753results about How to "Prevent short-circuiting" patented technology

The invention relates to a floor covering (100) comprising: a plurality of coils (110), each coil (110) being operable to supply inductive energy to a power receiver circuit (200); wherein the plurality of coils comprises a transmitter area occupying the largest area of the floor covering (100); and a charging current through the coils is operable to generate said inductive energy.

A method for manufacturing a semiconductor device, including the steps of: forming a shielding film 38 on a first insulating film 37; sequentially forming a second insulating film 39 and an amorphous semiconductor film 40 on the shielding film 38; melting the amorphous semiconductor film 40 at least in portions to be channels of thin-film transistors by irradiating an energy beam onto the amorphous semiconductor film 40, and converting the amorphous semiconductor film 40 into a polycrystalline semiconductor film 41; sequentially forming a gate insulating film 43a and a gate electrode 44a on the polycrystalline semiconductor film 41 on the channels; and forming source and drain regions 41a in the polycrystalline semiconductor film 41 on sides of the gate electrode 44a, and forming a TFT 60 by use of the source and drain regions 41a, the gate insulating film 43a, and the gate electrode 44a.

A method for forming a self-aligned contact on a semiconductor substrate provided with a plurality of field-effect transistors. The method comprises the steps of forming a first insulating layer comprising a nitride along a profile of a gate structure and a junction region, forming a temporary layer comprising a doped oxide on the first insulating layer, removing a portion of the temporary layer by performing a selective etch of the oxide with a mask while leaving a plug portion of the temporary layer over the junction region, forming a second insulating layer comprising an undoped oxide in a region where the portion of the temporary layer is removed, removing the plug portion by performing a selective etch of the undoped oxide to form a contact hole, removing a portion of the first insulating layer at a bottom of the contact hole, and forming a conductive contact in the contact hole.

An improved electrosurgical instrument and method is disclosed for simplifying making incisions and other treatments using electrosurgery. The electrosurgical instrument comprises a body having more than two electrodes with at least two electrodes having alternating current power supplied to them such that they comprise a bipolar alternating current configuration and employ a means other than electrode spacing, composition, or geometry for reducing or preventing accumulation of eschar that would otherwise form a short circuit current path and interfere with obtaining a predetermined surgical effect. In one aspect, such means for reducing or preventing eschar accumulation consists of at least one other electrode having a direct current voltage between it and at least one of the two electrodes forming the alternating current bipolar configuration. In another aspect of the invention two or more pairs of alternating current electrodes comprising bipolar electrodes are powered with alternating current having a nonzero RMS voltage sufficient to at least reduce eschar accumulations on one electrode or induce electrolysis of at least one component of a medium surrounding at least one pair of bipolar electrodes. The electrodes are separated from each other using electrically insulating materials such that electric current does not flow between at least two of the bipolar alternating current electrodes unless they contact at least one other electrically conductive medium, such as patient tissue or a medium comprising at least in part a solid, liquid, gas, or ionized component that allows electric current to flow between electrodes. In the aspect where at least one electrode is powered by direct current the electrodes are configured such that electrical current does not flow between at least one of the bipolar alternating current electrodes and at least one of the direct current electrodes unless one or more media, such as patient tissue or a medium comprising at least in part a solid, liquid, gas, or ionized component that allows electric current to flow between electrodes, are contacting or adjacent to the electrodes having a direct current voltage difference between them. The assembly comprised of the electrodes and the separating insulating materials may also employ one or more means to reduce the current flowing between them that does not produce a desired predetermined surgical effect with one aspect of such means being using an outer insulating coating configured such that one or more portions of at least one of the bipolar alternating current electrodes are insulated while leaving exposed other portions of such insulated electrodes so that they are capable of being in electrical communication with tissue or at least one material in electrical communication with tissue.

The present invention relates to a USB storage device having a USB plug with top and bottom terminals, connection terminals of the USB plug being provided at both top and bottom sides so that an information terminal apparatus such as a PC, a notebook, an MP3 player and a digital camera, can be inserted in face-down / face-up manners, comprising a main unit and a cover unit, the main unit comprising a USB plug having connection terminals at both sides to be connected to a USB port of the information terminal apparatus to communicate data, and slide rails provided in a longitudinal direction to define a sliding range for rail protrusions of the cover unit; and the cover unit comprising rail protrusions inserted into the slide rails and provided at both ends of the cover unit toward the main unit so that the cover unit can rotatably move along with the slide rail. Therefore, since the USB storage device according to the present invention includes the connection terminals of the USB plug at top and bottom sides, it can be inserted into the information terminal apparatus in a face-down or face-up manner. Further, in the USB storage device according to the present invention, the sliding range for the rail protrusions provided on the cover unit is defined into the slide rails extending the corresponding main unit, thereby preventing the cover unit from being separated and missing.

