657 results about "Metal membrane" patented technology

The invention provides a finite element analysis method and system for geometric design of a flow regulating valve, and relates to the technical field of data processing.The method comprises the steps that 1, spatial geometric feature analysis is conducted on each data point in a discrete contour coordinate dataset, the principal curvature value of each data point on the sealing surface of a metal diaphragm is solved, and the principal curvature value of each data point is calculated; determining a point with the maximum average curvature value on the sealing surface of the metal diaphragm as a core morphology reference point; step 2, establishing a local coordinate system by taking the core morphology reference point as an original point, screening four sealing state points from the discrete contour coordinate data set, solving a corresponding space plane equation, and calculating a space intersection line between the space plane and the sealing surface of the metal diaphragm; according to the method, through accurate positioning of the core reference point, definition of the analysis sub-domain, grid division, mechanical solution, leakage rate calculation and parameter optimization, the dynamic particulate matter problem is effectively improved, and the sealing performance and the micro flow adjusting precision are improved.

The invention discloses a magnetron sputtering coating method with uniform coating and high target material utilization rate, and belongs to the technical field of film preparation, and the method realizes high-precision coating through whole-process collaborative optimization of pretreatment, sputtering, deposition and post-treatment. The substrate is cleaned in cooperation with radio-frequency pulse focusing bombardment; an electromagnetic coil group containing a temperature compensation coil is used for target sputtering, a magnetic field is dynamically adjusted in combination with laser profile sensing and a PID self-adaptive algorithm, and a direct current pulse-radio frequency composite power supply is matched to solve the target problem; in the deposition stage, a quartz crystal instrument is used for closed-loop film thickness control, metal film pulse gas supply and compound film reaction gas phase adjustment; gradient temperature rise is carried out according to data of an X-ray stress meter in post-treatment, and argon is used for dynamic protection and impurity prevention. According to the magnetron sputtering coating method with uniform coating and high target material utilization rate, the uniformity of coating and the target material utilization rate are improved, and the technological adaptability and stability of coating are improved.

The invention relates to the technical field of thermal insulation material preparation, and discloses an aerogel composite metal film thermal insulation material and a preparation method thereof, and the preparation method comprises the following steps: metal film surface treatment; performing fiber-metal film needling; through mold forming and porosity control, a fiber-metal film prefabricated part with a specific shape and a high-porosity structure is prepared; soaking and aging the sol, realizing efficient permeation and filling of the sol in the fiber-metal film prefabricated member through staged pressure control, and completing conversion from the sol to gel in a low-temperature aging stage, so that a uniform and stable nano-particle continuous phase is constructed in the fiber-metal film prefabricated member, and a gel-containing fiber-metal film prefabricated member is formed; the preparation method comprises the following steps: preparing a fiber-metal film preform, performing supercritical drying, thoroughly removing a solvent under the condition of not damaging a gel network structure by utilizing the characteristic that alcohol fluid has no gas-liquid interface surface tension in a supercritical state aiming at the fiber-metal film preform containing gel, and further preparing the aerogel composite metal film heat insulation material.

The invention discloses a preparation method of a flexible infrared super-surface absorber based on MDM, and belongs to the field of micro-nano machining patterning. The method comprises the following steps: pretreating a polymer material; depositing a layer of bottom metal film on the pretreated substrate by adopting magnetron sputtering; a metal reflecting layer, a dielectric insulating layer and a metal surface functional layer are sequentially deposited through magnetron sputtering, a periodic nano microstructure is constructed on the surface of a flexible composite film, a nano round pit array is etched in situ on a surface metal layer of an MDM structure by using a femtosecond laser selective etching process, and an MDM laminated structure is formed. According to the invention, stable integration of the MDM structure and the flexible substrate can be realized, and meanwhile, high absorptivity and good flexibility of the device in an infrared band are ensured. The absorber prepared by the invention can generate resonance absorption on incident infrared electromagnetic waves through a surface plasmon and F-P cavity resonance coupling mechanism, and meanwhile, the characteristic size variation is changed through physical excitation, so that effective absorption and frequency regulation of the electromagnetic waves at the infrared band of 3-14 microns are realized.

