1782results about "Conductive material chemical/electrolytical removal" patented technology

Disclosed herein are bonded structures and methods of forming the bonded structures. In some embodiments, the bonded structures include a first element having an inorganic dielectric surface, a second element having an organic dielectric surface, an interface layer between the first and second elements and bonded to the inorganic and organic dielectric surfaces. The method of forming the bonded structure includes providing the first and second elements, exposing the inorganic dielectric surface to a silane coupling agent to form the interface layer, contacting the organic dielectric surface to the interface layer, and heating the first element, second element, and interface layer to bond the first element to the second element.

The invention discloses a method for manufacturing a high-precision circuit board based on material transfer, which comprises the following steps of: taking a thick copper layer, attaching a micro-mucous membrane layer, manufacturing a dry film pattern layer on the other surface, etching off a part of thickness of the thick copper layer, stripping a film, screen-printing solder resist ink, baking and curing, polishing, forming a solder resist ink pattern, laminating an insulating medium layer, and stripping the micro-mucous membrane layer. Etching for the second time to form a circuit pattern layer, and performing surface treatment to form the high-precision circuit board; a reverse processing flow is formed through a material transfer mode, a semi-circuit layer is firstly manufactured, then solder resist ink is directly screen-printed to form a solder resist pattern, then the pattern is transferred to an insulating medium layer, the manufactured circuit pattern and the solder resist pattern are etched and exposed, alignment and exposure are carried out only once, the circuit processing precision is greatly improved, and the production cost is reduced. The solder resist pattern is not subjected to exposure and development processing, the phenomena of irregular pattern edge and lateral erosion are avoided, the whole processing flow is efficient and convenient, and a high-precision circuit board product is formed.

Provided are a photosensitive transfer material capable of producing a resin pattern with reduced defects, a method for producing a resin pattern using the photosensitive transfer material, a method for producing circuit wiring, and a method for producing a touch panel, and a polyethylene terephthalate film. The present invention provides a temporary support and a photosensitive resin layer disposed on the temporary support, and the number of foreign particles having a major axis of 3 μm or more contained in the temporary support is 0.5 / mm 2 The following are photosensitive transfer materials and their applications.

The invention discloses a circuit board etching device and method, and the method comprises the steps: S1, providing a substrate, forming a laser activation micro-channel on the surface of the substrate, carrying out the plasma cleaning of the substrate, and pressing a gradient copper foil layer; s2, based on the thickness distribution data of the gradient copper foil layer, establishing an etching parameter prediction model, and generating a pressure-temperature dynamic regulation and control curve; s3, preparing a first-stage etching solution, carrying out spraying treatment, and etching the surface layer of the gradient copper foil layer under the assistance of ultrasonic waves to form a porous layer; s4, switching to a second-stage etching solution to directionally etch the porous layer of the gradient copper foil layer to a target residual thickness; s5, performing surface leveling treatment on the etched circuit board, and verifying the etching precision based on a high-frequency impedance test result; gradient copper layer dynamic parameter regulation and control are combined with a two-stage etching process, high-frequency impedance verification and surface leveling have a synergistic effect, signal transmission loss can be reduced, and the method is suitable for manufacturing high-frequency and high-speed circuit boards.

The invention discloses a method for manufacturing a circuit board embedded with a carbon oil resistor, which comprises the following steps of: taking a double-sided copper-clad plate, manufacturing a circuit pattern comprising a carbon oil connecting pattern which comprises a wire end and a connecting end, adhering a dry film to two sides, a dry film windowing pattern is manufactured in the area, corresponding to the carbon oil pattern, of the surface where the carbon oil connection pattern is located, plasma treatment is conducted, then film stripping is conducted, a carbon oil layer is manufactured in the area of the carbon oil pattern, a bonding layer prepreg is taken, core plates of other layers are taken and stacked and pressed together with the carbon oil plate, and the circuit board embedded with the carbon oil resistor is formed through subsequent procedure manufacturing; by designing the connecting end, the carbon oil layer has a larger bonding area, the bonding force of the carbon oil layer is increased, prepregs are laminated and bonded to the surface of the carbon oil layer, the interlayer bonding force of the carbon oil layer is improved, and the problems of falling, layering of a multi-layer board and even board explosion of the multi-layer board caused by poor bonding of the carbon oil layer are solved.