A method of manufacturing a semiconductor device having electrodes penetrating a semiconductor substrate, the method includes the steps of forming a concave portion extending from an active surface of a semiconductor substrate on which an integrated circuit is formed to an interior of the semiconductor substrate, forming a first insulating layer on an inner surface of the concave portion, filling an inner side of the first insulating layer with an electroconductive material so as to form an electrode, exposing a distal end portion of the first insulating layer by etching a rear surface of the semiconductor substrate, forming a second insulating layer on a rear surface of the substrate, and exposing the distal end portion of the electrode by removing the first insulating layer and the second insulating layer from a distal end portion of the electrode.

A solid-state image sensing device includes a plurality of pixels. Each pixel has a photodiode, a first transistor, and a second transistor. The photodiode is constituted by a first-conductivity-type semiconductor region and a second-conductivity-type semiconductor region. The first and second conductivity types are opposite to each other. The first transistor has a first-conductivity-type drain region formed in the second-conductivity-type semiconductor region to transfer signal charge to the drain region. The second transistor has a source region and a drain region which are formed in the second-conductivity-type semiconductor region and which have the first conductivity type. At least one second-conductivity-type potential barrier is provided under the drain region of the first transistor and the source region and / or the drain region of the second transistor.

It is an object of the present invention to form a pixel electrode and a metal film using one resist mask in manufacturing a stacked structure by forming the metal film over the pixel electrode. A conductive film to be a pixel electrode and a metal film are stacked. A resist pattern having a thick region and a region thinner than the thick region is formed over the metal film using an exposure mask having a semi light-transmitting portion. The pixel electrode, and the metal film formed over part of the pixel electrode to be in contact therewith are formed using the resist pattern. Accordingly, a pixel electrode and a metal film can be formed using one resist mask.

A piezoelectric micro-blower includes an inner case to which a peripheral portion of a vibrating plate including a piezoelectric element is fixed such that a blower chamber is defined between the inner case and the vibrating plate and an outer case arranged to cover an outer periphery of the inner case with a gap therebetween. The inner case is elastically retained in the outer case by a plurality of connecting portions. A first opening is provided in a top plate portion of the inner case that faces a central portion of the vibrating plate, and a second opening is provided in a top plate portion of the outer case that faces the first opening. A central space is provided between the top plate portions, and fluid introduced from the outside is guided to the central space through the gap between the inner and outer cases. The vibrating plate is driven in a bending mode so that air is sucked into the central space and is discharged through the second opening. The connecting portions prevent leakage of vibration of the vibrating plate from the inner case to the outer case, thereby reducing energy loss.

Electrode pads (5) and a solder resist (7) are disposed on the upper surface of a wiring board (1), and apertures (7a) are formed in the solder resist (7) so as to expose the electrode pads (5). Electrodes (4) are disposed on the lower surface of a semiconductor element (2). Electrodes (4) are connected to the electrode pads (5) by way of bumps (3). An underfill resin (6) is disposed in the area that excludes the solder resist (7) and the bumps (3) in the space between the wiring board (1) and the semiconductor element (2). Between the wiring board (1) and the semiconductor element (2), the thickness (B) of the solder resist (7) is equal to or greater than the thickness (A) of the underfill resin (6) on the solder resist (7). The volume (Vb) of the bumps (3) is less than the volume (Vs) of the apertures (7a).

The invention concerns an electrical reactor for reforming, in the presence of an oxidant gas, a gas comprising at least one hydrocarbon, and / or at least one organic compound, including carbon and hydrogen atoms as well as at least one heteroatom. Said reactor comprises: an enclosure, a reaction chamber provided with at least two electrodes comprising at least one conductive lining material electrically isolated from the metal wall of the enclosure, at least one supply of gas to be reformed, at least one oxidant gas supply, at least one outlet for the gases from the reforming and one electrical source for powering the electrodes and resulting in generation of an electronic flux in the conductive lining between the electrodes and in heating said lining.

