275results about "Resistor terminals/electrodes" patented technology

A system includes an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module, the power module including a thermistor assembly, the thermistor assembly including: a conductive layer including a trench; a thermistor connected to the conductive layer and disposed across the trench; and a first height control feature between the conductive layer and the thermistor.

The invention discloses a resistor carrier, a resistor pin bending system and a resistor pin bending method. The resistor carrier comprises a support body which is strip-shaped and has two opposite sides in the width direction of the support body; and the retaining structure is positioned on the top surface of the support body and is used for retaining the resistor body of the resistor. When the resistor body of the resistor is held in the holding structure, a pair of pins of the resistor are suspended above the top surface of the supporting body and extend out of the two sides of the supporting body respectively, so that the pins of the resistor are allowed to be bent relative to the resistor body. According to the resistor pin bending system, automatic bending of the resistor pin can be achieved, the resistor pin bending efficiency is improved, automatic flow line production of electronic products can be achieved, and the production efficiency of the electronic products is greatly improved.

This invention discloses a high-vibration-resistant high-voltage surge arrester, specifically relating to the field of surge arrester technology. It includes a surge arrester body, a buffer assembly, and an adjustment assembly. Through the buffer assembly, this invention can release the blockage of the vent hole when the surge arrester body experiences severe, large-amplitude vibrations. It can adjust the buffer rigidity, allowing the first piston to continue moving downwards for buffering, thus improving the buffering effect. Furthermore, as the first piston moves to the bottom of the first chamber, it gradually blocks the connecting hole, acting as a throttling device, gradually reducing the oil output within the connecting hole. This further slows the descent speed of the first piston, thus providing multi-stage buffering. This prevents buffer failure and impacts under large-amplitude vibrations, further improving the buffering effect and extending the service life of the surge arrester.

The present invention relates to a ceramic substrate (10) having at least one metallization layer (20) on at least one surface (11) and at least one feedline (30) in electrical contact with said metallization layer (20), and an encapsulation structure (40) surrounding said ceramic substrate (10), said at least one metallization layer (20), and a first segment (31) of said at least one feedline (30), said first segment (31) being directly adjacent to said metallization layer (20). a protective layer (50) surrounding the encapsulation structure (40) and a second segment (32) of the at least one supply line (30), the second segment (32) being directly adjacent to the first segment (31); and an insulating layer (60) surrounding the protective layer (50) and a third segment (33) of the supply line (30), the third segment (33) being directly adjacent to the second segment (32). The present invention further provides a method for manufacturing a ceramic element.

The application discloses a voltage-limited overvoltage protection component with a recoverable electromagnetic drive tripping mechanism, which is composed of a voltage-limited overvoltage protector and an electromagnetic drive tripping mechanism. In a normal state, the normally closed contact of the electromagnetic drive tripping mechanism is in a closed state, which does not affect the normal working state of the voltage-limited overvoltage protector and the protection state under a normal intensity overvoltage. When an overvoltage occurs, a pulse current flowing through the voltage-limited pressure-sensitive resistor induces a current in the upper metal disc of the electromagnetic drive tripping mechanism, which is opposite to the direction of the spiral conductor coil of the lower electromagnetic drive disc, so that the upper metal disc of the lower electromagnetic drive mechanism induces an electromagnetic repulsive force with the lower electromagnetic drive disc, thereby causing the normally closed contact of the electromagnetic drive tripping mechanism to break, effectively inhibiting the continuous effect of a subsequent power frequency or direct current arc on the voltage-limited protector, prolonging the service life of the voltage-limited overvoltage protection component, and effectively realizing the safe use coefficient and prolonging the service life of the voltage-limited overvoltage protection component.

In some embodiments, the multilayer electrical device may have a plurality of electrodes connected to respective terminals, with at least two specific terminals configured to allow relative movement with respect to one another to accommodate changes in the separation distance of each electrode due to temperature changes and to allow solder to provide a connection between the multilayer electrical device and the mounting surface when the multilayer electrical device is soldered onto the mounting surface. In some embodiments, the multilayer electrical device may further include a layer having a temperature dependent electrical property mounted between each of an adjacent pair of electrodes.

An electrical device is specified. According to one embodiment, an electrical device includes an electrical element including two electrodes and two wires connected to the electrodes, where each wire includes a flat region constituting a wire end, and where the flat region is configured for contacting the electrodes. The invention further relates to a method for producing an electrical device.

