The utility model discloses a
chip resistor heat dissipation structure, which comprises a
resistor main body structure, a first
electrode structure and a second
electrode structure, the first
electrode structure and the second electrode structure are respectively arranged at two ends of the
resistor main body structure, and the resistor main body structure comprises a
ceramic substrate, a resistor layer, an inner
protection layer and an outer
protection layer, the resistance layer is arranged on one side of the upper end of the
ceramic substrate, the inner
protection layer is arranged on the outer side of the resistance layer, the outer protection layer is arranged on the outer side of the inner protection layer, a first reinforcing block is arranged in the middle of the interior of the
ceramic substrate, and second reinforcing blocks are symmetrically arranged on the two sides of the first reinforcing block in the
ceramic substrate. Compared with the prior art, the
ceramic substrate has the advantages that the circulation grooves and the heat dissipation openings are additionally formed in the
ceramic substrate, the heat dissipation speed of the ceramic substrate can be increased, meanwhile, the first reinforcing blocks and the second reinforcing blocks are additionally arranged, and therefore the stability of the structure of the ceramic substrate is guaranteed while internal heat dissipation of the ceramic substrate is not affected.