A 
cutting instrument including a 
metal blade has a recess formed therein and a 
semiconductor substrate affixed to the blade in the recess. The 
semiconductor substrate includes at least one sensor formed thereon. The sensor formed on the 
semiconductor substrate may comprise at least one or an array of a strain sensors, pressure sensors, nerve sensors, temperature sensors, density sensors, accelerometers, and gyroscopes. The 
cutting instrument may also further include a 
handle wherein the blade is affixed to the 
handle and the semiconductor substrate is electrically coupled to the 
handle. The handle may then be coupled, either physically or by 
wireless transmission, to a computer that is adapted to display information to a person using the 
cutting instrument based on signals generated by one or more of the sensors formed on the semiconductor substrate. The computer or handle may also be adapted to store data based on the signals generated by one or more of the sensors. A method of making said cutting instrument includes the steps of at least one sensor being formed on a semiconductor 
wafer and a layer of 
photoresist being applied on a top side of the semiconductor 
wafer according to a pattern that matches the defined shape of the semiconductor substrate. The portion of the semiconductor 
wafer not covered by the 
photoresist is removed and thereafter the 
photoresist is removed from the semiconductor wafer, thereby leaving the semiconductor substrate having a defined shape and at least one sensor formed thereon. The semiconductor substrate having a defined shape and at least one sensor formed thereon is then affixed to a 
metal blade in a recess formed in said blade.