Eureka-AI is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Eureka AI

5967 results about "Electrical wiring" patented technology

Electrical wiring is an electrical installation of cabling and associated devices such as switches, distribution boards, sockets, and light fittings in a structure. Wiring is subject to safety standards for design and installation. Allowable wire and cable types and sizes are specified according to the circuit operating voltage and electric current capability, with further restrictions on the environmental conditions, such as ambient temperature range, moisture levels, and exposure to sunlight and chemicals.

Noninvasive measurement of chemical substances

Utilization of a contact device placed on the eye in order to detect physical and chemical parameters of the body as well as the non-invasive delivery of compounds according to these physical and chemical parameters, with signals being transmitted continuously as electromagnetic waves, radio waves, infrared and the like. One of the parameters to be detected includes non-invasive blood analysis utilizing chemical changes and chemical products that are found in the conjunctiva and in the tear film. A transensor mounted in the contact device laying on the cornea or the surface of the eye is capable of evaluating and measuring physical and chemical parameters in the eye including non-invasive blood analysis. The system utilizes eye lid motion and/or closure of the eye lid to activate a microminiature radio frequency sensitive transensor mounted in the contact device. The signal can be communicated by wires or radio telemetered to an externally placed receiver. The signal can then be processed, analyzed and stored. Several parameters can be detected including a complete non-invasive analysis of blood components, measurement of systemic and ocular blood flow, measurement of heart rate and respiratory rate, tracking operations, detection of ovulation, detection of radiation and drug effects, diagnosis of ocular and systemic disorders and the like.

Composite structures, such as coated wiring assemblies, having integral fiber optic-based condition detectors and systems which employ the same

InactiveUS7154081B1Weakening rangeReducing compressive strainControlRadiation pyrometryElectrical conductorGrating
Integral fiber optic-based condition sensors detect conditions of a composite structure, e.g., a coated wire assembly so as to detect damage or conditions that may damage the same. Preferably, at least one optical fiber sensor having a plurality of Bragg gratings written into the fiber at spaced-apart locations along its axial length is integrated into the electrical insulator coating of a wire, wire bundle or wiring harness. The fiber optic sensor may thus be employed to measure the environmental loads on the electrical wiring including stresses from bending, axial loading, pinch points, high temperature excursions and chemical damage. The system is capable of detecting and locating transient conditions that might cause damage to a wiring system or permanent changes in state associated with damage events. The residual stress in the electrical insulator coating of a wire, wire bundle, or wiring harness are used to monitor the evolution of damage by wear or chaffing processes. Detected stress relief on one or more Bragg gratings will thus be indicative of damage to the insulator coating on the conductor. As such, the magnitude of such stress relief may be detected and used as an alert that the wire insulation is damaged to an unsafe extent.

Method of implementing air-gap technology for low capacitance ILD in the damascene scheme

Air-gap technology is introduced in the damascene scheme, reducing the capacitance between interconnect metal lines on an integrated circuit substrate, and ultimately enhancing the speed of the device. Reduction of extraneous signal energy (cross-talk) from traversing from one metal line to another is also realized. The method for implementing an air-gap filled dielectric between the interconnect metal lines involves depositing a first dielectric layer on the substrate at a predetermined height. Next the first dielectric is patterned and etched to form lines. A second dielectric layer is then deposited using air-gap technology, such that the second dielectric contains air-gaps between the first dielectric lines. These air-gaps are situated below the predetermined height of the first dielectric. The substrate is then polished so that the top surface of the first dielectric is exposed. The first dielectric lines are then etched and removed. A metal is deposited in place of the removed first dielectric lines, forming interconnect metal lines on the substrate having an air-gap filled dielectric therebetween. The air-gap filled dielectric has a dielectric constant on the order of k=1.9 to 2.5, which is significantly lower than that of the same dielectric material without the air-gap.

Tissue cutting catheter and RF cutting method

A tissue cutting device includes a catheter with a window at its distal tip for admitting tissue into a catheter compartment. A cylindrical cartridge in the compartment has a cutting edge that supports an electrically conductive cutting element, e.g. a band or wire. The cutting element and adjacent tissue can be heated to a selected temperature by generating an electrical current through the cutting element. The catheter is maneuverable to position its distal end near the tissue to be cut. The catheter incorporates a dilatation balloon or other feature to urge the catheter against the tissue, so that at least part of the tissue may enter the compartment through the window. Then, the cartridge is manipulated from the catheter's proximal end to move the cutting edge across the window, cutting the tissue. According to alternative embodiments, the cartridge is either rotated or moved axially relative to the catheter and, in either event may be capable of closing the catheter window when the cut is complete. Further alternatives involve either placing an indifferent electrode on the patient and providing an RF signal via a single conductor to the cutting element for ohmic heating, or providing an RF (or a DC) current through the cutting element and two separate conductors for direct resistive heating of the cutting element.
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products