55 results about "Normal thickness" patented technology

A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, higher performing, robust and cost-effective microsystem package. The highly integrated microsystem package, comprising electronics, sensors, optics, and MEMS, can be miniaturized both in volume and footprint to the size of a bottle-cap or less.

One embodiment of the invention concerns an electrical household apparatus, for example a washing machine, equipped with a control device in the form of a panel, said panel comprising a display device for providing visual data to the user. Said panel (10) is made of a material which is substantially opaque when it has a normal thickness (14). One area specific to the display device (15) comprises at least one transparency zone (20) wherein the thickness of the panel material is reduced relative to the thickness of the material outside said transparency zone such that light from a light source (16), for example a light-emitting diode, located behind the panel may pass through said transparency zone. Such a configuration provides backlighted panels having a closed surface. In another embodiment, the control device is in the form of a turning knob (70, 80).

The invention discloses a mirror image milling follow-up jacking support method and device for thin-walled parts. The mirror image milling follow-up jacking support method and device for the thin-walled parts are used for solving the problem that in an existing milling machining process of large-sized thin-walled parts, machining vibration and local deformation easily occur to the workpieces. According to the technical scheme, the special mechanical-arm-shaped jacking support device is adopted and comprises a jacking support arm rotating box, a main jacking support arm, a jacking support headrotating box, a main jacking support head, an auxiliary jacking support arm, an auxiliary jacking support head rotating box, an auxiliary jacking support head, a servo motor and the like. In the milling machining process of the thin-walled parts, the jacking support heads of the jacking support device conduct follow-up support from the reverse surfaces of the thin-walled parts according to machining cutter trajectory program coordinates, the normal thickness compensation of the support surface is achieved through online thickness monitoring at the same time, the machining deformation is avoided, the machining stability is improved, and the machining precision and quality of the thin-walled parts are ensured.

The invention belongs to the field of metal plastic deformation technologies and detection, and discloses a detecting method of a deformation defect of a multi-groove panel. The method comprises the following steps: (a) dividing a panel to be detected into a plurality of cross sections; treating each cross section as a surface to be detected; and scanning the upper surface and the lower surface ofeach surface to be detected so as to obtain coordinates of each scanning point on each of the upper side and the lower side of all surfaces to be detected; and (b) calculating the normal thickness ofeach scanning point on the surface to be detected based on the coordinates of each scanning point on each of the upper side and the lower side of each surface to be detected; comparing the normal thickness of each scanning point and the standard thickness of the panel to be detected; and determining that the panel of which the normal thickness is less than a preset deviation range as a qualifiedpanel, and otherwise determining that the panel is defected. The invention also discloses a detecting system of the method. With the adoption of the detecting method and system, the panel defect can be automatically rapidly detected; the detecting efficiency is high; and the detecting result is high in reliability.

The invention relates to a method manufacturing a mold cavity for preventing shrinkage of decorative strip products and the mold cavity. The decorative strip products have large injection pressure loss because the tail end of the product is far from the glue inlet, so that the tail part is easy to shrink at the corner to generate pits which can influence the appearance of the products. In order to solve the problem, the thickness of the mold cavity at the corner can be reduced, and then slowly transits to the normal thickness through a horizontal segment with a distance, so that the shrinkage problem of the tail part of the product can be well solved. The method is simple, and good effect can be achieved only by slightly changing the mold.

The invention discloses a glass fiber reinforced plastic flue gas jetting pipe used in a desulphurization technology. The glass fiber reinforced plastic flue gas jetting pipe comprises components of, from the inner side to the outer side: an inner antiseptic layer, a resin-rich structural layer, and an outer antiseptic layer. The inner antiseptic layer comprises a glass fiber surface felt layer and a glass fiber chopped strand felt layer manufactured from pasted oxirene-based resin. Oxirene-based resin takes 70-80wt% of the inner antiseptic layer. According to the weight of oxirene-based resin, 1-10% of silicon carbide and 1-2% of conductive carbon powder are mixed in oxirene-based resin. The resin-rich structural layer comprises normal thickness sections and thickened sections arranged along an axial direction of the jetting pipe. The thickened sections are arranged at connection positions between the glass fiber reinforced plastic flue gas jetting pipe and a separating plate, and between the glass fiber reinforced plastic flue gas jetting pipe and a grate. The resin-rich structural layer comprises alternately paved glass fiber check cloth layers and glass fiber chopped strand felt layers. The surfaces of the glass fiber check cloth layers and glass fiber chopped strand felt layers are pasted by using oxirene-based resin. Oxirene-based resin takes 55-70wt% of the resin-rich structural layer. Correspondingly, the invention provides a manufacturing method of the glass fiber reinforced plastic flue gas jetting pipe used in the desulphurization technology.