The invention provides a thermosensitive resistor and a manufacturing method. The thermosensitive resistor comprises a substrate, electrodes and a protective layer, the matrix is prepared from a nano-scale ceramic powder and high-molecular polymer composite material, the nano-scale ceramic powder is uniformly dispersed in a high-molecular polymer, and the high-molecular polymer is polyimide; the electrode is made of an alloy material composed of silver, palladium and rare earth elements, and the electrode is deposited on the surface of the base body through the physical vapor deposition technology. The protective layer wraps the surfaces of the base body and the electrodes, the protective layer is composed of a multi-layer composite material, and the multi-layer composite material comprises an inner layer, a middle layer and an outer layer. Compared with a traditional product, the size is greatly reduced, the development requirement for miniaturization of electronic equipment is met, meanwhile, the layering failure problem caused by thermal expansion under large-current impact is effectively prevented, and the stability of product performance is guaranteed.

The present invention provides resistors having various arrangements of conductive parts and resistive elements, current sensing resistors, battery shunt resistors, and shunt resistors. [Solution] The resistor 610 has one or more resistive elements 611 and a plurality of conductive parts 612, 614. Openings or slots 672, 676 are formed within the resistive elements in a configuration that allows adjustment of the resistor's TCR (temperature coefficient of resistance). The shape, number, and orientation of the openings or slots are variable. In one embodiment, a header member is provided to fix or hold pins to the resistor.

The invention discloses a chip thermistor. The chip thermistor comprises a ceramic body, a coating layer, two external electrodes and a plurality of internal electrodes, the ceramic body comprises a plurality of ceramic layers which are stacked in the first direction, the outer surface of the ceramic body is coated with the coating layer, and the two external electrodes are arranged on the ceramic body. The internal electrode is disposed in the ceramic body, and the surface area S1 on the ceramic layer and the surface area S of the ceramic layer satisfy 0.1 S < = S1 < = 0.5 S. According to the area proportion design, the electrical yield is guaranteed, meanwhile, an enough ceramic matrix bonding area is reserved, and the cracking risk can be reduced. Meanwhile, the coating layer can serve as a protective barrier to block electroplating liquid and water vapor, the corrosion and overplating phenomena are effectively improved, and the structural strength of the device is improved. In addition, the invention also discloses electronic equipment with the chip thermistor.

The application provides a temperature sensor and a manufacturing method thereof. The manufacturing method of the temperature sensor comprises the following steps: sleeving a first hot-melt sleeve on the wire skin surface of a plurality of wires respectively, and the first hot-melt sleeve is slidably connected with the corresponding wire; connecting a plurality of pins of a thermistor with the wire core of the plurality of wires one by one, welding another part of the connecting area of the wire core and the pin to form a welding area; sliding the first hot-melt sleeve so that the first hot-melt sleeve is sleeved on the welding area, and sleeving a second hot-melt sleeve on the outside of the thermistor; sleeving a heat-shrinkable sleeve on the outside of the second hot-melt sleeve and the first hot-melt sleeve, performing first heat treatment, so that the second hot-melt sleeve and the plurality of first hot-melt sleeves are fused into a hot-melt layer, the heat-shrinkable sleeve is shrunk, the inner surface of the heat-shrinkable sleeve is fused into the hot-melt layer, and a temperature sensor is formed. The application can improve the sealing performance of the joint between the wire and the thermistor, and further improve the reliability and service life of the temperature sensor.

To suppress the occurrence of cross talk.SOLUTION: A laminated varistor 1 comprises: a sintered body 2; and a first inner electrode E1, a second inner electrode E2, a third inner electrode E3, and a fourth inner electrode E4 that are provided inside the sintered body 2. The first inner electrode E1, the second inner electrode E2, the third inner electrode E3, and the fourth inner electrode E4 are arranged in order of the first inner electrode E1, the third inner electrode E3, the fourth inner electrode E4, and the second inner electrode E2 from a first main surface side. The third inner electrode E3 and the fourth inner electrode E4 are electrically connected each other. In view from a third direction, at least one part of the first inner electrode E1 and at least one part of the third inner electrode E3 are overlapped. In a view of the third direction, at least a part of the second inner electrode E2 and at least a part of the fourth inner electrode E4 are overlapped each other.SELECTED DRAWING: Figure 1

A surge protective device (SPD) module (100) includes a printed circuit board (PCB) (150), a first electrode (122), a second electrode (124), and a disc varistor (140) electrically connected between the first and second electrodes. The SPD module forms a housing assembly (121) defining a chamber (123) containing the varistor. The PCB forms a portion of the housing assembly.

