250 results about "Chip resistor" patented technology

The invention discloses a broadband reflection-free filtering antenna which is provided with a stop-band energy absorption structure, a high-low impedance microstrip line and a yagi-like radiator which are connected in sequence. The yagi-like radiator is composed of a pair of dipole arms and two pairs of bilateral parallel parasitic patches. Wherein the stop-band energy absorption structure is composed of two microstrip line band-stop filters, two grounded chip resistors, a section of folded phase line and a section of input microstrip feeder line. The two microstrip band-stop filters are respectively connected with a grounded chip resistor, and the two microstrip band-stop filters are connected through a folding phase line. The antenna is high in structural compactness, and meanwhile, the integrated design of the filter and the antenna and the ultra-wide non-reflection bandwidth are realized.

The invention discloses a semi-automatic resistance measuring instrument, which belongs to the technical field of chip resistor resistance measurement, and comprises a rack, a mounting platform, a driving mechanism and a measuring mechanism, the mounting platform is fixed on the rack, the driving mechanism is fixed on the mounting platform, and the measuring mechanism is arranged on a movable module of the driving mechanism and comprises a multi-path flying probe switching assembly and a resistor positioning and clamping device. The multi-path flying probe switching assembly is used for realizing adaptation and measurement of resistor substrates with different specifications by replacing flying probe groups, and is driven by the driving mechanism to move to a position above the detection station; the resistor positioning and clamping device is used for clamping and positioning a resistor substrate to be detected and is driven by the driving mechanism to move to a detection station; in the multi-path flying probe switching assembly, flying probes can move downwards to be in contact with a resistor substrate to be detected on the resistor positioning and clamping device, and detection is carried out. The method is mainly applied to the measurement of the resistance value of the chip resistor on the resistor substrate, and can meet the measurement requirements of miniaturization and high density.

The resistor body of the chip resistor is provided with a resistance value adjusting part. A meandering forming portion is formed in the resistance value adjusting portion. In the meandering forming portion, the first trimming groove and the second trimming groove are arranged along a first direction (longitudinal direction). The first trimming groove has a first linear portion extending from a second edge of the resistance value adjusting portion along a second direction (short side direction). The second trimming groove has a second linear portion extending from the second edge of the resistance value adjusting portion in the second direction, and a bent portion extending from the tip of the second linear portion toward the first trimming groove.

The invention belongs to the technical field of microwave antennas, and particularly provides a tight coupling phased-array antenna based on an application frequency-variable impedance matching layer, so as to solve the challenges of the existing phased-array antenna in the aspects of dynamic adjustability and environmental adaptability. The three-order Chebyshev impedance converter comprises a reconfigurable surface loaded with a diode, a bow-tie type dipole, a double-Y balun, a three-order Chebyshev impedance converter, a coaxial feed port, a metal floor, a dielectric layer, a grounding metal sheet and a metal chip resistor. The three-order Chebyshev impedance transformer, the chip resistor and the double-Y balun are cascaded to carry out broadband balanced feed on the dipole, and the dielectric constant and the magnetic conductivity of the dielectric substrate are changed through the on-off of the diode, so that the impedance matching and radiation characteristics of the phased-array antenna are improved. According to the invention, dynamic requirements of modern communication and radar systems on antenna performance can be met.

The invention specifically provides a low-cross-polarization ultra-wideband wide-angle scanning low-profile tight coupling phased-array antenna based on metal grid loading, and belongs to the technical field of microwave antennas. The three-order Chebyshev impedance transformer comprises a C-shaped ring metasurface loading wide-angle matching layer, a folded dipole, a double-Y balun, a three-order Chebyshev impedance transformer, a coaxial feed port, a metal floor, a metal grid, a grounding metal sheet, a resistive film, a dielectric layer and a metal chip resistor. Different polarization electromagnetic waves are regulated and controlled through the metal grid, the resistive film is introduced to absorb cross polarization components, the front-to-back ratio is improved, and the cross polarization level is smaller than or equal to-30 dB; the working bandwidth is expanded to 5.6: 1 under the condition that the profile is only 0.09 lambda by combining the size design of the non-uniform unit and the gradient balun feed, and the scanning of the wide angle of + / -60 degrees of an E surface and an H surface is supported. The invention has the advantages of compact structure, high polarization purity and wide-angle stability, and is suitable for 5G / 6G communication, radar and electronic countermeasure systems.

This chip resistor is provided with a ceramic substrate, two electrodes that are disposed on the ceramic substrate, and a resistor that electrically connects the two electrodes. The ceramic substrate comprises a base material that contains a sintered body of ceramic particles (A) and a covering that contains a sintered body of α-alumina particles (B). The covering covers at least a part of the surface of the base material. The average particle diameter of the α-alumina particles (B) is smaller than the average particle diameter of the ceramic particles (A). The ceramic substrate has a support surface, the support surface-side surface of the base material is covered with the covering, and the resistor overlaps the support surface.

