470results about "Resistor terminals/electrodes" patented technology

The utility model provides a leveled resistor element, which comprises a substrate, a resistor layer and an electrode layer, solves the problems of impedance increase and abnormal product characteristics caused by improper joint of an interface between the electrode layer and the resistor layer, and comprises the following steps of: after the electrode layer process is finished, forming the resistor layer on the substrate; and laser or grinding is utilized to eliminate the height difference of the interface and process the discontinuous structure of the outline of the electrode layer.

To improve the solderability of an electrode, in a strain gauge using as a resistor a material containing Cr (chromium) or Ni (nickel).SOLUTION: A strain gauge includes: a flexible base material made of resin; a functional layer formed directly on one surface of the base material and made of a metal, an alloy, or a metal compound; a resistor containing α-Cr as a main component, formed directly on one surface of the functional layer and made of a film containing Cr, CrN, and Cr2 N; and an electrode electrically connected to the resistor. The functional layer has a function of promoting crystal growth of the α-Cr to form a film containing the α-Cr as a main component. The resistor has a thickness of 0.05 μm or more and 2 μm or less, and the functional layer has a thickness of 1 nm or more and 100 nm or less. The electrode includes: a terminal portion extending from an end part of the resistor; a first metal layer formed on the terminal portion and made of copper, a copper alloy, nickel, or a nickel alloy; and a second metal layer formed on the first metal layer and made of a material more excellent in solder wettability than the first metal layer.SELECTED DRAWING: Figure 2

A system includes an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module, the power module including a thermistor assembly, the thermistor assembly including: a conductive layer including a trench; a thermistor connected to the conductive layer and disposed across the trench; and a first height control feature between the conductive layer and the thermistor.

The invention discloses a resistor carrier, a resistor pin bending system and a resistor pin bending method. The resistor carrier comprises a support body which is strip-shaped and has two opposite sides in the width direction of the support body; and the retaining structure is positioned on the top surface of the support body and is used for retaining the resistor body of the resistor. When the resistor body of the resistor is held in the holding structure, a pair of pins of the resistor are suspended above the top surface of the supporting body and extend out of the two sides of the supporting body respectively, so that the pins of the resistor are allowed to be bent relative to the resistor body. According to the resistor pin bending system, automatic bending of the resistor pin can be achieved, the resistor pin bending efficiency is improved, automatic flow line production of electronic products can be achieved, and the production efficiency of the electronic products is greatly improved.

This invention discloses a high-vibration-resistant high-voltage surge arrester, specifically relating to the field of surge arrester technology. It includes a surge arrester body, a buffer assembly, and an adjustment assembly. Through the buffer assembly, this invention can release the blockage of the vent hole when the surge arrester body experiences severe, large-amplitude vibrations. It can adjust the buffer rigidity, allowing the first piston to continue moving downwards for buffering, thus improving the buffering effect. Furthermore, as the first piston moves to the bottom of the first chamber, it gradually blocks the connecting hole, acting as a throttling device, gradually reducing the oil output within the connecting hole. This further slows the descent speed of the first piston, thus providing multi-stage buffering. This prevents buffer failure and impacts under large-amplitude vibrations, further improving the buffering effect and extending the service life of the surge arrester.

The present invention relates to a ceramic substrate (10) having at least one metallization layer (20) on at least one surface (11) and at least one feedline (30) in electrical contact with said metallization layer (20), and an encapsulation structure (40) surrounding said ceramic substrate (10), said at least one metallization layer (20), and a first segment (31) of said at least one feedline (30), said first segment (31) being directly adjacent to said metallization layer (20). a protective layer (50) surrounding the encapsulation structure (40) and a second segment (32) of the at least one supply line (30), the second segment (32) being directly adjacent to the first segment (31); and an insulating layer (60) surrounding the protective layer (50) and a third segment (33) of the supply line (30), the third segment (33) being directly adjacent to the second segment (32). The present invention further provides a method for manufacturing a ceramic element.