The utility model discloses a low-temperature-resistant shunt resistor assembly which comprises a resistor body, an input side wire connector, an output side wire connector and two substrates, one end of the resistor body is electrically connected with the input side wire connector, the other end of the resistor body is electrically connected with the output side wire connector, one substrate is connected into a gap between the resistor body and the input side wire connector, and the other substrate is connected into a gap between the resistor body and the output side wire connector; the resistor body comprises two T-shaped blocks and a plurality of groups of sheet-shaped resistors which are distributed at equal intervals, one side of each sheet-shaped resistor is connected to one T-shaped block, and the other side of each sheet-shaped resistor is connected to the other T-shaped block. The low-temperature-resistant shunt resistor assembly disclosed by the utility model has the beneficial effects that the substrate can bear and conduct deformation of the resistor body caused by temperature change in high and low temperature environments, so that the influence of the temperature change on the performance of the chip resistor is reduced.

The invention discloses a resistor manufacturing method and a resistor. The manufacturing method comprises the following steps: forming a metal coating on the upper surface of a metal substrate through a cold spraying process; carrying out an annealing process; and performing a first calendaring process to obtain an electrode coating, wherein the reduction rate of the first calendaring process is greater than or equal to 0 and less than 10%.

A ceramic thermosensitive element comprises a ceramic body, an inner electrode layer, an interconnection structure and a packaging layer. The inner electrode layer is provided with a first inner electrode layer and a second inner electrode layer which respectively cover the upper surface and the lower surface of the ceramic body. The interconnection structure is provided with a first interconnection structure and a second interconnection structure which are respectively connected with the first inner electrode layer and the second inner electrode layer and extend to the lower part of the second inner electrode layer. The packaging layer wraps the ceramic body, the inner electrode layer and the interconnection structures, so that part of the first interconnection structures and part of the second interconnection structures are located on the lower side of the packaging layer.

The utility model discloses an aluminum shell resistor, which belongs to the related field of resistor processing technology, and comprises an aluminum shell and a porcelain base body, the porcelain base body is fixedly arranged at the middle position of the inner side of the aluminum shell, screw rods are fixedly arranged at the middle positions of the outer surfaces of the two ends of the porcelain base body, and connecting sheets are arranged between the aluminum shell and the screw rods. The screw rod is installed in the middle of the connecting piece in a penetrating mode, and quartz sand is filled between the aluminum shell and the porcelain base body. Cylindrical mica blocks are installed on the inner sides of the two ends of the porcelain base body, one end of the screw penetrates through the middle positions of the cylindrical mica blocks, and a mica plug is installed on the inner side of the aluminum shell. A traditional wire body connecting structure is replaced, so that the resistor core is in a stable and centered state, the insulation performance of the resistor core is improved, the phenomenon that the lead is damaged in the production and transfer process is avoided, the problem that the withstand voltage is reduced due to the fact that the resistor core moves in the production process is solved, and the withstand voltage performance is improved.

A method for producing oxidation-resistant base metals and alloys using high temperature sintering under air is provided. [Solution] The electrode material of the existing thick film printing is completely changed from precious metal to base metal, and when using base metal instead of precious metal to avoid oxidation of metal, high temperature sintering is not required under reducing atmosphere, but the method of the present invention uses a very cheap base metal or alloy, uses a cheap process, does not oxidize, can be sintered at high temperature under air, and maintains excellent electrical properties. That is, since base metal material can be used instead of precious metal material, there is no need to purchase new equipment, and material costs are greatly reduced.

The invention provides a lightning arrester core fixed based on an insulating rod and an assembly method thereof, which are used for solving various problems of a traditional metal oxide lightning arrester core. According to the lightning arrester core body fixed based on the insulating rods, the first groove and the second groove are matched and clamped with the Y-shaped clamping heads at the two ends of the insulating rods, and the core body is fixed through the plurality of insulating rods, so that the additional arrangement of structures such as an insulating cylinder is avoided, and the volume of the lightning arrester core body is reduced; meanwhile, the axial displacement of the insulating rod in the assembling and using processes is effectively avoided, so that the close contact among a plurality of resistor discs is ensured; compared with the prior art, the resistor discs pressed in a Y-shaped clamping mode are higher in stability, the plurality of resistor discs are in closer contact and do not generate gaps, and when the outer sides of the resistor discs are directly wrapped with the rubber jackets, rubber is not prone to permeating into the space between every two adjacent resistor discs.

