320 results about "Chip resistor" patented technology

The utility model discloses a chip resistor heat dissipation structure, which comprises a resistor main body structure, a first electrode structure and a second electrode structure, the first electrode structure and the second electrode structure are respectively arranged at two ends of the resistor main body structure, and the resistor main body structure comprises a ceramic substrate, a resistor layer, an inner protection layer and an outer protection layer, the resistance layer is arranged on one side of the upper end of the ceramic substrate, the inner protection layer is arranged on the outer side of the resistance layer, the outer protection layer is arranged on the outer side of the inner protection layer, a first reinforcing block is arranged in the middle of the interior of the ceramic substrate, and second reinforcing blocks are symmetrically arranged on the two sides of the first reinforcing block in the ceramic substrate. Compared with the prior art, the ceramic substrate has the advantages that the circulation grooves and the heat dissipation openings are additionally formed in the ceramic substrate, the heat dissipation speed of the ceramic substrate can be increased, meanwhile, the first reinforcing blocks and the second reinforcing blocks are additionally arranged, and therefore the stability of the structure of the ceramic substrate is guaranteed while internal heat dissipation of the ceramic substrate is not affected.

The invention discloses a broadband reflection-free filtering antenna which is provided with a stop-band energy absorption structure, a high-low impedance microstrip line and a yagi-like radiator which are connected in sequence. The yagi-like radiator is composed of a pair of dipole arms and two pairs of bilateral parallel parasitic patches. Wherein the stop-band energy absorption structure is composed of two microstrip line band-stop filters, two grounded chip resistors, a section of folded phase line and a section of input microstrip feeder line. The two microstrip band-stop filters are respectively connected with a grounded chip resistor, and the two microstrip band-stop filters are connected through a folding phase line. The antenna is high in structural compactness, and meanwhile, the integrated design of the filter and the antenna and the ultra-wide non-reflection bandwidth are realized.

According to the automatic assembling, braiding and tin dipping equipment for the chip resistor, a ceramic substrate is automatically fed and cracked into a resistor disc on a feeding and grain disassembling mechanism, a terminal braid is automatically fed and punched through a belt conveying mechanism and a terminal punching mechanism to obtain two terminals, and the resistor disc and the two terminals are automatically assembled after being transferred to an assembling station. According to the invention, the automatic feeding, processing and assembling of the resistor discs and the terminals in the double-terminal chip resistor can be realized, and the resistor discs are braided after being assembled, so that the automatic feeding, processing and assembling of the resistor discs and the terminals in the double-terminal chip resistor can be realized, and the automatic feeding, processing and assembling of the resistor discs and the terminals can be realized. Tin immersion welding is carried out in a resistor braid mode, the structure is compact, and the production efficiency is high; and finally, receiving is carried out in a cut-off mode, the strip-shaped resistor braid is convenient to store, and the resistor disc can be conveniently inserted into a mold to be packaged in the follow-up process.

According to the chip resistor and the preparation method thereof, the laser wire cutting grooves adjacent to the left electrode and the right electrode are formed in the resistance layer through laser cutting, the resistance value of the resistor can be accurately adjusted and controlled, the manufacturing precision and consistency of the resistor are improved, the laser cutting mode is optimized through diagonal cutting, and the production efficiency is improved. The laser wire cutting groove is limited at the diagonal position and is adjacent to the front electrode, and the heat effect of the resistor is correspondingly controlled, so that the heat dissipation performance is improved; according to the chip resistor, through a multi-layer protection structure formed by the first protection layer made of the glass material and the second protection layer made of the epoxy resin material, the invasion of moisture, chemical corrosion and mechanical damage is effectively prevented, the service life of the resistor in a severe environment is remarkably prolonged, and particularly, through the third protection layer made of the resin silver material, the service life of the resistor is prolonged. The anti-corrosion performance of the electrode part is enhanced, so that the resistor can keep stable electrical performance during long-time work.