To provide a chip resistor having lower electric resistance and more stable quality.SOLUTION: The chip resistor 1 includes a metallic resistor 10, a first plated electrode 21, and a second plated electrode 22. The metal resistor 10 includes a first bottom plate portion 11, a second bottom plate portion 12, a top plate portion 13, a first inclined leg portion 14, and a second inclined leg portion 15. The first plating electrode 21 is disposed on the bottom surface of the first bottom plate portion 11, the bottom surface of the first inclined leg portion 14, and the bottom surface of the top plate portion 13. The second plating electrode 22 is disposed on the bottom surface of the second bottom plate portion 12, the bottom surface of the second inclined leg portion 15, and the bottom surface of the top plate portion 13.SELECTED DRAWING: Figure 3

The application discloses a voltage-limited overvoltage protection component with a recoverable electromagnetic drive tripping mechanism, which is composed of a voltage-limited overvoltage protector and an electromagnetic drive tripping mechanism. In a normal state, the normally closed contact of the electromagnetic drive tripping mechanism is in a closed state, which does not affect the normal working state of the voltage-limited overvoltage protector and the protection state under a normal intensity overvoltage. When an overvoltage occurs, a pulse current flowing through the voltage-limited pressure-sensitive resistor induces a current in the upper metal disc of the electromagnetic drive tripping mechanism, which is opposite to the direction of the spiral conductor coil of the lower electromagnetic drive disc, so that the upper metal disc of the lower electromagnetic drive mechanism induces an electromagnetic repulsive force with the lower electromagnetic drive disc, thereby causing the normally closed contact of the electromagnetic drive tripping mechanism to break, effectively inhibiting the continuous effect of a subsequent power frequency or direct current arc on the voltage-limited protector, prolonging the service life of the voltage-limited overvoltage protection component, and effectively realizing the safe use coefficient and prolonging the service life of the voltage-limited overvoltage protection component.

The utility model relates to the technical field of thermistors, and discloses a high-corrosion-resistance thermistor which comprises a resistor body, a lead is arranged on the lower surface of the resistor body, a protective shell is arranged on the side wall of the resistor body, a sealing cover is arranged on the lower surface of the resistor body, and a fixing assembly is arranged on the side wall of the sealing cover. A sealing assembly is arranged on the upper surface of the sealing cover, the fixing assembly comprises a fixing block, the side wall of the fixing block is fixedly connected to the side wall of the sealing cover, a clamping sleeve is fixedly connected to the side wall of the protective shell, a first clamping groove is formed in the clamping sleeve, an elastic plate is fixedly connected to the upper surface of the fixing block, and a clamping block is fixedly connected to the side wall of the elastic plate. The sealing assembly comprises a mounting block, and the side wall of the mounting block is fixedly connected to the upper surface of the sealing cover. According to the utility model, the elastic plate slides into the clamping sleeve, so that the clamping block is clamped with the clamping groove I, the fixing effect is achieved, and the practicability of the equipment is improved through the structure.

In some embodiments, the multilayer electrical device may have a plurality of electrodes connected to respective terminals, with at least two specific terminals configured to allow relative movement with respect to one another to accommodate changes in the separation distance of each electrode due to temperature changes and to allow solder to provide a connection between the multilayer electrical device and the mounting surface when the multilayer electrical device is soldered onto the mounting surface. In some embodiments, the multilayer electrical device may further include a layer having a temperature dependent electrical property mounted between each of an adjacent pair of electrodes.

The invention relates to a ceramic component, comprising: a ceramic base body (10) having at least one metallization (20) on at least one surface (11) of the base body and at least one feed line (30) in electrical contact with the metallization (20); an encapsulation (40) surrounding the ceramic base body (10), the at least one metallization (20), and a first sub-section (31) of the at least one feed line (30), the first sub-section (31) directly adjoining the metallization (20); a protective layer (50) surrounding the encapsulation (40) and a second sub-section (32) of the at least one feed line (30), the second sub-section (32) directly adjoining the first sub-section (31); and an insulating layer (60) surrounding the protective layer (50) and the third sub-section (33) of the feed line (30), the third sub-section (33) directly adjoining the second sub-section (32). A method for producing a ceramic component is also described.

An electrical device is specified. According to one embodiment, an electrical device includes an electrical element including two electrodes and two wires connected to the electrodes, where each wire includes a flat region constituting a wire end, and where the flat region is configured for contacting the electrodes. The invention further relates to a method for producing an electrical device.

