The invention discloses a Micro-LED
chip based on a
passivation layer and a side wall
metal layer and a preparation method, the Micro-LED
chip comprises an LED structure and an
electrode structure which are arranged on a substrate, and a first
passivation layer and a
dielectric layer which are sequentially arranged on the surface of the LED structure, and one side of the
dielectric layer is provided with a
metal layer; the LED structure sequentially comprises a first
semiconductor layer, a light-emitting layer and a second
semiconductor layer, and the first
semiconductor layer and the second semiconductor layer are opposite in
conduction type. According to the invention, low interface
trap density and
fixed charge density are realized through the first
passivation layer on the surface of the LED structure, the non-radiative recombination of side wall carriers is significantly reduced, and the EQE of the Micro-LED
chip is improved; forward bias
voltage is applied through the
dielectric layer /
metal layer side wall structure, the energy difference between a surface defect state and an
electron energy state is reduced, surface non-radiative recombination is reduced, EQE is improved, and the method is suitable for low-current-density operation.