The invention provides a device and a method for manually measuring normal thickness of a large cavity deep radome. The device comprises a radome measurement fixing device and a handheld radome normal thickness snap gauge, wherein the radome measurement fixing device comprises a measurement table, a radome shelf, a large-end fixing clip and a small-end fixing clip; and the handheld radome normal thickness snap gauge comprises a measurement main support, a reinforcing frame, a measurement micrometer head, a measurement micrometer head support, an inner measuring rod, an inner measuring rod support, a positioning micrometer head, a lengthened positioning rod and a positioning micrometer head support. The device has a composite measuring rack structure; the structure of the measurement snap gauge is designed optimally; and the measurement snap gauge can be light under the condition that the structural strength is guaranteed. The positioning measurement method is implemented by using the micrometer head, and a measured angle can be accurately and quickly positioned. The device has the advantages of high precision, low cost, convenience in operation and the like. Moreover, the device and the method have remarkable application value on measurement of the normal thickness of the radome.

According to the present invention, there is provided an image forming apparatus capable of setting plural printing modes including a normal mode for printing on a recording medium having a normal thickness other than recording media having specific thicknesses including a thick recording medium and a thin recording medium, the image forming apparatus comprising: a fixing section configured to fix a developing agent image carried on a recording medium onto the recording medium by heat supplied from a heat source, the fixing section having not less than two printing speeds and not less than two preset fixing temperatures; and a temperature control section configured to control a fixing temperature of the fixing section so as to adjust the fixing temperature to a preset fixing temperature.

The invention discloses a negative pressure ageing method of a lithium ion battery, which can preferably eliminate the ballooning of the lithium ion battery and ensure normal thickness index and safety use of the battery. The method comprises the following steps: carrying out formation on the battery; placing the battery in a vacuum tank for carrying out opening negative pressure ageing for 10 hours; and reforming and sealing the battery. A battery production method is designed independently and has independent core intellectual property. The method provided by the invention is used to ensure the thickness index, normal cycling performance and stability of the battery, and is applied to the production field of the lithium ion batteries.

The invention discloses a radio frequency laterally diffused metal oxide semiconductor (LDMOS) device with thermometal silicide and a manufacturing method. A P-shaped silicon substrate is provided with P-shaped epitaxy. A N-shaped low doped drain region, a P trap and a N-shaped heavy doped drain region are arranged in the P-shaped epitaxy. A N-shaped heavy doped source region and a P-shaped heavy doped lead out region are arranged in the P trap. A drain electrode titanium silicide layer is arranged on the top of the N-shaped heavy doped source region. A source electrode titanium silicide layer is arranged on the top of the P-shaped heavy doped lead out region and the N-shaped heavy doped source region. A grid electrode titanium silicide layer is arranged on the top of a polycrystalline silicon grid electrode. Thickness of the grid electrode titanium silicide layer is larger than thickness of the drain electrode titanium silicide layer and the source electrode titanium silicide layer. Titanium silicide of a grid electrode is thicker, square resistance of the grid electrode is reduced, and normal thickness titanium silicide on a source electrode and a source electrode avoids electricity leakage to caused by junction penetration of source drain and the trap.

An inspection device of the present invention includes: a linear irregularity detecting section for detecting linear irregularities individually in an image L of dots on a substrate being inspected by projecting light from a first direction and in an image R of the dots by projecting light from a second direction, which differs from the first direction; a specific-cycle irregularity extracting section for extracting linear irregularities detected at predetermined intervals T in the individual mages L and R, the intervals being taken vertical to the linear irregularities on the substrate; and a detection-target-irregularity extracting section for extracting a linear irregularity detected in both the images L and R as a detection-target linear irregularity. The device therefore is capable of detecting only linear irregularities of a specific cycle which are caused by the presence of dots having irregular thickness when compared to a dot with normal thickness.