The present application provides a resistor for detecting current and a power supply device.SOLUTION: The resistor for detecting current comprises a middle portion, and a first end portion and a second end portion respectively connected to the middle portion, wherein the middle portion comprises a middle portion body including a first side surface and a second side surface opposite to each other, the first end portion and the second end portion are respectively connected to a first extension portion and a second extension portion extending from the middle portion body, the first testing end portion is connected to the first extension portion, and the second testing end portion is connected to the second extension portion. The resistor according to embodiments of the present application reduces the influence of the test contact position on the resistor, and improves the test accuracy while ensuring the connection between the resistor and the voltage testing device.SELECTED DRAWING: Figure 1

The invention discloses a sintering process and a production process of a zinc oxide ring varistor, a newly purchased sagger is coated with slurry or placed into a sintering furnace for degumming sintering or placed into the sintering furnace for empty sintering after powder scattering and three to ten rounds of treatment, the sagger can be directly placed, coating or powder scattering is not needed, and the sagger can be repeatedly used for at least 30 times; the situation that the ceramic chip is adhered to the inner wall of the sagger is avoided, and yellowing is also avoided; according to the sheet placing mode, the negative influence on blank sheet breakage in the operation process from blank sheet forming to sintering furnace entering is minimized; after the supporting shaft is pulled out, the bunched axial middle shaft through holes are beneficial to thorough glue discharging, the semi-conducting process is benign, and the thoroughness of glue discharging and the consistency of performance are guaranteed; the production efficiency is improved, the production cost is reduced, and meanwhile, resources are fully utilized.

Provided is a copper-manganese-nickel based alloy having characteristics (in particular, specific resistance) close to those of a nickel-chromium based alloy. It is also an objective to provide an alloy having high processability compared to a nickel-chromium based alloy. An alloy for a resistive body includes copper, manganese, and nickel, wherein the manganese is 33 to 38% by mass, and the nickel is 8 to 15% by mass.

The invention provides a thermosensitive resistor and a manufacturing method. The thermosensitive resistor comprises a substrate, electrodes and a protective layer, the matrix is prepared from a nano-scale ceramic powder and high-molecular polymer composite material, the nano-scale ceramic powder is uniformly dispersed in a high-molecular polymer, and the high-molecular polymer is polyimide; the electrode is made of an alloy material composed of silver, palladium and rare earth elements, and the electrode is deposited on the surface of the base body through the physical vapor deposition technology. The protective layer wraps the surfaces of the base body and the electrodes, the protective layer is composed of a multi-layer composite material, and the multi-layer composite material comprises an inner layer, a middle layer and an outer layer. Compared with a traditional product, the size is greatly reduced, the development requirement for miniaturization of electronic equipment is met, meanwhile, the layering failure problem caused by thermal expansion under large-current impact is effectively prevented, and the stability of product performance is guaranteed.

The utility model provides a chip resistor. The chip resistor comprises a substrate, a back electrode, a front electrode, a resistive layer, a protective layer and a side electrode, the protective layer comprises a first protective layer and a second protective layer; the first protective layer is made of a glass material, and the second protective layer is made of at least two layers of epoxy resin materials; a third protective layer is formed on the left electrode and the right electrode which are not covered, and the third protective layer is made of a resin silver material; through a multi-layer protection structure formed by the first protection layer made of the glass material and the second protection layer made of the epoxy resin material, invasion of moisture, chemical corrosion and mechanical damage is effectively prevented, the service life of the resistor in a severe environment is remarkably prolonged, and particularly, through the third protection layer made of the resin silver material, the service life of the resistor is prolonged. The anti-corrosion performance of the electrode part is enhanced, so that the resistor can keep stable electrical performance during long-time work.

An electronic component that includes: a base body; wiring inside the base body; a glass film covering an outer surface of the base body; an underlying electrode electrically connected to the wiring and covering a part of the glass film; and a metal layer covering the underlying electrode, wherein the glass film includes an uncovered portion that is not covered with the underlying electrode and separated from an outer edge of the underlying electrode by more than 10 μm, and a boundary portion that is not covered with the underlying electrode and not separated from the outer edge of the underlying electrode by more than 10 μm, and a thickness of the boundary portion is larger than a thickness of the uncovered portion.

The present invention provides resistors having various arrangements of conductive parts and resistive elements, current sensing resistors, battery shunt resistors, and shunt resistors. [Solution] The resistor 610 has one or more resistive elements 611 and a plurality of conductive parts 612, 614. Openings or slots 672, 676 are formed within the resistive elements in a configuration that allows adjustment of the resistor's TCR (temperature coefficient of resistance). The shape, number, and orientation of the openings or slots are variable. In one embodiment, a header member is provided to fix or hold pins to the resistor.

