191results about "Resistor cooling/heating/ventillation" patented technology

The invention discloses a power type negative temperature coefficient thermistor and method for suppressing surge current, and relates to the technical field of negative temperature coefficient thermistors, the thermistor comprises a core body and pins, the pins are respectively arranged on electrodes on two sides of the core body by adopting a multi-contact-surface structure, and the pins are arranged on the two sides of the core body. The core body is made of a Mn-Co-Ni-La oxide with a nano composite gradient structure; the Mn-Co-Ni-La oxide with the nano-composite gradient structure determines the upper limits of core capabilities such as surge suppression, wide temperature stability and low power consumption of the thermistor, and the redesign of the pin is the key of performance transfer, so that the electrical properties (low contact resistance and high surge tolerance) of the Mn-Co-Ni-La oxide with the nano-composite gradient structure are not counteracted by structural defects; the arrangement of the bracket prevents the Mn-Co-Ni-La oxide with the nano-composite gradient structure from losing the effect due to heat accumulation and physical damage through thermal management and mechanical protection, and the three components supplement one another and cooperate with one another, so that the performance of the thermistor of the Mn-Co-Ni-La oxide with the nano-composite gradient structure is guaranteed.

The invention discloses an aluminum shell heat dissipation and heating tube resistor integrated structure which comprises a heat dissipation aluminum shell, a plurality of installation cavities are formed in the heat dissipation aluminum shell, heating assemblies are installed in the installation cavities, lead terminals are installed on the heating assemblies, a closed cooling cavity is formed in the heat dissipation aluminum shell, and a resistor is arranged in the closed cooling cavity. According to the aluminum shell heat dissipation and heating tube resistor integrated structure, through the integrated fusion design of the aluminum shell and the heating tube resistor and the combination of the phase change material cooling technology, the heat dissipation bottleneck problem of a high-power resistor is solved, and the aluminum shell heat dissipation and heating tube resistor integrated structure is compact in structure and efficient in heat dissipation; the resistor is particularly suitable for high-end industrial application such as robots and new energy equipment, and is expected to replace a traditional aluminum shell resistor and an independent cooling system, the reliability of equipment is enhanced, and meanwhile, the equipment cost and maintenance requirements are reduced.

The application discloses an integrated battery thermal runaway energy-absorbing resistor and a battery pack. The integrated battery thermal runaway energy-absorbing resistor is used for being integrated on a preset component of the battery pack. The integrated battery thermal runaway energy-absorbing resistor is a laminated body, which comprises a first clamping plate, a second clamping plate and an energy-absorbing laminated body clamped between the first clamping plate and the second clamping plate. The energy-absorbing laminated body comprises a plurality of resistance resistance core plates arranged at intervals. The plurality of resistance resistance core plates are connected in series to form a conductive connection. Adjacent resistance resistance core plates and the energy-absorbing laminated body and the first clamping plate and the second clamping plate are separated by phase change material plates. The application can integrate the energy-absorbing resistor with other structural components in the battery pack from the structure, improve the space utilization and improve the integration degree.

A resistor assembly, in particular a resistor assembly for a power combiner, includes a resistor chip and a clamping element for fixing the resistor chip to a cooling element, the clamping element having a clamping arm that applies pressure to the resistor chip.

The present application relates to the technical field of high-power resistor, conductive connection, electrothermal technology, and provides a production method of a high-power resistor with separated resistor sheets and the high-power resistor. The method comprises: processing a metal material through a laser device to make a resistor shell with convection heat dissipation holes; processing a plurality of cuboid-shaped resistor sheets, each resistor sheet being provided with an insulating support at an end portion and being capable of being connected in series and parallel according to resistance requirements as an independent resistance unit; and installing the resistor sheets into the shell at intervals to form a convection space of a preset height between adjacent resistor sheets, which is communicated with an external environment through the convection heat dissipation holes. The method of the present application obtains a high-power resistor composed of independent resistance units through a separated design and convection heat dissipation, effectively reduces the thermal load and energy consumption of the high-power resistor, and prolongs the service life.