The invention belongs to the technical field of coated glass, and particularly provides a deposition method of a metal seed layer in TGV metallization and magnetron sputtering equipment. The invention aims to solve the problem of serious surface discharge phenomenon caused by low adhesive force between a metal film and a glass substrate, low metal coverage rate and step rate in a through hole and high accumulated charge on the surface of glass in the existing TGV metallization process. The independent and controllable ion source is introduced to assist deposition, the ion source is started at different stages of metal film deposition, and directional and high-energy positive ion flow generated by the ion source is utilized to bombard the surface of the glass substrate so as to assist the magnetron sputtering process, so that the surface of the glass substrate is subjected to magnetron sputtering. Through shallow ion implantation, enhancement of surface migration energy of deposited metal atoms and neutralization of negative charges accumulated on the glass surface, the adhesive force between metal and a glass substrate is improved, the metal coverage rate and the step rate in a through hole are improved, surface discharge is inhibited, and therefore the process stability is improved.

The invention belongs to the technical field of graphite metal composite heat dissipation devices, and provides a flexible graphene film heat conduction cable and a preparation method thereof.The preparation method comprises the steps that the surface of a graphene film is cleaned and punched, and the graphene film with micron-sized pores in the surface is obtained; sequentially plating a layer of active metal film and a layer of heat-conducting metal film on the surface of the graphene film, and cutting to obtain a graphene film; graphene films are overlaid layer by layer to obtain a laminated material, and the two ends of the laminated material are clamped to a hot-pressing mold to be subjected to hot-pressing welding treatment, so that a locally connected flexible heat conduction section is obtained; and the flexible heat conduction section and the heat conduction metal shell are assembled, a soldering lug is placed for brazing and finish machining, and the flexible graphene film heat conduction cable is obtained. According to the method, the internal connection problem of the flexible section is solved by establishing a synergistic process of surface punching, double-layer coating and hot pressing, the heterogeneous connection problem of the flexible section and the shell is solved in a manner of sampling coating and brazing, and through the synergistic effect of all links, the overall performance and reliability of the heat-conducting cable are remarkably improved.

The present application relates to the technical field of biological sensing, and discloses a composite functional porous metal membrane and detection system for monitoring and identifying airborne microorganisms, and a method for monitoring and identifying airborne microorganisms. The monitoring and identification method comprises: applying an electric field to the composite functional porous metal membrane, causing the membrane to freely switch charge and capture airborne microorganisms to be tested; adding a fluorescent probe to the composite functional porous metal membrane, which binds with the microorganisms to be tested to obtain a fluorescent sample, and collecting imaging of light emitted after irradiation of excitation light, to achieve preliminary determination and addressing of the microorganisms to be tested; performing Raman spectroscopy scanning on individual bacteria, and comparing with a standard Raman spectrum library to achieve species identification of the individual bacteria. Relying on the "composite functional porous metal membrane," an integrated process of "selective enrichment-total bacteria monitoring-species identification" is realized; the present invention takes selective enrichment of the microorganisms to be tested as an entry point, lays the foundation for preliminary judgment accuracy and species identification accuracy, and improves the efficiency and precision of monitoring and identifying airborne microorganisms.

An optical component including: a substrate on which an optical element is mounted; a transparent sealing member disposed above the substrate and configured to seal the optical element; and a bonded portion in which a plurality of metal films are laminated, and which is configured to bond the transparent sealing member and the substrate. The bonded portion includes: one or more stress relaxation layers constituted by one or more metal films having a Young's modulus of less than or equal to 150 GPa, the one or more stress relaxation layers having a total thickness of greater than or equal to 1.2 μm; and a diffusion prevention layer disposed on each of both sides in a thickness direction of each of the one or more stress relaxation layers, and configured to prevent diffusion of metal constituting the stress relaxation layer.

The invention discloses a method for efficiently extracting and recovering valuable elements from tailings. The method comprises the steps of gradient crushing-morphology separation, rotational flow reselection-flotation coupling, enhanced alkaline leaching, biological oxidation-acid leaching collaboration, membrane electrolysis enrichment, extraction resin deep recovery and tail water zero discharge treatment. According to the method, metal is pre-enriched through gradient crushing-morphology separation; after rotational flow classification, minerals of different size fractions are recycled through gravity separation and flotation; metal with different chemical forms is dissolved through three-stage synergism of alkaline leaching, biological oxidation and acid leaching; selective deposition of valuable metal in the solution is realized through membrane electrolysis; adsorbing and recovering rare earth by using extraction resin; and tail water closed-loop treatment. According to the method, the aim of multi-element collaborative recovery is achieved, meanwhile, the recovery rate of coarse-grain gold is increased, meanwhile, high-temperature roasting is replaced with biological oxidation, energy consumption is reduced, full recycling of waste water can be achieved, and the method is quite suitable for efficient recovery of valuable elements in metal mine tailings.

