713results about "Metallic pattern materials" patented technology

A method of the subject technology includes forming a first circuit component at a first portion of a deformable substrate and forming a second circuit component at a second portion of the deformable substrate. The method further includes electronically coupling the first circuit component and the second circuit component using traces comprising a formulation including a liquid Ga-based alloy and a metal filler.

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

The invention provides a double-sided conduction AMB ceramic substrate and a manufacturing method thereof, and belongs to the technical field of ceramic substrates for power modules. The manufacturing method comprises the following steps: punching holes in a ceramic substrate; filling conductive metal slurry into the holes by using a screen printing machine and sintering at high temperature; brazing materials are printed on the two faces of the ceramic; the copper layer and the ceramic layer are laminated and then subjected to vacuum brazing; manufacturing a circuit; etching the solder layer of the AMB line groove to expose the ceramic; performing surface treatment; laser cutting; and conducting test and inspection. Two-sided conduction is realized through metal slurry hole filling and a high-temperature sintering process, the problem that conduction of an upper copper layer and a lower copper layer of a traditional AMB ceramic substrate cannot be realized is solved, the assembling size of a power module is reduced, the three-dimensional integration requirement of a high-end module is met, meanwhile, the technological process is reasonable, and the production cost is reduced.

The invention relates to the technical field of wireless communication equipment manufacturing, in particular to a method for manufacturing an FPC flexible antenna through integrated injection molding and the antenna, and the method comprises the following steps: preparing a copper foil layer on the surface of a double-layer polyimide substrate flexible circuit, and chemically plating a nickel-gold layer on the surface of the copper foil layer; a receding groove is formed in a golden finger area of the FPC flexible circuit board, and a positioning hole is formed in the edge of the FPC flexible circuit board; a Teflon coating is sprayed on the inner wall of the mold cavity, and a positioning column is mounted in the mold cavity; the method comprises the following steps: firstly, fixing a preprocessed FPC flexible circuit board in a mold cavity through a positioning column; and injecting a thermoplastic high polymer material heated to a molten state into a mold cavity, applying a dwell pressure to the injected molten material, so that the FPC flexible circuit board is completely coated with the molten material, cooling, and demolding to obtain the FPC flexible antenna. According to the invention, seamless integration of the antenna and the shell can be realized, so that the coupling problem of line damage and impedance mismatch in a traditional injection molding antenna is solved.

The invention relates to the technical field of thick-film resistors, and discloses a high-sheet-resistance resistor paste, a preparation method thereof and a thick-film circuit. The resistance paste comprises 6%-24% of a composite conductive phase, 33%-57% of an inorganic binding phase, 2%-6% of a modifier and 22%-38% of an organic carrier. The conductive phase comprises nano-scale / submicron-scale ruthenium dioxide powder and submicron-scale flake silver powder, and the conductivity and the stability are cooperatively guaranteed. According to the preparation method, a secondary dispersing and grinding process is adopted, and a finished product is obtained through coarse grinding, vacuumizing fine grinding and 800-mesh filtering. The thick film circuit adopts an N-group parallel architecture, so that the use amount of conductive phases can be greatly reduced. The problem that traditional slurry is poor in stability under high sheet resistance is solved, TCR is smaller than or equal to 100 ppm / DEG C, resistance precision is within + / -5%, temperature and humidity stability is excellent, cost is low, and the slurry is suitable for high-precision heating scenes such as a new energy automobile heating system.

The present invention provides a "circuit board manufacturing method" that allows for the formation of multiple pixel circuits using a film with a thickness of a certain value or greater, while also enabling the appropriate connection of the wiring patterns of each pixel circuit with an appropriate amount of liquid metal. [Solution] In the first step, multiple pixel circuits 2 are formed on the PI film 1 with the pixels connected by the wiring pattern 3. In the second to second-fourth steps, the PI film 1 is processed to reduce the thickness at the positions between pixels, and the PI film 1 is divided into individual pixel pieces so that the PI film 1 is cut together with the wiring pattern 3 at the positions between pixels. This makes it possible to properly connect the wiring patterns 3 of each pixel circuit 2 with an appropriate amount of liquid metal 6 in the region where the liquid metal 6 is attached between pixels, by making the step difference between the wiring pattern 3 formed on the pixel circuit 2 and the flexible substrate 5 to which the individual pieces 4 are transferred less than a certain value, thereby enabling the wiring patterns 3 of each pixel circuit 2 to be properly connected with an appropriate amount of liquid metal 6.