The application provides a double-row lead frame resistance. The double-row lead frame resistance comprises a lead frame, a resistance, and the two ends of the first coil and the second coil are respectively installed with the lead wires; a protective cover; a cooling mechanism, the inside of the protective cover is fixedly connected with the supporting rod, the bottom end of the supporting rod is installed with the air bag; the top end of the supporting rod is internally installed with the fixed block and the fixed frame, the inside of the fixed block is slidably connected with the piston, the inside of the piston and the fixed block is respectively installed with the magnetic ring, the magnetic rings are attracted to each other; the inside of the fixed frame is slidably connected with the sliding rod, the sliding rod is fixedly connected with the piston, the side wall of the sliding rod is sleeved with the spring, and the two ends of the spring are respectively connected with the fixed frame and the piston; a cooling mechanism; a connecting mechanism. The double-row lead frame resistance provided by the application has the advantages of eliminating the self-induction of the coil, reducing the eddy current, and facilitating the dissipation of the heat inside the coil.

A battery pack according to one embodiment of the present invention includes: a battery module in which a plurality of battery cells are mounted; and a discharge member electrically connected to the battery module, wherein the discharge member includes: a frame member having an open upper portion and containing coolant; a top cover for covering the upper portion of the frame member; and a resistor mounted in the frame member, wherein both ends of the resistor are exposed to the outside of the discharge member and electrically connected to the battery module.

The utility model discloses a high-temperature-resistant winding resistor device which comprises a ceramic winding reel, two ends of the ceramic winding reel are fixedly connected with pin caps, the circumferential outer wall of the ceramic winding reel is connected with a resistance wire in a winding mode, a contact pin is arranged between the ceramic winding reel and the pin caps in a penetrating mode, the outer side of the resistance wire is sleeved with an insulating shell, and the outer side of the insulating shell is sleeved with an insulating sleeve. A plurality of heat dissipation fins are clamped on the outer wall of the circumference of the insulating shell, and a plurality of heat dissipation holes are formed in the circumference of the insulating shell. According to the utility model, heat generated by the resistance wire is efficiently transmitted to the insulating shell through the insulating heat-conducting glue, and then is dissipated into the air through the heat dissipation fins, so that the resistance wire is subjected to heat dissipation and cooling at a high speed, and meanwhile, the heat of the resistance wire is dissipated from the heat dissipation holes, so that the resistance wire is better subjected to heat dissipation and cooling, and the service life of the resistance wire is prolonged. Therefore, the resistance device is prevented from generating stress due to high-temperature expansion, the resistance wire is prevented from loosening and deforming, and the precision and stability of the resistor are prevented from being reduced.

The invention relates to an electronic device comprising: - a component having a resistance (R120) with a negative temperature coefficient, and - a temperature control means having an electrical resistance (R130) varying as a function of the temperature T such that the sum of the total resistance (R) is, on a second temperature subrange (302), greater than a setpoint temperature (305), strictly greater than the total resistance (R) at the setpoint temperature (305).

The utility model provides a chip resistor. The chip resistor comprises a substrate, a back electrode, a front electrode, a resistive layer, a protective layer and a side electrode, the protective layer comprises a first protective layer and a second protective layer; the first protective layer is made of a glass material, and the second protective layer is made of at least two layers of epoxy resin materials; a third protective layer is formed on the left electrode and the right electrode which are not covered, and the third protective layer is made of a resin silver material; through a multi-layer protection structure formed by the first protection layer made of the glass material and the second protection layer made of the epoxy resin material, invasion of moisture, chemical corrosion and mechanical damage is effectively prevented, the service life of the resistor in a severe environment is remarkably prolonged, and particularly, through the third protection layer made of the resin silver material, the service life of the resistor is prolonged. The anti-corrosion performance of the electrode part is enhanced, so that the resistor can keep stable electrical performance during long-time work.

