100 results about "Chip resistor" patented technology

The invention relates to the technical field of supply chain product quality inspection, in particular to an AI model-based supply chain intelligent quality inspection and defect identification system, which comprises a texture feature adaptive unit, a defect identification dynamic adjustment unit, an AI defect identification unit and a control output unit, the texture feature adaptive unit extracts texture density, contrast and edge gradient direction distribution of a chip resistor grey-scale map in real time, the texture density, the contrast and the edge gradient direction distribution are dynamically compared with a historical batch feature library to generate texture feature difference mapping, the defect identification dynamic adjustment unit nonlinearly adjusts a gradient deviation threshold value through an S-shaped response function according to the difference mapping, and the defect identification accuracy is improved. The AI defect identification unit adopts a convolutional neural network, outputs a defect classification result through parallel branch processing, spatial pyramid pooling and secondary verification, controls the output unit to transmit the result to an execution mechanism, records batch switching parameters, solves the problem of false and missing judgment caused by batch texture fluctuation, and improves the detection accuracy. And the quality inspection precision is improved.

To provide a chip resistor having lower electric resistance and more stable quality.SOLUTION: The chip resistor 1 includes a metallic resistor 10, a first plated electrode 21, and a second plated electrode 22. The metal resistor 10 includes a first bottom plate portion 11, a second bottom plate portion 12, a top plate portion 13, a first inclined leg portion 14, and a second inclined leg portion 15. The first plating electrode 21 is disposed on the bottom surface of the first bottom plate portion 11, the bottom surface of the first inclined leg portion 14, and the bottom surface of the top plate portion 13. The second plating electrode 22 is disposed on the bottom surface of the second bottom plate portion 12, the bottom surface of the second inclined leg portion 15, and the bottom surface of the top plate portion 13.SELECTED DRAWING: Figure 3

To provide a resistor paste capable of achieving both high resistivity and low TCR of a resistor.SOLUTION: The resistor paste includes metal particles, insulating particles, glass particles, and metal silicide. The metal particles contain copper and nickel. The insulating particles contain at least one of alumina, zirconia, zinc oxide, and boron nitride. A chip resistor 1 includes a resistor 13 and a substrate 11. The resistor 13 is formed on the substrate 11 using the above-mentioned resistor paste as a material.SELECTED DRAWING: Figure 1

The invention discloses a chip resistor performance test support tin soldering tool and a workpiece positioning method. The chip resistor performance test support tin soldering tool comprises an electric heater, a fixing plate, a glass plate, a manual lifting assembly, a limiting column, a positioning supporting column and a material pressing device. Limiting columns and positioning supporting columns are fixedly assembled at the four corners of a heating platform of the electric heater. The fixed plate is provided with a plurality of detection seat positioning grooves, four corners of the detection seat positioning grooves are provided with fixed plate positioning holes, and the fixed plate positioning holes are matched with the positioning support columns; the glass plate is provided with pressing device mounting holes with the same number as the detection seat positioning grooves on the fixed plate, the four corners of the glass plate are provided with limiting long holes and positioning round holes, and the left and right edges of the glass plate are provided with manual lifting assemblies; and the material pressing device is arranged in the material pressing device mounting hole of the glass plate. The requirement for the set range of the thickness of the tin soldering layer on the bottom face of the cross-shaped supporting frame is met, and the purpose of guaranteeing the reliability of the performance index testing result of the chip resistor is achieved.

The utility model discloses a low-temperature-resistant shunt resistor assembly which comprises a resistor body, an input side wire connector, an output side wire connector and two substrates, one end of the resistor body is electrically connected with the input side wire connector, the other end of the resistor body is electrically connected with the output side wire connector, one substrate is connected into a gap between the resistor body and the input side wire connector, and the other substrate is connected into a gap between the resistor body and the output side wire connector; the resistor body comprises two T-shaped blocks and a plurality of groups of sheet-shaped resistors which are distributed at equal intervals, one side of each sheet-shaped resistor is connected to one T-shaped block, and the other side of each sheet-shaped resistor is connected to the other T-shaped block. The low-temperature-resistant shunt resistor assembly disclosed by the utility model has the beneficial effects that the substrate can bear and conduct deformation of the resistor body caused by temperature change in high and low temperature environments, so that the influence of the temperature change on the performance of the chip resistor is reduced.