The application relates to the field of high-precision resistor devices, in particular to a film-coated resistor and a processing method thereof. The film-coated resistor comprises a ceramic substrate, the left and right ends of the ceramic substrate are integrally formed with cylindrical parts, a nickel-chromium alloy film is deposited on the ceramic substrate, a sleeve is sleeved on each cylindrical part, and a metal sheet is arranged on each sleeve. The processing method comprises the following steps: S1, ultrasonic cleaning of the ceramic substrate with deionized water to remove oil stains, dust and impurities on the surface, and then drying for standby; S2, placing the nickel-chromium alloy into a storage pot, and fixing the ceramic substrate on four clamping rods in an evaporation box; S3, covering a cover plate on the evaporation box, and performing air extraction on the inside of the evaporation box to form a low-pressure state; and S4, driving a resistance heating ring to heat the nickel-chromium alloy in the storage pot, so that the nickel-chromium alloy evaporates and diffuses in a gaseous form.

The utility model discloses a surface-mounted zinc oxide varistor which comprises a voltage-sensitive ceramic chip, surface electrodes and side electrodes positioned on the upper side and the lower side or the lower side of the surface electrodes are arranged on bosses at the two ends of the voltage-sensitive ceramic chip along the length direction, and the side electrodes are used for adhering and positioning solder paste during reflow soldering, can be horizontally laid on a PCB (Printed Circuit Board) and are prevented from rolling. According to the utility model, the bosses at the two ends of the pressure-sensitive ceramic chip increase the distance between the side electrodes and different side surface electrodes to exceed the shortest distance between the two surface electrodes, so that the problems of short distance and pressure-sensitive voltage drop caused by the side electrodes are avoided; and the pressure-sensitive ceramic chip is provided with a boss height interval when being welded on the PCB so as to prevent solder paste from polluting the ceramic body at the lower side edge.

The invention discloses a chip thermistor. The chip thermistor comprises a ceramic body, a coating layer, two external electrodes and a plurality of internal electrodes, the ceramic body comprises a plurality of ceramic layers which are stacked in the first direction, the outer surface of the ceramic body is coated with the coating layer, and the two external electrodes are arranged on the ceramic body. The internal electrode is disposed in the ceramic body, and the surface area S1 on the ceramic layer and the surface area S of the ceramic layer satisfy 0.1 S < = S1 < = 0.5 S. According to the area proportion design, the electrical yield is guaranteed, meanwhile, an enough ceramic matrix bonding area is reserved, and the cracking risk can be reduced. Meanwhile, the coating layer can serve as a protective barrier to block electroplating liquid and water vapor, the corrosion and overplating phenomena are effectively improved, and the structural strength of the device is improved. In addition, the invention also discloses electronic equipment with the chip thermistor.

The application provides a temperature sensor and a manufacturing method thereof. The manufacturing method of the temperature sensor comprises the following steps: sleeving a first hot-melt sleeve on the wire skin surface of a plurality of wires respectively, and the first hot-melt sleeve is slidably connected with the corresponding wire; connecting a plurality of pins of a thermistor with the wire core of the plurality of wires one by one, welding another part of the connecting area of the wire core and the pin to form a welding area; sliding the first hot-melt sleeve so that the first hot-melt sleeve is sleeved on the welding area, and sleeving a second hot-melt sleeve on the outside of the thermistor; sleeving a heat-shrinkable sleeve on the outside of the second hot-melt sleeve and the first hot-melt sleeve, performing first heat treatment, so that the second hot-melt sleeve and the plurality of first hot-melt sleeves are fused into a hot-melt layer, the heat-shrinkable sleeve is shrunk, the inner surface of the heat-shrinkable sleeve is fused into the hot-melt layer, and a temperature sensor is formed. The application can improve the sealing performance of the joint between the wire and the thermistor, and further improve the reliability and service life of the temperature sensor.

Provided is a multilayer ceramic electronic component provided with a pair of spacers connected to external electrodes for preventing "acoustic noise", wherein the bonding strength between the pair of spacers and a multilayer ceramic capacitor is increased and detachment of the spacers is suppressed.　A multilayer ceramic electronic component 100 according to the present invention comprises: a multilayer ceramic capacitor including a laminate body 12 and two external electrodes 30; a first spacer 52 connected to a first external electrode 30a; a second spacer 54 connected to a second external electrode 30b; and a third spacer 56 disposed between the first spacer 52 and the second spacer 54. The laminate body 12 has a second surface that is a surface on a mounting surface S side. When viewed in a direction perpendicular to the mounting surface S, the third spacer 56 covers the first spacer 52.