The utility model relates to a resistor box body, in particular to a heat dissipation window for the resistor box body, which solves the problems that the open-air environment is not considered in the design of the heat dissipation window of the existing resistor box body, and sand and dust are easy to gather in an air duct of the heat dissipation window, so that the through-flow area is reduced, and the heat dissipation is influenced. The projection parts of the second vertical sections of the S-shaped shutter strips located at the top and the projection parts of the first vertical ends of the S-shaped shutter strips located at the bottom in the plane where the first vertical sections or the second vertical sections are located coincide; the two flow guide plates guide the hot air to enable the hot air to flow to the outside, if external sand and dust enter the resistance box, the sand and dust need to move upwards against the gravity, the flow guide plates block the sand and dust, part of the sand and dust can fall on the second flow guide plate, and the included angle between the first flow guide plate and the first vertical section is 100-170 degrees; and the included angle between the second guide plate and the second vertical section is 100-170 degrees, so that a large amount of dust cannot be gathered, and smooth through-flow is ensured.

The utility model discloses a locomotive brake resistor quick replacement device, which relates to the technical field of brake resistor replacement devices and comprises a mounting frame, mounting openings are formed in two sides of the mounting frame in a penetrating manner, fixing mechanisms are arranged in the mounting openings, and a wire placement groove is formed in the back surface of the mounting frame. The fixing mechanism comprises a mounting groove formed in the inner bottom wall of the mounting opening, clamping plates are arranged in the mounting groove, and symmetrical limiting clamping strips are arranged on the upper surfaces of the two clamping plates. According to the quick replacing device for the locomotive brake resistor, due to the arrangement of the fixing mechanism, the clamping plates on the two sides are pushed under the action of the spring to clamp and fix the brake resistor device in the mounting frame, so that the brake resistor device can be mounted and dismounted, and when the brake resistor device is dismounted, the push rod is pushed to drive the clamping plates to move in the mounting grooves; and the brake resistor can be taken out from the mounting frame, so that the replacement efficiency of the brake resistor is improved while the operation is simple.

An electronic device, comprising a component having a resistance with a negative temperature coefficient, and a temperature control means having an electrical resistance varying according to the temperature, such that the sum of the total resistance is, over a second temperature subrange greater than a setpoint temperature strictly greater than the total resistance at the setpoint temperature

The high-temperature-resistant and corrosion-resistant ceramic resistor comprises a ceramic resistor, the ceramic resistor is placed in a support, first placing grooves are formed in the centers of the two sides of the support, pins of the ceramic resistor are placed in the first placing grooves, through grooves are formed in the centers of the two ends of the support, and second heat dissipation assemblies are arranged in the through grooves. A plurality of clamping grooves are formed in the two ends of the bottom of the inner surface of the support, first heat dissipation pieces are connected to the clamping grooves in a clamped mode, second heat dissipation assemblies are arranged at the two ends of the support where the ceramic resistor is installed, and heat generated in the working process of the ceramic resistor is guided into sliding blocks through heat conduction plates through the second heat dissipation assemblies; and the heat is finally guided into the second cooling fins, and is guided out through the second cooling fins, so that the bracket is provided with a corresponding heat dissipation mechanism, the heat dissipation of the ceramic resistor is carried out, and the heat dissipation of the ceramic resistor is prevented from being influenced after the ceramic resistor is mounted through the bracket, so that the high-temperature-resistant characteristic of the ceramic resistor is prevented from being influenced.

The invention discloses a dynamic reactive power support operation method of a hybrid commutation converter, the converter and equipment. The method comprises the following steps: detecting whether the hybrid commutation converter has a reactive power demand or not; starting an advanced turn-off mode under the condition that the hybrid commutation converter has a reactive power demand; determining an initial trigger angle according to a preset target reference value and the output value of the hybrid commutation converter; adjusting the initial trigger angle in a preset second quadrant angle range to obtain a target trigger angle; the next trigger bridge arm is triggered and conducted based on the target trigger angle, so that the hybrid commutation converter outputs reactive power, and the range of the second quadrant angle is 180-270 degrees; according to the embodiment of the invention, the hybrid commutation converter can be supported to realize advanced turn-off in the second quadrant angle range, and the target trigger angle of the next trigger bridge arm is dynamically adjusted by adjusting the initial trigger angle, so that the dynamic reactive power support technology of the hybrid commutation converter is realized.