The utility model belongs to the technical field of new energy vehicle charging, and discloses an alternating current and direct current integrated charging socket which comprises a square plate, an alternating current socket assembly and a direct current socket assembly are arranged on the square plate, the alternating current socket assembly comprises an AC insulator, an AC tail cover is arranged on the rear side of the AC insulator, and an AC circuit board is arranged in the AC tail cover. The AC circuit board is provided with five AC power contacts, two pin contacts and four chip resistors, the DC socket assembly comprises a DC insulator, the rear side of the DC insulator is provided with a pressing plate, the DC insulator is internally provided with a DC circuit board, the DC circuit board is provided with two DC power contacts and six pin contacts, the DC power contacts are provided with temperature sensors, and the temperature sensors are provided with temperature sensors. And the six pin contacts and the two temperature sensors on the DC circuit board are communicated to the ten-core low-voltage plug-in. The signal pin of the charging gun is in direct contact with the circuit board, signals are collected by the circuit board and then are connected with an automobile control system through a signal line, signal transmission can be carried out without redundant parts and wire harnesses, the structure is simple, and assembly is easy.

The invention discloses a semi-automatic resistance measuring instrument, which belongs to the technical field of chip resistor resistance measurement, and comprises a rack, a mounting platform, a driving mechanism and a measuring mechanism, the mounting platform is fixed on the rack, the driving mechanism is fixed on the mounting platform, and the measuring mechanism is arranged on a movable module of the driving mechanism and comprises a multi-path flying probe switching assembly and a resistor positioning and clamping device. The multi-path flying probe switching assembly is used for realizing adaptation and measurement of resistor substrates with different specifications by replacing flying probe groups, and is driven by the driving mechanism to move to a position above the detection station; the resistor positioning and clamping device is used for clamping and positioning a resistor substrate to be detected and is driven by the driving mechanism to move to a detection station; in the multi-path flying probe switching assembly, flying probes can move downwards to be in contact with a resistor substrate to be detected on the resistor positioning and clamping device, and detection is carried out. The method is mainly applied to the measurement of the resistance value of the chip resistor on the resistor substrate, and can meet the measurement requirements of miniaturization and high density.

The resistor body of the chip resistor is provided with a resistance value adjusting part. A meandering forming portion is formed in the resistance value adjusting portion. In the meandering forming portion, the first trimming groove and the second trimming groove are arranged along a first direction (longitudinal direction). The first trimming groove has a first linear portion extending from a second edge of the resistance value adjusting portion along a second direction (short side direction). The second trimming groove has a second linear portion extending from the second edge of the resistance value adjusting portion in the second direction, and a bent portion extending from the tip of the second linear portion toward the first trimming groove.

The invention belongs to the technical field of microwave antennas, and particularly provides a tight coupling phased-array antenna based on an application frequency-variable impedance matching layer, so as to solve the challenges of the existing phased-array antenna in the aspects of dynamic adjustability and environmental adaptability. The three-order Chebyshev impedance converter comprises a reconfigurable surface loaded with a diode, a bow-tie type dipole, a double-Y balun, a three-order Chebyshev impedance converter, a coaxial feed port, a metal floor, a dielectric layer, a grounding metal sheet and a metal chip resistor. The three-order Chebyshev impedance transformer, the chip resistor and the double-Y balun are cascaded to carry out broadband balanced feed on the dipole, and the dielectric constant and the magnetic conductivity of the dielectric substrate are changed through the on-off of the diode, so that the impedance matching and radiation characteristics of the phased-array antenna are improved. According to the invention, dynamic requirements of modern communication and radar systems on antenna performance can be met.

The invention specifically provides a low-cross-polarization ultra-wideband wide-angle scanning low-profile tight coupling phased-array antenna based on metal grid loading, and belongs to the technical field of microwave antennas. The three-order Chebyshev impedance transformer comprises a C-shaped ring metasurface loading wide-angle matching layer, a folded dipole, a double-Y balun, a three-order Chebyshev impedance transformer, a coaxial feed port, a metal floor, a metal grid, a grounding metal sheet, a resistive film, a dielectric layer and a metal chip resistor. Different polarization electromagnetic waves are regulated and controlled through the metal grid, the resistive film is introduced to absorb cross polarization components, the front-to-back ratio is improved, and the cross polarization level is smaller than or equal to-30 dB; the working bandwidth is expanded to 5.6: 1 under the condition that the profile is only 0.09 lambda by combining the size design of the non-uniform unit and the gradient balun feed, and the scanning of the wide angle of + / -60 degrees of an E surface and an H surface is supported. The invention has the advantages of compact structure, high polarization purity and wide-angle stability, and is suitable for 5G / 6G communication, radar and electronic countermeasure systems.