The invention discloses identification printing equipment for a ceramic resistor, and relates to the field of code spraying and printing. According to the technical scheme, the device comprises an equipment box, a feeding assembly and a receiving assembly are assembled on the two sides of the equipment box correspondingly, and the feeding assembly and the receiving assembly are used for feeding and receiving correspondingly; the code spraying mechanism is assembled on the equipment box and is used for spraying and printing; the material guide groove is fixed on the equipment box and is used for guiding materials; the rotary adsorption mechanism is assembled below the material guide groove and is used for adsorbing the material belt; the acquisition unit is arranged on the equipment box and is used for acquiring working data in real time; and the quality analysis module calculates a code spraying quality index based on the work data formulation and compares the code spraying quality index with a preset code spraying quality index threshold value to judge whether the code spraying quality index is abnormal or not, when the material belt passes through the material guide groove, the material belt is rotationally adsorbed and fixed through the rotary adsorption mechanism, and the material belt passes through the material guide groove. The material belt conveying stability is improved, and the code spraying quality is guaranteed.

This application relates to the field of thermistor technology, specifically disclosing an NTC thermistor material, a chip resistor, and its preparation method and application. The NTC thermistor material provided in this application comprises a base material and 3-13% additives by weight; the base material comprises Mn3O4, Co3O4, Al2O3, Fe2O3, and ZnO in a weight ratio of (10-40):(10-50):(1-15):(10-25):(5-19); the additives comprise MgAl2O4, Nb2O5, and TiO2 in a weight ratio of (1-200):(1-10):(5-25); this application also provides a chip resistor made using the NTC thermistor material. The NTC thermistor material provided in this application has a high material constant B value and a low room temperature resistivity ρ. 25 It can meet the application requirements of high-precision and high-reliability temperature sensors.

The embodiment of the utility model discloses a mining belt conveyor frequency converter logic control board which comprises a PCB, the PCB is installed on a module frame, the left side of the PCB is provided with a plurality of first relays, SMD light-emitting diodes, SMD resistors and SMD diodes, the middle of the surface of the PCB is provided with a relay base, a second relay is installed on the relay base, and the SMD resistors are installed on the PCB. A first terminal base and a second PCB terminal base are arranged on the upper side of the PCB, and a first terminal base, a third PCB terminal base and a fourth PCB terminal base are arranged on the lower side of the PCB. According to the utility model, the installation space is obviously saved, complex external wiring is avoided, the overall structure is more compact and concise, the integration level of equipment is improved, and the difficulty of installation and maintenance is reduced.

The invention belongs to the field of thick film electronic element manufacturing, and particularly relates to chip resistor MK layer UV curing slurry and a preparation method thereof. The problems that an existing UV curing protective layer is insufficient in heat resistance, and cracking and falling are caused by mismatching of thermal expansion coefficients are solved. Through an epoxy-organic silicon hybrid resin system and a composite functional filler, the resin system comprises trimethylolpropane triacrylate, hexanediol diacrylate, an epoxy acrylate oligomer, an organic silicon modified acrylate oligomer, a phosphorus-containing acrylate functional monomer and a thermal polymerization inhibitor, and the functional filler is prepared from modified spherical aluminum oxide, modified silicon dioxide, a photoinitiator, a photoinitiator, a photoinitiator, a photoinitiator, a photoinitiator and a photoinitiator. According to the invention, the thermal shock resistance and insulation reliability of the protective layer are improved while the high efficiency of the UV photocuring process is maintained.

The invention discloses a power semiconductor device with an external gate resistor, and relates to the field of semiconductor devices, the power semiconductor device with the external gate resistor comprises a semiconductor substrate, and a gate bus, a first gate connection region and a second gate connection region which are arranged on the front surface of the semiconductor substrate, the second gate connection region is electrically connected with a gate bus; and providing an external gate resistor, one end of the external gate resistor being electrically connected with the first gate connection region, and the other end of the external gate resistor being electrically connected with the second gate connection region. Through the structural design, the external chip resistor is used for replacing a traditional grid built-in resistor RGint made of polycrystalline silicon, the repeated tape-out verification period caused by the improper built-in resistor can be avoided, meanwhile, due to the flexibility of the external chip resistor, the grid resistance value requirements of different application scenes can be met, and the effects of reducing cost and increasing efficiency are achieved.

