2091results about "Metallic pattern materials" patented technology

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

An article is provided to have a transparent substrate; and an electrically-conductive, metal-containing pattern disposed on a surface the transparent substrate. The electrically-conductive, metal-containing pattern has, in order outwardly from a surface of the transparent substrate: a first darkening agent; a metallic pattern; and a second darkening agent. The first darkening agent substantially conforms to a first surface of the metallic pattern, forming a first darkened surface on the metallic pattern. In addition, the second darkening agent is disposed over at least a portion of a second surface of the metallic pattern, forming a second darkened surface on the metallic pattern.

The invention relates to a resistance conductive material as well as a preparation method and application thereof. The resistance conductive material comprises a copper foil layer, a transition layer and a resistance layer from bottom to top, the resistance layer comprises a dispersion reinforcing phase and a homogeneous phase; the dispersion enhancing phase is subjected to surface pretreatment before being added into the electroplating liquid. According to the invention, the transition layer and the dispersion reinforcing phase are introduced, the diffusion of copper into the resistance layer is inhibited through the synergistic effect of the transition layer and the dispersion reinforcing phase, the high resistivity of the resistance layer is maintained, and the application prospect is good.

A copper-ceramic bonded body (10, 110) in which a copper member (12, 13, 112, 113) comprising copper or a copper alloy is bonded to a ceramic member (11, 111), in which an active metal compound layer (31) or a magnesium oxide layer (131) is formed in a region on the copper member side of the ceramic member (11, 111). The active metal compound layer (31) contains a compound of one or more active metals selected from the group consisting of Ti, Zr, Nb and Hf, and transition metal layers (34, 134) containing one or more transition metals selected from the group consisting of V, Cr, Mn, Fe, Co, Ni, Mo, Ta and W are formed at the interface of the active metal compound layer (31) or the magnesium oxide layer (131) on the copper member side.

The invention relates to a soft electronic device based on a particle phagocytosis effect and a preparation method thereof, and the preparation method comprises the following steps: S1, attaching a hollow mask plate to a polymer substrate, and controlling the position where the polymer substrate can be printed; s2, uniformly dispersing micro-nano particles on the mask plate, wherein the micro-nano particles are in contact with the polymer substrate at the hollowed-out part of the hollowed-out mask plate; s3, after the micro-nano particles make contact with the polymer substrate, the micro-nano particles gradually enter the polymer substrate through the particle phagocytosis effect, and a functional composite material is formed; and S4, removing the hollow mask plate to form the soft electronic device. According to the method, the micro / nano material is directly printed in the soft polymer matrix without introducing a solvent, so that chemical incompatibility and complex fluid dynamic behaviors are avoided. The surface energy-driven particle phagocytosis phenomenon is utilized to realize deep embedding of the material, spontaneous generation is realized, and additional introduction of energy is not needed. Different materials can be seamlessly integrated into the high-performance elastic electronic equipment. Multi-material wireless electronic equipment is created through a multi-layer phagocytic printing technology, and layered printing can be achieved.

Provided is a copper foil with a carrier, whereby the carrier can be easily peeled off even after high-temperature pressing at a temperature exceeding 350 DEG C. This copper foil with a carrier is provided with a carrier, an intermediate layer, and a copper foil in this order, wherein the intermediate layer has a Cr phase, an Ni-P phase, and a Mo-Fe-Ni phase. In the surface of the carrier on the intermediate layer side, the ratio of the surface covered with the Mo-Fe-Ni phase is from 61.00% to 96.00% (inclusive). The Ni / Mo ratio, which is the ratio of the amount of deposited Ni to the amount of deposited Mo in the intermediate layer, is 2.00 or more. The Fe content of the intermediate layer, which is the ratio of the amount of deposited Fe to the total amount of the amount of deposited Mo, the amount of deposited Ni, and the amount of deposited Fe, is 8.90% or less.