The invention relates to the technical field of etching solutions, and discloses a molybdenum-aluminum-niobium etching solution for a TFT-LCD (Thin Film Transistor Liquid Crystal Display), which comprises the following components in percentage by mass: 50 to 60 percent of phosphoric acid, 3 to 8 percent of nitric acid, 5 to 10 percent of glacial acetic acid, 1 to 5 percent of aluminum nitrate, 0.1 to 0.5 percent of diphenyl thiourea, 1 to 5 percent of etidronic acid, 3.0 to 5.0 percent of sodium hexametaphosphate, 0.1 to 0.2 percent of fatty alcohol-polyoxyethylene ether, 0.5 to 0.8 percent of amino trimethylene phosphonic acid and the balance of ultrapure water. The invention further discloses a preparation method of the molybdenum-aluminum-niobium etching solution. According to the invention, a phosphorus nitrate vinegar system, a composite additive, a novel corrosion inhibitor, a metal ion chelating agent and a surfactant matched with the etching liquid are adopted, so that the molybdenum-aluminum-niobium multi-layer composite metal film can be simultaneously etched at one time; the etching solution has the advantages of being uniform in etching, capable of inhibiting Mo / Nb etching, high in selectivity, controllable in etching rate, free of residues, long in service life, high in stability and the like.

The invention provides an etching solution compatible with Cu / Mo and Cu / MTD and application of the etching solution. The etching solution comprises a main agent and an auxiliary agent, the main agent comprises the following components in parts by weight: 5-22 parts of an oxidizing agent, 1-15 parts of organic acid, 0.01-5 parts of inorganic acid, 0.5-15 parts of organic alkali, 0.01-5 parts of a stabilizer, 0.01-1 part of a metal inhibitor and 1-100 parts of water. The etching solution provided by the invention can be effectively compatible with two different metal structures, namely Cu / Mo and Cu / MTD, and can realize a good etching effect on different metal film layers in the etching process, so that the problem of poor etching caused by poor compatibility of the etching solution is reduced, and the yield of products is improved; the etching solution has excellent etching performance on Cu / Mo and Cu / MTD alloy double-layer films and the like, no residue is left after etching, substrate materials such as a glass substrate and the like cannot be damaged, and the high requirement of the modern electronic manufacturing process on the etching solution is met.

An electronic device according to the present disclosure includes a semiconductor substrate, a chip, and a bump. The chip has a thermal expansion coefficient different from that of the semiconductor substrate. The bump connects the connection pads provided on the opposing principal surfaces of the semiconductor substrate and the chip. The bump has a porous metal layer and a metal film. The metal film is provided on at least one of a portion between the connection pad provided on the semiconductor substrate and the porous metal layer and a portion between the connection pad provided on the chip and the porous metal layer, and on the side surfaces of the porous metal layer.

The application discloses a preparation method of a multi-layer composite film system, a conductive thin film and a semiconductor device. The preparation method of the multi-layer composite film system comprises the following steps: preparing a first layer of metal film on a substrate by a vacuum coating method; performing surface roughening treatment on the first layer of metal film; and preparing a second layer of metal film on the first layer of metal film after the surface roughening treatment by the vacuum coating method. The preparation method of the multi-layer composite film system can enhance the adhesion between the film layers by performing the surface roughening treatment on the first layer of metal film, so that the mechanical combination mode is adopted between the film layers, the adhesion between the film layers is improved, some film layers which cannot be combined under vacuum can be effectively connected in the mechanical combination mode, the equipment investment cost is reduced, the multi-layer film system of various types is prepared by a single device, the substrate rework is effectively reduced or prevented, and the production cost is greatly reduced.