In a chip resistor, a first trimming groove has: a first linear portion extending linearly from a first edge along an X-axis direction; and a second linear portion extending linearly along the Y-axis direction. The second trimming groove includes: a third linear portion disposed on a second upper surface electrode side of the first linear portion and extending linearly along the first linear portion 1 from the first edge; and a fourth linear portion disposed on the second edge side of the second linear portion and extending linearly along the second linear portion from the tip of the third linear portion. When viewed in the X-axis direction, the tip of the second trimming groove is positioned closer to the second upper surface electrode side than the tip of the first trimming groove.

The invention belongs to the field of electronic component materials, and discloses UV curing slurry for a first protective layer of a chip resistor and a preparation method of the UV curing slurry. The UV curing slurry is prepared from the following raw materials in parts by weight: 30 to 50 parts of silicon-containing epoxy acrylate resin, 10 to 20 parts of polyurethane acrylate resin, 10 to 20 parts of modified polyphosphazene resin, 15 to 25 parts of reactive diluent, 5 to 8 parts of photoinitiator, 5 to 10 parts of composite boron nitride powder, 5 to 10 parts of inorganic filler, 0.1 to 1 part of wetting agent, 0.1 to 1 part of flatting agent and 0.5 to 2 parts of adhesion promoter, the protective layer formed by curing the slurry has the advantages of high hardness, high heat resistance and excellent insulating property.

The present disclosure provides a laminated ceramic sintered body substrate for electronic devices, an electronic device, a chip resistor, and a method for manufacturing a chip resistor. The laminated ceramic sintered body substrate for electronic devices includes a ceramic sintered body substrate and a planarization film provided on an upper surface of the ceramic sintered body substrate, the planarization film containing a thermally conductive filler.

The invention discloses a chip resistor failure detection method, apparatus and device, and a storage medium. The method comprises the steps of obtaining an electrode image in a to-be-detected chip resistor through a penetration detection device; determining a failure detection result of the chip resistor to be detected under the condition that the working humidity, the working voltage, the working duration and the imaging detection result meet failure conditions; the internal structure of the chip resistor can be detected through penetration detection equipment, and on the premise that the chip resistor is compared with standard reference electrode imaging of a qualified chip resistor, the chip resistor is judged to have a silver migration failure problem by combining working humidity, working voltage and working time to reach set conditions on the premise that electrode deficiency occurs, so that the chip resistor is judged to have the silver migration failure problem. According to the embodiment of the invention, on the premise that the detection efficiency is improved, other detection can be carried out on the chip resistor when it is detected that the chip resistor does not fail, and the detection cost is reduced.

The invention relates to a chip resistor preparation method based on magnetron sputtering and low-temperature heat treatment. The chip resistor preparation method comprises the following steps: respectively preparing a surface electrode and a back electrode on the front and back surfaces of a substrate; a resistance layer is sputtered on the front face of the substrate, the sputtering power density is 0.05 W / mm < 2 >, the sputtering time is 30 min to 2 h, the temperature of a target material is smaller than or equal to 200 DEG C during sputtering, and the temperature of the substrate is smaller than or equal to 180 DEG C; performing low-temperature heat treatment on the resistance layer under the protection of inert gas, wherein the temperature of the low-temperature heat treatment is 350 + / -5 DEG C; after the resistance value of the resistive layer is adjusted through laser cutting, a protective layer is prepared on the surface of the resistive layer; and preparing a side surface electrode on the side surface of the substrate, so that the surface electrode is electrically connected with the back electrode. Through temperature control of the target material and the substrate during sputtering, an optimized initial condition is provided for film growth, a film with a more ideal stress state and a more ideal microstructure is formed, and through a subsequent low-temperature heat treatment process, a resistive layer is recovered to an alloy phase and the activation energy of a manganese element is improved, so that the qualitative improvement of the film performance is cooperatively realized.

