1572results about "Metallic pattern materials" patented technology

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

The invention relates to a resistance conductive material as well as a preparation method and application thereof. The resistance conductive material comprises a copper foil layer, a transition layer and a resistance layer from bottom to top, the resistance layer comprises a dispersion reinforcing phase and a homogeneous phase; the dispersion enhancing phase is subjected to surface pretreatment before being added into the electroplating liquid. According to the invention, the transition layer and the dispersion reinforcing phase are introduced, the diffusion of copper into the resistance layer is inhibited through the synergistic effect of the transition layer and the dispersion reinforcing phase, the high resistivity of the resistance layer is maintained, and the application prospect is good.

Provided is a copper foil with a carrier, whereby the carrier can be easily peeled off even after high-temperature pressing at a temperature exceeding 350 DEG C. This copper foil with a carrier is provided with a carrier, an intermediate layer, and a copper foil in this order, wherein the intermediate layer has a Cr phase, an Ni-P phase, and a Mo-Fe-Ni phase. In the surface of the carrier on the intermediate layer side, the ratio of the surface covered with the Mo-Fe-Ni phase is from 61.00% to 96.00% (inclusive). The Ni / Mo ratio, which is the ratio of the amount of deposited Ni to the amount of deposited Mo in the intermediate layer, is 2.00 or more. The Fe content of the intermediate layer, which is the ratio of the amount of deposited Fe to the total amount of the amount of deposited Mo, the amount of deposited Ni, and the amount of deposited Fe, is 8.90% or less.

In order to solve the problems that an existing stretchable circuit board is large in impedance and short in service life, the stretchable circuit board comprises an elastic substrate and an elastic packaging layer, the elastic packaging layer covers the surface of one side of the elastic substrate, and the elastic packaging layer covers the surface of the other side of the elastic substrate. A fiber reinforcement area is formed on one side, facing the elastic packaging layer, of the elastic substrate, a glass fiber layer penetrating through the elastic substrate is arranged in the fiber reinforcement area, a line groove is formed in the fiber reinforcement area, the glass fiber layer partially penetrates through the line groove, the line groove is filled with a liquid metal coating, and the liquid metal coating is arranged on the elastic substrate. And a circuit pattern is formed by the liquid metal coating in the circuit groove.

The invention relates to a copper foil and a preparation method and application thereof, the copper foil comprises an electrolytic copper foil layer and secondary long copper layers located on the surfaces of the two sides of the electrolytic copper foil layer, the maximum Feret diameter average value of crystal grains of the secondary long copper layers is 2.5-3 microns, and the maximum Feret diameter average value of crystal grains of the electrolytic copper foil layer is 1-2 microns. The maximum Feret diameter average value of grains of the secondary growing copper layer on the surface of the copper foil is 2.3-3 microns, the maximum Feret diameter average value of grains of the internal electrolytic copper foil layer is 1-2 microns, a structure with the grain size of the surface layer being large and the grain size of the inner layer being small is formed, and when the copper foil is used for transmitting a high-speed high-frequency electric signal, due to the skin effect of current, the high-speed high-frequency electric signal can be transmitted. More electric signals are transmitted along the surface layer of the copper foil, the grain size of the surface layer is large, the grain boundary is correspondingly reduced, and the obstruction to current is reduced, so that the loss of the electric signals is reduced, and the transmission integrity of the electric signals is improved.

A printed circuit board (PCB) serves as a core basic component of the electronic information industry, and the manufacturing process of the PCB faces double challenges of rapid iteration and customization requirements of electronic products. A traditional PCB manufacturing technology (such as mechanical board manufacturing, silk-screen printing and the like) is suitable for large-scale production, but has the defects of long production period, high cost, minimum order quantity limitation and the like, and is difficult to meet the market requirements of small batch and high flexibility. Under the background, the 3D printing technology is completely exposed by means of the efficient customized production capacity, the supply efficiency of a minimum batch of PCBs (such as test single boards and concept verification boards) can be remarkably improved, the production batch constraint of a traditional method is avoided, and the comprehensive cost advantage is shown in the design verification stage. However, the current 3D printing PCB technology is still limited by the circuit complexity and the number of layers and is mostly limited by single / double panel manufacturing, and the performance of the conductive slurry and the base material needs to be optimized urgently. The key technical bottlenecks of interlayer vertical interconnection, multilayer medium lamination manufacturing and the like need to be broken through in the future, so that 3D printing of high-density and multilayer arbitrary interconnection PCBs is achieved, deep application of the technology in the field of intelligent manufacturing and new materials is promoted, and an innovative development opportunity is created for the PCB industry.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

The present invention provides a surface treatment liquid that can form an organic film sufficiently excellent in adhesive properties between metal and resin and is also excellent in chemical resistance properties, the surface treatment liquid being excellent in storage stability. The present invention relates to a metal surface treatment liquid for forming an organic film on a metal surface, wherein the surface treatment liquid contains a silane coupling agent and an acid and has a pH of 1.9 or less.

