This invention discloses an Sb-enhanced AgCu
alloy, its preparation method, and its applications, relating to the field of high-end electrical contact
metal materials technology. The composition of this Sb-enhanced AgCu
alloy, by
mass percentage, includes: 20-40% Cu, 1-10% Sb, and the balance Ag. The specific preparation method is as follows:
alloy raw materials are weighed and mixed in proportion to obtain mixed
raw material powder; the mixed
raw material powder is vacuum melted to obtain alloy melt; the alloy melt is cast to obtain an
ingot; the
ingot is subjected to homogenization treatment, cold rolling, annealing, drawing,
solution treatment, and aging treatment to obtain the Sb-enhanced AgCu alloy. This invention, by introducing Sb into the AgCu alloy and combining it with a precisely controlled heat treatment process, achieves
microstructure optimization and synergistic
performance improvement, preparing an Sb-enhanced AgCu alloy with excellent mechanical, electrical, and
processing properties, which can be applied to micro-motor
brush filament materials,
potentiometer brush filaments, or
semiconductor test probe materials.