The invention relates to the technical field of electronic component manufacturing, in particular to a preparation tray and a preparation method of an integrally-formed sputtering chip resistor, and the preparation tray comprises a lower support tray, a support frame, a plurality of hanging plates and an upper support tray. The lower supporting disc is provided with an annular notch and an annular sliding plate sliding in the annular notch, and an inner gear ring is arranged on the top of the sliding plate. The bottom of the hanging plate is provided with a gear meshed with the inner gear ring. When the device is used, all the hanging plates can be driven to synchronously deflect by rotating the inner gear ring, so that the target-substrate distance between a substrate carried by the hanging plates and a sputtering cathode is continuously adjusted, a front electrode and a resistance layer are simultaneously deposited on a ceramic substrate of a patterned mask through one-time vacuum sputtering process, integrated forming is realized, and then low-temperature aging is carried out, so that the device is obtained. The flexible and accurate control of the target-substrate distance is realized, the uniformity and density of the film and the electrical property stability of the product are remarkably improved, and the method is particularly suitable for the flexible and efficient production of high-performance precise film chip resistors.

The utility model relates to patch resistance substrate production technical field, concretely is a kind of patch resistance substrate cutting dust removal device, including modular quick-release filter element assembly, modular quick-release filter element assembly includes: filter box body;Drawer type filter element module, and the sliding connection is achieved with installation cavity by slide rail structure;Panel locking assembly, preliminary fixing drawer type filter element module is adsorbed magnetism metal block by electromagnet;Pneumatic locking assembly, control unit controls high-pressure gas source to pneumatic seal ring inflation to make it swell and realize sealing and lock;Drawer type filter element module is slidably installed in installation cavity by slide rail assembly, after preliminary positioning is realized by cooperation electromagnet, positioning hole, positioning piece, control unit controls pneumatic seal ring inflation to swell and completely adhere installation cavity wall, complete final locking, pneumatic seal ring cooperation first sealing gasket, second sealing gasket realizes double locking, and the sealing property is superior to traditional mechanical structure, avoid dust leakage, improve the efficiency of filter element replacement on the other hand.

The utility model discloses a chip resistor, which relates to the technical field of chip resistors and comprises a substrate, two ends of the upper side surface of the substrate are respectively provided with a positive electrode, two ends of the lower side surface of the substrate are respectively provided with a back electrode, and the positive electrodes and the back electrodes are respectively provided with a prefabricated groove. Side electrodes are arranged on the outer sides of the prefabricated grooves, net-shaped pins are fixedly connected to the side electrodes, and the net-shaped pins are correspondingly arranged in the prefabricated grooves. According to the resistor disclosed by the utility model, the prefabricated grooves are formed in the positive electrode and the back electrode, and the net-shaped pins are inserted and fixed in the prefabricated grooves, so that the conductive effect of the resistor is remarkably enhanced, and the connection stability between the pins and the electrodes is also greatly improved.

The application discloses a positioning method for open-circuit position of metal film chip resistor, comprising the following steps: S1, repeatedly loading voltage on the defective resistor, so that the metal resistor film at the open-circuit position is fused to generate a morphology feature different from resistor films at other positions, measuring the resistance value after voltage loading, and stopping loading voltage after the resistance value decreases; S2, using a solvent to open the resistor, so as to dissolve the protective layer of the chip resistor; S3, cleaning the sample, so that the sample surface is free of solvent residues, and then taking out the sample and placing it on filter paper for drying; S4, observing the sample. The method for opening the resistor after voltage loading not only changes the morphology feature of the resistor film at the open-circuit position, but also can etch the resistor film completely and intact, so that the characteristic resistor film can be clearly observed, and the open-circuit position can be accurately positioned.

[Problem] To provide a sealant composition for a protective film layer, said sealant composition being made of a resin and being cured at a lower temperature than the firing temperature of an overcoat agent comprising a glass paste. [Solution] This sealant composition for a protective film layer is characterized by including: a bisnadimide compound that is represented by chemical formula 1 and in which a divalent hydrocarbon group (R1) is bonded to nitrogen atoms of imide groups having norbornene skeletons; a phenolic resin; and a reactive diluent that has one or more epoxy groups. A resin cured film that has superior heat resistance can be formed using this composition, and thus this composition can be used as a sealant for a protective film layer of a chip resistor, a chip capacitor, or similar.

