Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

1124 results about "Electromagnetic noise" patented technology

Electromagnetic Interference (EMI) usually refers to unwanted electrical noise present on a power line. This noise may “leak” from the power lines and affect equipment that isn’t even connected to the power line.

Ion wind indoor unit, ion wind air conditioner system and control method

The invention discloses an ion wind indoor unit, an ion wind air conditioner system and a control method, and relates to the technical field of refrigerating and heating equipment. In order to solve the problems that an existing air conditioner indoor unit is large in occupation size, large in noise and the like, the ion wind indoor unit is designed. The ion wind indoor unit comprises a shell and an indoor heat exchanger arranged in the shell; an ion wind generator is arranged on the upwind side and / or downwind side of the indoor heat exchanger, and carries out corona on air entering the interior of the generator to generate ion wind and blow out the iron wind so as to achieve convection heat exchange of indoor air; and meanwhile, the ion wind air conditioner system with the ion wind indoor unit and the control method of the air conditioner system are provided. The ion wind indoor unit can reduce the starting noise of air and eliminate electromagnetic noise of a motor and vibration noise of a structural part; use comfort is greatly improved; and meanwhile, the indoor unit structure is simplified, the occupied size of the indoor unit is reduced, the attractiveness of the indoor unit is improved, and the production cost and the assembling cost are reduced.
Owner:QINGDAO HAIER AIR CONDITIONING ELECTRONICS CO LTD

System and method for using film deposition techniques to provide an antenna within an integrated circuit package

An integrated circuit package comprises a cavity for housing an integrated circuit (IC) and an antenna provided as part of the package that is located substantially outside the cavity. The antenna may be located on the floor of the IC package that lies in the region outside of the IC cavity. Alternatively, the antenna may be located on the upper or lower surface of the lid sealing the IC package. The antenna may be placed in the floor or on a surface of the IC lid by forming depressions in the floor or lid surface and depositing conductive material in the depressions. The conductive material deposition may be by sputtering, evaporation, or other known physical or chemical deposition method. Antennas formed in the upper surface of an IC lid may be coupled to a pin of the IC package so that the antenna may be electrically coupled to a transceiver component on the IC within the package. Antennas formed in the lower surface of an IC lid or the floor of the IC package may be coupled by a conductive pin to a component pad of the IC within the package. To reduce electromagnetic noise that may be induced by the radio frequency signals emitted or received by an antenna, a grounding plane may be provided as part of the IC package. The grounding plane may be coupled to an electrical ground reference point through an IC package pin or the IC within the package.
Owner:BELL SEMICON LLC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products