To suppress the occurrence of cross talk.SOLUTION: A laminated varistor 1 comprises: a sintered body 2; and a first inner electrode E1, a second inner electrode E2, a third inner electrode E3, and a fourth inner electrode E4 that are provided inside the sintered body 2. The first inner electrode E1, the second inner electrode E2, the third inner electrode E3, and the fourth inner electrode E4 are arranged in order of the first inner electrode E1, the third inner electrode E3, the fourth inner electrode E4, and the second inner electrode E2 from a first main surface side. The third inner electrode E3 and the fourth inner electrode E4 are electrically connected each other. In view from a third direction, at least one part of the first inner electrode E1 and at least one part of the third inner electrode E3 are overlapped. In a view of the third direction, at least a part of the second inner electrode E2 and at least a part of the fourth inner electrode E4 are overlapped each other.SELECTED DRAWING: Figure 1

The invention relates to a method for producing a resistor device (2) having contacts (5, 5 '), said method comprising the following steps: a) providing a resistor device (2) comprising at least one material; b) inserting a tool (9) into the material of the resistor device (2) on a machining side (21) of the resistor device (2) or on an end face (22) of the resistor device (2) adjoining the machining side (21); c) partially separating the material from the layer of material located on the processed side (21) of the resistor device (2) such that at least one material projection (50, 50 ') is formed on the processed side (21) of the resistor device (2), which material projection remains integrally connecting the material of the resistor device (2) in the connection region (51, 51') and which material projection has a free end (52, 52 ') located radially opposite the connection region (51, 51'); d) bending the material projection (50, 50 ') into an upright position, thereby forming a contact (5, 5') for tapping an electrical signal. The invention also relates to a resistor arrangement with a contact element.

A surge protective device (SPD) module (100) includes a printed circuit board (PCB) (150), a first electrode (122), a second electrode (124), and a disc varistor (140) electrically connected between the first and second electrodes. The SPD module forms a housing assembly (121) defining a chamber (123) containing the varistor. The PCB forms a portion of the housing assembly.

The utility model discloses a low-temperature-resistant shunt resistor assembly which comprises a resistor body, an input side wire connector, an output side wire connector and two substrates, one end of the resistor body is electrically connected with the input side wire connector, the other end of the resistor body is electrically connected with the output side wire connector, one substrate is connected into a gap between the resistor body and the input side wire connector, and the other substrate is connected into a gap between the resistor body and the output side wire connector; the resistor body comprises two T-shaped blocks and a plurality of groups of sheet-shaped resistors which are distributed at equal intervals, one side of each sheet-shaped resistor is connected to one T-shaped block, and the other side of each sheet-shaped resistor is connected to the other T-shaped block. The low-temperature-resistant shunt resistor assembly disclosed by the utility model has the beneficial effects that the substrate can bear and conduct deformation of the resistor body caused by temperature change in high and low temperature environments, so that the influence of the temperature change on the performance of the chip resistor is reduced.

The utility model provides an electronic device capable of adjusting resistance, which belongs to the technical field of rheostats and comprises two mounting seats and a plurality of wiring components arranged on the mounting seats, and mounting sleeves are mounted on the outer walls of one sides of the mounting seats. According to the utility model, the lamp bead arranged on the wiring assembly is conducted when the position is wired, the path of current is judged by judging the lightening position of the lamp bead, meanwhile, when the sliding block is moved to adjust the resistance value of the resistor, the change of the resistance value can be intuitively reflected through the brightness of the lamp bead, and meanwhile, the direction of the current can be judged; according to the utility model, students can intuitively judge the current direction when the slide rheostat demonstrates and the current change when the slide rheostat changes, the teaching efficiency is improved, the arranged sliding sleeve is matched with the positioning sleeve to protect and fix the wire clamp in the process of conducting the lamp bead by wiring, the wire clamp connection position is prevented from loosening in the demonstration process, and the teaching quality is improved. Therefore, the stability of the demonstration process is improved.

The invention discloses a resistor manufacturing method and a resistor. The manufacturing method comprises the following steps: forming a metal coating on the upper surface of a metal substrate through a cold spraying process; carrying out an annealing process; and performing a first calendaring process to obtain an electrode coating, wherein the reduction rate of the first calendaring process is greater than or equal to 0 and less than 10%.