The invention provides a current measuring device of a power semiconductor device test circuit and a measuring method thereof. The current measuring device comprises a multi-layer circuit board and a plurality of chip resistors, the multi-layer circuit board at least comprises a first circuit board and a second circuit board which are oppositely arranged, the multi-layer circuit board is provided with a plurality of first through holes penetrating through the multi-layer circuit board, and the at least two chip resistors are connected in parallel. Each chip resistor is embedded into each first through hole of the multilayer circuit board, each chip resistor comprises a first detection end and a second detection end which are oppositely arranged, and the current direction of the wire of the circuit to be detected connected to the first detection end is at least partially opposite to the current direction of the wire of the circuit to be detected connected to the second detection end; the first detection end and the second detection end are both used for being externally connected with a voltage measuring device. It is possible to provide a current measuring device with high bandwidth and low insertion inductance.

A load cell includes a bridge circuit that converts and outputs a change in resistance of a strain gauge, which changes in accordance with a load. The load cell includes, in a first path on one side of the bridge circuit, a first chip resistor that adjusts an initial balance of the bridge circuit, and a thermistor that compensates for a temperature characteristic of the bridge circuit and a first adjustment resistor that adjusts a deviation of the initial balance with the thermistor being provided, which are connected in series with the first chip resistor and connected in parallel. The load cell includes, in a second path on another side of the bridge circuit, a second chip resistor that adjusts the initial balance, and a second adjustment resistor that adjusts the deviation caused by providing the first adjustment resistor and is connected in series with the second chip resistor.

This chip resistor is provided with a ceramic substrate, two electrodes that are disposed on the ceramic substrate, and a resistor that electrically connects the two electrodes. The ceramic substrate comprises a base material that contains a sintered body of ceramic particles (A) and a covering that contains a sintered body of α-alumina particles (B). The covering covers at least a part of the surface of the base material. The average particle diameter of the α-alumina particles (B) is smaller than the average particle diameter of the ceramic particles (A). The ceramic substrate has a support surface, the support surface-side surface of the base material is covered with the covering, and the resistor overlaps the support surface.

The invention relates to the technical field of supply chain product quality inspection, in particular to an AI model-based supply chain intelligent quality inspection and defect identification system, which comprises a texture feature adaptive unit, a defect identification dynamic adjustment unit, an AI defect identification unit and a control output unit, the texture feature adaptive unit extracts texture density, contrast and edge gradient direction distribution of a chip resistor grey-scale map in real time, the texture density, the contrast and the edge gradient direction distribution are dynamically compared with a historical batch feature library to generate texture feature difference mapping, the defect identification dynamic adjustment unit nonlinearly adjusts a gradient deviation threshold value through an S-shaped response function according to the difference mapping, and the defect identification accuracy is improved. The AI defect identification unit adopts a convolutional neural network, outputs a defect classification result through parallel branch processing, spatial pyramid pooling and secondary verification, controls the output unit to transmit the result to an execution mechanism, records batch switching parameters, solves the problem of false and missing judgment caused by batch texture fluctuation, and improves the detection accuracy. And the quality inspection precision is improved.

The invention relates to the technical field of material rolling structures, in particular to a semiconductor ceramic chip resistor material disc which comprises inner discs, a connecting shaft, an outer ring, a fixing assembly, a supporting assembly and a rolling assembly, the connecting shaft is connected between the two inner discs, the rolling assembly is connected to the outer walls of the inner discs, the outer ring is connected to the outer walls of the inner discs, and the fixing assembly is connected to the supporting assembly. An annular groove is formed in the inner wall of the outer ring, and the rolling assembly is connected with the annular groove. By arranging the inner disc and the outer ring, an original overall structure is divided into a double-layer structure, in the feeding process, the inner disc rotates in the outer ring, then the situation that the whole material disc rotates in a tray of a chip mounter and rubs with the tray is avoided, and then generation of static electricity is reduced; the rotating resistance of the outer ring in the tray is further increased, rotation of the outer ring is avoided, and due to the fact that no friction exists between the outer ring and the tray, abrasion of the outer ring is reduced, and the service life of the charging tray is prolonged.