The utility model discloses a low-temperature-resistant shunt resistor assembly which comprises a resistor body, an input side wire connector, an output side wire connector and two substrates, one end of the resistor body is electrically connected with the input side wire connector, the other end of the resistor body is electrically connected with the output side wire connector, one substrate is connected into a gap between the resistor body and the input side wire connector, and the other substrate is connected into a gap between the resistor body and the output side wire connector; the resistor body comprises two T-shaped blocks and a plurality of groups of sheet-shaped resistors which are distributed at equal intervals, one side of each sheet-shaped resistor is connected to one T-shaped block, and the other side of each sheet-shaped resistor is connected to the other T-shaped block. The low-temperature-resistant shunt resistor assembly disclosed by the utility model has the beneficial effects that the substrate can bear and conduct deformation of the resistor body caused by temperature change in high and low temperature environments, so that the influence of the temperature change on the performance of the chip resistor is reduced.

This invention discloses a heat-absorbing layer for a metal oxide varistor. A thermally protected metal oxide varistor (TMOV) device includes: an MOV chip; a first electrode disposed on a first side of the MOV chip; a second electrode disposed on a second side of the MOV chip opposite to the first side; a conductive first lead connected to the first electrode; a heat-absorbing layer bonded to the second electrode by a heat-absorbing paste formed from a mixture of silica sand, melamine cyanurate, and silicone resin, wherein the heat-absorbing paste is formed from a mixture of melamine cyanurate and silicone resin; a thermal cutoff (TCO) element extending through pores in the heat-absorbing layer and having a first end electrically connected to the second electrode by a certain amount of solder having a melting temperature lower than the melting temperature of the TCO element; and a conductive second lead electrically connected to the second end of the TCO element.

The utility model discloses an aluminum shell resistor, which belongs to the related field of resistor processing technology, and comprises an aluminum shell and a porcelain base body, the porcelain base body is fixedly arranged at the middle position of the inner side of the aluminum shell, screw rods are fixedly arranged at the middle positions of the outer surfaces of the two ends of the porcelain base body, and connecting sheets are arranged between the aluminum shell and the screw rods. The screw rod is installed in the middle of the connecting piece in a penetrating mode, and quartz sand is filled between the aluminum shell and the porcelain base body. Cylindrical mica blocks are installed on the inner sides of the two ends of the porcelain base body, one end of the screw penetrates through the middle positions of the cylindrical mica blocks, and a mica plug is installed on the inner side of the aluminum shell. A traditional wire body connecting structure is replaced, so that the resistor core is in a stable and centered state, the insulation performance of the resistor core is improved, the phenomenon that the lead is damaged in the production and transfer process is avoided, the problem that the withstand voltage is reduced due to the fact that the resistor core moves in the production process is solved, and the withstand voltage performance is improved.

The present disclosure relates to semiconductor structures, and more particularly, to a heat dissipation structure and a method for manufacturing the same. The structure includes a thin film resistor located within a back-end-of-line (BOL) structure, and a heat dissipation structure located below the thin film resistor. The heat dissipation structure includes a top plate having a slotted configuration and located within the BOL structure.

The invention provides a magnetofluid cooled thermistor protection device, and relates to the technical field of thermistors, the magnetofluid cooled thermistor protection device comprises a thermistor body, a replacement mechanism and an adjustment mechanism, one side of the thermistor body is provided with two electrodes, the inner wall of the thermistor body is provided with a heat dissipation mechanism, and the heat dissipation mechanism comprises a communicating pipe; the arc surface of the communicating pipe fixedly penetrates through the inner wall of the thermistor body, the two ends of the arc surface of the communicating pipe fixedly communicate with the same runner pipe, a feeding pipe fixedly penetrates through one inner wall of the runner pipe, and a discharging pipe fixedly penetrates through the other inner wall of the runner pipe; and one end of the arc surface of each of the feeding pipe and the discharging pipe is in threaded connection with a sealing cover. According to the invention, when heat dissipation protection needs to be carried out on the thermistor, heat dissipation can be carried out on the thermistor through the heat dissipation mechanism, heat energy can be prevented from being accumulated on the thermistor through the heat dissipation mechanism, and the problem that the heat energy affects the service life and the measurement accuracy of the thermistor is avoided.