The application provides an electromagnetic shock wave generator, comprising an electromagnetic generating assembly and an electromagnetic induction assembly, the electromagnetic generating assembly is arranged on one side of the electromagnetic induction assembly; wherein the electromagnetic generating assembly comprises a coil and a conductive piece connected with each other, the electromagnetic induction assembly comprises a clamping piece and a metal diaphragm fixed at least partially to the periphery of the clamping piece, the metal diaphragm is arranged on one side of the coil and can vibrate under the action of the coil; wherein a metal sheet is arranged on the side of the metal diaphragm away from the coil, the radial dimension of the metal sheet is smaller than the radial dimension of the metal diaphragm, and the metal sheet is arranged at the middle part of the metal diaphragm. The electromagnetic shock wave generator provided by the application can generate shock waves, and the metal diaphragm generating the shock waves will not be damaged due to external microjet impact and other factors, meanwhile, the shock waves will not be excessively lost, the service life is prolonged and the functionality is not reduced.

The invention relates to an etching liquid composition for a copper-based metal film. The etching liquid composition for the copper-based metal film according to the invention comprises hydrogen peroxide, a hydrogen peroxide stabilizer, tetrazole substituted by amino, tetrazole substituted by (C1-C4) alkyl, an ammonium compound and organic acid containing one carboxyl group.

A measurement system (100) for measuring the thickness of a layer on a substrate (10) is described. The measurement system (100) includes a holder for holding the substrate (10) or a mask. The holder has a measurement opening (111) for providing an optical path from the back side (110B) of the holder (110) to a measurement region of the substrate. The measurement region includes a metal film (11). Additionally, the measurement system (100) includes a light source (120) that provides light to the measurement region (10M) through the measurement opening (111). Furthermore, the measurement system (100) includes a detector (130) for detecting reflected light from the measurement region through the measurement opening (111).

Materials and methods for metallizing target substrates and metallized structures formed according to these methods are provided. The methods generally involve the formation of a conductive seed layer on a target substrate. The conductive seed layer is formed using a conductive ink composition that is converted to a conductive metallic film on the target substrate. The conductive metallic film is then metallized using standard additive techniques such as electroplating. The methods can further include masking and unmasking steps and optional etching of the metallized surface to generate conductive patterned structures. Also provided are metallized structures that comprise a conductive seed layer on the target substrate and a metallized layer on the conductive seed layer. In some cases, the metallized structures are prepared according to the disclosed methods.

The present invention addresses a problem of providing a polypropylene film that has excellent voltage resistance characteristics and reliability in a high-temperature environment and is suitable for capacitor applications or the like used under a high temperature and a high voltage. Provided is a polypropylene film including a cyclic olefin resin, in which in a case where a strength in a main orientation direction measured at 23°C is F(A23) and a strength in a main orientation orthogonal direction measured at 23°C is F(B23), F(A23) + F(B23) is 120 MPa or more and 1000 MPa or less, and a shrinkage rate in the main orientation direction measured at 150°C is -2.0% or more and 3.0% or less.

A plated metal film is formed on a wire placement surface of a terminal electrode. The plated metal film includes a nickel layer serving as a base and a tin layer as a surface layer. The wire extends along the wire placement surface and is bonded to the wire placement surface, in a connection portion between the wire and the wire placement surface, by a bonding member that contains a metal, such as tin, derived from the plated metal film. A fillet that contains a metal, such as tin, derived from the plated metal film is formed so as to fill in the gap between the wire and the wire placement surface at the end of the wire placement surface from which the wire extends toward a winding core portion.

The invention relates to the technical field of thermal interface material defect detection, in particular to a nondestructive detection method and system for thermal interface material application defects, and the system comprises an electric displacement table, heating laser, detection laser, a photoelectric detector, an acoustic optical modulator, a lock-in amplifier, an optical element and a data processing unit; the electric displacement table is used for fixing a sample and accurately controlling the position of the sample; the sample is of a silicon-thermal interface material-substrate sandwich structure; the upper-layer silicon wafer of the sample is plated with a metal film as a transduction layer; the heating laser is used for heating the sample; the acoustic optical modulator is used for modulating the heating laser, so that the heating laser heats the sample in a sine wave form; the detection laser is used for detecting sample temperature fluctuation; the photoelectric detector is used for collecting and detecting laser reflection signals; the lock-in amplifier is used for extracting and detecting laser phase and amplitude signals. According to the invention, non-destructive rapid detection of the defects of the thermal interface material in an application scene can be realized.