The invention discloses an aluminum-based composite material, a preparation method thereof and an electronic device, and belongs to the field of electrical materials. The preparation method comprises the following steps: purifying the aluminum-based base material to obtain the purified aluminum-based base material. A metal protection layer is formed on the surface of the purified aluminum-based base material, and a first composite material intermediate is obtained; performing first electroplating treatment on the first composite material intermediate to corrode the metal protective layer so as to form a first metal coating on the surface of the aluminum-based substrate, thereby obtaining a second composite material intermediate; and the second composite material intermediate is subjected to second electroplating treatment, so that a second metal coating is formed on the surface of the first metal coating, and the aluminum-based composite material is obtained. According to the preparation method, the compactness and smoothness of the plating layer can be improved, other inert precious metals do not need to be introduced in the preparation process, and the preparation method has the advantages of being short in operation process, convenient, efficient, high in reliability, low in cost and the like.

In order to solve the problems that an existing stretchable circuit board is large in impedance and short in service life, the stretchable circuit board comprises an elastic substrate and an elastic packaging layer, the elastic packaging layer covers the surface of one side of the elastic substrate, and the elastic packaging layer covers the surface of the other side of the elastic substrate. A fiber reinforcement area is formed on one side, facing the elastic packaging layer, of the elastic substrate, a glass fiber layer penetrating through the elastic substrate is arranged in the fiber reinforcement area, a line groove is formed in the fiber reinforcement area, the glass fiber layer partially penetrates through the line groove, the line groove is filled with a liquid metal coating, and the liquid metal coating is arranged on the elastic substrate. And a circuit pattern is formed by the liquid metal coating in the circuit groove.

The invention relates to a copper foil and a preparation method and application thereof, the copper foil comprises an electrolytic copper foil layer and secondary long copper layers located on the surfaces of the two sides of the electrolytic copper foil layer, the maximum Feret diameter average value of crystal grains of the secondary long copper layers is 2.5-3 microns, and the maximum Feret diameter average value of crystal grains of the electrolytic copper foil layer is 1-2 microns. The maximum Feret diameter average value of grains of the secondary growing copper layer on the surface of the copper foil is 2.3-3 microns, the maximum Feret diameter average value of grains of the internal electrolytic copper foil layer is 1-2 microns, a structure with the grain size of the surface layer being large and the grain size of the inner layer being small is formed, and when the copper foil is used for transmitting a high-speed high-frequency electric signal, due to the skin effect of current, the high-speed high-frequency electric signal can be transmitted. More electric signals are transmitted along the surface layer of the copper foil, the grain size of the surface layer is large, the grain boundary is correspondingly reduced, and the obstruction to current is reduced, so that the loss of the electric signals is reduced, and the transmission integrity of the electric signals is improved.

The invention discloses a preparation process of a thick film circuit board based on a thick film copper metal ceramic base, and relates to the technical field of circuit boards. Comprising the following steps: step 1, in a nitrogen atmosphere, adding a binder into a solvent, and uniformly stirring to obtain an organic carrier; the pretreated copper particles are added, and stirring is conducted for 20-30 minutes at the set temperature of 40-50 DEG C; adding glass powder, grinding and mixing; thick film copper paste is obtained; 2, uniformly printing the copper slurry on a ceramic substrate; putting into a sintering furnace, and pre-drying for 10-30 minutes at 150-160 DEG C in a nitrogen atmosphere; raising the temperature to 220-230 DEG C, and performing medium baking for 10-30 minutes; raising the temperature to 450-550 DEG C, and calcining for 30-40 minutes for the first time; carrying out secondary calcination for 20 to 30 minutes at the temperature of 800 to 900 DEG C; cooling, and placing in a room temperature environment for 1-2 hours to form a thick film copper layer; and the thick film circuit board with excellent conductivity and adhesive force is obtained.