Disclosed is a copper foil to which a carrier foil is attached, which has favorable peel strength under high-temperature pressing conditions, the copper foil to which the carrier foil is attached comprising: a carrier foil; a release layer on the carrier foil; a heat-resistant layer on the release layer; and an ultra-thin copper foil on the heat-resistant layer, in which a buffer layer of a nickel alloy is interposed between the release layer and the heat-resistant layer.

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

The invention provides a multifunctional flexible electronic device based on ionic liquid gel and patterned liquid metal and a preparation method. The preparation method comprises the following steps: firstly preparing ionic liquid gel with excellent performance as an upper substrate and a lower substrate of the flexible electronic device, then forming a high-resolution conductive pattern on the ionic liquid gel through a template printing method by using liquid metal alloy subjected to surface modification, and finally curing and packaging by using another layer of ionic liquid gel. According to the flexible electronic device, the modified particles are introduced to be mixed with the liquid metal, the flexible electronic device with the tensile adjustable resistance change characteristic is prepared, and meanwhile, the conductive patterns form firm interface bonding with the gel matrix through hydrogen bonds formed between the gallium with the oxidized surface and carboxyl of the ionic gel. Even if the prepared multifunctional flexible electronic device is stretched and released, the composite material can keep continuous contact with the base material, so that stable electric connection is maintained, and the method is suitable for the fields of wearable electronics and flexible electronics.

A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.

The invention discloses a novel automobile back view mirror flexible printed circuit board prepared based on weldable silver paste, and belongs to the technical field of electronic materials and devices, conductor patterns in the flexible printed circuit board comprise a main circuit pattern and an auxiliary function structure formed by weldable low-temperature curing silver paste; the curing temperature of the weldable low-temperature silver paste is 125-135 DEG C, and the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, a high-boiling-point ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes, modified aluminum oxide powder, modified barium sulfate and a low-stress modifier. The polymer resin system comprises novolac epoxy resin, biphenyl epoxy resin and a polyacrylate-CTBN copolymer; through the synergistic effect of all the components and an innovative process, comprehensive improvement of mechanical reliability, environmental durability, conductive stability and power load capacity is achieved, and the strict requirement for high reliability of the automobile rearview mirror in an extreme environment is perfectly met.

The invention discloses a novel notebook flexible printed circuit board prepared based on weldable low-temperature silver paste and a backlight module, and belongs to the technical field of electronic materials and devices. Conductor patterns of the flexible printed circuit board comprise a main circuit pattern formed by rolled copper; the auxiliary function structure is formed in a local area of the main circuit pattern by weldable low-temperature silver paste; the curing temperature of the weldable low-temperature silver paste is 130-145 DEG C, the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, an ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes and modified antimony tin oxide powder, and the conductive filler comprises flaky silver powder, spherical silver powder and low-temperature alloy powder. The low-temperature alloy powder is Sn42Bi58 low-temperature alloy powder of which D50 is 12 [mu] m-15 [mu] m; according to the invention, low-temperature curing, high flexibility, excellent conductivity and direct weldability are integrated, and a solution suitable for local repair of a flexible printed circuit board and direct mounting of a jumper and a Mini LED chip is provided.

The invention relates to an oxygen-free copper sheet and a preparation method and application thereof, and the preparation method of the oxygen-free copper sheet comprises the following steps: (1) carrying out microalloy smelting and casting on an electrolytic copper raw material to obtain a cast ingot; cr, Pb, a Cu-Ni alloy and a Cu-Fe alloy are added in the microalloy smelting process; (2) sequentially carrying out hot rolling, rough rolling and intermediate rolling on the cast ingot obtained in the step (1), and then carrying out bright annealing to obtain a blank; (3) the blank obtained in the step (2) is subjected to at least two times of first finish rolling and annealing combined treatment, and a semi-finished product is obtained; and the obtained semi-finished product is subjected to second finish rolling and post-treatment, and the oxygen-free copper sheet is obtained. The oxygen-free copper sheet with the purity reaching 4N and the performance meeting the production requirements of the ceramic copper-clad plate can be finally obtained by controlling the added elements and the content of the added elements and matching with rolling and annealing processes.