An electrode stack includes a cathode active material layer and an anode active material layer stacked together, and an electrolyte layer arranged between the cathode active material layer and the anode active material layer. A through hole extending in the stacking direction of the cathode active material layer and anode active material layer is formed in the cathode active material layer, anode active material layer and the electrolyte layer. The electrode stack further includes a bolt inserted to the hole for integrally holding the cathode active material layer, anode active material layer and the electrolyte layer. By such a structure, an electrode stack and a bipolar secondary battery that can effectively prevent displacement of interface between each of the cathode, anode and the electrolyte can be provided.

Permanent magnets 52a1, 52a2 are inserted into magnet insert holes 51a1, 51a4 formed in a main magnetic pole 50A of a rotor 50. An outer circumferential surface of the rotor includes a first outer circumferential surface portion 50a which intersects with a d-axis and second outer circumferential surface portions 50da, 50ab which intersect with a q-axis. A radius R2 of curvature of the second outer circumferential surface portions 50da, 50ab is larger than a radius of curvature of the first outer circumferential surface portions 50a. Recesses 50a1, 50a2 are formed in the second outer circumferential surface portions 50da, 50ab and in a position to face end walls 51a2, 51a5 of the magnet insert holes 51a1, 51a4 which are adjacent to the outer circumferential surface of the rotor. It is constructed such that [(74 / P)°≦θ≦(86 / P)°] and [(16 / P)°≦α≦(48 / P)°], where θ is a mechanical angle of the first outer circumferential surface portion 50a, P is the number of pairs of poles of the rotor 50, and α is a mechanical angle of the recesses 50a1, 50a2.

A coil component comprises a core element having a mounting portion, a coil conductor placed on the core element, and at least two terminal electrodes which are placed in the mounting portion. The mounting portion has at least two terminal placement areas for placing the terminal electrodes respectively. A hollow portion opening to the mounting side face of the mounting portion is formed in an area between the at least two terminal placement areas in the mounting portion. When mounting the coil component on a circuit board, conductive paste is intervened between an area from the terminal electrodes placed in the mounting portion of the core element to the base exposed area of the mounting portion, and the electrode patterns on the circuit board.

In a method for shielding electronics, a plurality of components to be shielded are arranged on a part of an assembly base to be shielded, each of the plurality of components having a first side including a first contact surface connectable to a common earth connection of the assembly base, each of the plurality of components further having a second contact surface, the plurality of components being arranged such that, for each of the plurality of components, the first side with the first contact surface faces out toward a periphery of the part of the assembly base. For each of the plurality of components, the first contact surface is connected to the earth connection. The plurality of components are shielded with a shielding device. For each of the plurality of components, the first contact surface is closer to the shielding device than the second contact surface.

An object of the prevent invention is to provide a light emitting element having slight increase in driving voltage with accumulation of light emitting time. Another object of the invention is to provide a light emitting element having slight increase in resistance value with increase in film thickness. A light emitting element of the invention includes a first layer for generating holes, a second layer for generating electrons and a third layer comprising a light emitting substance between first and second electrodes. The first and third layers are in contact with the first and second electrodes, respectively. The second and third layers are connected to each other so as to inject electrons generated in the second layer into the third layer when applying the voltage to the light emitting element such that a potential of the second electrode is higher than that of the first electrode.

A low-voltage male connector designed to be plugged into a low-voltage female connector having a plurality of flexible pins serving to come into contact with the male connector so as to establish electrical contact between the male connector and the female connector, the male connector being provided with insulation-displacement contacts, each of which serves to receive a respective conductor wire, wherein the electrical connection between the flexible pins of the female connector and the insulation-displacement contacts is established by a printed circuit provided with conductor tracks, each of which connects a respective insulation-displacement contact to a respective pin.

A case accommodates two circuit components to be overlapped one above the other and mutually in an approximately parallel form. The terminals of the upper electric power conducting channel are fitted into the terminals of the lower electric power conducting channel one above the other so that they can be connected. The case is provided with a positioning part which regulates deflection of both the terminals above and below toward the vertical direction intersecting with the direction that the terminal is fitted into the terminal, thus making it possible to give positioning to a plurality of the terminals all together and also making it possible to connect the terminals and the terminals respectively to their counterparts without fail. Further, the positioning part is provided on the case for accommodating the circuit components, which eliminates the necessity for a special positioning member.