A printed circuit board (PCB) serves as a core basic component of the electronic information industry, and the manufacturing process of the PCB faces double challenges of rapid iteration and customization requirements of electronic products. A traditional PCB manufacturing technology (such as mechanical board manufacturing, silk-screen printing and the like) is suitable for large-scale production, but has the defects of long production period, high cost, minimum order quantity limitation and the like, and is difficult to meet the market requirements of small batch and high flexibility. Under the background, the 3D printing technology is completely exposed by means of the efficient customized production capacity, the supply efficiency of a minimum batch of PCBs (such as test single boards and concept verification boards) can be remarkably improved, the production batch constraint of a traditional method is avoided, and the comprehensive cost advantage is shown in the design verification stage. However, the current 3D printing PCB technology is still limited by the circuit complexity and the number of layers and is mostly limited by single / double panel manufacturing, and the performance of the conductive slurry and the base material needs to be optimized urgently. The key technical bottlenecks of interlayer vertical interconnection, multilayer medium lamination manufacturing and the like need to be broken through in the future, so that 3D printing of high-density and multilayer arbitrary interconnection PCBs is achieved, deep application of the technology in the field of intelligent manufacturing and new materials is promoted, and an innovative development opportunity is created for the PCB industry.

An electrolytic solution for a copper foil, and the preparation and use of an electrolytic copper foil. The electrolytic solution for a copper foil comprises an additive, wherein the additive comprises an inhibitor and an auxiliary agent. The auxiliary agent comprises at least one of polystyrene sulfonate, polyethylene sulfonate, alkyl sulfonate and alkylbenzene sulfonate, wherein both the alkyl sulfonate and the alkyl benzene sulfonate have ≥12 carbon atoms. By means of simple and convenient chemical regulation and control means such as the selection and combination of additives for an electrolytic (electroplating) solution, a pre-electroplated copper material resulting from electroplating using the electrolytic solution can form a high-proportion annealing twin boundary after a heat treatment at a temperature of ≥200° C., and has the unique mechanical characteristic of “annealing-induced strengthening and toughening”.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

The invention discloses a preparation method and application of repairable low-temperature curing slurry based on liquid metal microcapsules and conductive filler, and belongs to the field of flexible circuits. The invention aims to solve the problems that the existing liquid metal and conductive filler are poor in compatibility, agglomeration or intermetallic compounds are easy to form, the repairing effect generated in the circuit deformation process is greatly weakened, and small-particle-size liquid metal particles are difficult to crack and repair the circuit in the circuit deformation process. The method comprises: 1, preparing an elastomer solution; 2, preparing a liquid metal capsule; and 3, preparing the liquid metal capsule / conductive filler / elastomer ink. The method is applied to plane printing, complex structure surface printing and multi-layer stretchable flexible circuit printing. The invention is used for preparation and application of the repairable low-temperature curing slurry based on the liquid metal microcapsule and the conductive filler.

The present invention provides a surface treatment liquid that can form an organic film sufficiently excellent in adhesive properties between metal and resin and is also excellent in chemical resistance properties, the surface treatment liquid being excellent in storage stability. The present invention relates to a metal surface treatment liquid for forming an organic film on a metal surface, wherein the surface treatment liquid contains a silane coupling agent and an acid and has a pH of 1.9 or less.

The invention provides a circuit board, an electronic assembly and electronic equipment. The circuit board comprises a transmission area and a connection area. The connecting area comprises a bending area and a pin area, and the pin area, the bending area and the transmission area are divided at the angle of a plane. The connection area comprises a plurality of pins, and the plurality of pins are connected with the signal lines. Specifically, the pins are arranged in the pin area and used for being connected with other electronic assemblies. The thickness of the bending area is smaller than that of the transmission area, so that the bending area has good flexibility, the insertion loss and impedance of the whole circuit board are balanced, and the circuit board can give consideration to multiple performance indexes such as insertion loss, impedance and flexibility.

Disclosed is a copper foil to which a carrier foil is attached, which has favorable peel strength under high-temperature pressing conditions, the copper foil to which the carrier foil is attached comprising: a carrier foil; a release layer on the carrier foil; a heat-resistant layer on the release layer; and an ultra-thin copper foil on the heat-resistant layer, in which a buffer layer of a nickel alloy is interposed between the release layer and the heat-resistant layer.