A circuit board having one or more computer-based components comprises a ground plane, such as a copper sheet, and a dielectric layer overlaying the ground plane. An opening is defined in the dielectric layer such that an area of the ground plane is exposed. A heating device is mounted within the opening and thermally coupled to the ground plane such that energizing the heating device transfers heat to the ground plane.

A permeable bioelectronic system comprising stretchable multilayered circuits comprising liquid metal (LM), and LM interconnects for bonding one or more inorganic electronic circuit components to the stretchable multilayered circuits.

A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.

The invention belongs to the technical field of flexible electronic materials, and particularly relates to an adsorption layer for promoting patterning and separation of liquid metal, a preparation method of the adsorption layer and a recoverable flexible liquid metal sensing device. The metal organic framework material-polymer is used as an adsorption layer for promoting patterning and separation of the liquid metal, and the characteristics that the liquid metal is adsorbed on the surface of the polymer and repelled on the surface of the metal organic framework material are achieved by adjusting surface functional groups and roughness. And meanwhile, high-precision patterning is carried out on the polymer through a 3D printing or photoetching technology, and a high-precision liquid metal pattern is obtained under selective adsorption of the liquid metal. Besides, according to the dissolution characteristics of the metal-organic framework material and the polymer, a two-step recovery method for dissolving the polymer, separating the liquid metal from the polymer and then dissolving and separating the metal-organic framework material is designed, and the scheme of the invention is beneficial to the integration and sustainable development of the liquid metal-based electronic device.

The invention relates to the technical field of unmanned aerial vehicle speed regulators, in particular to an unmanned aerial vehicle brushless motor electronic speed regulator which comprises a controller module and a power module, the controller module is used for controlling the working state of an unmanned aerial vehicle brushless motor, and the power module is used for controlling the working power of the unmanned aerial vehicle brushless motor; the power module comprises a power PCB (Printed Circuit Board), and a power board chip is welded on the power PCB; the controller module comprises an independent controller PCB, a controller chip is welded on the upper surface of the controller PCB, a controller module surface mounting bonding pad is arranged on the upper surface of the power PCB, and the controller PCB is welded on the controller module surface mounting bonding pad on the power PCB; the copper foil thickness of the power PCB is different from that of the controller PCB, and the copper foil thickness of the power PCB is larger than that of the controller PCB. The problems of power supply stability, electromagnetic interference, high PCB manufacturing difficulty and high cost of an existing unmanned aerial vehicle brushless motor electronic speed regulator are effectively solved.

The present application relates to the technical field of automotive electronics, and discloses an FPC structure and a manufacturing method. In a first aspect, an FPC structure is provided, comprising a supporting substrate and an aluminum substrate, wherein the supporting substrate comprises an integrally formed flexible board body and a flexible board connecting piece, and the aluminum substrate is covered on the supporting substrate; in a second aspect, a manufacturing method for the above-mentioned FPC structure is provided, comprising the following steps: Step 1: cutting and blanking, cutting the raw material into rectangular sheets required for production; Step 2: performing laser drilling on the rectangular sheets; Step 3: laminating a protective film on the rectangular sheets; Step 4: corroding the unprotected aluminum material through exposure, development, and etching to expose the final circuit pattern; Step 5: covering with a protective film to protect the formed circuit; and at the same time, the flexible board body and the flexible board connecting piece are integrally punched and formed. The present application can simplify the manufacturing process of the FPC and improve the processing efficiency.

To provide a circuit board that is capable of maintaining stable electrical characteristics even under repeated stretching and / or bending over a long period of use, as compared to conventional ones based on stretchable conductive materials.SOLUTION: A circuit board 1 of the present invention comprises: a base member 101 having stretchability and / or flexibility; a conductive layer 110 formed on the base member 101 in a predetermined pattern and containing a liquid metal 110a; and a coating layer 120 laminated on the conductive layer 110.SELECTED DRAWING: Figure 1

The invention provides a double-sided conduction AMB ceramic substrate and a manufacturing method thereof, and belongs to the technical field of ceramic substrates for power modules. The manufacturing method comprises the following steps: punching holes in a ceramic substrate; filling conductive metal slurry into the holes by using a screen printing machine and sintering at high temperature; brazing materials are printed on the two faces of the ceramic; the copper layer and the ceramic layer are laminated and then subjected to vacuum brazing; manufacturing a circuit; etching the solder layer of the AMB line groove to expose the ceramic; performing surface treatment; laser cutting; and conducting test and inspection. Two-sided conduction is realized through metal slurry hole filling and a high-temperature sintering process, the problem that conduction of an upper copper layer and a lower copper layer of a traditional AMB ceramic substrate cannot be realized is solved, the assembling size of a power module is reduced, the three-dimensional integration requirement of a high-end module is met, meanwhile, the technological process is reasonable, and the production cost is reduced.

