174 results about "Chip resistor" patented technology

The invention relates to the technical field of supply chain product quality inspection, in particular to an AI model-based supply chain intelligent quality inspection and defect identification system, which comprises a texture feature adaptive unit, a defect identification dynamic adjustment unit, an AI defect identification unit and a control output unit, the texture feature adaptive unit extracts texture density, contrast and edge gradient direction distribution of a chip resistor grey-scale map in real time, the texture density, the contrast and the edge gradient direction distribution are dynamically compared with a historical batch feature library to generate texture feature difference mapping, the defect identification dynamic adjustment unit nonlinearly adjusts a gradient deviation threshold value through an S-shaped response function according to the difference mapping, and the defect identification accuracy is improved. The AI defect identification unit adopts a convolutional neural network, outputs a defect classification result through parallel branch processing, spatial pyramid pooling and secondary verification, controls the output unit to transmit the result to an execution mechanism, records batch switching parameters, solves the problem of false and missing judgment caused by batch texture fluctuation, and improves the detection accuracy. And the quality inspection precision is improved.

The invention relates to the technical field of material rolling structures, in particular to a semiconductor ceramic chip resistor material disc which comprises inner discs, a connecting shaft, an outer ring, a fixing assembly, a supporting assembly and a rolling assembly, the connecting shaft is connected between the two inner discs, the rolling assembly is connected to the outer walls of the inner discs, the outer ring is connected to the outer walls of the inner discs, and the fixing assembly is connected to the supporting assembly. An annular groove is formed in the inner wall of the outer ring, and the rolling assembly is connected with the annular groove. By arranging the inner disc and the outer ring, an original overall structure is divided into a double-layer structure, in the feeding process, the inner disc rotates in the outer ring, then the situation that the whole material disc rotates in a tray of a chip mounter and rubs with the tray is avoided, and then generation of static electricity is reduced; the rotating resistance of the outer ring in the tray is further increased, rotation of the outer ring is avoided, and due to the fact that no friction exists between the outer ring and the tray, abrasion of the outer ring is reduced, and the service life of the charging tray is prolonged.

The invention relates to a wide-angular-domain low-scattering omnidirectional microstrip antenna, which comprises a first dielectric substrate, wherein an upper radiation patch and an annular wave-absorbing structure are etched on the upper surface of the first dielectric substrate, and a lower radiation patch is etched on the lower surface of the first dielectric substrate; the upper radiation patch is located on the inner side of the annular wave-absorbing structure and is connected with the lower radiation patch through the first metal via hole; a plurality of first chip resistors distributed along the circumference are arranged on the annular wave-absorbing structure; the second dielectric substrate is located below the lower radiation patch, and a metal floor is etched on the lower surface of the second dielectric substrate; the metal floor is connected with the upper radiation patch through the second metal via hole and is connected with the annular wave-absorbing structure through the third metal via hole; the upper surface of the metal floor is provided with a plurality of second chip resistors, and the upper radiation patch is connected with the second chip resistors through fourth metal through holes. The triple wave absorbing paths are directly integrated on the antenna body, the low scattering performance is achieved, the original profile height is kept, and the dual-polarization single-station and dual-station RCS in the upper half space of the antenna is effectively reduced.

To provide a chip resistor having lower electric resistance and more stable quality.SOLUTION: The chip resistor 1 includes a metallic resistor 10, a first plated electrode 21, and a second plated electrode 22. The metal resistor 10 includes a first bottom plate portion 11, a second bottom plate portion 12, a top plate portion 13, a first inclined leg portion 14, and a second inclined leg portion 15. The first plating electrode 21 is disposed on the bottom surface of the first bottom plate portion 11, the bottom surface of the first inclined leg portion 14, and the bottom surface of the top plate portion 13. The second plating electrode 22 is disposed on the bottom surface of the second bottom plate portion 12, the bottom surface of the second inclined leg portion 15, and the bottom surface of the top plate portion 13.SELECTED DRAWING: Figure 3