The application belongs to the technical field of couplings, and particularly relates to a metal membrane disc coupling and a processing method thereof. The metal membrane disc coupling comprises a flange disc, a coupling joint and a metal membrane disc, and the metal membrane disc is arranged between the flange disc and the coupling joint. In particular, the metal membrane disc comprises an upper closed membrane, a middle layer membrane and a lower closed membrane, at least one side surface of the middle layer membrane is provided with a plurality of microgrooves arranged along a predetermined path, the microgrooves are filled with liquid metal, the upper closed membrane and the lower closed membrane are respectively arranged on the upper and lower sides of the middle layer membrane, and are used for closing the microgrooves and forming a closed liquid metal microcavity structure. In the application, the liquid metal is filled in the microgrooves of the middle layer membrane, and the good fluidity and high thermal conductivity of the liquid metal can be used to actively migrate to a local high load area when stress is concentrated or temperature rises, so that stress relief and heat diffusion are realized, and the fatigue resistance and thermal stability of the membrane are improved, and the service life of the coupling is prolonged.

An acoustic wave device includes a substrate including first and second main surfaces facing away from each other, a substrate including a third main surface facing the first main surface, a functional electrode on the third main surface, a support portion positioned between the main surface and the main surface to provide a space between the first and third main surfaces, and a via conductor in the substrate and extending from the first main surface toward the second main surface. The support portion includes a first metal film on the first main surface and a second metal film on the third main surface, and a ratio of an area of the first metal film to that of the first main surface is larger than a ratio of an area of the second metal film to that of the third main surface.

The present application relates to the technical field of laser-induced etching, and particularly relates to a MEMS optical-grade cavity cover plate processing method. The method comprises the following steps: S1. selecting an optical cover plate with a required size, and cleaning the surface; S2. depositing a metal film on the surface of the optical cover plate by using a PVD process; S3. coating a negative photoresist on one side of the optical cover plate; S4. covering the cover plate containing a pattern on the surface of the photoresist to perform exposure and development, and exposing the patterned metal layer; S5. etching the metal film to manufacture a mask plate; S6. modulating a high-power infrared laser into a spatial structure light, irradiating the surface of the mask plate, and ascending and descending in the Z-axis direction; S7. etching the modified part to a required depth by using a wet etching method, and controlling the etching depth by controlling the depth of the irradiation modification area and adjusting the etching time; S8. removing the photoresist and the metal film, and obtaining an optical-grade cavity cover plate. The method has low equipment cost, fast processing speed, accurate size and shape, completely transparent cavity, and safe and environmentally-friendly process.

The manufacturing method of the composite metal film comprises the following steps: cleaning a metal substrate; plating a nickel film on the surface of the metal substrate; performing ion etching on the nickel film to form a honeycomb surface; plating a tin film on the nickel film; and performing ion etching on the tin film to form a honeycomb surface. The method is simple in process and low in cost, and can form a film body on the metal substrate, which is stable in combination and performance, resistant to corrosion and low in stress, thereby prolonging the service life.

The application provides a thick metal wet etching process improvement method, and relates to the technical field of wet etching.The method comprises the following steps: performing one-time wet etching on a metal film layer to be etched covered by a photoresist film layer, and continuously monitoring the corrosion width of the sidewall of the etched part; when the corrosion width is greater than a preset value, the present wet etching is terminated; heating the metal film layer to be etched after the present wet etching is completed, so that the photoresist film layer naturally collapses and covers and protects the sidewall of the etched part; after the photoresist film layer is reshaped, the above steps are cyclically executed until the etching is completed, and the metal film layer after the etching is completed is obtained.The method of the application aims to solve the problem that the thick metal wet etching becomes difficult to control due to the increase of the metal film thickness, can ensure that the sidewall corrosion is controllable in the etching process of the thick metal film layer, avoids over-corrosion of the sidewall, thereby ensuring the integrity of the required pattern and avoiding distortion of the appearance.