The invention relates to the technical field of supply chain product quality inspection, in particular to an AI model-based supply chain intelligent quality inspection and defect identification system, which comprises a texture feature adaptive unit, a defect identification dynamic adjustment unit, an AI defect identification unit and a control output unit, the texture feature adaptive unit extracts texture density, contrast and edge gradient direction distribution of a chip resistor grey-scale map in real time, the texture density, the contrast and the edge gradient direction distribution are dynamically compared with a historical batch feature library to generate texture feature difference mapping, the defect identification dynamic adjustment unit nonlinearly adjusts a gradient deviation threshold value through an S-shaped response function according to the difference mapping, and the defect identification accuracy is improved. The AI defect identification unit adopts a convolutional neural network, outputs a defect classification result through parallel branch processing, spatial pyramid pooling and secondary verification, controls the output unit to transmit the result to an execution mechanism, records batch switching parameters, solves the problem of false and missing judgment caused by batch texture fluctuation, and improves the detection accuracy. And the quality inspection precision is improved.

The invention relates to the technical field of material rolling structures, in particular to a semiconductor ceramic chip resistor material disc which comprises inner discs, a connecting shaft, an outer ring, a fixing assembly, a supporting assembly and a rolling assembly, the connecting shaft is connected between the two inner discs, the rolling assembly is connected to the outer walls of the inner discs, the outer ring is connected to the outer walls of the inner discs, and the fixing assembly is connected to the supporting assembly. An annular groove is formed in the inner wall of the outer ring, and the rolling assembly is connected with the annular groove. By arranging the inner disc and the outer ring, an original overall structure is divided into a double-layer structure, in the feeding process, the inner disc rotates in the outer ring, then the situation that the whole material disc rotates in a tray of a chip mounter and rubs with the tray is avoided, and then generation of static electricity is reduced; the rotating resistance of the outer ring in the tray is further increased, rotation of the outer ring is avoided, and due to the fact that no friction exists between the outer ring and the tray, abrasion of the outer ring is reduced, and the service life of the charging tray is prolonged.

The invention relates to a wide-angular-domain low-scattering omnidirectional microstrip antenna, which comprises a first dielectric substrate, wherein an upper radiation patch and an annular wave-absorbing structure are etched on the upper surface of the first dielectric substrate, and a lower radiation patch is etched on the lower surface of the first dielectric substrate; the upper radiation patch is located on the inner side of the annular wave-absorbing structure and is connected with the lower radiation patch through the first metal via hole; a plurality of first chip resistors distributed along the circumference are arranged on the annular wave-absorbing structure; the second dielectric substrate is located below the lower radiation patch, and a metal floor is etched on the lower surface of the second dielectric substrate; the metal floor is connected with the upper radiation patch through the second metal via hole and is connected with the annular wave-absorbing structure through the third metal via hole; the upper surface of the metal floor is provided with a plurality of second chip resistors, and the upper radiation patch is connected with the second chip resistors through fourth metal through holes. The triple wave absorbing paths are directly integrated on the antenna body, the low scattering performance is achieved, the original profile height is kept, and the dual-polarization single-station and dual-station RCS in the upper half space of the antenna is effectively reduced.

To provide a chip resistor having lower electric resistance and more stable quality.SOLUTION: The chip resistor 1 includes a metallic resistor 10, a first plated electrode 21, and a second plated electrode 22. The metal resistor 10 includes a first bottom plate portion 11, a second bottom plate portion 12, a top plate portion 13, a first inclined leg portion 14, and a second inclined leg portion 15. The first plating electrode 21 is disposed on the bottom surface of the first bottom plate portion 11, the bottom surface of the first inclined leg portion 14, and the bottom surface of the top plate portion 13. The second plating electrode 22 is disposed on the bottom surface of the second bottom plate portion 12, the bottom surface of the second inclined leg portion 15, and the bottom surface of the top plate portion 13.SELECTED DRAWING: Figure 3

The present invention relates to the technical field of LED light strips, and in particular to a high-power and high-efficiency heat dissipation LED light strip, comprising a film-type light strip body, a heat dissipation adhesive, a chip resistor and an LED lamp bead. The film-type light strip body and the heat dissipation adhesive are used to replace a traditional hard aluminum substrate, so as to reduce the heat conduction distance between the heat dissipation adhesive and the film-type light strip body, increase the heat flux density, promote the heat dissipation of the film-type light strip body, and the film-type light strip body is lighter and the LED light strip is bendable. The heat dissipation adhesive is used to dissipate the heat of the film-type light strip body, which not only avoids the light strip being damaged due to drilling holes or screwing during installation, but also facilitates installation and has a heat dissipation effect. In addition, the side wall of the film-type light strip body is protruded with a first heat dissipation fin evenly arranged at intervals, and the side wall of the heat dissipation adhesive is protruded with a second heat dissipation fin evenly arranged at intervals and corresponding to the first heat dissipation fin one by one, thereby increasing the heat dissipation area between the high-power and high-efficiency heat dissipation LED light strip and the air, and further improving the heat dissipation efficiency.