The application discloses a novel flexible printed circuit board and camera module prepared based on weldable low-temperature silver paste, and belongs to the technical field of electronic materials and devices. The conductor pattern in the flexible printed circuit board comprises a main circuit pattern and an auxiliary function structure formed by weldable low-temperature cured silver paste. The curing temperature of the weldable low-temperature silver paste is 87-103 DEG C. The silver paste comprises conductive fillers, a polymer resin system, ester solvents, a curing agent, a silane coupling agent, polyamide wax thixotropic agents, polysiloxane defoaming agents, modified carbon nanotubes, modified antimony tin oxide powder, modified ceramic fillers and low-stress modifiers. The polymer resin system comprises hydrogenated bisphenol A type epoxy resin, diphenyl type epoxy resin and polyacrylate-CTBN copolymer. The conductive fillers comprise silver-coated copper flaky powder, nano silver wire and low-temperature alloy powder. Through the synergistic effect of components and the innovative process, the comprehensive improvement of mechanical properties, conductive properties, high-frequency characteristics and welding reliability is realized under the premise of ultralow-temperature curing.

A method for manufacturing a circuit board that has both a high adhesive property and excellent high frequency characteristics is provided. Provided is a method for manufacturing a circuit board, the circuit board comprising a high frequency circuit that includes a base material, a ground layer, and a signal layer, at least the signal layer being a layer derived from a copper foil, the method comprising: (a) a step for, on the assumption of manufacturing a high frequency circuit using a copper foil having no adhesive agent layer, designing the specifications of a high frequency circuit having a predetermined impedance Z1; and (b) a step for forming a high frequency circuit in accordance with the specifications with the exception that the signal layer is formed by using, instead of the copper foil having no adhesive agent layer as assumed in the specifications, an adhesive agent layer-attached copper foil in such a way that an adhesive agent layer is interposed between the base material and the signal layer, to thereby manufacture a circuit board with the high frequency circuit having an impedance Z2 greater than Z1.

A method to form a plurality of inductors in a single process by stacking multiple magnetic sheets, wherein each sheet is made to form a particular part in quantities, which can be a base part, a pillar part, a hollow part, or a cover part, for forming a magnetic body of an inductor.

In order to obtain a high-frequency module with less warping, small size, and high connection reliability, a wiring substrate is provided, which has: a core material made of glass, having a first surface, a second surface opposite to the first surface, and a through-hole passing through the first surface to the second surface; a first adhesion layer formed so as to adhere to the first surface and an inner wall of the through-hole, and further block a bottom of the through-hole on the second surface side; a second adhesion layer adhering to the second surface and the first adhesion layer blocking the bottom of the through-hole on the second surface side; a first wiring layer laminated on the first adhesion layer; and a second wiring layer laminated on the second adhesion layer, wherein in a case where a total area of the first wiring layer is set as A, and an area occupied by copper in the first wiring layer is set as B, a residual copper rate C of the first wiring layer is represented by C=B / A (%), C=70-100%, and a Young's modulus of a material of the first adhesion layer is 0.1-0.85 times a Young's modulus of a material of the first wiring layer.

The present disclosure provides a multilayer substrate including a nanotwinned metal layer and a printed circuit board, the multilayer substrate including a substrate, a seed layer disposed on the substrate, and a nanotwinned copper layer disposed on the seed layer, wherein the seed layer includes a crystal structure having a random orientation, a crystal structure having a (200) plane preferred orientation, and / or a crystal structure having a (220) plane preferred orientation.

The application discloses an electronic skin-oriented conductive silver paste and a preparation method and application thereof, and relates to the technical field of flexible printed electronic materials.The raw materials of the electronic skin-oriented conductive silver paste include flaky silver powder, silver nanoparticles, thermoplastic polyurethane elastomer, acrylic elastomer, PEDOT:PSS microgel dispersion, (3-glycidylpropoxy)trimethoxysilane, polydiallyldimethylammonium chloride, hexanedial modified dopamine copolymer, (3-aminopropyl)triethoxysilane, methacryloyloxypropyltrimethoxysilane, cellulose acetate, modified polyurea thixotropic agent, hydrogenated castor oil, ethylene glycol ether acetate, dibasic acid ester, leveling agent and water.The electronic skin-oriented conductive silver paste has the advantages of good electrical performance, good mechanical-electrical stability, good anti-electromigration and sweat corrosion resistance, and can still maintain dendrite-free and low drift under long-term coupling of sweat and bias, and is suitable for electronic skin.