The present invention discloses a lead frame surface mount metal oxide varistor device, comprising an upper housing, a lower housing, and an MOV chip body. The upper and lower housings are connected to form a sealed cavity. The MOV chip body is disposed within the cavity. Electrode terminals are provided on both sides of the MOV chip body. Two sets of patch mounting slots are provided at the lower end of the lower housing, corresponding to the two sets of electrode terminals. Patches are mounted within the patch mounting slots. The two sets of patches are connected to the corresponding electrode terminals in sequence via legs and electrode leads. A first heat conducting layer, a microchannel heat sink, and a second heat conducting layer are sequentially disposed on the outer side of the MOV chip body. The side of the second heat conducting layer, away from the microchannel heat sink, is connected to the inner wall of the cavity formed by the connection between the upper and lower housings. The present invention transfers heat generated by the MOV chip body to the microchannel heat sink via the first heat conducting layer. Microchannels provided within the microchannel heat sink rapidly remove the heat from the heat source, thereby preventing local overheating and chip damage.

The invention discloses a high-current power type thermosensitive chip and a preparation method thereof. The current bearing capacity of the chip is remarkably improved on the premise that the product size is not increased, and the technical scheme is as follows: the thermosensitive chip is made of a composite material, and the composite material comprises a main material and a composite additive; the main material comprises the following components in percentage by weight: 30 to 70 percent of manganous-manganic oxide (MnO), 10 to 30 percent of zinc oxide (ZnO), 8 to 20 percent of copper oxide (CuO) and 1 to 10 percent of cobaltosic oxide (CoO); the composite additive accounts for 1-10% of the weight of the main material; the invention has the following beneficial effects: a multi-layer annular structure design is adopted to form a collaborative heat dissipation mechanism, which is beneficial to simultaneous dissipation of heat in the up and down directions, and avoids the'hot bottleneck 'effect of heat accumulation in the central area of a solid structure; the technical bottleneck that a traditional power type thermistor depends on increasing the size and improving the current capacity is effectively solved, the outstanding industrial application value is achieved, and meanwhile the thermal stability and durability are improved.

The utility model relates to the technical field of resistors, in particular to an embedded resistor unit, which comprises an insulated support tube and a plurality of resistor modules, and two ends of the support tube are penetrated to form a heat dissipation channel; a plurality of limiting grooves are formed in the inner wall of the supporting pipe, and the resistor modules are inserted into the limiting grooves from ports of the supporting pipe in a one-to-one correspondence mode. Each resistor module comprises a plurality of resistor blocks which are arranged at intervals and a conductive strip which is used for positioning the plurality of resistor blocks and is connected in series. Compared with the prior art, the multiple resistor modules are arranged at the limiting grooves in the inner wall of the supporting pipe, more resistor modules can be contained, different numbers of resistor modules can be electrically connected according to needs during use, and use is more flexible; and when a local resistor module breaks down, the corresponding resistor module can be conveniently replaced, so that the whole resistor is not scrapped, and the application cost is saved.

The utility model provides a chip resistor, which relates to the technical field of resistors, and comprises a protective layer, a ventilation assembly fixedly connected in the protective layer, a heat dissipation assembly fixedly connected in the ventilation assembly, the ventilation assembly comprises a heat dissipation layer, the outer side of the heat dissipation layer is fixedly connected on the protective layer, and the bottom end of the heat dissipation layer is fixedly connected with a resistance layer. The bottom end of the resistance layer is fixedly connected with the heat conduction layer, and the bottom end of the heat conduction layer is fixedly connected with the substrate layer, so that by optimizing a heat conduction path and increasing a heat dissipation surface area, the working temperature of the resistor body is reduced, and measurement errors caused by temperature rise are reduced; the problem of heat accumulation of an existing chip resistor under a high-power condition is effectively solved, measurement errors caused by temperature rise are solved, and the stability of the resistor under various application occasions is improved.