The invention relates to a resistance conductive material as well as a preparation method and application thereof. The resistance conductive material comprises a copper foil layer, a transition layer and a resistance layer from bottom to top, the resistance layer comprises a dispersion reinforcing phase and a homogeneous phase; the dispersion enhancing phase is subjected to surface pretreatment before being added into the electroplating liquid. According to the invention, the transition layer and the dispersion reinforcing phase are introduced, the diffusion of copper into the resistance layer is inhibited through the synergistic effect of the transition layer and the dispersion reinforcing phase, the high resistivity of the resistance layer is maintained, and the application prospect is good.

The invention discloses a PCB (printed circuit board) etching device, which relates to the field of circuit board etching, and comprises an etching pool, a central column, a lifting mechanism, a turnover mechanism, a clamping plate mechanism and a pick-and-place mechanism, the central column is rotatably arranged in the etching pool, the lifting mechanism, the turnover mechanism and the clamping plate mechanism form an etching part, and the pick-and-place mechanism is arranged in the etching pool. A plurality of etching parts are arranged on the side face of the central column at equal intervals in the circumferential direction, the etching parts are arranged on the side face of the central column rotating intermittently, etching liquid in the etching pool is stirred, it is ensured that the etching effects of a plurality of circuit boards in the etching pool are consistent, the turnover mechanism drives the clamping plate mechanism with two clamping parts to turn over by 180 degrees, and therefore the circuit boards are prevented from being damaged. Therefore, the board taking assembly and the board placing assembly outside the etching pool can continuously take and place the circuit board without position adjustment, and the problem that when the circuit board on the clamping part is placed into and taken out of the etching pool, the consistency of the etching effect of the upper area and the lower area of the circuit board is poor due to the fact that the upper portion and the lower portion of the circuit board make contact with the etching liquid for different time lengths is solved.

The invention discloses a copper-clad plate etching device and method, and relates to the technical field of copper-clad plate production, the copper-clad plate etching device comprises a box body, two sets of conveying mechanisms, a feeding frame, a spraying mechanism and a controller, the feeding frame is arranged at one end of the box body, the two conveying mechanisms are connected to the side walls of the two sides of the box body respectively, and the spraying mechanism is arranged on the box body. A feeding groove is formed in the box body in the transverse direction in a penetrating mode, the box body is divided into an upper box body and a lower box body, the spraying mechanism comprises four sets of nozzles and four sets of moving assemblies, the two sets of nozzles are arranged at the two ends of the upper box body, and the other two sets of nozzles are arranged at the two ends of the lower box body; liquid outlet ports of the four sets of nozzles obliquely extend towards the center direction of the box bodies, the two sets of nozzles located on the upper box body are arranged in a staggered mode, the two sets of nozzles located on the lower box body are arranged in a staggered mode, and a distance measuring sensor is arranged on a conveying part of the conveying mechanism. The detection end of the distance measuring sensor faces the copper-clad plate of the feeding frame. According to the invention, the etching effect can be improved.

The invention belongs to the technical field of integrated circuit manufacturing, and relates to an etching device for a thick copper PCB. Comprising a shell, material holes are formed in the two sides of the shell, a liquid conveying pipe is arranged on the upper side of the shell, the liquid conveying pipe is communicated with liquid distribution pipes which are distributed at equal intervals, the liquid distribution pipes penetrate through the shell and are communicated with spraying pipes, the lower sides of the spraying pipes are communicated with spraying heads which are distributed at equal intervals, a gas conveying pipe is arranged on the upper side of the shell, and the gas conveying pipe is communicated with the spraying heads. The air conveying pipe is communicated with air distributing pipes distributed at equal intervals, the air distributing pipes penetrate through the shell and are communicated with air spraying pipes, and the air spraying pipes are used for guiding air flow in the air spraying pipes to flow downwards. According to the invention, the vertical downward air flow is applied by means of the air injection pipe, and downward acting force is applied to the PCB by means of blowing of the air flow, so that the stability of the PCB in the etching process is kept while a supporting roller on the upper side of the PCB is omitted, and the etching efficiency and the etching uniformity are improved.