The invention relates to the technical field of circuit protection components, in particular to a surface-mounted polymer PTC (Positive Temperature Coefficient) over-current protection component, which comprises a PTC core material, the plastic packaging layer wraps the PTC core material; the rewiring layer is arranged in the plastic packaging layer and is electrically connected with the conductive electrode of the PTC core material; the buried hole is formed in the plastic package layer; the bonding pads comprise a first bonding pad and a second bonding pad, and the first bonding pad and the second bonding pad are arranged outside the plastic packaging layer; the rewiring layer and the buried hole are combined to form an electrical connection path, and the bonding pad is electrically connected with the conductive electrode of the PTC core material through the electrical connection path. According to the invention, the rewiring layer and the buried hole are combined to form an electrical path, the traditional mode of directly manufacturing a bonding pad on an electrode is replaced, the dependence on the processing precision is reduced, the production yield is obviously improved, the cost is reduced, the electrical connection bottleneck of a miniaturized plastic package structure is overcome, and the overcurrent protection of the element is stably realized in a smaller size.

The invention relates to the technical field of electronic components, in particular to a high-moisture-proof multi-layer resistor and a preparation method of the high-moisture-proof multi-layer resistor. The resistor comprises an aluminum oxide substrate, a front electrode, a back electrode and a resistance layer between the front electrode and the back electrode; a first protective layer made of glass, a second protective layer which correspondingly covers the laser cutting line groove and is made of thermosetting ink, a third protective layer and a fourth protective layer which are made of at least two layers of epoxy resin, and a fifth protective layer which is positioned at the lap joint of the electrode and the protective layer and is made of resin silver are sequentially laminated on the resistive layer; the outer side of the electrode is provided with a nickel-plated layer and a tin-plated layer which extends and is lapped to the surface of the fourth protective layer; the preparation method comprises the steps of printing and sintering each functional layer and forming each protective layer in a targeted manner. According to the invention, through a multi-layer synergetic sealing structure, especially enhanced protection of a laser groove and an electrode interface, and epitaxial lap joint of a metal coating, excellent moisture resistance, long-term electrical stability and high reliability are realized, and the device is suitable for a harsh environment.

The utility model provides a vertically-installed series-connected resistor unit and a circuit breaker closing resistor structure, belonging to the field of circuit breakers, the vertically-installed series-connected circuit breaker closing resistor structure comprises at least two tank bodies, each tank body is internally provided with a vertically-installed series-connected resistor unit, all the resistor units which are vertically installed and connected in series are sequentially connected in series through an elastic electric connection module, the lower end of a cross-core insulating rod in each resistor unit which is vertically installed and connected in series is fixedly connected with a lower side conductor, and the upper end of the cross-core insulating rod sequentially penetrates through a conductive cushion block, a resistor disc, a conductive fixing plate and a first conductive spring from bottom to top and then is fixed to an upper side conductor. And all the resistor discs are spirally arranged and are sequentially connected in series through conductive pieces. The closing resistor structure has the beneficial effects that the hidden danger of deflection deformation of the cross-core insulating rod caused by the gravity of the resistor disc is eliminated, so that the reliability of the whole closing resistor structure is improved.

This utility model belongs to the field of electrical equipment technology and discloses a varistor and a surge protector. The varistor includes a varistor resistor, a first electrode, a second electrode, and a third electrode. The first electrode includes a first connecting portion and a first contact portion connected together. The second electrode includes a second connecting portion and a second contact portion connected together. The first and second contact portions are fixedly attached to opposite sides of the varistor resistor. The third electrode includes a third connecting portion disposed between the first and second connecting portions. The first connecting portion is provided with a positioning head for positioning the second and third connecting portions. The surge protector includes the aforementioned varistor. The varistor and surge protector provided by this utility model can achieve reliable positioning between multiple electrodes without the need for an external positioning structure, reducing production costs, improving production efficiency, ensuring accurate and reliable positioning after welding, and ensuring good conductivity.