Provided are a composite device for automotive electric parts and a manufacturing method thereof. The composite device includes: a multi-layered ceramic capacitor having a plurality of first and second internal electrodes alternately arranged; a multi-layered ceramic varistor having a plurality of third and fourth internal electrodes arranged to face each other, the multi-layered ceramic varistor being stacked on one side surface of the multi-layered ceramic capacitor; an adhesive layer made of an insulating heat dissipation ceramic adhesive for bonding the multi-layered ceramic capacitor and the multi-layered ceramic varistor; and first and second external electrodes which connect the plurality of first and second internal electrodes exposed to both end portions of the multi-layered ceramic capacitor with the plurality of third and fourth internal electrodes exposed to both end portions of the multi-layered ceramic varistor, respectively.

To provide a resistor capable of improving heat dissipation property.SOLUTION: A resistor 1 includes a resistance body part 2, and a resin part 3 covering the resistance body part 2. The resin part 3 has a heat dissipation fin 32.SELECTED DRAWING: Figure 1

The utility model relates to the technical field of piezoresistors, and discloses an integrated double-layer structure piezoresistor which comprises a piezoresistor body, a cooling heat dissipation device is arranged on the outer surface of the piezoresistor body, and the cooling heat dissipation device comprises a semiconductor chilling plate. A semiconductor chilling plate is arranged on one side of the piezoresistor body, a device convenient to disassemble is arranged between one side of the semiconductor chilling plate and the outer surface of the piezoresistor body, and when the piezoresistor body is installed on a circuit board to be used, after the semiconductor chilling plate on one side is powered on, the semiconductor chilling plate on the other side of the piezoresistor body can be cooled. When surge current absorbed in the piezoresistor body is too large, one side of the piezoresistor body absorbs heat on the surfaces of the piezoresistor body and the aluminum frame to cool the piezoresistor body, then the aluminum frame increases surface contact with the piezoresistor body to enable the piezoresistor body to perform heat exchange, the temperature of the surface of the piezoresistor body is reduced, and the surge current absorbed in the piezoresistor body is too large. And the piezoresistor main body cannot be damaged due to overheating, so that the service life of the piezoresistor main body is prolonged.

The utility model provides a band-shaped resistor, which is used for solving the problems that the existing large-current resistor is larger in size and higher in production cost, the through-flow area of the traditional wire type resistor and membrane type resistor cannot meet the requirement of impact current, and the requirements of intelligence and miniaturization are not met. According to the strip-shaped resistor provided by the utility model, the strip-shaped resistor bodies which are arranged and fixed in the mounting frame in a multi-layer manner are arranged, and the strip-shaped resistor bodies effectively increase the length of a resistor through-flow path through a continuous bending process, so that the requirement on the cross section size of the resistor required by high-current impact is met; meanwhile, the plurality of strip-shaped resistor bodies are connected in parallel or sequentially connected in series through the respective metal lead-out sheets, or each P strip-shaped resistor bodies are connected in series and then connected in parallel, so that the requirements of different resistance values can be met; the strip-shaped resistor disclosed by the utility model is small in size, large in through-flow, convenient to install and very strong in mechanical property, and can effectively ensure the safe and reliable operation of a product.

A kind of high-current power type thermosensitive chip and its preparation method;Effectively solve the premise of not increasing product volume, significantly improve the current carrying capacity of chip, its technical scheme is as follows:The thermosensitive chip uses composite material, the composite material includes main material and composite additive;The weight percentage of each component in the main material is as follows:Manganese tetroxide Mn₃O₄: 30-70%, zinc oxide ZnO: 10-30%, copper oxide CuO: 8-20%, cobalt tetroxide Co₃O₄: 1-10%;The composite additive accounts for 1-10% of the weight of main material;The beneficial effects of the present application are as follows:Multi-layer ring structure design is adopted, a synergistic heat dissipation mechanism is formed, which is beneficial to heat dissipation in the upward and downward directions simultaneously, avoiding the "thermal bottleneck" effect of heat accumulation in the center area of solid structure;Effectively solve the technical bottleneck of traditional power type thermistor relying on increasing volume to improve current capacity, have outstanding industrial application value, improve thermal stability and durability at the same time.