The utility model provides a chip resistor. The chip resistor comprises a substrate, a back electrode, a front electrode, a resistive layer, a protective layer and a side electrode, the protective layer comprises a first protective layer and a second protective layer; the first protective layer is made of a glass material, and the second protective layer is made of at least two layers of epoxy resin materials; a third protective layer is formed on the left electrode and the right electrode which are not covered, and the third protective layer is made of a resin silver material; through a multi-layer protection structure formed by the first protection layer made of the glass material and the second protection layer made of the epoxy resin material, invasion of moisture, chemical corrosion and mechanical damage is effectively prevented, the service life of the resistor in a severe environment is remarkably prolonged, and particularly, through the third protection layer made of the resin silver material, the service life of the resistor is prolonged. The anti-corrosion performance of the electrode part is enhanced, so that the resistor can keep stable electrical performance during long-time work.

To provide a resistor paste capable of achieving both high resistivity and low TCR of a resistor.SOLUTION: The resistor paste includes metal particles, insulating particles, glass particles, and metal silicide. The metal particles contain copper and nickel. The insulating particles contain at least one of alumina, zirconia, zinc oxide, and boron nitride. A chip resistor 1 includes a resistor 13 and a substrate 11. The resistor 13 is formed on the substrate 11 using the above-mentioned resistor paste as a material.SELECTED DRAWING: Figure 1

To provide a thin film chip resistor capable of preventing the resistance value from becoming unstable due to the heat generated by trimming and absorbed by a second parallel resistor pattern.SOLUTION: The thin film chip resistor includes a second parallel resistor pattern 24e in which an adjacent folded portion of a zigzag resistor pattern 24b is connected by a substantially U-shaped resistor pattern 24d. Each of the approximately U-shaped resistor patterns 24d has a separate trimming groove 30b formed opposite the longitudinal side of an insulating circuit board 21.SELECTED DRAWING: Figure 2

The invention discloses a chip resistor performance test support tin soldering tool and a workpiece positioning method. The chip resistor performance test support tin soldering tool comprises an electric heater, a fixing plate, a glass plate, a manual lifting assembly, a limiting column, a positioning supporting column and a material pressing device. Limiting columns and positioning supporting columns are fixedly assembled at the four corners of a heating platform of the electric heater. The fixed plate is provided with a plurality of detection seat positioning grooves, four corners of the detection seat positioning grooves are provided with fixed plate positioning holes, and the fixed plate positioning holes are matched with the positioning support columns; the glass plate is provided with pressing device mounting holes with the same number as the detection seat positioning grooves on the fixed plate, the four corners of the glass plate are provided with limiting long holes and positioning round holes, and the left and right edges of the glass plate are provided with manual lifting assemblies; and the material pressing device is arranged in the material pressing device mounting hole of the glass plate. The requirement for the set range of the thickness of the tin soldering layer on the bottom face of the cross-shaped supporting frame is met, and the purpose of guaranteeing the reliability of the performance index testing result of the chip resistor is achieved.

The utility model discloses a low-temperature-resistant shunt resistor assembly which comprises a resistor body, an input side wire connector, an output side wire connector and two substrates, one end of the resistor body is electrically connected with the input side wire connector, the other end of the resistor body is electrically connected with the output side wire connector, one substrate is connected into a gap between the resistor body and the input side wire connector, and the other substrate is connected into a gap between the resistor body and the output side wire connector; the resistor body comprises two T-shaped blocks and a plurality of groups of sheet-shaped resistors which are distributed at equal intervals, one side of each sheet-shaped resistor is connected to one T-shaped block, and the other side of each sheet-shaped resistor is connected to the other T-shaped block. The low-temperature-resistant shunt resistor assembly disclosed by the utility model has the beneficial effects that the substrate can bear and conduct deformation of the resistor body caused by temperature change in high and low temperature environments, so that the influence of the temperature change on the performance of the chip resistor is reduced.

This resistor paste contains: metal particles including copper and nickel; insulating particles including at least one from among aluminum oxide, zirconium oxide, zinc oxide, and boron nitride; glass particles; silicon particles; and an organic vehicle.