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

The invention provides a multifunctional flexible electronic device based on ionic liquid gel and patterned liquid metal and a preparation method. The preparation method comprises the following steps: firstly preparing ionic liquid gel with excellent performance as an upper substrate and a lower substrate of the flexible electronic device, then forming a high-resolution conductive pattern on the ionic liquid gel through a template printing method by using liquid metal alloy subjected to surface modification, and finally curing and packaging by using another layer of ionic liquid gel. According to the flexible electronic device, the modified particles are introduced to be mixed with the liquid metal, the flexible electronic device with the tensile adjustable resistance change characteristic is prepared, and meanwhile, the conductive patterns form firm interface bonding with the gel matrix through hydrogen bonds formed between the gallium with the oxidized surface and carboxyl of the ionic gel. Even if the prepared multifunctional flexible electronic device is stretched and released, the composite material can keep continuous contact with the base material, so that stable electric connection is maintained, and the method is suitable for the fields of wearable electronics and flexible electronics.

A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.

The invention discloses a novel automobile back view mirror flexible printed circuit board prepared based on weldable silver paste, and belongs to the technical field of electronic materials and devices, conductor patterns in the flexible printed circuit board comprise a main circuit pattern and an auxiliary function structure formed by weldable low-temperature curing silver paste; the curing temperature of the weldable low-temperature silver paste is 125-135 DEG C, and the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, a high-boiling-point ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes, modified aluminum oxide powder, modified barium sulfate and a low-stress modifier. The polymer resin system comprises novolac epoxy resin, biphenyl epoxy resin and a polyacrylate-CTBN copolymer; through the synergistic effect of all the components and an innovative process, comprehensive improvement of mechanical reliability, environmental durability, conductive stability and power load capacity is achieved, and the strict requirement for high reliability of the automobile rearview mirror in an extreme environment is perfectly met.

The invention discloses a novel notebook flexible printed circuit board prepared based on weldable low-temperature silver paste and a backlight module, and belongs to the technical field of electronic materials and devices. Conductor patterns of the flexible printed circuit board comprise a main circuit pattern formed by rolled copper; the auxiliary function structure is formed in a local area of the main circuit pattern by weldable low-temperature silver paste; the curing temperature of the weldable low-temperature silver paste is 130-145 DEG C, the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, an ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes and modified antimony tin oxide powder, and the conductive filler comprises flaky silver powder, spherical silver powder and low-temperature alloy powder. The low-temperature alloy powder is Sn42Bi58 low-temperature alloy powder of which D50 is 12 [mu] m-15 [mu] m; according to the invention, low-temperature curing, high flexibility, excellent conductivity and direct weldability are integrated, and a solution suitable for local repair of a flexible printed circuit board and direct mounting of a jumper and a Mini LED chip is provided.

Provided in the present application are a circuit board, a preparation method for a circuit board, and an electronic assembly and an electronic device. The circuit board comprises a transmission area and a connection area, wherein the connection area comprises a bending area and a pin area, and the division of the pin area, the bending area and the transmission area is performed from the perspective of a plane; and the connection area comprises a plurality of pins, which are connected to signal lines. Specifically, the pins are arranged in the pin area and are used for being connected to other electronic assemblies. The thickness of the bending area is less than that of the transmission area, such that the bending area has good flexibility; and the insertion loss and impedance of the whole circuit board are balanced, such that the circuit board in the present application can take into account a plurality of performance indexes such as insertion loss, impedance and flexibility.

The invention relates to the technical field of rolled copper foils, in particular to a rolled copper foil surface electroplating method, a rolled copper foil and application of the rolled copper foil. The rolled copper foil surface electroplating method comprises the following steps that pretreatment is conducted, specifically, rolled rolled copper foil is sequentially subjected to degreasing, acid pickling, roughening and curing treatment; wherein in the pickling step, current is introduced into a pickling solution, and a rolled copper foil is used as a cathode; and electroplating treatment: carrying out electroplating treatment on the pretreated rolled copper foil so as to form a target plating layer on the surface of the rolled copper foil. According to the invention, the problem of uneven distribution of coating particles caused by the existing copper foil electroplating method is solved, and the performance of the rolled copper foil is improved, so that the difficulty and the cost of a subsequent precision manufacturing process are reduced, and the overall production efficiency is improved.

