1115results about "Metallic pattern materials" patented technology

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

In order to solve the problems that an existing stretchable circuit board is large in impedance and short in service life, the stretchable circuit board comprises an elastic substrate and an elastic packaging layer, the elastic packaging layer covers the surface of one side of the elastic substrate, and the elastic packaging layer covers the surface of the other side of the elastic substrate. A fiber reinforcement area is formed on one side, facing the elastic packaging layer, of the elastic substrate, a glass fiber layer penetrating through the elastic substrate is arranged in the fiber reinforcement area, a line groove is formed in the fiber reinforcement area, the glass fiber layer partially penetrates through the line groove, the line groove is filled with a liquid metal coating, and the liquid metal coating is arranged on the elastic substrate. And a circuit pattern is formed by the liquid metal coating in the circuit groove.

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.

The invention discloses a novel automobile back view mirror flexible printed circuit board prepared based on weldable silver paste, and belongs to the technical field of electronic materials and devices, conductor patterns in the flexible printed circuit board comprise a main circuit pattern and an auxiliary function structure formed by weldable low-temperature curing silver paste; the curing temperature of the weldable low-temperature silver paste is 125-135 DEG C, and the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, a high-boiling-point ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes, modified aluminum oxide powder, modified barium sulfate and a low-stress modifier. The polymer resin system comprises novolac epoxy resin, biphenyl epoxy resin and a polyacrylate-CTBN copolymer; through the synergistic effect of all the components and an innovative process, comprehensive improvement of mechanical reliability, environmental durability, conductive stability and power load capacity is achieved, and the strict requirement for high reliability of the automobile rearview mirror in an extreme environment is perfectly met.

The invention discloses a novel notebook flexible printed circuit board prepared based on weldable low-temperature silver paste and a backlight module, and belongs to the technical field of electronic materials and devices. Conductor patterns of the flexible printed circuit board comprise a main circuit pattern formed by rolled copper; the auxiliary function structure is formed in a local area of the main circuit pattern by weldable low-temperature silver paste; the curing temperature of the weldable low-temperature silver paste is 130-145 DEG C, the weldable low-temperature silver paste comprises conductive filler, a polymer resin system, an ester solvent, a curing agent, a silane coupling agent, a polyamide wax thixotropic agent, a polysiloxane defoaming agent, modified carbon nanotubes and modified antimony tin oxide powder, and the conductive filler comprises flaky silver powder, spherical silver powder and low-temperature alloy powder. The low-temperature alloy powder is Sn42Bi58 low-temperature alloy powder of which D50 is 12 [mu] m-15 [mu] m; according to the invention, low-temperature curing, high flexibility, excellent conductivity and direct weldability are integrated, and a solution suitable for local repair of a flexible printed circuit board and direct mounting of a jumper and a Mini LED chip is provided.

A circuit board having one or more computer-based components comprises a ground plane, such as a copper sheet, and a dielectric layer overlaying the ground plane. An opening is defined in the dielectric layer such that an area of the ground plane is exposed. A heating device is mounted within the opening and thermally coupled to the ground plane such that energizing the heating device transfers heat to the ground plane.

A permeable bioelectronic system comprising stretchable multilayered circuits comprising liquid metal (LM), and LM interconnects for bonding one or more inorganic electronic circuit components to the stretchable multilayered circuits.

A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.

The invention belongs to the technical field of flexible electronic materials, and particularly relates to an adsorption layer for promoting patterning and separation of liquid metal, a preparation method of the adsorption layer and a recoverable flexible liquid metal sensing device. The metal organic framework material-polymer is used as an adsorption layer for promoting patterning and separation of the liquid metal, and the characteristics that the liquid metal is adsorbed on the surface of the polymer and repelled on the surface of the metal organic framework material are achieved by adjusting surface functional groups and roughness. And meanwhile, high-precision patterning is carried out on the polymer through a 3D printing or photoetching technology, and a high-precision liquid metal pattern is obtained under selective adsorption of the liquid metal. Besides, according to the dissolution characteristics of the metal-organic framework material and the polymer, a two-step recovery method for dissolving the polymer, separating the liquid metal from the polymer and then dissolving and separating the metal-organic framework material is designed, and the scheme of the invention is beneficial to the integration and sustainable development of the liquid metal-based electronic device.

The invention provides a double-sided conduction AMB ceramic substrate and a manufacturing method thereof, and belongs to the technical field of ceramic substrates for power modules. The manufacturing method comprises the following steps: punching holes in a ceramic substrate; filling conductive metal slurry into the holes by using a screen printing machine and sintering at high temperature; brazing materials are printed on the two faces of the ceramic; the copper layer and the ceramic layer are laminated and then subjected to vacuum brazing; manufacturing a circuit; etching the solder layer of the AMB line groove to expose the ceramic; performing surface treatment; laser cutting; and conducting test and inspection. Two-sided conduction is realized through metal slurry hole filling and a high-temperature sintering process, the problem that conduction of an upper copper layer and a lower copper layer of a traditional AMB ceramic substrate cannot be realized is solved, the assembling size of a power module is reduced, the three-dimensional integration requirement of a high-end module is met, meanwhile, the technological process is reasonable, and the production cost is reduced.