To provide a ceramic copper circuit board using a Ag-free brazing filler metal layer, wherein the brazing filler metal layer of the ceramic copper circuit board includes a protruding part, and a semiconductor device using the same.SOLUTION: A ceramic copper circuit board according to the embodiment includes a ceramic substrate, and a plurality of copper circuit parts bonded respectively via brazing filler metal layers on at least one surface of the ceramic substrate. The brazing filler metal layer does not contain Ag and contains Cu, Ti, and one or two kinds selected from Sn and In. The brazing filler metal layer includes a junction provided between the ceramic substrate and the copper circuit part, and a first protruding part provided around the junction and having a titanium content in the range of 70 mass% or more and 100 mass% or less. When the thickness of the copper circuit part is D and the shortest distance between adjacent copper circuit parts is P, the thickness D of the copper circuit part is 0.1 mm or more, and a region satisfying 1≤P / D≤3 is included.SELECTED DRAWING: Figure 1

The objective is to provide a treated copper foil that can adhere firmly to a substrate at a smooth interface with minimal irregularities, and a method for manufacturing the same. Furthermore, the objective is to provide a laminate in which the treated copper foil and the substrate are firmly adhered at a smooth interface with minimal irregularities, and a method for manufacturing the same. [Solution] By using a treated copper foil in which a conductive layer (B) containing silver (b1) is laminated onto a copper foil (A) with a smooth surface, it is possible to firmly adhere the copper foil (A) and the substrate (D) at a smooth interface with minimal irregularities, thus completing the present invention.

A ceramic circuit board according to an embodiment includes a ceramic substrate and a metal circuit. The metal circuit is bonded to a first surface of the ceramic substrate via an active metal brazing material layer. A thickness of the metal circuit is not less than 1 mm. The metal circuit has a through-hole extending through the metal circuit along a first direction perpendicular to the first surface. A portion of the first surface overlaps the through-hole in the first direction. The active metal brazing material layer is present at the portion of the first surface.

To provide a conductive ink capable of obtaining good conductive stability even when expanded and contracted.SOLUTION: A conductive ink of the present invention includes silver particles and a resin, and is used for printing on a substrate having at least one of flexibility and stretchability, wherein the silver particles are chain-like, and a crystallite size obtained from powder X-ray diffractometry is 25 nm or more and 37 nm or less.SELECTED DRAWING: None

A composite ceramic substrate and method for producing the same. The composite ceramic substrate includes a ceramic substrate, a circuit board, and a composite adhered structure adhered to the ceramic substrate and the circuit board. The composite adhered structure includes a first active metal layer adhered to the ceramic substrate, a second active metal layer adhered to the circuit board, and a solder layer arranged between the first active metal layer and the second active metal layer. The first active metal layer includes titanium hydride. The second active metal layer includes tin, copper, and titanium hydride. The solder layer includes tin, copper, and titanium hydride.

An apparatus (100) for treating a portion of a surface of at least one electrically conductive layer structure (210) of a stack (201) of a printed circuit board or the like (200) is described, where the apparatus (100) comprises a surface treatment unit (120), the surface treatment unit is configured to change at least a portion of the exposed surface of the at least one electrically conductive layer structure (210) along a predetermined multi-profile shape portion (250). Furthermore, a printed circuit board or the like (200) and a method for treating a surface are described.

A printed circuit board (PCB) assembly for electrostatic discharge (ESD) protection is disclosed. The assembly includes a top layer comprising at least one signal track and configured to support at least a portion of a plurality of electronic components mounted thereon. A middle layer disposed beneath the top layer. The middle layer comprises at least one ground tack configured to receive electrostatic discharge currents from adjacent layers. A bottom layer disposed beneath the middle layer. The bottom layer comprising at least one power track and configured to support another portion of the plurality of electronic components. A plurality of metal discharge elements disposed on at least one of the top layer or the bottom layer. Each of the metal discharge element is electrically connected to the at least ground track of the middle layer.

The present invention provides biomolecular glass and its use. The biomolecular glass is obtained by volatilizing a solvent from a solution of biomolecular raw materials, the solution of biomolecular raw materials comprising biomolecular raw materials, a modifier, and a solvent. The biomolecular raw materials include natural amino acids, peptides, amino acid derivatives, peptide derivatives, or mixtures of two or more of the above. The soluble biomolecular glass of the present invention has excellent biocompatibility, high light transmittance, good mechanical strength, flexible processability, and biodegradability, and can be processed into implantable or non-implantable medical materials and / or devices, fillers and stent materials, electronic sensing materials and / or devices, temporary electronic materials and / or devices, etc., and can be decomposed by living organisms or nature, with decomposition products being non-contaminating.