The invention relates to a wide-angular-domain low-scattering omnidirectional microstrip antenna, which comprises a first dielectric substrate, wherein an upper radiation patch and an annular wave-absorbing structure are etched on the upper surface of the first dielectric substrate, and a lower radiation patch is etched on the lower surface of the first dielectric substrate; the upper radiation patch is located on the inner side of the annular wave-absorbing structure and is connected with the lower radiation patch through the first metal via hole; a plurality of first chip resistors distributed along the circumference are arranged on the annular wave-absorbing structure; the second dielectric substrate is located below the lower radiation patch, and a metal floor is etched on the lower surface of the second dielectric substrate; the metal floor is connected with the upper radiation patch through the second metal via hole and is connected with the annular wave-absorbing structure through the third metal via hole; the upper surface of the metal floor is provided with a plurality of second chip resistors, and the upper radiation patch is connected with the second chip resistors through fourth metal through holes. The triple wave absorbing paths are directly integrated on the antenna body, the low scattering performance is achieved, the original profile height is kept, and the dual-polarization single-station and dual-station RCS in the upper half space of the antenna is effectively reduced.

To provide a chip resistor having lower electric resistance and more stable quality.SOLUTION: The chip resistor 1 includes a metallic resistor 10, a first plated electrode 21, and a second plated electrode 22. The metal resistor 10 includes a first bottom plate portion 11, a second bottom plate portion 12, a top plate portion 13, a first inclined leg portion 14, and a second inclined leg portion 15. The first plating electrode 21 is disposed on the bottom surface of the first bottom plate portion 11, the bottom surface of the first inclined leg portion 14, and the bottom surface of the top plate portion 13. The second plating electrode 22 is disposed on the bottom surface of the second bottom plate portion 12, the bottom surface of the second inclined leg portion 15, and the bottom surface of the top plate portion 13.SELECTED DRAWING: Figure 3

The invention discloses a low-profile ultra-wideband time-domain antenna, and the antenna comprises an installation platform which is provided with a rectangular metal cavity at a top opening position, and the rectangular metal cavity is used for transmitting or receiving electromagnetic waves; the antenna is arranged in the rectangular metal cavity, and the antenna is used for receiving or transmitting horizontally polarized electromagnetic waves; the antenna comprises an SSMA connector, a radiation metal sheet and a chip resistor, the SSMA connector is assembled on the radiation metal sheet, and the radiation metal sheet is provided with the chip resistor; a radiation main body of the radiation metal sheet is an asymmetric heterogeneous metal sheet, a feed matching groove, a structure transition groove and a radiation groove are arranged in the radiation main body, and the radiation main body is bent. The antenna is novel in structural form, simple and reliable, achieves the performances of ultra wide band, low profile, miniaturization, specific wave beam coverage range and the like, and has a wide popularization prospect.

The present invention relates to the technical field of LED light strips, and in particular to a high-power and high-efficiency heat dissipation LED light strip, comprising a film-type light strip body, a heat dissipation adhesive, a chip resistor and an LED lamp bead. The film-type light strip body and the heat dissipation adhesive are used to replace a traditional hard aluminum substrate, so as to reduce the heat conduction distance between the heat dissipation adhesive and the film-type light strip body, increase the heat flux density, promote the heat dissipation of the film-type light strip body, and the film-type light strip body is lighter and the LED light strip is bendable. The heat dissipation adhesive is used to dissipate the heat of the film-type light strip body, which not only avoids the light strip being damaged due to drilling holes or screwing during installation, but also facilitates installation and has a heat dissipation effect. In addition, the side wall of the film-type light strip body is protruded with a first heat dissipation fin evenly arranged at intervals, and the side wall of the heat dissipation adhesive is protruded with a second heat dissipation fin evenly arranged at intervals and corresponding to the first heat dissipation fin one by one, thereby increasing the heat dissipation area between the high-power and high-efficiency heat dissipation LED light strip and the air, and further improving the heat dissipation efficiency.

The utility model relates to the technical field of chip resistor production, in particular to a chip resistor production strip folding device which comprises an operation table, a control panel is fixedly connected to the front surface of the operation table, a chip resistor plate body is arranged on the upper surface of the operation table, and a sliding groove is formed in the top face of the operation table. A first moving frame and a second moving frame are sequentially arranged in the sliding groove from left to right. And the lead screw body is installed in the first moving frame, and a first motor is arranged at the right end of the lead screw body. According to the chip resistor plate conveying device, the first moving frame can be driven to slide towards the right side in the sliding groove through rotation of the first motor, chip resistor plate bodies can be conveyed in a limited mode through abutting of the first abutting block and the second abutting block, the overall conveying effect is good, the positions of the chip resistor plate bodies can be fixed, and the conveying efficiency is improved. The position of the surface chip resistance plate body deviates during operation.