The invention relates to the technical field of resistance testing, in particular to a resistance testing system and method, and the system comprises a rack which is internally provided with a feeding table, an x-axis motion module, a normal-temperature resistance positioning platform and a high-temperature resistance positioning platform. The normal-temperature resistor positioning platform and the high-temperature resistor positioning platform are adjacently arranged and located between the feeding table and the x-axis movement module, a y-axis movement module is arranged on the x-axis movement module, and a probe positioning mechanism, a probe testing mechanism and a suction mechanism are arranged on the y-axis movement module. The suction mechanism is used for moving the resistor from the feeding table to the normal-temperature resistor positioning platform or the high-temperature resistor positioning platform, and the probe positioning mechanism is used for acquiring the position information of the resistor and controlling the probe testing mechanism to adjust the butt joint position with the resistor. According to the invention, the butt joint precision between the probe plate and the chip resistor can be improved, and the reliability of batch test of resistors is ensured.

The invention discloses identification printing equipment for a ceramic resistor, and relates to the field of code spraying and printing. According to the technical scheme, the device comprises an equipment box, a feeding assembly and a receiving assembly are assembled on the two sides of the equipment box correspondingly, and the feeding assembly and the receiving assembly are used for feeding and receiving correspondingly; the code spraying mechanism is assembled on the equipment box and is used for spraying and printing; the material guide groove is fixed on the equipment box and is used for guiding materials; the rotary adsorption mechanism is assembled below the material guide groove and is used for adsorbing the material belt; the acquisition unit is arranged on the equipment box and is used for acquiring working data in real time; and the quality analysis module calculates a code spraying quality index based on the work data formulation and compares the code spraying quality index with a preset code spraying quality index threshold value to judge whether the code spraying quality index is abnormal or not, when the material belt passes through the material guide groove, the material belt is rotationally adsorbed and fixed through the rotary adsorption mechanism, and the material belt passes through the material guide groove. The material belt conveying stability is improved, and the code spraying quality is guaranteed.

This application relates to the field of thermistor technology, specifically disclosing an NTC thermistor material, a chip resistor, and its preparation method and application. The NTC thermistor material provided in this application comprises a base material and 3-13% additives by weight; the base material comprises Mn3O4, Co3O4, Al2O3, Fe2O3, and ZnO in a weight ratio of (10-40):(10-50):(1-15):(10-25):(5-19); the additives comprise MgAl2O4, Nb2O5, and TiO2 in a weight ratio of (1-200):(1-10):(5-25); this application also provides a chip resistor made using the NTC thermistor material. The NTC thermistor material provided in this application has a high material constant B value and a low room temperature resistivity ρ. 25 It can meet the application requirements of high-precision and high-reliability temperature sensors.

The embodiment of the utility model discloses a mining belt conveyor frequency converter logic control board which comprises a PCB, the PCB is installed on a module frame, the left side of the PCB is provided with a plurality of first relays, SMD light-emitting diodes, SMD resistors and SMD diodes, the middle of the surface of the PCB is provided with a relay base, a second relay is installed on the relay base, and the SMD resistors are installed on the PCB. A first terminal base and a second PCB terminal base are arranged on the upper side of the PCB, and a first terminal base, a third PCB terminal base and a fourth PCB terminal base are arranged on the lower side of the PCB. According to the utility model, the installation space is obviously saved, complex external wiring is avoided, the overall structure is more compact and concise, the integration level of equipment is improved, and the difficulty of installation and maintenance is reduced.

The utility model belongs to the technical field of electronic components, and particularly relates to a beam welding alloy current detection chip resistor which comprises a current detection resistor and a circuit board, a shock absorption support is arranged between the current detection resistor and the circuit board, a buffer plate and a spring are arranged on the shock absorption support, and under the environment of high-frequency vibration or strong impact, the circuit board firstly extrudes the buffer plate, and then the buffer plate is pressed by the spring. The buffer plate drives the spring to move towards the damping bracket in the moving space, and as the fastening plate made of rubber is mounted, the vibration transmitted to the current detection resistor by the circuit board is further reduced by buffering through a rebound groove in the fastening plate; compared with the prior art, the vibration between the current detection resistor and the circuit board is reduced, and the stability of the current detection resistor is improved.