The invention relates to a preparation method and application of an etching-resistant composite hard mask, and the method comprises the following steps: S1, spin-coating a negative photoresist on the surface of a substrate to be etched, and carrying out soft baking and curing to obtain a bottom photoresist layer; s2, spin-coating positive photoresist on the bottom photoresist layer, and curing after soft baking to obtain a top photoresist layer; s3, covering a photoetching plate with a preset pattern on the top photoresist layer, and forming a patterned photoresist layer after exposure, baking after exposure and developing; and S4, performing extensive exposure treatment on the patterned photoresist layer to enable the top photoresist layer to be exposed and the covered bottom photoresist layer not to be exposed, then preparing a metal film layer on the patterned photoresist layer through chemical vapor deposition, and performing development treatment to obtain the etching-resistant composite hard mask. The preparation method of the composite hard mask is simple, the etching blocking effect is good, the requirement of a deep etching process is met, after etching is completed, the hard mask on the surface of the substrate can be rapidly removed in a lossless mode, and the product yield is improved.

The invention relates to the field of semiconductor manufacturing, in particular to a metal film stripping process and device, in the process, a substrate with a metal film layer and a photoresist pattern layer is provided, the metal film layer is located on the upper surface of the photoresist pattern layer, and the metal film layer is provided with a metal stripping area located on the upper surface of photoresist in the photoresist pattern layer; in the stripping process, pulse airflow is sprayed to the surface of the metal stripping area until the metal film layer in the metal stripping area is separated from the upper surface of the photoresist, and the pulse airflow is steam or steam two-fluid formed by combining steam and liquid drops. According to the method, the metal film layer on the surface of the substrate is impacted by controlling the pulse airflow, so that the impact pressure can be improved in a short time, and a strong shear force and an eddy current effect are generated between the metal film layer in the metal stripping region and the photoresist pattern layer, so that the stripping effect is improved, and the metal film layer in the metal stripping region is effectively stripped and taken away; and the pulse airflow conveyed in the pulse form can reduce the conveying amount and reduce the cost.

The utility model discloses a printing carrier plate and a photovoltaic cell, and belongs to the technical field of photovoltaic cells. The printing support plate comprises a support plate body and a film layer arranged on the surface of at least one side of the support plate body, and the film layer comprises at least one of a metal film layer and a polymer film layer; the printing carrier plate further comprises a groove array, and the groove array penetrates through the film layer and extends to the carrier plate body in the thickness direction of the printing carrier plate. According to the utility model, the quality of groove laser etching can be improved.

This invention discloses a method for removing a double-layer positive photoresist for preparing metal bumps: S1, cleaning the epitaxial wafer; S2, spin-coating a first-type positive photoresist as the bottom layer onto the epitaxial wafer; S3, soft baking to cure the first-type positive photoresist; S4, spin-coating a second-type positive photoresist as the top layer onto the first-type positive photoresist; S5, soft baking to cure the second-type positive photoresist; S6, exposure using a photolithography machine to expose the double-layer photoresist; S7, post-baking; S8, development using an alkaline developer to develop the double-layer photoresist; S9, metal deposition using a metal deposition apparatus; S10, removing the double-layer photoresist using a photoresist stripping solution; S11, preparing metal bumps on the surface of the epitaxial wafer. This invention achieves a lift-off process using a double-layer positive photoresist, solving the problem of difficult preparation of small-sized metal bumps in Micro-LED micro-display devices, and enabling the preparation of metal bumps with small spacing and high thickness.

This invention pertains to photothermal evaporation and its water purification, specifically relating to a biochar metal membrane. It is composed of a copper foam mesh, titanium acetylacetonate, lychee charcoal, and alcohol. The composition, by mass, includes one sheet of copper foam mesh, 75g of alcohol, 2g of lychee charcoal, and 0.2g of titanium acetylacetonate. The invention also discloses a method for preparing the biochar metal membrane, specifically involving: stirring titanium acetylacetonate and lychee charcoal in alcohol; immersing the copper foam mesh in the solution repeatedly for several dozen times to obtain a hydrophilic biochar metal membrane. The XRD and contact angle images of the obtained hydrophilic biochar metal membrane are shown in Figure 1a. The prepared biochar metal membrane has a porous structure, further enhancing its photothermal performance. This invention also discloses the photothermal evaporation performance of the biochar metal membrane and its application in seawater desalination. The biochar metal membrane of this invention is non-salt-accumulating, hydrophilic, and possesses highly efficient photothermal performance, enabling its application in multiple fields.