The utility model provides a chip resistor. The chip resistor comprises a substrate, a back electrode, a front electrode, a resistive layer, a protective layer and a side electrode, the protective layer comprises a first protective layer and a second protective layer; the first protective layer is made of a glass material, and the second protective layer is made of at least two layers of epoxy resin materials; a third protective layer is formed on the left electrode and the right electrode which are not covered, and the third protective layer is made of a resin silver material; through a multi-layer protection structure formed by the first protection layer made of the glass material and the second protection layer made of the epoxy resin material, invasion of moisture, chemical corrosion and mechanical damage is effectively prevented, the service life of the resistor in a severe environment is remarkably prolonged, and particularly, through the third protection layer made of the resin silver material, the service life of the resistor is prolonged. The anti-corrosion performance of the electrode part is enhanced, so that the resistor can keep stable electrical performance during long-time work.

To provide a resistor paste capable of achieving both high resistivity and low TCR of a resistor.SOLUTION: The resistor paste includes metal particles, insulating particles, glass particles, and metal silicide. The metal particles contain copper and nickel. The insulating particles contain at least one of alumina, zirconia, zinc oxide, and boron nitride. A chip resistor 1 includes a resistor 13 and a substrate 11. The resistor 13 is formed on the substrate 11 using the above-mentioned resistor paste as a material.SELECTED DRAWING: Figure 1

The utility model discloses a universal chip resistor test fixture, including seat body, bearing mechanism, elevating mechanism, probe subassembly and connector, the bearing mechanism is used for bearing the resistance sample piece, elevating mechanism includes compressible piece and drive subassembly that drives the compressible piece to move, has ensured the accurate contact of probe and resistance sample piece, probe subassembly includes four probe, and the connector is connected with the probe subassembly. The four probes are detachably connected with the four-in and four-out connector, and the four-in and four-out connector is detachably connected with the detection equipment through the transmission line, so that the universality and flexibility of the test fixture are greatly improved. Moreover, the test fixture reduces the dependence on a connector of a specific model, thereby remarkably reducing the cost, and enabling the test fixture to be connected with test devices of different models, thereby facilitating the comparison of the test results of different test devices.

The invention discloses a MINI RGB LED lamp bead with a built-in resistor and a preparation method of the MINI RGB LED lamp bead, and relates to the technical field of LEDs, the MINI RGB LED lamp bead with the built-in resistor comprises a substrate, a first chip, a second chip, a third chip and a chip resistor; the front surface of the substrate is provided with a front circuit, the back surface of the substrate is provided with a back circuit, and the front circuit and the back circuit are connected through a through hole; the front circuit comprises a die bonding area, a bonding wire area, an insulating area and a groove area; the die bonding area comprises a first die bonding area, a second die bonding area and a third die bonding area which are separated from one another, the first chip is arranged in the first die bonding area, the second chip is arranged in the second die bonding area, and the third chip is arranged in the third die bonding area; a groove is formed in the groove area, and the chip resistor is arranged in the groove and connected with the first chip in series. According to the invention, burning of the lamp beads and caterpillars on the display screen due to water vapor permeation can be reduced, so that the process yield and the display effect are improved.

To provide a thin film chip resistor capable of preventing the resistance value from becoming unstable due to the heat generated by trimming and absorbed by a second parallel resistor pattern.SOLUTION: The thin film chip resistor includes a second parallel resistor pattern 24e in which an adjacent folded portion of a zigzag resistor pattern 24b is connected by a substantially U-shaped resistor pattern 24d. Each of the approximately U-shaped resistor patterns 24d has a separate trimming groove 30b formed opposite the longitudinal side of an insulating circuit board 21.SELECTED DRAWING: Figure 2

The invention discloses a chip resistor performance test support tin soldering tool and a workpiece positioning method. The chip resistor performance test support tin soldering tool comprises an electric heater, a fixing plate, a glass plate, a manual lifting assembly, a limiting column, a positioning supporting column and a material pressing device. Limiting columns and positioning supporting columns are fixedly assembled at the four corners of a heating platform of the electric heater. The fixed plate is provided with a plurality of detection seat positioning grooves, four corners of the detection seat positioning grooves are provided with fixed plate positioning holes, and the fixed plate positioning holes are matched with the positioning support columns; the glass plate is provided with pressing device mounting holes with the same number as the detection seat positioning grooves on the fixed plate, the four corners of the glass plate are provided with limiting long holes and positioning round holes, and the left and right edges of the glass plate are provided with manual lifting assemblies; and the material pressing device is arranged in the material pressing device mounting hole of the glass plate. The requirement for the set range of the thickness of the tin soldering layer on the bottom face of the cross-shaped supporting frame is met, and the purpose of guaranteeing the reliability of the performance index testing result of the chip resistor is achieved.