The invention relates to the technical field of wireless communication equipment manufacturing, in particular to a method for manufacturing an FPC flexible antenna through integrated injection molding and the antenna, and the method comprises the following steps: preparing a copper foil layer on the surface of a double-layer polyimide substrate flexible circuit, and chemically plating a nickel-gold layer on the surface of the copper foil layer; a receding groove is formed in a golden finger area of the FPC flexible circuit board, and a positioning hole is formed in the edge of the FPC flexible circuit board; a Teflon coating is sprayed on the inner wall of the mold cavity, and a positioning column is mounted in the mold cavity; the method comprises the following steps: firstly, fixing a preprocessed FPC flexible circuit board in a mold cavity through a positioning column; and injecting a thermoplastic high polymer material heated to a molten state into a mold cavity, applying a dwell pressure to the injected molten material, so that the FPC flexible circuit board is completely coated with the molten material, cooling, and demolding to obtain the FPC flexible antenna. According to the invention, seamless integration of the antenna and the shell can be realized, so that the coupling problem of line damage and impedance mismatch in a traditional injection molding antenna is solved.

The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.

The invention discloses a high-temperature-resistant flexible circuit and a preparation method and application thereof, and belongs to the technical field of flexible electronics. Liquid metal particles and a solution of a high-temperature-resistant polymer are blended, the mixed solution is subjected to blade coating on a glass plate to form a film, then the film is placed in a drying oven to evaporate a solvent and is subjected to high-temperature crosslinking, then an ultraviolet laser imprinting machine is used for conducting circuit imprinting on the surface of the cooled film, and the high-temperature-resistant flexible circuit is obtained. According to the invention, the high-temperature-resistant polymer is used as the flexible circuit substrate, and the laser-activated dispersed liquid metal particles are used as the circuit, so that the high-temperature-resistant performance of the flexible circuit is improved.

A printed circuit board includes: an insulating portion; a first pad disposed on the bottom of the insulating portion; a first solder resist layer disposed on the bottom of the insulating portion, covering at least a portion of the first pad, and having a first opening in at least a portion of the first pad; a first barrier layer disposed on a portion of the first pad corresponding to the first opening; a first surface treatment layer disposed on the first barrier layer; a second pad disposed on the top of the insulating portion; a second solder resist layer disposed on the top of the insulating portion, covering at least a portion of the second pad; a metal post disposed on the second pad; and a second barrier layer disposed between the second pad and the metal post.

The invention relates to an electrolytic copper foil and a preparation method thereof, a printed circuit board, a negative electrode current collector and a battery, the electrolytic copper foil is of a layer-by-layer structure and comprises a columnar crystal layer and blocky crystal layers located on the two sides of the columnar crystal layer, the grain size of the columnar crystal layer is 60 nm to 250 nm, and the grain size of the blocky crystal layers is 350 nm to 750 nm. The electrolytic copper foil with the layer-by-layer structure can give consideration to tensile strength, ductility and low warping degree after high-temperature annealing, and the bending resistance is remarkably improved.

A flexible film conductor (122) as a balancing resistor for charge or discharge balancing of the cells (102), the flexible film conductor (122) being arranged between the cells (102, 104, 105, 106) and the integrated switching circuit (112), comprising an electrically conductive material, characterized in that the flexible film conductor (122) has a predetermined conductor guide (204) and / or the flexible film conductor (122) has a predetermined conductor width, and the flexible film conductor (122) has a predetermined conductor guide (204) and / or a predetermined conductor width, and the flexible film conductor (122) is arranged between the cells (102, 104, 105, 106) and the integrated switching circuit (112). The flexible film conductor (122) has a specific conductor thickness, which is measured in such a way that the current required for the balance of charge and discharge is generated directly at the flexible film conductor (122), and / or the flexible film conductor (122) has a conductor length, which is adapted to the spatial arrangement between the cells (102, 104, 105, 106) and the integrated switching circuit (102, 104, 105, 106), and / or the flexible film conductor (122) has a specific conductor thickness, which is measured in such a way that the current required for the balance of charge and discharge is generated directly at the flexible film conductor (122) and / or the flexible film conductor (122) has a conductor length.