The invention discloses a low-TCR thick-film chip resistor and a preparation method thereof, and relates to the technical field of integrated circuit resistors, and the low-TCR thick-film chip resistor comprises a ceramic substrate, a back internal electrode, a resistor unit and an electroplating unit, the bottom of the ceramic substrate is fixedly provided with a back internal electrode, the outer wall of the back internal electrode is fixedly provided with an electroplating unit, the electroplating unit is fixedly connected with the ceramic substrate, and the ceramic substrate is fixedly provided with a resistor unit. According to the invention, the low TCR performance of 50ppm / DEG C can be realized only by adjusting the material formula of the resistive layer and finely adjusting the sintering temperature curve without replacing the original production equipment, so that the equipment upgrading cost of an enterprise is greatly reduced; and by adopting an opposite TCR original paste mixing mode, the TCR can be accurately controlled, the operation of replacing and calibrating a temperature curve for multiple times is reduced, and the production efficiency and the product consistency are remarkably improved.

To provide a chip resistor capable of improving reliability and mountability on a circuit board.SOLUTION: The chip resistor 1 includes a metal resistor 10, a first electrode 15, a second electrode 16, a first plating layer 21, and a second plating layer 26. The first plating layer 21 includes a first nickel plating layer 22 and a first tin plating layer 23. The first outermost 21a of the first plating layer 21 is formed by the first tin plating layer 23. The thickness of the first nickel plating layer 22 is smaller than the thickness of the first tin plating layer 23. The second plating layer 26 includes a second nickel plating layer 27 and a second tin plating layer 28. A second outermost 26a portion of the second plating layer 26 is formed of a second tin plating layer 28. The thickness of the second nickel plating layer 27 is smaller than the thickness of the second tin plating layer 28.SELECTED DRAWING: Figure 3

To provide a chip resistor having lower electric resistance and more stable quality.SOLUTION: The chip resistor 1 includes a metal resistor 10, a first plated electrode 15, and a second plated electrode 16. The metal resistor 10 has a top surface 11 and a bottom surface 12 opposite to the top surface 11. The first plated electrode 15 is disposed on the bottom surface 12. The second plated electrode 16 is disposed on the bottom surface 12 and is separated from the first plated electrode 15. The top surface 11 is a flat surface.SELECTED DRAWING: Figure 3

The utility model relates to the technical field of resistors, in particular to an anti-vulcanization thick-film chip resistor for an automobile. According to the technical scheme, a resistance layer is arranged on a substrate, positive electrodes are arranged on the two sides of the resistance layer, side electrodes wrap the outer sides of the positive electrodes, back electrodes are arranged on the two sides of the bottom end of the substrate, second clamping teeth are arranged on the back electrodes, clamping grooves are formed in the positive electrodes, first clamping teeth and limiting protruding blocks are arranged on the side electrodes, and the limiting protruding blocks are arranged on the first clamping teeth. The side electrode is clamped with the second clamping tooth and the clamping groove through the first clamping tooth and the limiting convex block respectively; the outer side of the side electrode is coated with a nickel-plated layer and a tin-plated layer, and the outer side of the resistive layer is coated with an inner protective layer and an outer protective layer. According to the utility model, through a unique clamping structure, the electrode connection stability is obviously enhanced, the contact resistance is reduced, and the current transmission stability is ensured. Due to the multi-layer protection design, vulcanization and water vapor erosion are effectively resisted, the service life of the resistor is prolonged, and powerful support is provided for reliable operation of an automobile electronic system.

The invention belongs to the field of conductive paste, and particularly relates to conductive silver paste and a preparation method and application thereof. The conductive silver paste comprises the following components in parts by mass: 60-70 parts of silver powder, 0.5-1.5 parts of an inorganic additive, 10-15 parts of organic resin, 1-3 parts of a curing agent and 7-9 parts of an organic solvent, the organic resin comprises epoxy resin and polyurethane; the mass ratio of the epoxy resin to the polyurethane is less than 10: 1. The conductive silver paste has appropriate viscosity and high printing yield during printing, the printing yield reaches up to 99%, and the glass transition temperature of the anti-sulfuration silver paste layer formed after curing is matched with the glass transition temperature of the second protection layer in the chip resistor, so that when the temperature changes, interlayer interface gaps are avoided, and the chip resistor is prevented from being damaged. Therefore, the front electrode is protected, the vulcanization resistance of the chip resistor is improved, and the edge collapse ratio of the chip resistor is reduced.

