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4662 results about "Electron bunches" patented technology

Equipment for manufacturing large-size metal part in high energy beam additive manufacturing mode and control method of equipment

The invention discloses equipment for manufacturing a large-size metal part in a high energy beam additive manufacturing mode and a control method of the equipment. The equipment comprises a work cavity, a worktable, a control system, a high energy beam scanning generator, a powder storage hopper, a powder laying device and a gas purification module, wherein the worktable is composed of a forming cylinder and a powder recycling cylinder, and the upper surface of the forming cylinder and the upper surface of the powder recycling cylinder are coplanar and form a work plane. The control system controls the high energy beam scanning generator and the powder laying device to move opposite to the worktable in the powder laying direction. The equipment for manufacturing the large-size metal part in the high energy beam additive manufacturing mode and the control method of the equipment largely shorten the waiting time caused by pre-installation of a powder bed when a common laser/electron beam selective melting technology is used for processing a part, thereby obviously improving the forming efficiency of high energy beam additive manufacturing. Through the application of the equipment for manufacturing the large-size metal part in the high energy beam additive manufacturing mode and the control method of the equipment, a metal part with a meter-grade size, high performance, high accuracy and a complex structure can be manufactured efficiently and rapidly.

Apparatus and method for obtaining topographical dark-field images in a scanning electron microscope

An electron beam apparatus is configured for dark field imaging of a substrate surface. Dark field is defined as an operational mode where the image contrast is sensitive to topographical features on the surface. A source generates a primary electron beam, and scan deflectors are configured to deflect the primary electron beam so as to scan the primary electron beam over the substrate surface whereby secondary and/or backscattered electrons are emitted from the substrate surface, said emitted electrons forming a scattered electron beam. A beam separator is configured to separate the scattered electron beam from the primary electron beam. The apparatus includes a cooperative arrangement which includes at least a ring-like element, a first grid, and a second grid. The ring-like element and the first and second grids each comprises conductive material. A segmented detector assembly is positioned to receive the scattered electron beam after the scattered electron beam passes through the cooperative arrangement. Other embodiments, aspects and features are also disclosed. The apparatus is configured to yield good topographical contrast, high signal to noise ratio, and to accommodate a variety of scattered beam properties that result from different primary beam and scan geometry settings.
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