The present invention relates to a method for manufacturing a ceramic substrate. Each of upper and lower metal layers respectively bonded to upper and lower surfaces of the ceramic substrate may have a thickness of 0.3 mm to 10 mm, so as to be applicable to a high output power module, and may reduce a chemical etching process time by performing, in advance, a trenching process, which is a mechanical processing scheme, in order to form an electrode pattern on the upper metal layer.

The invention discloses a manufacturing method of a support-free isolated step circuit board, which comprises the following steps of: manufacturing a plurality of inner-layer core boards, pressing and fixing the inner-layer core boards, planning a step area on the uppermost layer, and carrying out nickel-gold plating treatment on all areas outside the step area to obtain inner-layer sub-components; covering the nickel-gold plating area on the uppermost layer of the inner-layer sub-component with the cut PI adhesive tape, and leaving the step area when the opening is over against the step area; sequentially placing a prepreg I and an outer-layer core plate on the upper side of the PI adhesive tape, and pressing the prepreg I and the outer-layer core plate together; and milling a step area corresponding to the outer-layer core board, and removing the pre-pasted PI adhesive tape after milling to obtain the support-free isolated step circuit board. According to the invention, the step structure formed by direct milling is arranged on the multilayer circuit board, and the non-support isolated step structure is obtained by using the nickel-gold plating area outside the step position protected by the PI adhesive tape; the adhesive overflow risk and the difficulty in adhesive tape stripping in the micro blind groove processing are avoided, and the method is particularly suitable for high-precision and miniaturized design scenes.

A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a first portion on the surface of the insulating layer, a second portion on an inner wall surface in the opening of the insulating layer, and a third portion on a portion of the first conductor layer exposed by the opening of the insulating layer such that the first portion is thicker than the second portion and the third portion, the second portion has a first film and a second film electrically connected to the first film, and a portion of the first film is formed on the second film.

The invention discloses a preparation method of a PCB, and the method comprises the steps: preparing a high polymer material into a solution, and adding a nanoscale pore-forming agent to form a mixture; coating the mixture on the surface of a PCB substrate; grinding the surface of the PCB substrate; etching is carried out on the PCB substrate; carrying out chemical plating on the etched PCB substrate; performing electrochemical deposition of a metal layer on the PCB substrate subjected to chemical plating treatment to obtain a metal-clad plate; and performing outer-layer circuit manufacturing on the metal-clad plate to obtain the PCB. According to the PCB prepared by the preparation method disclosed by the invention, the surface roughness is reduced, the surface flatness of the PCB is improved, the binding force between the substrate and the metal layer is improved, and the signal loss of the PCB can be greatly reduced; and meanwhile, the production process flow is shortened, the production cost is reduced, and the production efficiency is improved.

The invention relates to the technical field of PCB processing, in particular to a PCB processing, etching and spraying device which comprises an etching machine and two spraying mechanisms, a conveying mechanism is arranged in the etching machine, the two spraying mechanisms are symmetrically distributed at the top and the bottom of the conveying mechanism, U-shaped moving frames are arranged at the top and the bottom of the conveying mechanism, and the spraying mechanisms are arranged on the U-shaped moving frames. Transmission mechanisms are arranged in the two U-shaped moving frames, a first connecting rod and a second connecting rod are fixedly installed on one sides of the two U-shaped moving frames respectively, and a first air cylinder and a second air cylinder are fixedly installed on the side, close to the first connecting rod and the second connecting rod, of the etching machine. The spraying device has the beneficial effects that the angles of the spraying nozzles in the two spraying mechanisms are adjusted according to the depth of the hole, etching liquid sprayed in an inclined mode can forcibly enter the hole with the high thickness-diameter ratio, and therefore copper residues in the hole are reduced.

