1434results about "Resistor terminals/electrodes" patented technology

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and / or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes and anchor tabs are exposed along the periphery of the electronic component in respective groups. Each exposed portion is within a predetermined distance from other exposed portions in a given group such that termination structures may be formed by deposition and controlled bridging of a thin-film plated material among selected of the exposed internal conductive elements. Electrolytic plating may be employed in conjunction with optional cleaning and annealing steps to form directly plated portions of copper, nickel or other conductive material. Once an initial thin-film metal is directly plated to a component periphery, additional portions of different materials may be plated thereon.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

A method of making resistors includes providing a sacrificial layer. Conductive material is then formed over a region of the sacrificial layer. Resistive material is then deposited over the first surface of the sacrificial layer such that the resistive material covers the sacrificial layer and the conductive material. A portion of the sacrificial layer is then removed to expose the conductive material. A method of making resistors includes the steps of providing a sacrificial layer, removing at least a portion of the sacrificial layer from regions of the sacrificial layer so as to create a plurality of cavities within the sacrificial layer, plating said cavities with a conductive material, disposing resistive material over the first surface of the sacrificial layer such that resistive material covers the sacrificial layer and said conductive material, and removing at least a portion of said sacrificial layer to expose the conductive material. In another embodiment, a method of making resistors includes the steps of providing a sacrificial layer having a roughened first surface and a second surface, depositing resistive material over the first surface of the sacrificial layer such that the resistive material covers the first surface of the sacrificial layer, and selectively etching the sacrificial layer to form electrodes.

The present invention relates to a novel thermal-sensitive resistive apparatus, such as PTC and NTC, which allocates planar electrode films on the top and bottom surfaces of a prior art thermal-sensitive resistive apparatus, such as a PTC apparatus, to laminate with an outer electrode layer. A plurality of interconnection vias are electroplated with conductive material to connect to any plane. It is convenient to surface mount the apparatus of the present invention on a printed circuit board. The present invention can largely increase the dimensional stability of components and overcome the disadvantage that thermal diffusion of the prior are surface mounted resistive apparatus is affected easily by line width and environments.

The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave / convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.

A driver can intuitively and conveniently perform an operation for instructing passing to a vehicle. In a driving support device 10, an image output unit 14a outputs, to a display unit 31, an image containing an own vehicle object representing an own vehicle and an another vehicle object representing another vehicle in front of the own vehicle object. An operation signal input unit 14b receives an operation of a user for changing the positional relationship between the own vehicle object and the another vehicle object in the image displayed on the display unit 31. A command output unit 14c outputs, to an automatic driving control unit 20, a command for instructing the own vehicle to pass the another vehicle when the positional relationship between the own vehicle object and the another vehicle object is changed such that the own vehicle object is positioned in front of the another vehicle object.

An EMI filter capacitor assembly and implantable passive electronic network components utilize biocompatible and non-migratable materials to adapt the electronic components for direct body fluid exposure. The assembly includes a capacitor having first and second sets of electrode plates which are constructed of non-migratable biocompatible material. A conductive hermetic terminal of non-migratable and biocompatible material adjacent to the capacitor is conductively coupled to the second set of electrode plates. One or more conductive terminal pins having at least an outer surface of non-migratable and biocompatible material are conductively coupled to the first set of electrode plates, while extending through the hermetic terminal in non-conductive relation. The terminal pins may be in direct contact with the first set of electrode plates, or in contact with a termination surface of conductive connection material. The termination surface is also constructed of non-migratable and biocompatible materials.

A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. A socket substrate is provided with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are attached to the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pads to electrically and mechanically couple the electrical interconnect to the PCB.

A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave / convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.

An electronic component includes an electronic element including external electrodes on a surface and a substrate terminal on which the electronic element is mounted. The substrate terminal includes a first main surface, a second main surface opposite the first main surface, and a peripheral surface joining the first main surface and the second main surface. The substrate terminal includes mounting electrodes provided on the second main surface and electrically connected to the external electrodes of the electronic element, and connection electrodes provided on the first main surface and electrically connected to lands of a circuit substrate. A maximum width of the connection electrodes is greater than a maximum width of the mounting electrodes.

A predetermined electrode arrangement (1 / 1, 1 / 2, 1 / 3A, 1 / 6) comprising a plurality of shielded electrodes (213, 215) and a plurality of shielding electrodes (204, 214, 269A, 269B,) that together with other conductive (799, 206, 208, 207, 203, 218, 216, 217, 218) semi-conductive (not shown) and / or non-conductive material elements (212) are formed into a multi-functional energy condition assembly (1-1, 1-2, 1-3A, 1-6) or variant to be selectively coupled into circuitry (4-1, 5-1, 1-2).

Resistance or side electrodes of a chip resistor is prevented from being lost due to chemical reaction with NaCl contained in human sweat and so on when human sweat, seawater, etc. are adhered thereto. The chip resistor comprises an insulating substrate, thick-film upper surface electrodes formed at opposite ends of the top surface of the insulating substrate, a thin-film resistance made of a constituent material not reacting with NaCl, and formed so as to be extended over the upper surface of the insulating substrate and respective portions of the upper surface of the thick-film upper surface electrodes, thick-film back surface electrodes formed at spots on the back surface of the insulating substrate, corresponding to the thick-film upper surface electrodes, respectively, and thick-film side surface electrodes connecting the thick-film back surface electrodes with respective portions of the thick-film upper surface electrodes, exposed out of the thin-film resistance, respectively.