To provide a chip resistor having excellent surge characteristics and suitable for miniaturization.SOLUTION: A chip resistor 1 according to the present invention has a crank-shaped resistor 7 having a first resistor portion 7a, a second resistor portion 7b, and a third resistor portion 7c, and a first trimming groove 12 and a second trimming groove 13 are formed with their starting ends at positions that are approximately point-symmetric on the upper and lower sides of the first resistor portion 7a, and the ending positions of the first trimming groove 12 and the second trimming groove 13 are set so as not to exceed a first straight line A that passes through the center (point O) of the first resistor portion 7a and extends in the X-axis direction, and so as not to overlap on the same Y-axis.SELECTED DRAWING: Figure 3

The utility model discloses a low-temperature-resistant shunt resistor assembly which comprises a resistor body, an input side wire connector, an output side wire connector and two substrates, one end of the resistor body is electrically connected with the input side wire connector, the other end of the resistor body is electrically connected with the output side wire connector, one substrate is connected into a gap between the resistor body and the input side wire connector, and the other substrate is connected into a gap between the resistor body and the output side wire connector; the resistor body comprises two T-shaped blocks and a plurality of groups of sheet-shaped resistors which are distributed at equal intervals, one side of each sheet-shaped resistor is connected to one T-shaped block, and the other side of each sheet-shaped resistor is connected to the other T-shaped block. The low-temperature-resistant shunt resistor assembly disclosed by the utility model has the beneficial effects that the substrate can bear and conduct deformation of the resistor body caused by temperature change in high and low temperature environments, so that the influence of the temperature change on the performance of the chip resistor is reduced.

This resistor paste contains: metal particles including copper and nickel; insulating particles including at least one from among aluminum oxide, zirconium oxide, zinc oxide, and boron nitride; glass particles; silicon particles; and an organic vehicle.

The invention relates to the technical field of resistance testing, in particular to a resistance testing system and method, and the system comprises a rack which is internally provided with a feeding table, an x-axis motion module, a normal-temperature resistance positioning platform and a high-temperature resistance positioning platform. The normal-temperature resistor positioning platform and the high-temperature resistor positioning platform are adjacently arranged and located between the feeding table and the x-axis movement module, a y-axis movement module is arranged on the x-axis movement module, and a probe positioning mechanism, a probe testing mechanism and a suction mechanism are arranged on the y-axis movement module. The suction mechanism is used for moving the resistor from the feeding table to the normal-temperature resistor positioning platform or the high-temperature resistor positioning platform, and the probe positioning mechanism is used for acquiring the position information of the resistor and controlling the probe testing mechanism to adjust the butt joint position with the resistor. According to the invention, the butt joint precision between the probe plate and the chip resistor can be improved, and the reliability of batch test of resistors is ensured.

The utility model relates to the technical field of resistor production, in particular to a high-speed braiding machine for chip resistors, which comprises a support, and a vibrating disc, a feeding mechanism and a conveying table are mounted on the top surface of the support; a cutting structure is installed on the top face of the support and comprises an installation frame, the installation frame is fixedly installed on the top face of the support, a resistance heating block is fixedly installed on the inner side of the installation frame, an electric telescopic rod is fixedly installed on the top face of the installation frame, and the extending end of the electric telescopic rod is fixedly connected with a cutting knife body. And the top surface of the cutting knife main body is in threaded connection with a guide column. The rubber rollers are arranged on the lower side of the cutting knife body and can be pressed on the two sides of the cutting position of the carrier tape, the cut carrier tape can be positioned, when the cutting knife body is lifted and reset, the carrier tape can be located at the original position of the top face of a conveying table, normal conveying work of the carrier tape on the conveying table can be guaranteed, and follow-up machining production is facilitated.