The invention provides a preparation method of a copper-clad substrate and the copper-clad substrate. The preparation method comprises the following steps: providing a copper-clad substrate for forming an inner-layer core plate; the copper-clad substrate comprises a copper-clad plate base material and a copper foil arranged on the surface of the copper-clad plate base material; executing an interface modification process on the surface of the copper foil; forming a dry film photoetching film on the surface of the copper foil after interface modification; performing exposure and development processing on the dry film photoetching film to form a dry film photoetching film with a circuit pattern; and the dry film photoetching film is used as a mask to execute an etching process so as to form a circuit pattern on the copper-clad substrate, so that the technical effect of improving the wiring precision is realized.

The invention relates to the technical field of etching solutions, in particular to a double-agent type etching solution. Comprising the following components in percentage by weight: 10-15% of a first etching agent, 0.5-1% of a first regulator, 1-5% of a first stabilizer, 8-12% of a first complexing agent, 0.05-0.3% of a first inhibitor, 10-15% of hydrogen peroxide and the balance of water; the auxiliary agent comprises 40-60% of a second etching agent, 20-30% of a second complexing agent, 0.5-0.8% of a second inhibitor, 3-4% of a second stabilizer, 0.5-1% of a second conditioning agent and the balance of water. By limiting the formula content of the main agent, poor etching can be avoided, meanwhile, the content of the first regulator (phenylurea) is increased to 0.5 wt%, and the service life of copper is at least 14 kppm.

A single circuit board assembly for forming a vehicle-motor interface, the single circuit board assembly includes a first side of a board with logic modules located thereon. The single circuit board assembly also includes a second side of the board with power modules located thereon. The board comprises a plurality of layers, the plurality of layers having at least one through via and at least one buried via defined therein, wherein the at least one through via extends through all of the plurality of layers, the at least one buried via extending through less than all of the plurality of layers.

The utility model discloses a spraying device for circuit board processing, which comprises a spraying device and a swinging device, the spraying device comprises a plurality of upper spraying pipes, a plurality of lower spraying pipes, an upper connecting pipe and a lower connecting pipe; the upper spraying pipe and the lower spraying pipe are distributed in the conveying direction of the circuit board, the upper spraying pipe is located above the lower spraying pipe, and nozzles used for spraying liquid medicine to the circuit board are fixed to the upper spraying pipe and the lower spraying pipe; the upper connecting pipe and the lower connecting pipe extend in the conveying direction of the circuit board, the upper connecting pipe is connected with the upper spraying pipe and used for conveying liquid medicine to the upper spraying pipe, and the lower connecting pipe is connected with the lower spraying pipe and used for conveying liquid medicine to the lower spraying pipe; the upper connecting pipe and the lower connecting pipe are both connected with a swing device, and the swing device is used for driving the upper connecting pipe and the lower connecting pipe to reciprocate in the horizontal direction perpendicular to the conveying direction of the circuit board. The liquid medicine pipeline is convenient to arrange.

The invention discloses an alkaline medium-coarsening micro-etching solution as well as a preparation method and a micro-etching method thereof, and relates to the technical field of printed circuit board production. The alkaline medium-coarsening micro-etching liquid is prepared from the following components in mass concentration: 5-30 g / L of ammonium chloride, 0.5-2 g / L of tetramethylammonium hydroxide, 5-15 g / L of ammonia water, 2-10% of a catalyst, 0.1-1% of a wetting agent, 0.2-2% of an accelerator, 0.3-1.5% of a stabilizer, 0.5-5% of a color difference regulator and the balance of deionized water. The invention provides an alkaline medium-coarsening micro-etching solution and a preparation method and a micro-etching method thereof, which can solve the problem of color change of a board surface after micro-etching of a circuit board and overcome the defect that a sulfuric acid hydrogen peroxide micro-etching system is easily polluted by chloride ions, and can effectively improve the problem that hydrogen peroxide is easily decomposed by replacing sulfuric acid hydrogen peroxide with an alkaline substance. And the micro-etching rate is stable.

