31results about How to "Good shielding properties" patented technology

An electrical connector for mounting on a circuit board includes an insulative housing (11) having a pair of side walls (113), a pair of end walls (114) and defining a mating opening (115), and a mounting face and a number of contact receiving slots (112); a plurality of contacts (12) received in the contact receiving slots and each having a soldering portion (125) extending along the mounting face for surface mounting on the circuit board; a pair of shielding plates (13) each having a main portion (132) located outside tail ends of the soldering portion, a bent portion (131) bent from opposite ends of the main potion and attached to the end walls and a grounding pad (135) extending along the mounting face for surface mounting on the circuit board.

A protector includes a protector body which has a receiving portion for receiving at least one wire. A groove is formed on a bottom face of the receiving portion. The groove has a width smaller than a diameter of the wire.

A semiconductor device in which semiconductor chip(s) is or are mounted onto substrate(s) incorporating patterned wiring and the entirety or entireties has or have been sealed with resin(s), wherein by forming electrically conductive pattern(s) for shielding at end face(s) at top(s) of substrate(s) and attaching such electrically conductive pattern(s) to region(s) of ground plane pattern(s) on circuit board(s) of apparatus(es) which is or are provided with such semiconductor device(s), it is possible to shield semiconductor device(s) even without use of shield case(s). In such case, by applying material(s) possessing good shielding characteristics, e.g., gold plating, over electrically conductive pattern(s), it is possible to increase sensitivity with respect to electromagnetic noise and improve shielding effect (anti-electromagnetic-noise effect).

The purpose of the present invention is to provide: an electromagnetic wave shield film having excellent transmission characteristics for high frequency signals and having excellent shielding characteristics with respect to electromagnetic waves in the high frequency region; and a shielded printed wiring board equipped with the electromagnetic wave shield film. An electromagnetic wave shield film 1 comprises: a shield layer constituted by a first metal layer in which nickel is the main component and a second metal layer in which copper is the main component; an adhesive layer provided to the second metal layer side of the shield layer; and a protective layer provided to the first metal layer side which is opposite the second metal layer side of the shield layer. A thickness T1 of the first metal layer is 2 to 10 [mu]m, and a thickness T2 of the second metal layer is 2 to 10 [mu]m.

The invention relates to a plug connector housing consisting of at least one housing upper part (1) and at least one housing lower part (5) which together form a plug connector housing. The housing upper part (1) and the housing lower part (5) each have a contact surface (3, 9a, 9b), said contact surfaces (3, 9a, 9b) being at least partly in contact with each other when the housing upper part (1) and the housing lower part (5) are connected to each other. The housing upper part (1) and the housing lower part (5) are made of an electrically conductive material, said housing upper part (1) and lower part (5) having a surface coating that protects against corrosion for example, and the contact between the two contact surfaces (3, 9a, 9b) is formed along an edge (9).

Provided is a near-infrared-shielding ultrafine particle dispersion body or the like that has an excellent near-infrared-shielding function, a low haze value, excellent design properties, and inhibited color tone change and blue haze phenomenon in outdoor use, and that is obtained by using near-infrared-shielding ultrafine particles which are transparent in a visible light region, have excellent near-infrared-shielding characteristics, and are produced with high productivity. Provided is a near-infrared-shielding ultrafine particle dispersion body or the like which is a dispersion of ultrafineparticles having near-infrared-shielding characteristics in a solid medium, wherein the ultrafine particles are composite tungsten oxide ultrafine particles (A) represented by general formula MxWyOz,the ratio value of the top intensity of the XRD peak of the composite tungsten oxide ultrafine particles (A) with respect to the XRD peak intensity, defined as 1, of the (220) plane of a silicon powder standard sample is 0.13 or more, the solid medium contains a resin binder (B) and a weather resistance improver (C), and the weather resistance improver (C) contains at least one selected from benzotriazole-based UV absorbents, triazine-based UV absorbents, and benzophenone-based UV absorbents.

The present invention suppresses as much as possible the impedance mismatch that causes the connection operation between the shielded single core wire and the connection terminal that is performed by removing the shield portion at the end. The shielding connector removes the shielding part (36) of the end of the shielding wire (30) to expose a plurality of shielding single core wires (31 and / or 32), and connects the connecting terminal (38) to each shielding part (36) exposed. The conductor at the top of the single core wire (31 and / or 32) keeps the connecting terminal (38) by the inner casing (39), and wraps the inner casing (39) and the shielding unit with the shielding shell (42). The core wire is fixed to the end of the shielded wire (30) through the fixing piece (47) integrated with the shielding shell (42), wherein the shielding member of the connector is arranged on the shielding shell (42) (43), electrically connecting the shielding member (43) of the connector to the exposed single-core wire shielding portion of the shielded single-core wire (31 and / or 32).

The invention belongs to the technical field of composite materials, and particularly relates to a radiation protection gradient composite material and a preparation method and application thereof. In parts by weight, the radiation protection gradient composite material includes the following components: 30-40 parts of core layer composite crystals, 35-50 parts of BECQ powder, and 20-35 parts of polyethylene glycol. The radiation protection gradient composite material includes an inner layer of BECQ powder and an outer layer of a core layer composite crystal. The radiation protection gradient composite material of the present invention is based on the BECQ powder, and then adds a core layer composite crystal layer, and the main component of the core layer composite crystal layer is MoO 3 Crystal, the crystal has good shielding properties. The outer core layer composite crystal can absorb and attenuate radiation rays, and the inner layer BECQ powder further attenuates and absorbs attenuating radiation rays. The synergistic effect between the two can effectively shield Radiation rays, therefore, have certain application prospects in the field of materials.

An optical filter includes an absorption layer which increases a visible light transmittance while having a good near-infrared blocking characteristic, and which is excellent in not only adhesivenesswith respect to a layer to be abutted, but also light resistance. The optical filter includes the absorption layer containing a near-infrared absorption dye containing a squarylium-based dye and a transparent resin; and an inorganic or organic material in contact with the absorption layer. The squarylium-based dye has a squarylium skeleton and condensed ring structures bonded thereto respectivelyon both sides thereof, the condensed ring structures each including a benzene ring and a nitrogen atom as an annular atom, each benzene ring having an urethane structure in the second position.

The invention relates to a layered structure comprising a plastic substrate, at least one intermediate metallic layer on top of this plastic substrate and a metal or metal alloy layer on top of this intermediate metallic layer. The metal or metal alloy layer is applied from the melt of a metal or metal alloy. The invention further relates to a method of manufacturing such a layered structure.