Special-shaped tapered double-sided key board manufacturing method

Abstract

The invention provides a special-shaped tapered double-sided key board manufacturing method. The method comprises the steps that S1 (film drying) film drying is carried out on parts needing thickening on each bottom copper surface of a key board, so as to produce a stable material adhered on each bottom copper surface; S2 (pattern plating) after film drying, each part of the key board is plated to form a metal film; S3 (film drying) then different-shaped bottom copper surfaces are covered and same-shaped bottom copper surfaces are profiled; S4 (etching) normal thickness negative film etching of bottom copper with confirmed same-shaped bottom is carried out; S5 (film drying) etched same-shaped bottom copper surfaces are covered, and different-shaped bottom copper surfaces are patterned; and S6 (etching) normal thickness negative film etching of confirmed different-shaped bottom copper is carried out. According to the invention, front and back copper foils of a printed circuit board are different; tapered layout of the copper foil thickness is realized; high frequency and low frequency coexistence is realized; the method is suitable for double sides of the circuit board; and each side of the circuit board is independent, and can be independently communicated.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a special-shaped tower-type double-sided key board. Background technique [0002] In the production of printed circuit boards, the etching process is an indispensable and important step, especially with the rapid development of microelectronics technology, the wide application of large-scale integrated circuits and ultra-large-scale integrated circuits, making printed circuit boards The width and spacing of the wires are getting smaller and smaller, the wiring density and precision are getting higher and higher, and higher and stricter requirements are put forward for the precision and tolerance of etching. The quality of etching directly affects the quality of printed circuit boards. inferior. [0003] For printed circuit boards with the same thickness of copper foil, usually both sides are etched at the same time to meet the requirements. How...

AI Technical Summary

Problems solved by technology

However, for printed circuit boards with different thicknesses of copper foil, etching on both sides at the same time cannot meet the requirements. At present, the common methods are: one is that the amount of line etching compensation on both sides is based on the thicker copper foil thickness to avoid equal compensation, and then etch The other is to make circuit etching compensation according to the actual copper foil thickness on both sides, and adjust the etching pressure during etching. This method is only suitable for the situation where the copper foil thickness difference on both sides is less than or equal to 1 ounce. However, both methods are Suitable for printed circuit boards with very wide line spacing, unable to process printed circuit boards with fine lines, and also unable to process printed circuit boards with a copper foil thickness difference greater than 1 ounce on both sides

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