The invention belongs to the field of thick film electronic element manufacturing, and particularly relates to chip resistor MK layer UV curing slurry and a preparation method thereof. The problems that an existing UV curing protective layer is insufficient in heat resistance, and cracking and falling are caused by mismatching of thermal expansion coefficients are solved. Through an epoxy-organic silicon hybrid resin system and a composite functional filler, the resin system comprises trimethylolpropane triacrylate, hexanediol diacrylate, an epoxy acrylate oligomer, an organic silicon modified acrylate oligomer, a phosphorus-containing acrylate functional monomer and a thermal polymerization inhibitor, and the functional filler is prepared from modified spherical aluminum oxide, modified silicon dioxide, a photoinitiator, a photoinitiator, a photoinitiator, a photoinitiator, a photoinitiator and a photoinitiator. According to the invention, the thermal shock resistance and insulation reliability of the protective layer are improved while the high efficiency of the UV photocuring process is maintained.

This chip resistor comprises a substrate, a first electrode and a second electrode, and a resistor. A first trimming groove and a second trimming groove are formed in the resistor. The first trimming groove has a first linear portion and a second linear portion. The first linear portion extends from a first end edge of the resistor toward a second end edge thereof along a second direction intersecting a first direction. The second linear portion extends from a distal-end portion of the first linear portion toward the second trimming groove. The second trimming groove has a third linear portion and a curved portion. The third linear portion extends from the first end edge of the resistor toward the second end edge thereof. The curved portion extends from a distal-end portion of the third linear portion toward the first trimming groove. The curved portion is convex in a direction from the first end edge toward the second end edge.

The invention discloses a power semiconductor device with an external gate resistor, and relates to the field of semiconductor devices, the power semiconductor device with the external gate resistor comprises a semiconductor substrate, and a gate bus, a first gate connection region and a second gate connection region which are arranged on the front surface of the semiconductor substrate, the second gate connection region is electrically connected with a gate bus; and providing an external gate resistor, one end of the external gate resistor being electrically connected with the first gate connection region, and the other end of the external gate resistor being electrically connected with the second gate connection region. Through the structural design, the external chip resistor is used for replacing a traditional grid built-in resistor RGint made of polycrystalline silicon, the repeated tape-out verification period caused by the improper built-in resistor can be avoided, meanwhile, due to the flexibility of the external chip resistor, the grid resistance value requirements of different application scenes can be met, and the effects of reducing cost and increasing efficiency are achieved.

In a chip resistor, a first trimming groove has: a first linear portion extending linearly from a first edge along an X-axis direction; and a second linear portion extending linearly along the Y-axis direction. The second trimming groove includes: a third linear portion disposed on a second upper surface electrode side of the first linear portion and extending linearly along the first linear portion 1 from the first edge; and a fourth linear portion disposed on the second edge side of the second linear portion and extending linearly along the second linear portion from the tip of the third linear portion. When viewed in the X-axis direction, the tip of the second trimming groove is positioned closer to the second upper surface electrode side than the tip of the first trimming groove.

The invention belongs to the field of electronic component materials, and discloses UV curing slurry for a first protective layer of a chip resistor and a preparation method of the UV curing slurry. The UV curing slurry is prepared from the following raw materials in parts by weight: 30 to 50 parts of silicon-containing epoxy acrylate resin, 10 to 20 parts of polyurethane acrylate resin, 10 to 20 parts of modified polyphosphazene resin, 15 to 25 parts of reactive diluent, 5 to 8 parts of photoinitiator, 5 to 10 parts of composite boron nitride powder, 5 to 10 parts of inorganic filler, 0.1 to 1 part of wetting agent, 0.1 to 1 part of flatting agent and 0.5 to 2 parts of adhesion promoter, the protective layer formed by curing the slurry has the advantages of high hardness, high heat resistance and excellent insulating property.