The invention relates to a battery anti-explosion positive cover structure which comprises a sealing outer cover embedded in an anode terminal of the battery, wherein the interior of the sealing outer cover is provided with a conducting plate with holes, a thermistor plate and a positive cover; the positive cover is positioned on the exterior; the conducting plate with the holes is positioned in the interior; a washer is arranged between the positive cover and the thermistor plate; the thermistor plate is connected with the center of the conducting plate with the holes by die-casting points and a tapered depression is formed in the center of the thermistor plate; the conducting plate with the holes is fixed in the interior of the sealing outer cover by an insulating rubber ring; the internal bottom of the sealing outer cover is provided with steps in which the insulating rubber ring is embedded; the insulating rubber ring and the steps together support the thermistor plate; the thermistor plate is provided with a circle dent; the thickness of the cross section of the dent is less than the normal thickness of the cross section of the thermistor plate; and by the design of the invention, the battery anti-explosion positive cover structure is arranged at the positive terminal of the battery and can effectively prevent the explosion caused owing to the over high air pressure in the interior of the battery.

The invention discloses an ion release deficiency improvement method based on a model. The ion release deficiency improvement method based on the model includes that setting ion implantation conditions under different film thickness conditions according to a relation model between an oxide film thickness and an ion release deficiency when the thickness of a wafer surface oxide film is larger than a normal thickness standard, and inputting into a production execution system; before the ion implantation, measuring the thickness of the wafer surface oxide film, and storing data in the production execution system; when the measurement result shows that the oxide film thickness is larger than the normal thickness, allowing the production execution system to automatically regulate and control the ion implantation conditions according to set ion implantation conditions under different film thicknesses so as to prevent forming ion release deficiency when the oxide film thickness is larger than the normal thickness. The ion release deficiency improvement method based on the model avoids the ion release deficiency through building an ion release deficiency model and improving implantation technique, and the chip yield is effectively guaranteed.

The invention relates to the technical field of home appliances and discloses a split multilayer quilt with good cleaning convenience, comprising a pair of edge quilt layers and a plurality of intermediate quilt layers; the two edge quilt layers are arranged correspondingly; each of the parts of closing sides of the two edge quilt layers are peripherally and fixedly fitted with mutually fit connectors, and each middle quilt layer is peripherally provided with through holes; the connectors penetrate the through holes. The edge quilt layers, the middle quilt layers, the connectors and the through holes are in mutual fit in crossing manner, the connectors of the two edge quilt layers penetrate the through holes of one or multiple middle quit layers and are fixedly connected so that the two edge quit layers are integrated via the middle layers. The split multilayer quilt with good cleaning convenience has compact, reasonable and practical structure; with normal thickness, the split multilayer quilt with good cleaning convenience can be divided into three or more quilt layers, so that warmth retention regulation range is wider, and comfort is better; the split multilayer quilt with goodcleaning convenience is washable with a washing machine, is cleaner, and is suitable for being split for airing; the different quilt layers may form different quilts through different combinations offillers.

A driven disc assembly is provided. The backing plates have right angle depression sections that surround mounting holes of a clutch disc. The thickness of the backing plates are enlarged from their normal thickness causing a top surface of the backing plates to axially clear heads of conventional rivets. The thickness of the friction buttons on the backing plates can then be reduced to their minimal effective use thickness.

A driven disc assembly is provided wherein a clutch disc has enlarged holes for connection of opposing backing plates. The backing plates have semi-pierced sections that are insertable within mounting holes of the clutch disc. The thickness of the backing plates are enlarged from their normal thickness causing a top surface of the backing plates to axially clear heads of conventional rivets. The thickness of the friction buttons on the backing plates can then be reduced to their minimal effective use thickness.

The invention provides a chip packaging method and a chip packaging structure. The chip packaging method includes pasting a first carrier with high heat conductivity on the front side of a component wafer with normal thickness so as to be used for supporting the component wafer in a component wafer backside thinning process, and rapidly transferring extra heat generated in the backside thinning process to reduce the unfavorable influences on the component wafer; and replacing the first carrier into a second carrier with low heat conductivity, or, pasting the second carrier with low heat conductivity on the back side of the component wafer and removing the first carrier so as to be used for supporting the component wafer in a process transferring the component wafer after backside thinning.Thus, operation on the component wafer can be realized, and the component wafer can be prevented from warping; and in a subsequent wafer stacking process, good heat preservation and maintenance of heat can be achieved by utilizing the characteristic that the heat conductivity of the second carrier is lower relative to the first carrier, so that the problem of high throughput bottleneck caused bythe high heat conductivity of the first carrier can be solved.