The present invention provides a translucent solar cell and a manufacturing method thereof. The translucent solar cell comprises, in stacking order, a substrate, a first electrode layer, a photoconductive layer and a second electrode layer. The translucent solar cell is characterized in that there are formed a plurality of first light-transmissive apertures on the second electrode layer and the plurality of first light-transmissive apertures are further extended in a depth direction to the photoconductive layer to form a plurality of second light-transmissive apertures corresponding to the first light-transmissive apertures. A projected area of each of the second light-transmissive apertures is equal to or smaller than that of a corresponding first light-transmissive aperture.

A light emitting diode chip includes: a first conductive type semiconductor layer disposed on a substrate; a mesa disposed on the first conductive type semiconductor layer and including an active layer and a second conductive type semiconductor layer; an insulation layer covering the first conductive type semiconductor layer and the mesa, the insulation layer including at least one first opening exposing the first conductive type semiconductor layer and a second opening disposed on the mesa; a first pad electrode disposed on the insulation layer and electrically connected to the first conductive type semiconductor layer through the first opening; and a second pad electrode disposed on the insulation layer and electrically connected to the second conductive type semiconductor layer through the second opening. The first opening of the insulation layer includes a first region covered by the first pad electrode and a second region exposed outside the first pad electrode.

The present invention provides an assembled battery with reduced weight and high reliability that can achieve improvement of assembling easiness at low cost. An assembled battery is provided with a frame holding a plurality of unit cells 14 having positive polarity at one end and negative polarity at the other end. The frame is composed of two outer frames 2 having the same shape and an inner frame 3. The unit cells 14 constituting an assembled battery 1 are disposed on both sides of the inner frame 3, and one outer frame 2 and the other outer frame 2 are disposed such that the unit cells are sandwiched between the former outer frame 2 and the inner frame 3 and between the latter outer frame 2 and the inner frame 3. The two outer frames 2 are joined to the inner frame 3 through side face coupling portions 23 and vertical coupling portions 24. The inner frame 3 is fixed with positive electrode bus bars 5, negative electrode bus bars 6, and inter-unit cell bus bars 7 for electrically connecting the unit cells 14 in series, and lead wires for voltage detection with a connector 4 for detecting voltages of the unit cells 14.

Disclosed are a separator for lithium ion secondary batteries, having an inorganic layer formed from inorganic particles, characterized in that the inorganic particles have a particle diameter distribution in which the 50% cumulative particle diameter D50 is in the range of 100 nm to 500 nm, the 10% cumulative particle diameter D10 is 0.5D50 or more, and the 90% cumulative particle diameter D90 is 2D50 or less; a method for manufacturing the separator; and a lithium ion secondary battery using the separator. When the separator is used, there can be produced a lithium ion secondary battery in which a short circuit caused by contraction or melting can be definitely prevented, as well as the current density applied to the electrodes during charging and discharging is uniform so that charging and discharging can be efficiently achieved.

RTV silicone rubber compositions are provided comprising (A) an organopolysiloxane, (B) an organosilicon compound or partial hydrolytic condensate thereof, and (C) a non-aromatic amino-bearing compound. The compositions, when electric and electronic parts having a copper, silver or other metal portion on their surface are encapsulated or sealed therewith, can prevent or retard the parts from corrosion with sulfur-containing gas.

The present invention provides a ferrite core which has a structure in that plating is prevented from elongating, which can maintain insulation resistance between electrodes and can prevent short-circuit between a conductor wire and the electrode without damaging adhesion properties while mounted and, moreover, which can stabilize a Q value (loss characteristic) of a product. The ferrite core includes a wound core and flanges integrally formed at both ends of the wound core, and each of the flanges includes a plurality of legs provided so as to rise from one surface of the wound core and having a top surface to be formed with electrode, and each leg is tapered off toward the top surface and an vertical corner portion formed between adjacent side faces thereof has a curved surface.

When forming sophisticated semiconductor devices, a replacement gate approach may be applied in combination with a self-aligned contact regime by forming the self-aligned contacts prior to replacing the placeholder material of the gate electrode structures.