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7622results about "Electronic circuit testing" patented technology

Method and apparatus for testing error detection

Disclosed is a device and method for testing of a program or a design of an electronic device comprising digital logic circuitry. The method comprises testing the design of software or an electronic device and injecting, after initiation of the testing step, a predetermined error pattern into a value operated upon by the design of the digital logic circuitry. In a preferred embodiment, the software is a simulation of the design of a processor having a cache with error detection and/or correction circuitry. A triggering condition is preferably a cache hit, in response to which a detectable error is injected into the cache. The simulated operations of the model are observed to determine whether the injected error is detected, as should happen if the processor's error detection circuitry has been designed properly. In another respect, the invention is an apparatus, or computer software embedded on a computer readable medium, for testing a program comprising an error detector. The apparatus or software comprises the program, an error injector module connected to the program; and a checker module connected to the program. The checker module is capable of determining whether the program responds appropriately to an error dynamically produced by the error injector module during execution of the program. By injecting errors dynamically the invention easily facilitates precisely focused testing at any time during simulated operation regardless of initialization conditions.

Self-diagnostic circuitry for emergency lighting fixtures

Electronic self-test and/or self-diagnostic systems particularly useful with emergency lighting fixtures, including exit signage having light emitting diodes as light sources and unit emergency fixtures powered with lead-acid batteries, the systems perform testing and diagnostic functions on the circuitry, power supply, charger and lamping of such fixtures either by manual or automatic initiation. Testing functions are provided through use of a programmable microprocessor, the diagnostic circuitry not only monitoring operation of charger/transfer circuitry but also controlling the charger/transfer circuitry to enable alternate strategies for alleviation of a given failure. In emergency mode of a light emitting diode exit sign, a microprocessor-controlled two-stage inverter is employed not only to power the LED light source, but also to efficiently power the microprocessor. Power to the microprocessor is controlled by the microprocessor itself and can therefore be discontinued after appropriate operation until mains power is restored, thereby effectively reducing power consumption to zero. System operation can be flexibly configured through use of a two-wire serial link between modular elements of the system. Incandescent emergency unit fixtures due to high drain rates and output loads require emergency mode operation through use of lead-acid batteries, thereby requiring voltage controlled charging and relay transfer, the self-test and/or self-diagnostic circuitry of the invention used with emergency unit fixtures thus differing in various respects from the circuitry employed for the LED exit signage fixtures and primarily in the need to measure both charge and discharge currents, the circuitry having a larger dynamic range in addition to a capability of measuring both positive and negative currents.

High density integrated circuit apparatus, test probe and methods of use thereof

InactiveUS20070271781A9High performance functional testingHigh-temperature burnElectrically conductive connectionsElectronic circuit testingElastomerElectricity
The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed ion the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
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