The utility model provides a chip resistor. The chip resistor comprises a substrate, a back electrode, a front electrode, a resistive layer, a protective layer and a side electrode, the protective layer comprises a first protective layer and a second protective layer; the first protective layer is made of a glass material, and the second protective layer is made of at least two layers of epoxy resin materials; a third protective layer is formed on the left electrode and the right electrode which are not covered, and the third protective layer is made of a resin silver material; through a multi-layer protection structure formed by the first protection layer made of the glass material and the second protection layer made of the epoxy resin material, invasion of moisture, chemical corrosion and mechanical damage is effectively prevented, the service life of the resistor in a severe environment is remarkably prolonged, and particularly, through the third protection layer made of the resin silver material, the service life of the resistor is prolonged. The anti-corrosion performance of the electrode part is enhanced, so that the resistor can keep stable electrical performance during long-time work.

To provide a resistor paste capable of achieving both high resistivity and low TCR of a resistor.SOLUTION: The resistor paste includes metal particles, insulating particles, glass particles, and metal silicide. The metal particles contain copper and nickel. The insulating particles contain at least one of alumina, zirconia, zinc oxide, and boron nitride. A chip resistor 1 includes a resistor 13 and a substrate 11. The resistor 13 is formed on the substrate 11 using the above-mentioned resistor paste as a material.SELECTED DRAWING: Figure 1

To provide a thin film chip resistor capable of preventing the resistance value from becoming unstable due to the heat generated by trimming and absorbed by a second parallel resistor pattern.SOLUTION: The thin film chip resistor includes a second parallel resistor pattern 24e in which an adjacent folded portion of a zigzag resistor pattern 24b is connected by a substantially U-shaped resistor pattern 24d. Each of the approximately U-shaped resistor patterns 24d has a separate trimming groove 30b formed opposite the longitudinal side of an insulating circuit board 21.SELECTED DRAWING: Figure 2

The invention discloses a chip resistor performance test support tin soldering tool and a workpiece positioning method. The chip resistor performance test support tin soldering tool comprises an electric heater, a fixing plate, a glass plate, a manual lifting assembly, a limiting column, a positioning supporting column and a material pressing device. Limiting columns and positioning supporting columns are fixedly assembled at the four corners of a heating platform of the electric heater. The fixed plate is provided with a plurality of detection seat positioning grooves, four corners of the detection seat positioning grooves are provided with fixed plate positioning holes, and the fixed plate positioning holes are matched with the positioning support columns; the glass plate is provided with pressing device mounting holes with the same number as the detection seat positioning grooves on the fixed plate, the four corners of the glass plate are provided with limiting long holes and positioning round holes, and the left and right edges of the glass plate are provided with manual lifting assemblies; and the material pressing device is arranged in the material pressing device mounting hole of the glass plate. The requirement for the set range of the thickness of the tin soldering layer on the bottom face of the cross-shaped supporting frame is met, and the purpose of guaranteeing the reliability of the performance index testing result of the chip resistor is achieved.

The utility model discloses a low-temperature-resistant shunt resistor assembly which comprises a resistor body, an input side wire connector, an output side wire connector and two substrates, one end of the resistor body is electrically connected with the input side wire connector, the other end of the resistor body is electrically connected with the output side wire connector, one substrate is connected into a gap between the resistor body and the input side wire connector, and the other substrate is connected into a gap between the resistor body and the output side wire connector; the resistor body comprises two T-shaped blocks and a plurality of groups of sheet-shaped resistors which are distributed at equal intervals, one side of each sheet-shaped resistor is connected to one T-shaped block, and the other side of each sheet-shaped resistor is connected to the other T-shaped block. The low-temperature-resistant shunt resistor assembly disclosed by the utility model has the beneficial effects that the substrate can bear and conduct deformation of the resistor body caused by temperature change in high and low temperature environments, so that the influence of the temperature change on the performance of the chip resistor is reduced.

This resistor paste contains: metal particles including copper and nickel; insulating particles including at least one from among aluminum oxide, zirconium oxide, zinc oxide, and boron nitride; glass particles; silicon particles; and an organic vehicle.