The invention relates to an oxygen-free copper sheet and a preparation method and application thereof, and the preparation method of the oxygen-free copper sheet comprises the following steps: (1) carrying out microalloy smelting and casting on an electrolytic copper raw material to obtain a cast ingot; cr, Pb, a Cu-Ni alloy and a Cu-Fe alloy are added in the microalloy smelting process; (2) sequentially carrying out hot rolling, rough rolling and intermediate rolling on the cast ingot obtained in the step (1), and then carrying out bright annealing to obtain a blank; (3) the blank obtained in the step (2) is subjected to at least two times of first finish rolling and annealing combined treatment, and a semi-finished product is obtained; and the obtained semi-finished product is subjected to second finish rolling and post-treatment, and the oxygen-free copper sheet is obtained. The oxygen-free copper sheet with the purity reaching 4N and the performance meeting the production requirements of the ceramic copper-clad plate can be finally obtained by controlling the added elements and the content of the added elements and matching with rolling and annealing processes.

The utility model relates to a multilayer flexible stretchable liquid metal interconnection circuit based on a flexible substrate, and belongs to the field of flexible electronics. The flexible packaging structure comprises a flexible substrate layer with gradient modulus, a first liquid metal circuit, a flexible insulating layer, a second liquid metal circuit and a flexible packaging layer from bottom to top, electrical connection between the first liquid metal circuit and the second liquid metal circuit is realized through a through hole in the flexible insulating layer; and realizing device packaging by using a flexible packaging layer. According to the flexible substrate with the gradient modulus, smooth transition from hard to soft of the flexible substrate is realized, and the problems of tensile stress concentration, even assembly failure and the like caused by mismatching of the modulus of a rigid electronic component and the modulus of the flexible substrate in a flexible circuit are solved; and by designing a multi-layer liquid metal interconnection circuit, reliable electrical connection of the flexible circuit is realized, and meanwhile, the integration density of the flexible circuit is improved. According to the utility model, the working reliability and the integration level of the rigid electronic component on the flexible stretchable circuit are improved.

A circuit board having one or more computer-based components comprises a ground plane, such as a copper sheet, and a dielectric layer overlaying the ground plane. An opening is defined in the dielectric layer such that an area of the ground plane is exposed. A heating device is mounted within the opening and thermally coupled to the ground plane such that energizing the heating device transfers heat to the ground plane.

The present disclosure relates to a printed circuit board including: an insulating layer, a through-hole penetrating the insulating layer from an upper surface to a lower surface of the insulating layer and having an inclined wall surface; a metal ball disposed within the through-hole and in contact with the inclined wall surface; and a metal via filling the through-hole and surrounding the metal ball.

Provided is electrolytic copper foil that has a high degree of smoothness and yet exhibits high flexibility which is suitable for a flexible substrate (in particular, high flexibility obtained after being annealed for 1 hour at 180°C). This electrolytic copper foil has a ten-point mean roughness Rz of 0.1-2.0 μm on at least one surface thereof, and is configured such that when subjected to a cross sectional analysis by electron backscatter diffraction (EBSD), among the area of the observation field occupied by copper crystal grains, the proportion of area occupied by copper crystal grains satisfying all of the following is at least 63%: i) oriented toward the (101)-plane; ii) the aspect ratio is 0.500 or less; iii) when the angle formed by a line normal to the electrode surface of the electrolytic copper foil and the major axes of the copper crystal grains is θ (°), ׀sinθ׀ is 0.001-0.707; and iv) when the crystal is elliptically approximated, the minor axis length is 0.38 μm or less.