The utility model relates to the technical field of chip resistors, and discloses a chip resistor detection device, which comprises a detection base, a detector and a detection turntable, the bottom end of the detection base is stably supported by a plurality of supporting columns, a driving motor is arranged in a top end fixing ring, an output shaft of the driving motor is connected with a rotating chassis, and the rotating chassis is sleeved with the detection turntable. The detection turntable and the supporting strip are in magnetic fit through positive and negative magnets to realize synchronous rotation, a rotating strip is rotationally mounted on the supporting strip on one side of the detection base, a movable strip is slidably mounted in the rotating strip, the horizontal position of the movable strip is controlled by a first electric push rod, and the front end of the movable strip is connected with a detector through a second electric push rod. The driving motor drives the detection rotating disc to rotate, so that the resistor sequentially reaches a detection position, the first electric push rod and the second electric push rod work cooperatively, the position of the detector is accurately adjusted, detection of the chip resistor is completed, automatic and continuous detection is achieved, and the detection efficiency and precision are improved.

The utility model discloses a high-speed braiding machine for chip resistors, relates to the technical field of braiding machines, and solves the problems that when the braiding machine is used, particle devices are inevitably attached in a placing groove of a carrier tape during production, so that the internal resistors are extruded after the resistors are placed in the placing groove during packaging, and the chip resistors are damaged. The device comprises a supporting table and a placement belt, the placement belt is arranged above the supporting table, the two ends of the placement belt are arranged on the two sides of the supporting table respectively and are wound around a winding roller and an unwinding roller respectively, and a vibration motor is fixedly installed on the side wall of the right end of the supporting table. And a supporting column is fixedly installed at the vibration end of the vibration motor, through cooperation between the vibration motor and the supporting column, the rubber pad can conveniently vibrate the side wall of the containing belt, and particle impurities in the containing groove in the containing belt can be conveniently shaken out.

This invention relates to a digital, on-chip resistor- and capacitor-free buck DC-DC converter, belonging to the field of power management technology. It includes digital control logic, a driver module, an error comparator, a high-clamp comparator, a low-clamp comparator, a delay module, and power switching transistors. A digital structure based on comparators and digital units is proposed, using pure MOSFETs and eliminating on-chip resistors and capacitors to achieve a low-power, high-efficiency DC-DC converter. The circuit implementation is simple, without complex analog modules, consisting of only three comparators, one digital control logic, one digital driver stage, one power stage, and three identical delay modules, reducing the overall power consumption and hardware cost of the power chip. The DC-DC converter can achieve a stable output voltage of 1.2–2.8V within an input voltage range of 1.8–3.6V, with a peak-to-peak ripple of less than 7mV under load current of 0–50mA and variations in process angle and temperature. The power efficiency can reach over 90% under heavy load (50mA) and over 73% under light load (1mA).

The invention discloses a chip resistor, and relates to the technical field of electronic components, the chip resistor comprises a resistor body and connecting electrodes, the connecting electrodes comprise a first electrode and a second electrode, the first electrode and the second electrode are connected to two opposite sides of the resistor body in the length direction, and the resistor body, the first electrode and the second electrode are all made of metal materials.

The invention discloses a novel tin-crack-resistant chip resistor and a manufacturing process thereof, the novel tin-crack-resistant chip resistor comprises a substrate, a front electrode and a back electrode which are respectively covered on the front surface and the back surface of the substrate, as well as a protective layer and an electroplated layer which are wrapped on the outer side, and a resistance layer is arranged between the front electrode and the protective layer; the bonding pad is characterized in that a conductor layer is arranged below the back electrode, and the size of the conductor layer is smaller than that of the back electrode, so that an inclined plane included angle of 30-60 degrees is formed between the electroplated layer wrapping the back electrode and the bonding pad bottom plate. One side of the conductor layer close to the outer side is flush with the outer side of the substrate, and one side of the inner side shrinks on the inner side of the back electrode to form a height difference step. Through the arrangement of the conductor layer, the contact surface of the resistor back conductor and the solder paste is changed from a plane to a three-dimensional curved surface, and the effective area is increased; the increased contact surface provides a multi-channel flow path for the solder, the bubble rate is reduced, and the tin crack resistance is effectively improved.