Materials and methods for metallizing target substrates and metallized structures formed according to these methods are provided. The methods generally involve the formation of a conductive seed layer on a target substrate. The conductive seed layer is formed using a conductive ink composition that is converted to a conductive metallic film on the target substrate. The conductive metallic film is then metallized using standard additive techniques such as electroplating. The methods can further include masking and unmasking steps and optional etching of the metallized surface to generate conductive patterned structures. Also provided are metallized structures that comprise a conductive seed layer on the target substrate and a metallized layer on the conductive seed layer. In some cases, the metallized structures are prepared according to the disclosed methods.

The present invention provides a light-transmitting conductive film suitable for reducing resistance and suppressing yellowing, a transparent conductive film equipped with the light-transmitting conductive film, and an article with the transparent conductive film. [Solution] The light-transmitting conductive film 20 contains an indium-containing conductive oxide and includes a first region 21 in at least a portion of its thickness that contains krypton in a content ratio of less than 0.1 atomic percent. The light-transmitting conductive film 20 also contains an indium-containing conductive oxide and includes a second region 22 in at least a portion of its thickness that does not contain krypton.

To provide a wiring circuit board which can be manufactured with simple facilities and processes and can reduce transmission loss, and to provide a method of manufacturing the wiring circuit board.SOLUTION: The wiring circuit board 1 sequentially includes a metal supporting board 2, a metal particle-containing layer 3 containing metal particles 31, an insulating layer 4, and a conductive pattern 5 toward one side in a thickness direction.SELECTED DRAWING: Figure 1

To provide an electroless plating catalyst addition bath capable of obtaining excellent patternability even when skipping the post dip step of causing the non-deposition of electroless plating and capable of achieving both patternability and electroless plating depositability; a method for manufacturing a material to be electroless-plated including a catalyst nucleus using the electroless plating catalyst addition bath; a method for manufacturing a material including an electroless plating film; and the material including the electroless plating film.SOLUTION: An electroless plating catalyst application bath includes a palladium compound and aminocarboxylic acid.SELECTED DRAWING: None

Provided is a roughened copper foil capable of achieving both high adhesiveness with respect to a thermoplastic resin and exceptional high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. In the roughened surface, the surface texture aspect ratio Str is 0.02-0.24, and the load area ratio Smr1 separating protruding peaks from a core portion is 1.0-15.0%. Str and Smr1 are values measured in compliance with ISO 25178 at a cutoff wavelength of 0.251 μm using an S-filter and at a cutoff wavelength of 4.5 μm using an L-filter.

To provide a printed circuit board including a conductor pattern in which delamination hardly occurs when etching a seed metal layer for plating, and such a conductor pattern includes a plurality of fine patterns.SOLUTION: And a conductor pattern including a pattern metal layer disposed on the seed metal layer, wherein the seed metal layer includes a first metal layer including a first metal and a second metal layer disposed on the first metal layer, connected to the pattern metal layer, and including a second metal, and a thickness of the first metal layer is greater than a thickness of the second metal layer, the first metal may be any one selected from the group consisting of aluminum (Al), iridium (Ir), molybdenum (Mo), tungsten (W), cobalt (Co), nickel (Ni), and ruthenium (Ru).SELECTED DRAWING: Figure 3

This application pertains to the field of electrical materials, and discloses an aluminum matrix composite material and a preparation method therefor, and an electronic device. The preparation method includes: performing purification processing on an aluminum-based substrate to obtain a purified aluminum-based substrate; forming a metal protective layer on a surface of the purified aluminum-based substrate to obtain a first composite material intermediate; performing first electroplating processing on the first composite material intermediate, so that the metal protective layer is corroded to form a first metal plating layer on the surface of the aluminum-based substrate and obtain a second composite material intermediate; and performing second electroplating processing on the second composite material intermediate to form a second metal plating layer on a surface of the first metal plating layer and obtain the aluminum matrix composite material. The preparation method can improve compactness and flatness of the plating layers. In addition, the preparation method eliminates a need to introduce another inert precious metal in the preparation process, and achieves advantages such as a simplified operation procedure, convenience, high efficiency, high reliability, and low costs.