To provide a method of easily, accurately and efficiently adjusting a temperature coefficient of resistance of a current sense resistor and a shunt resistor, and the resistors.SOLUTION: A resistor 10 has one or more resistive elements 11, 13 and a plurality of conductive portions 12, 14, 16. Openings or slots 72 allowing adjustment of temperature coefficient of resistance (TCR) values of the resistor are formed adjacently to a second side, namely an inner side 20, of the first conductive portion 12. The shape, quantity and orientation of the openings or slots can vary. In one aspect, header members 80a, 80b are provided for securing or holding pins 84 relative to the resistor.SELECTED DRAWING: Figure 1

A stereoscopic arch ignitor resistor and manufacturing method thereof are provided. The stereoscopic arch ignitor resistor includes a substrate, an alloy layer, a combustible material accommodating portion, and a lateral conductive layer. The alloy layer is disposed on a first surface of the substrate. The alloy layer includes an arch lead, a first connecting portion, and a second connecting portion. The combustible material accommodating portion is positioned between the arched lead and the substrate. The arch lead defines a volume of combustible material of the combustible material accommodating portion. The lateral conductive layer is disposed on the alloy layer. The lateral conductive layer abuts against a side surface of the substrate. The stereoscopic arch-type ignition resistance element is configured to reduce ignition distance and / or increase contact area with combustible material.

The present disclosure provides a laminated ceramic sintered body substrate for electronic devices, an electronic device, a chip resistor, and a method for manufacturing a chip resistor. The laminated ceramic sintered body substrate for electronic devices includes a ceramic sintered body substrate and a planarization film provided on an upper surface of the ceramic sintered body substrate, the planarization film containing a thermally conductive filler.

The invention discloses a miniature low-resistance thick-diaphragm thermistor and a resistance value adjusting method thereof, and belongs to the technical field of production of thick-diaphragm thermistors. The miniature low-resistance thick diaphragm type thermistor comprises a ceramic substrate, a thermistor layer, a first end electrode, a second end electrode, a first interdigital electrode layer, a second interdigital electrode layer and a top electrode layer, wherein the first interdigital electrode layer, the second interdigital electrode layer and the top electrode layer are made of electric conductor materials; according to the resistance value adjusting method, the resistance value of the horizontal branch and the resistance value of the vertical branch are calculated firstly, and then the resistance value of the miniature low-resistance thick-diaphragm thermistor is calculated. According to the invention, the interdigital electrode layer and the top electrode layer are connected with the thermistor layer and are used as resistance adjusting assemblies, so that the low-resistance function and the resistance adjusting function of the thick film type thermistor are greatly realized through structure adjustment, and the use amount of noble metal can be reduced, so that the cost is reduced, and the product volume is reduced; and finally, the comprehensive functions of miniaturization, low resistance, low cost and convenience in resistance value adjustment are realized at the same time.

The flame-retardant piezoresistor assembly comprises a base, a fixed conducting strip, an elastic conducting strip and a piezoresistor chip, a first piezoresistor conducting electrode and a second piezoresistor conducting electrode are arranged at the two ends of the piezoresistor chip respectively, and the lower end of the fixed conducting strip is fixed to the base; the upper end of the fixed conducting strip is connected with the first piezoresistor conducting electrode, the lower end of the elastic conducting strip is fixed on the base, and the elastic conducting strip has outward elastic force, so that the upper end of the elastic conducting strip is not connected with the second piezoresistor conducting electrode in a natural state that the lower end of the elastic conducting strip is fixed on the base; the upper end of the elastic conducting strip is connected with the second piezoresistor conducting electrode through metal welding, so that when the piezoresistor chip is in thermal runaway, the welding metal is melted, the elastic conducting strip rebounds outwards and is separated from the second piezoresistor conducting electrode, the electric connection between the piezoresistor chip and the second piezoresistor conducting electrode is cut off, and the piezoresistor chip stops heating in a power-off state; and the fire risk caused by ignition of the potting glue is avoided.

A system includes an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module, the power module including a thermistor assembly, the thermistor assembly including: a ceramic substrate; a thermistor element on the ceramic substrate; a protective coating disposed on the thermistor element so that the thermistor element is between the protective coating and the ceramic substrate; and a terminal electrode on the ceramic substrate, wherein an angle between a surface of the terminal electrode facing the protective coating and a surface of the protective coating facing the terminal electrode is greater than 90 degrees.