The invention provides a cotton adjusting plate which can adjust the thickness and the uniformity of a cotton layer on the surface of a dust cage and is applied to the working process of a condenser. The main part of the cotton adjusting plate is a sheet iron inserting plate, a rectangular cotton adjusting inserting plate is installed above the dust cage of the condenser, the width of the inserting plate is equal to that of the dust cage in the condenser, a knife edge is positioned at the lower end of the inserting plate, the knife edge faces to a cotton inlet of the condenser, the condenser extends out from the upper end of the cotton adjusting inserting plate, scales are marked so as to indicate the thickness of the cotton layer on the surface of the dust cage, the position height is determined by the size of cotton flows, and plug pin holes are drilled in both sides of the cotton adjusting inserting plate and used for adjusting the height of the cotton adjusting inserting plate and fixing the cotton adjusting inserting plate on a shell of the condenser; when the cotton adjusting plate is in working, the cotton flows enter the condenser, are adsorbed on the dust cage and flow through the cotton adjusting inserting plate, then extra cotton blocks are cut off by the knife edge of the inserting plate, and only the cotton layer with the normal thickness is permitted to pass, so that the cotton layer on the surface of the dust cage is uniform; and on the premise of ensuring the normal working of the condenser by the cotton adjusting plate, the thickness of the cotton layer on the surface of the dust cage can be effectively controlled, the thickness can be uniform, and the working stability of the condenser is improved.

The invention provides a special-shaped tapered double-sided key board manufacturing method. The method comprises the steps that S1 (film drying) film drying is carried out on parts needing thickening on each bottom copper surface of a key board, so as to produce a stable material adhered on each bottom copper surface; S2 (pattern plating) after film drying, each part of the key board is plated to form a metal film; S3 (film drying) then different-shaped bottom copper surfaces are covered and same-shaped bottom copper surfaces are profiled; S4 (etching) normal thickness negative film etching of bottom copper with confirmed same-shaped bottom is carried out; S5 (film drying) etched same-shaped bottom copper surfaces are covered, and different-shaped bottom copper surfaces are patterned; and S6 (etching) normal thickness negative film etching of confirmed different-shaped bottom copper is carried out. According to the invention, front and back copper foils of a printed circuit board are different; tapered layout of the copper foil thickness is realized; high frequency and low frequency coexistence is realized; the method is suitable for double sides of the circuit board; and each side of the circuit board is independent, and can be independently communicated.

The invention relates to an assembly type continuous box girder hogging moment steel cable anchoring area structure and a construction method thereof. The assembly type continuous box girder hogging moment steel cable anchoring area structure comprises a prefabricated box girder, a prefabricated box girder top plate thickened section which is thickened inwards is arranged on a prefabricated box girder top plate, and steel cable tensioning preformed grooves are formed in the prefabricated box girder top plate thickened section. Transverse and longitudinal steel bar structures are arranged in the prefabricated box girder top plate thickened section. When the box girder is prefabricated, the parts, with the length within the length range of hogging moment steel cables, of the box girder top plate and the parts, extending through tensioning notches 10-15 cm, of the box girder top plate are thickened, and a top plate thickened section of about 30 cm is arranged at the thickened tail end fortransition to the normal thickness; when the top plate is thickened inwards, the requirements of a round anchorage device in a hogging moment area for tensioning and anchoring are met, and the assembly type continuous box girder hogging moment steel cable anchoring area structure has the advantages that the bridge deck pavement space does not need to be occupied; load-carrying steel bars on the lower layer of the top plate cannot be cut off, and the later-stage stress of the tensioning notches is improved; the steel cables are tensioned on the bridge deck, and the requirements for arranging more steel cables are met; the structural force of the hogging moment area is improved, and tensioning and grouting are facilitated.

The invention relates to a roof modeling function layer lean construction method, and belongs to the technical field of constructional engineering. The method includes the steps: arranging a control network; constructing control points; distributing mortar cones; isolating grid areas; finishing roundness; constructing functional layers; treating expansion joints. The method properly solves the problem that all points of a seashell roof structure layer forming surface and a finished surface of a final building need to be consistent in normal thickness. The method is practicable, and construction efficiency is improved on the premise of ensuring quality.