The invention relates to the technical field of wireless communication equipment manufacturing, in particular to a method for manufacturing an FPC flexible antenna through integrated injection molding and the antenna, and the method comprises the following steps: preparing a copper foil layer on the surface of a double-layer polyimide substrate flexible circuit, and chemically plating a nickel-gold layer on the surface of the copper foil layer; a receding groove is formed in a golden finger area of the FPC flexible circuit board, and a positioning hole is formed in the edge of the FPC flexible circuit board; a Teflon coating is sprayed on the inner wall of the mold cavity, and a positioning column is mounted in the mold cavity; the method comprises the following steps: firstly, fixing a preprocessed FPC flexible circuit board in a mold cavity through a positioning column; and injecting a thermoplastic high polymer material heated to a molten state into a mold cavity, applying a dwell pressure to the injected molten material, so that the FPC flexible circuit board is completely coated with the molten material, cooling, and demolding to obtain the FPC flexible antenna. According to the invention, seamless integration of the antenna and the shell can be realized, so that the coupling problem of line damage and impedance mismatch in a traditional injection molding antenna is solved.

The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.

The invention relates to an electrolytic copper foil and a preparation method thereof, a printed circuit board, a negative electrode current collector and a battery, the electrolytic copper foil is of a layer-by-layer structure and comprises a columnar crystal layer and blocky crystal layers located on the two sides of the columnar crystal layer, the grain size of the columnar crystal layer is 60 nm to 250 nm, and the grain size of the blocky crystal layers is 350 nm to 750 nm. The electrolytic copper foil with the layer-by-layer structure can give consideration to tensile strength, ductility and low warping degree after high-temperature annealing, and the bending resistance is remarkably improved.

The invention discloses a manufacturing method of a flexible electronic skin light source, which comprises the following steps: cutting a base material to obtain a base material raw material with a required size; obtaining conductive silver paste, mixing the conductive silver paste with a diluent, and uniformly stirring to prepare conductive ink; printing conductive ink on the surface of the base material raw material according to a preset circuit pattern by using screen printing equipment to obtain a base material circuit diagram; placing a light source patch at a corresponding position of the substrate circuit diagram, and electrically connecting the light source patch with the circuit diagram by adopting welding equipment to obtain an electrically connected light source patch substrate; laminating a polyimide reinforcing material on the back surface of the light source patch to obtain a flexible light source semi-finished product; the flexible light source semi-finished product is packaged, the flexible light source semi-finished product is completely wrapped, and the flexible electronic skin light source is obtained; the flexible electronic skin light source manufactured through the method can be bent in any direction, the bending frequency of the flexible light source is greatly increased, and the service life of the flexible light source is greatly prolonged.

The invention provides low-temperature base metal conductive paste and a preparation method and application thereof.The low-temperature base metal conductive paste comprises 86 wt%-90 wt% of a conductive phase, 3 wt%-6 wt% of resin, 0.1 wt%-0.5 wt% of a curing agent, 0.1 wt%-1 wt% of a dispersing agent, 0.1 wt%-3 wt% of an antioxidant, 0.8 wt%-1.4 wt% of an anti-settling agent and the balance solvent, the conductive phase comprises 30-60 wt% of first-class tin-coated copper powder, 10-30 wt% of second-class tin-coated copper powder and 30-60 wt% of pure copper powder, the first-class tin-coated copper powder is spheroidic and / or blocky and has an average particle size D1, the second-class tin-coated copper powder is flaky and has an average particle size D2, the pure copper powder has an average particle size D3, and D1 / D2 is larger than or equal to 0.5 and smaller than or equal to 1, and D1 / D3 is larger than or equal to 6 and smaller than or equal to 16.7. The tin-coated copper powder with different morphologies is matched according to a specific mass ratio and a specific particle size ratio and is further compounded with the pure copper powder according to a ratio, so that a conductive phase system with dense powder accumulation is formed, the electrode resistivity is reduced, metal silver does not need to be used, the dependence of conductive paste on a conductive network formed by silver powder is eliminated, and the remarkable cost reduction effect is achieved.

