The invention relates to the technical field of manufacturing of deep
ultraviolet semiconductor laser devices, in particular to a transverse-structure deep
ultraviolet laser capable of promoting carrier injection and a preparation method of the transverse-structure deep
ultraviolet laser. Comprising a substrate, a template layer, an n-type AlGaN
contact layer, an n-AlN
thin layer, an n-type AlGaN surrounding layer, a lower
waveguide layer, a multi-
quantum well layer, an upper
waveguide layer, a p-type AlGaN surrounding layer, a p-type
contact layer and a p-
type metal electrode layer which are sequentially stacked from bottom to top. The surface of one side, far away from the template layer, of the n-type AlGaN
contact layer is of a step-shaped structure; the step-shaped structure comprises a
ridge surface and an independent step surface, the
ridge surface bears the n-AlN
thin layer, and the step surface is independently provided with an n-
type metal electrode layer. The invention has the advantages that:
heterojunction with different Al components is introduced into the n-type region and the p-type region of the device to generate two-dimensional
electron gas, so that better
electron injection and hole injection are realized,
electron transmission paths are reduced, the
joule heat of the device is reduced, the
lasing threshold is greatly reduced, and the luminous power is improved.