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

The utility model discloses a millimeter wave radar PCB of an antenna area Hoz, and belongs to the technical field of PCBs. The millimeter wave radar PCB comprises n layers of circuit boards, wherein n is an even number; the n layers of circuit boards respectively form antenna radio frequency layers and digital signal control layers, the L1-L2 layers are the antenna radio frequency layers, and the L3-Ln layers are the digital signal control layers; the antenna radio frequency layer comprises an antenna pattern, the outer EA position of the antenna pattern is provided with a triangular protruding part protruding outwards, and the inner EA position of the antenna pattern is provided with a triangular notch part recessed inwards. The antenna has the beneficial effects that the 45-degree triangle design is additionally arranged at the outer EA position of the antenna pattern, 25 microns are added outwards, the 45-degree triangle design is designed at the inner EA position, and 25 microns are cut inwards, so that the precision of the feeder line, the bonding pad and the EA is ensured.

The invention provides a buried resistor circuit board and a preparation method thereof. According to the resistance element, one resistance material is arranged on the dielectric layer to form the first resistance layer, and then the other resistance material is arranged on the first resistance layer to form the second resistance layer, so that the binding force of the resistance layers and the dielectric layer can be enhanced, and the surface flatness of the resistance element can be improved. The resistive layer of the resistive element is protected by using the protective film, so that the shape and the length of the resistive layer are prevented from being influenced by subsequent processes. According to the preparation method, the whole process is a dry process, a differential etching process is omitted, an alkaline etching solution does not need to be used, and the preparation method is environmentally friendly.

The invention provides an etching compensation method, an etching compensation system and a deep learning system, and the etching compensation method comprises the steps: shooting a workpiece which is subjected to etching processing, so as to obtain a workpiece image; measuring the workpiece according to the workpiece image to obtain line measurement information of the workpiece; generating etching compensation information according to the line measurement information; and transmitting the etching compensation information to an exposure device or an etching device. According to the invention, after etching treatment, full-edition and comprehensive measurement of the workpiece can be carried out, and then through the functions of full-automatic rapid compensation value setting, full-automatic production intermediate monitoring and instant feedback adjustment, the effects of rapidly entering mass production, rapidly reaching optimal compensation value setting, monitoring in intelligent production and improving and stabilizing quality are achieved.

A high-precision impedance circuit board ink thickness uniformity control method relates to the circuit board processing field, and comprises the following steps: solder resist pretreatment: cleaning a circuit board, and roughening a copper surface; the circuit board is covered with the liquid photosensitive ink through extrusion type roller coating, the extrusion force is 2.5 + / -0.2 kg / cm < 2 >, and the speed is 1.2 + / -0.2 m / min; pre-baking: pre-curing and baking the ink; pressure is applied to the circuit board to flatten the ink on the surface of the circuit board, the applied pressure is 2 + / -0.2 kg / cm < 2 >, and the temperature is 82 + / -3 DEG C; exposure: protecting the ink at the position needing solder mask coverage through photocuring; developing: removing the unexposed ink, and exposing the electrical connection points needing surface treatment; and post-baking: further curing the ink at a high temperature to form a solder mask layer. According to the method, the ink range is reduced in an extrusion roll coating mode, the uniformity is improved through vertical coating, the requirement for the performance of the circuit board is guaranteed, and the method has high practicability.

The invention discloses a test system and method for detecting the etching effect of a thick copper PCB, and the system comprises an etching condition analysis unit, an etching defect analysis unit, an etching normal analysis unit, an etching adjustment analysis unit, and a test information output unit, and relates to the technical field of PCB testing. The technical problems that systematicness and scientificity are lacked during etching data analysis and process adjustment, and high-precision PCB production requirements are difficult to meet are solved, the defects such as copper nodules, etching pits and residual copper are effectively recognized through careful analysis on the appearance, the comprehensiveness and accuracy of etching effect evaluation are improved, and the production efficiency is improved. Meanwhile, screening and analysis are carried out according to parameters such as the size and the number of layers of the PCBs in allusion to the condition that etching abnormity exists, and appropriate etching factor records are selected as reference standards to generate adjustment test information, so that the etching process can be optimized more scientifically and accurately, the rejection rate caused by the etching abnormity is reduced, and the production efficiency and the product quality stability are improved.