The invention relates to the technical field of thick-film resistors, and discloses a high-sheet-resistance resistor paste, a preparation method thereof and a thick-film circuit. The resistance paste comprises 6%-24% of a composite conductive phase, 33%-57% of an inorganic binding phase, 2%-6% of a modifier and 22%-38% of an organic carrier. The conductive phase comprises nano-scale / submicron-scale ruthenium dioxide powder and submicron-scale flake silver powder, and the conductivity and the stability are cooperatively guaranteed. According to the preparation method, a secondary dispersing and grinding process is adopted, and a finished product is obtained through coarse grinding, vacuumizing fine grinding and 800-mesh filtering. The thick film circuit adopts an N-group parallel architecture, so that the use amount of conductive phases can be greatly reduced. The problem that traditional slurry is poor in stability under high sheet resistance is solved, TCR is smaller than or equal to 100 ppm / DEG C, resistance precision is within + / -5%, temperature and humidity stability is excellent, cost is low, and the slurry is suitable for high-precision heating scenes such as a new energy automobile heating system.

The present invention provides a "circuit board manufacturing method" that allows for the formation of multiple pixel circuits using a film with a thickness of a certain value or greater, while also enabling the appropriate connection of the wiring patterns of each pixel circuit with an appropriate amount of liquid metal. [Solution] In the first step, multiple pixel circuits 2 are formed on the PI film 1 with the pixels connected by the wiring pattern 3. In the second to second-fourth steps, the PI film 1 is processed to reduce the thickness at the positions between pixels, and the PI film 1 is divided into individual pixel pieces so that the PI film 1 is cut together with the wiring pattern 3 at the positions between pixels. This makes it possible to properly connect the wiring patterns 3 of each pixel circuit 2 with an appropriate amount of liquid metal 6 in the region where the liquid metal 6 is attached between pixels, by making the step difference between the wiring pattern 3 formed on the pixel circuit 2 and the flexible substrate 5 to which the individual pieces 4 are transferred less than a certain value, thereby enabling the wiring patterns 3 of each pixel circuit 2 to be properly connected with an appropriate amount of liquid metal 6.

[Problem] To provide a copper-clad laminate capable of simultaneously achieving good volume resistivity in an electroless copper plating layer of a low dielectric resin film and suppression of transmission loss when applied to a flexible circuit board, and a manufacturing method thereof. [Solution] This copper-clad laminate is characterized by including a low dielectric resin film which has a relative dielectric constant of 3.5 or lower and a dielectric loss tangent of 0.008 or lower at a frequency of 10 GHz and an electroless copper plating layer which is laminated on at least one surface of the low dielectric resin film, wherein the electroless copper plating layer has a Ni-content of 0.01 to 1.2 wt%, and the electroless copper plating layer has a volume resistivity of 6.0 µΩ·cm or lower.

The present invention discloses a multi-layer micro-space power supply board and a manufacturing method thereof, which belongs to the technical field of power supply boards. The multi-layer micro-space power supply board includes: a substrate, a dielectric layer, an inner copper layer, a surface copper layer and an inner conductive copper layer. Among them, a through groove is provided on the substrate. The dielectric layer includes a first dielectric layer and a second dielectric layer arranged on opposite sides of the substrate, and at least one through hole is provided on the first dielectric layer. The inner copper layer is stacked between the first dielectric layer and the second dielectric layer and fills the through groove. The surface copper layer includes a first surface copper layer arranged on the side of the first dielectric layer facing away from the inner copper layer and a second surface copper layer arranged on the side of the second dielectric layer facing away from the inner copper layer. The inner conductive copper layer is arranged in the through hole and is electrically connected to the inner copper layer and the first surface copper layer. The present invention maximizes the use of the longitudinal space superposition of the power supply board structure to obtain an ultra-thick copper heat dissipation layer, which significantly improves the heat dissipation capacity of the power supply board structure.

The application discloses a novel flexible printed circuit board and camera module prepared based on weldable low-temperature silver paste, and belongs to the technical field of electronic materials and devices. The conductor pattern in the flexible printed circuit board comprises a main circuit pattern and an auxiliary function structure formed by weldable low-temperature cured silver paste. The curing temperature of the weldable low-temperature silver paste is 87-103 DEG C. The silver paste comprises conductive fillers, a polymer resin system, ester solvents, a curing agent, a silane coupling agent, polyamide wax thixotropic agents, polysiloxane defoaming agents, modified carbon nanotubes, modified antimony tin oxide powder, modified ceramic fillers and low-stress modifiers. The polymer resin system comprises hydrogenated bisphenol A type epoxy resin, diphenyl type epoxy resin and polyacrylate-CTBN copolymer. The conductive fillers comprise silver-coated copper flaky powder, nano silver wire and low-temperature alloy powder. Through the synergistic effect of components and the innovative process, the comprehensive improvement of mechanical properties, conductive properties, high-frequency characteristics and welding reliability is realized under the premise of ultralow-temperature curing.