The utility model provides a chip resistor, which relates to the technical field of resistors, and comprises a protective layer, a ventilation assembly fixedly connected in the protective layer, a heat dissipation assembly fixedly connected in the ventilation assembly, the ventilation assembly comprises a heat dissipation layer, the outer side of the heat dissipation layer is fixedly connected on the protective layer, and the bottom end of the heat dissipation layer is fixedly connected with a resistance layer. The bottom end of the resistance layer is fixedly connected with the heat conduction layer, and the bottom end of the heat conduction layer is fixedly connected with the substrate layer, so that by optimizing a heat conduction path and increasing a heat dissipation surface area, the working temperature of the resistor body is reduced, and measurement errors caused by temperature rise are reduced; the problem of heat accumulation of an existing chip resistor under a high-power condition is effectively solved, measurement errors caused by temperature rise are solved, and the stability of the resistor under various application occasions is improved.

The present disclosure provides a laminated ceramic sintered body substrate for electronic devices, an electronic device, a chip resistor, and a method for manufacturing a chip resistor. The laminated ceramic sintered body substrate for electronic devices includes a ceramic sintered body substrate and a planarization film provided on an upper surface of the ceramic sintered body substrate, the planarization film containing a thermally conductive filler.

The invention relates to the technical field of intelligent power distribution system manufacturing, and provides a chip resistor detection device which comprises a base, a supporting rod is welded and fixed to the top end face of the base, a top plate is welded and fixed to the top end of the supporting rod, a mounting block is welded and fixed to the supporting rod, and a fixing frame is welded and fixed to the mounting block. An automatic feeding assembly is mounted on the fixing frame and comprises a servo motor and a connecting shaft, a fixing plate and a first gear are welded and fixed to the connecting shaft, a mounting plate is welded and fixed to the fixing plate, a second gear is connected to the first gear in a meshed mode, a driven shaft is welded and fixed to the second gear, and the driven shaft is connected to the second gear in a meshed mode. A feeding disc is fixedly welded to the driven shaft, and an automatic positioning assembly is mounted on the mounting plate. By means of the technical scheme, the problems that in the prior art, a chip resistor detection device cannot automatically complete work such as feeding, detection and sorting discharging of chip resistors, and the automation degree is poor are solved.

The invention discloses a chip resistor failure detection method, apparatus and device, and a storage medium. The method comprises the steps of obtaining an electrode image in a to-be-detected chip resistor through a penetration detection device; determining a failure detection result of the chip resistor to be detected under the condition that the working humidity, the working voltage, the working duration and the imaging detection result meet failure conditions; the internal structure of the chip resistor can be detected through penetration detection equipment, and on the premise that the chip resistor is compared with standard reference electrode imaging of a qualified chip resistor, the chip resistor is judged to have a silver migration failure problem by combining working humidity, working voltage and working time to reach set conditions on the premise that electrode deficiency occurs, so that the chip resistor is judged to have the silver migration failure problem. According to the embodiment of the invention, on the premise that the detection efficiency is improved, other detection can be carried out on the chip resistor when it is detected that the chip resistor does not fail, and the detection cost is reduced.

The present application relates to a kind of high reliability chip resistor with surface structure, including substrate and the end electrode of two ends, resistance layer between two side end electrodes, and protective layer is arranged on resistance layer, further include being arranged on substrate and being located under resistance layer several strip microstructure, strip microstructure area is arranged with laser adjustment group area, resistance layer is formed by laser cutting interval reservation two end part resistance area along strip microstructure and forms zigzag resistance path.The present application adopts strip microstructure to effectively avoid the formation of ion migration channel by separating two side resistance, glass microstructure layer enhances the insulation of laser incision, reduces the breakdown risk caused by potential difference;Using strip surface structure occupies smaller space than parallel laser incision, the resistance range that can be adjusted is larger;Change the direction of potential ion migration channel from horizontal to along strip surface structure, make it exist larger angle with electric field direction, slow down the speed of ion migration.