The invention discloses a PCB (Printed Circuit Board) wet etching machine, and relates to the technical field of etching equipment. The device comprises a bottom plate, a liquid tank box is fixed to the top of the bottom plate, a telescopic column is fixed to one side of the top of the bottom plate, an electric push rod is fixed to the other side of the top of the bottom plate, a fixing frame is fixed between the electric push rod and the top of the telescopic end of the telescopic column, a containing basket is fixed to the bottom of the fixing frame, and the containing basket comprises a Y-shaped frame. Through the arrangement of the impurity prevention device, a rotating rod and a belt are matched to drive a spiral blade to suck etching liquid in a liquid tank box into a fixed barrel, the fixed barrel can convey the sucked etching liquid into a filter screen box, and the filter screen box can filter impurities such as resin residues in the etching liquid; therefore, impurities such as resin residues are prevented from being accumulated in the etching liquid, the quality of the etching liquid is kept, and the stability and consistency of the etching process of the PCB are ensured.

The invention discloses a self-adaptive etching control method for automobile circuit board manufacturing, and relates to the technical field of automobile circuit board manufacturing. The self-adaptive etching control method for manufacturing the automobile circuit board comprises the following steps: S1, real-time multi-source sensing: synchronously acquiring a copper layer etching rate, a three-dimensional shape and a bath solution temperature gradient through a multispectral confocal unit, an ultrasonic thickness measuring unit and a distributed temperature sensing unit which are integrated in an etching bath; s2, dynamic decision analysis; s3, multi-parameter cooperative execution: independently adjusting the pressure gradient, the atomization particle size and the oscillation frequency through a spraying pressure regulation and control unit, an etching agent atomization unit and a mechanical oscillation unit; s4, closed-loop process verification: feeding back etching uniformity, and dynamically correcting the decision model; through the steps of real-time multi-source sensing, dynamic decision analysis, multi-parameter cooperative execution and closed-loop process verification, accurate control over the automobile circuit board etching process is achieved, and the etching quality and efficiency are improved.

The invention relates to the field of circuit board production and manufacturing, in particular to a method for manufacturing patterns with different copper thicknesses on the same layer of a circuit board. According to the method, a dry film covering protection pattern is replaced by a tin plating protection pattern, a tin layer does not have a gap at the connection position of a thick copper region and a thin copper region due to the height difference between the thick copper region and the thin copper region during tin plating, and tight combination with a thick copper region pattern part and a thin copper region pattern part is always kept; manufacturing of the thick copper area pattern part and the thin copper area pattern part is completed, and the production yield is improved.

The invention discloses a preparation method and structure of a multilayer board based on a ceramic substrate. A ceramic substrate is used as a core substrate and is laminated with a conventional FR4 core plate and a prepreg to form a multi-layer plate laminated structure, and all layers of circuits are connected through drilling and electroplating. Meanwhile, the components are printed or / and mounted on the ceramic substrate in a surface-mounted manner, so that the components are pre-embedded, the performance and the integration level of the circuit board are improved, and the development requirements of miniaturization and high performance of electronic equipment are met; therefore, better heat management can be realized. Due to the fact that the periphery is made of the conventional FR4 plate, the production difficulty is reduced, the production efficiency is improved, and the production cost is reduced due to the mature technology and large-size production.

The invention discloses a high-precision circuit board wet film processing method and system, and relates to the field of circuit board wet film processing, and the method comprises the complete manufacturing process of substrate pretreatment, wet film coating, LDI exposure, development, micropore etching and final film stripping. The key point is that a data barrier in a traditional process is broken through between LDI exposure and a downstream etching process. Specifically, key parameters of etching liquid are collected in real time in the etching stage, and an intelligent model capable of predicting the etching influence is constructed and continuously optimized in combination with an actual line width detection result of an etched plate. The model can be used for prospectively calculating an accurate dynamic etching compensation value according to the current state of the etching liquid, and feeding back the accurate dynamic etching compensation value to LDI equipment for adjusting the exposure line width. Therefore, the problem of compensation failure caused by etching liquid aging can be effectively solved, and the high consistency and stability of line width in cross-batch production are ensured.