer to a carrier
wafer;
etching the back side according to the release window, using the insulating layer as the
etching termination layer to form a deep cavity on the back side and release the support under the
cantilever beam; debonding and cleaning the front side; removing the sacrificial layer, releasing the device, and obtaining the self-supporting piezoelectric nanofilm
microactuator. This application can achieve low-
voltage compatibility between the device and on-
chip electronics and achieve high-yield manufacturing of submicron piezoelectric thin film microactuators.