One aspect of the present invention provides a stretchable device including a stretchable substrate, a stretchable wiring provided on the stretchable substrate, a conductive member that is in contact with the stretchable wiring, a solder member that is provided on the conductive member and is in contact with the conductive member, an electronic component electrically connected to the conductive member with the solder member interposed therebetween, and a first insulating layer covering at least a part of the stretchable wiring. An outer surface of an end portion, on a side in contact with the conductive member, of the stretchable wiring is in contact with the conductive member and the first insulating layer continuous with the conductive member.

A method for manufacturing a circuit board that has both a high adhesive property and excellent high frequency characteristics is provided. Provided is a method for manufacturing a circuit board, the circuit board comprising a high frequency circuit that includes a base material, a ground layer, and a signal layer, at least the signal layer being a layer derived from a copper foil, the method comprising: (a) a step for, on the assumption of manufacturing a high frequency circuit using a copper foil having no adhesive agent layer, designing the specifications of a high frequency circuit having a predetermined impedance Z1; and (b) a step for forming a high frequency circuit in accordance with the specifications with the exception that the signal layer is formed by using, instead of the copper foil having no adhesive agent layer as assumed in the specifications, an adhesive agent layer-attached copper foil in such a way that an adhesive agent layer is interposed between the base material and the signal layer, to thereby manufacture a circuit board with the high frequency circuit having an impedance Z2 greater than Z1.

A method to form a plurality of inductors in a single process by stacking multiple magnetic sheets, wherein each sheet is made to form a particular part in quantities, which can be a base part, a pillar part, a hollow part, or a cover part, for forming a magnetic body of an inductor.

In order to obtain a high-frequency module with less warping, small size, and high connection reliability, a wiring substrate is provided, which has: a core material made of glass, having a first surface, a second surface opposite to the first surface, and a through-hole passing through the first surface to the second surface; a first adhesion layer formed so as to adhere to the first surface and an inner wall of the through-hole, and further block a bottom of the through-hole on the second surface side; a second adhesion layer adhering to the second surface and the first adhesion layer blocking the bottom of the through-hole on the second surface side; a first wiring layer laminated on the first adhesion layer; and a second wiring layer laminated on the second adhesion layer, wherein in a case where a total area of the first wiring layer is set as A, and an area occupied by copper in the first wiring layer is set as B, a residual copper rate C of the first wiring layer is represented by C=B / A (%), C=70-100%, and a Young's modulus of a material of the first adhesion layer is 0.1-0.85 times a Young's modulus of a material of the first wiring layer.

The present disclosure provides a multilayer substrate including a nanotwinned metal layer and a printed circuit board, the multilayer substrate including a substrate, a seed layer disposed on the substrate, and a nanotwinned copper layer disposed on the seed layer, wherein the seed layer includes a crystal structure having a random orientation, a crystal structure having a (200) plane preferred orientation, and / or a crystal structure having a (220) plane preferred orientation.

The application discloses an electronic skin-oriented conductive silver paste and a preparation method and application thereof, and relates to the technical field of flexible printed electronic materials.The raw materials of the electronic skin-oriented conductive silver paste include flaky silver powder, silver nanoparticles, thermoplastic polyurethane elastomer, acrylic elastomer, PEDOT:PSS microgel dispersion, (3-glycidylpropoxy)trimethoxysilane, polydiallyldimethylammonium chloride, hexanedial modified dopamine copolymer, (3-aminopropyl)triethoxysilane, methacryloyloxypropyltrimethoxysilane, cellulose acetate, modified polyurea thixotropic agent, hydrogenated castor oil, ethylene glycol ether acetate, dibasic acid ester, leveling agent and water.The electronic skin-oriented conductive silver paste has the advantages of good electrical performance, good mechanical-electrical stability, good anti-electromigration and sweat corrosion resistance, and can still maintain dendrite-free and low drift under long-term coupling of sweat and bias, and is suitable for electronic skin.

Provided is a surface-treated copper foil that can be used to produce printed wiring boards and the like, which exhibit excellent adhesion between a resin substrate and the surface-treated copper foil, low transmission loss, and are less likely to develop voids at the interface between the resin substrate and the surface-treated copper foil even when subjected to thermal history. The surface-treated copper foil has a roughened surface on which roughening particles are formed. The physical properties measured on the roughened surface satisfy the following: (A) when the surface-treated copper foil is cut to expose a cross section perpendicular to the roughened surface and the cross section is observed under a scanning electron microscope, the density X of protrusions of the roughening particles present on the roughened surface is 4 to 10 per 1-μm long region of the roughened surface on the cross section; (B) the average aspect ratio AR, calculated by dividing the particle height by the particle diameter of the roughening particles, is 1.5 to 3.0; and (C) the arithmetic mean height Sa, measured in accordance with the optical measurement method specified in ISO 25178, is 0.04 μm to 0.10 μm.