The invention relates to a chip resistor preparation method based on magnetron sputtering and low-temperature heat treatment. The chip resistor preparation method comprises the following steps: respectively preparing a surface electrode and a back electrode on the front and back surfaces of a substrate; a resistance layer is sputtered on the front face of the substrate, the sputtering power density is 0.05 W / mm < 2 >, the sputtering time is 30 min to 2 h, the temperature of a target material is smaller than or equal to 200 DEG C during sputtering, and the temperature of the substrate is smaller than or equal to 180 DEG C; performing low-temperature heat treatment on the resistance layer under the protection of inert gas, wherein the temperature of the low-temperature heat treatment is 350 + / -5 DEG C; after the resistance value of the resistive layer is adjusted through laser cutting, a protective layer is prepared on the surface of the resistive layer; and preparing a side surface electrode on the side surface of the substrate, so that the surface electrode is electrically connected with the back electrode. Through temperature control of the target material and the substrate during sputtering, an optimized initial condition is provided for film growth, a film with a more ideal stress state and a more ideal microstructure is formed, and through a subsequent low-temperature heat treatment process, a resistive layer is recovered to an alloy phase and the activation energy of a manganese element is improved, so that the qualitative improvement of the film performance is cooperatively realized.

The invention relates to the technical field of electronic component manufacturing, in particular to a preparation tray and a preparation method of an integrally-formed sputtering chip resistor, and the preparation tray comprises a lower support tray, a support frame, a plurality of hanging plates and an upper support tray. The lower supporting disc is provided with an annular notch and an annular sliding plate sliding in the annular notch, and an inner gear ring is arranged on the top of the sliding plate. The bottom of the hanging plate is provided with a gear meshed with the inner gear ring. When the device is used, all the hanging plates can be driven to synchronously deflect by rotating the inner gear ring, so that the target-substrate distance between a substrate carried by the hanging plates and a sputtering cathode is continuously adjusted, a front electrode and a resistance layer are simultaneously deposited on a ceramic substrate of a patterned mask through one-time vacuum sputtering process, integrated forming is realized, and then low-temperature aging is carried out, so that the device is obtained. The flexible and accurate control of the target-substrate distance is realized, the uniformity and density of the film and the electrical property stability of the product are remarkably improved, and the method is particularly suitable for the flexible and efficient production of high-performance precise film chip resistors.

The utility model relates to patch resistance substrate production technical field, concretely is a kind of patch resistance substrate cutting dust removal device, including modular quick-release filter element assembly, modular quick-release filter element assembly includes: filter box body;Drawer type filter element module, and the sliding connection is achieved with installation cavity by slide rail structure;Panel locking assembly, preliminary fixing drawer type filter element module is adsorbed magnetism metal block by electromagnet;Pneumatic locking assembly, control unit controls high-pressure gas source to pneumatic seal ring inflation to make it swell and realize sealing and lock;Drawer type filter element module is slidably installed in installation cavity by slide rail assembly, after preliminary positioning is realized by cooperation electromagnet, positioning hole, positioning piece, control unit controls pneumatic seal ring inflation to swell and completely adhere installation cavity wall, complete final locking, pneumatic seal ring cooperation first sealing gasket, second sealing gasket realizes double locking, and the sealing property is superior to traditional mechanical structure, avoid dust leakage, improve the efficiency of filter element replacement on the other hand.

This invention relates to the technical field of industrial electronic component detection. More specifically, it relates to a method for extracting microvoid and solder joint features from chip resistors based on a multi-layer convolutional network. The key technical aspects of this method are: S1. Constructing training and test datasets for microvoids and solder joints; S2. Detecting microvoids based on a residual multiscale skip connection network (RMSC-Net); S3. Detecting solder joints based on a recurrent convolutional neural network (RU-Net); and S4. Using the trained model to perform detection results. This method offers the advantages of high algorithmic recognition and segmentation accuracy and strong anti-interference capabilities.

The utility model discloses a chip resistor, which relates to the technical field of chip resistors and comprises a substrate, two ends of the upper side surface of the substrate are respectively provided with a positive electrode, two ends of the lower side surface of the substrate are respectively provided with a back electrode, and the positive electrodes and the back electrodes are respectively provided with a prefabricated groove. Side electrodes are arranged on the outer sides of the prefabricated grooves, net-shaped pins are fixedly connected to the side electrodes, and the net-shaped pins are correspondingly arranged in the prefabricated grooves. According to the resistor disclosed by the utility model, the prefabricated grooves are formed in the positive electrode and the back electrode, and the net-shaped pins are inserted and fixed in the prefabricated grooves, so that the conductive effect of the resistor is remarkably enhanced, and the connection stability between the pins and the electrodes is also greatly improved.