Provided is a shunt resistor which has an excellent accuracy of current detection and a small temperature drift as well as a compact structure, and improves the operability. The shunt resistor is provided with a resistance body (11), a pair of main electrodes (12, 12) separated from the resistance body, and a pair of voltage detection electrodes (13, 13) separated from the main electrodes. The voltage detection electrodes (13) are provided and fixed between the resistance body (11) and the main electrodes (12). The voltage detection electrode (13) is provided with a detection terminal (13a) to be connected to a terminal of a voltage detection circuit. The resistance body (11) has a columnar shape. The voltage detection electrode (13) and main electrode (12) are fixed to both end faces of the resistance body (11) in the length direction, so that they are opposing each other. The components are bonded by diffusion boding, friction bonding, wax bonding, etc., after abutting the bonding surfaces with each other.

A metal plate resistor includes a resistive body comprising a metal plate, and at least a pair of electrodes joined respectively to opposite ends of the resistive body, the electrodes being made of a highly conductive metal conductor. The resistive body has a main section positioned between the electrodes and a pair of electrode sections progressively wider than the main section in directions away from the main section. The electrodes are disposed respectively beneath the electrode sections and identical in shape to the electrode sections.

An electrical circuit protection device with three supporting substrates, two PTC elements, and first and second end terminations. The first and third substrates have an electrode formed on a first surface thereof. The second substrate has electrodes formed on both surfaces thereof. The first PTC element is laminated between the first and second substrates, electrically connecting thefirst electrodes formed on the first and second substrates. The second PTC element is laminated between the second and third substrates, electrically connecting the second electrode formed on the second substrate and the first electrode formed on the third substrate. The end terminations wraps around opposite ends of the device. The first end termination is in electrical contact with the first electrodes formed on the second and third substrates and the second end termination is in electrical contact with the first electrode formed on the first substrate and the second electrode formed on the second substrate. The PTC elements are electrically connected in parallel between the end terminations. The multi-layered configuration allows for an increased electrical rating without increasing the overall footprint, i.e., length and width, of the device.

A chip resistor (R1) includes a resistor element (1) having a first surface (1a) and a second surface (1b) opposite to the first surface. Two main electrodes (21), spaced from each other, are provided on the first surface (1a), while two auxiliary electrodes (22), spaced from each other, are provided on the second surface (1b). The auxiliary electrodes face the main electrodes (21) via the resistor element (1). The main electrodes (21) and the auxiliary electrodes (22) are made of the same material.

A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces.

The protection circuit unit 52 is an integrated body comprising a surface-mount type PTC thermistor 49 mounted by a soldering on a printed circuit board 44 through reflow soldering or the like soldering method together with a protection IC 45 and a FET unit 46. The surface-mount type PTC thermistor 49, as compared with a PTC thermistor with leads, can be mounted readily on the printed circuit board 44, without requiring bending and welding work of a lead to be connected to a negative terminal of prismatic battery cell 41, for forming a circuit. As a result, change in a resistance due to a bending stress, a thermal stress, etc. can be eliminated. Furthermore, a degree of thermal coupling with the battery cell 41 can be adjusted by changing a location of the thermistor 49. Thus, varieties of control functions can be implemented.

A chip resistor (R1) includes a resistor element (1) having a first surface (1a) and a second surface (1b) opposite to the first surface. Two main electrodes (21), spaced from each other, are provided on the first surface (1a), while two auxiliary electrodes (22), spaced from each other, are provided on the second surface (1b). The auxiliary electrodes face the main electrodes (21) via the resistor element (1). The main electrodes (21) and the auxiliary electrodes (22) are made of the same material.

An EMI filter capacitor assembly and implantable passive electronic network components utilize biocompatible and non-migratable materials to adapt the electronic components for direct body fluid exposure. The assembly includes a capacitor having first and second sets of electrode plates which are constructed of non-migratable biocompatible material. A conductive hermetic terminal of non-migratable and biocompatible material adjacent to the capacitor is conductively coupled to the second set of electrode plates. One or more conductive terminal pins having at least an outer surface of non-migratable and biocompatible material are conductively coupled to the first set of electrode plates, while extending through the hermetic terminal in non-conductive relation. The terminal pins may be in direct contact with the first set of electrode plates, or in contact with a termination surface of conductive connection material. The termination surface is also constructed of non-migratable and biocompatible materials.

The present invention relates to a polymer PTC thermistor and a temperature sensor using the same. The polymer PTC thermistor, including a conductive polymer 1 having PTC characteristics and electrodes 2 and 3 joined to the conductive polymer 1, characterized in that the electrodes 2 and 3 are provided along two sides 1a and 1b of the plate-like conductive polymer 1 and are separated from the edges of the sides 1a and 1b, and resin films 4 and 5 are formed which cover the sides 1a and 1b so as to wrap the electrodes 2 and 3.

A metal plate resistor includes a resistive body comprising a metal plate, and at least a pair of electrodes joined respectively to opposite ends of the resistive body, the electrodes being made of a highly conductive metal conductor. The resistive body has a main section positioned between the electrodes and a pair of electrode sections progressively wider than the main section in directions away from the main section. The electrodes are disposed respectively beneath the electrode sections and identical in shape to the electrode sections.

A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices. The assembly is made by providing first and second laminates, each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface of the stack, and making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior.

A process for manufacturing a composite polymeric circuit protection device in which a polymeric assembly is provided and is then subdivided into individual devices (2). The assembly is made by providing first and second laminates (7,8), each of which includes a laminar polymer element having at least one conductive surface, providing a pattern on at least one of the conductive surfaces on one laminate, securing the laminates in a stack (1) in a desired configuration, at least one conductive surface of at least one of the laminates forming an external conductive surface (3) of the stack, and making a plurality of electrical connections (31,51) between a conductive surface of the first laminate and a conductive surface of the second laminate. The laminar polymer elements may be PTC conductive polymer compositions, so that the individual devices made by the process exhibit PTC behavior. Additional electrical components may be attached directly to the surface of the device or assembly.