The invention relates to the technical field of resistance testing, in particular to a resistance testing system and method, and the system comprises a rack which is internally provided with a feeding table, an x-axis motion module, a normal-temperature resistance positioning platform and a high-temperature resistance positioning platform. The normal-temperature resistor positioning platform and the high-temperature resistor positioning platform are adjacently arranged and located between the feeding table and the x-axis movement module, a y-axis movement module is arranged on the x-axis movement module, and a probe positioning mechanism, a probe testing mechanism and a suction mechanism are arranged on the y-axis movement module. The suction mechanism is used for moving the resistor from the feeding table to the normal-temperature resistor positioning platform or the high-temperature resistor positioning platform, and the probe positioning mechanism is used for acquiring the position information of the resistor and controlling the probe testing mechanism to adjust the butt joint position with the resistor. According to the invention, the butt joint precision between the probe plate and the chip resistor can be improved, and the reliability of batch test of resistors is ensured.

Chip resistor (1, 20) having: an insulating substrate (2); a pair of electrodes (3, 4) arranged on the insulating substrate (2) so as to face each other at a predetermined distance; and a resistor (5) for bridging between the pair of electrodes (3, 4), wherein the resistor (5) is provided with trimming grooves (9, 10) to set a resistance value, wherein the resistor (5) comprises a printing body continuously connecting the pair of electrodes (3, 4), the printing body comprising connecting portions each connected to the pair of electrodes (3, 4) and a rectangular adjustment portion (8), the adjustment portion (8) being located between the connecting portions, wherein at least one of the connecting regions is a meandering region (6, 7) which changes its direction, wherein a first trimming groove (9) for coarse adjustment is formed in the adjustment region to extend a current path of the resistor (5), and a second trimming groove (10) for fine adjustment is formed in the meandering region (6, 7), wherein, when a direction between the pair of electrodes (3, 4) is referred to as the X direction and a direction perpendicular to the X direction is referred to as the Y direction, the meandering region (6, 7) has an extension region (6a, 7a) extending in the Y direction, an outer direction-changing region (6b, 7b) extending in the X direction for establishing a connection between one end of the extension region (6a, 7a) and one of the pair of electrodes (3, 4), and an inner direction-changing region (6c, 7c) extending in the X direction for establishing a connection between the other end of the extension region (6a, 7a) and the adjustment region (8), wherein the second trim groove (10) extends from one of the outer direction change region (6b, 7b) and the inner direction change region (6c, 7c) as the initial end position in the Y direction, and wherein a distal end of the second trim groove (10) does not reach an imaginary line (E) connecting the outer direction change region (6b, 7b) and the inner direction change region (6c, 7c) at the shortest distance.

The invention discloses identification printing equipment for a ceramic resistor, and relates to the field of code spraying and printing. According to the technical scheme, the device comprises an equipment box, a feeding assembly and a receiving assembly are assembled on the two sides of the equipment box correspondingly, and the feeding assembly and the receiving assembly are used for feeding and receiving correspondingly; the code spraying mechanism is assembled on the equipment box and is used for spraying and printing; the material guide groove is fixed on the equipment box and is used for guiding materials; the rotary adsorption mechanism is assembled below the material guide groove and is used for adsorbing the material belt; the acquisition unit is arranged on the equipment box and is used for acquiring working data in real time; and the quality analysis module calculates a code spraying quality index based on the work data formulation and compares the code spraying quality index with a preset code spraying quality index threshold value to judge whether the code spraying quality index is abnormal or not, when the material belt passes through the material guide groove, the material belt is rotationally adsorbed and fixed through the rotary adsorption mechanism, and the material belt passes through the material guide groove. The material belt conveying stability is improved, and the code spraying quality is guaranteed.

This application relates to the field of thermistor technology, specifically disclosing an NTC thermistor material, a chip resistor, and its preparation method and application. The NTC thermistor material provided in this application comprises a base material and 3-13% additives by weight; the base material comprises Mn3O4, Co3O4, Al2O3, Fe2O3, and ZnO in a weight ratio of (10-40):(10-50):(1-15):(10-25):(5-19); the additives comprise MgAl2O4, Nb2O5, and TiO2 in a weight ratio of (1-200):(1-10):(5-25); this application also provides a chip resistor made using the NTC thermistor material. The NTC thermistor material provided in this application has a high material constant B value and a low room temperature resistivity ρ. 25 It can meet the application requirements of high-precision and high-reliability temperature sensors.

The embodiment of the utility model discloses a mining belt conveyor frequency converter logic control board which comprises a PCB, the PCB is installed on a module frame, the left side of the PCB is provided with a plurality of first relays, SMD light-emitting diodes, SMD resistors and SMD diodes, the middle of the surface of the PCB is provided with a relay base, a second relay is installed on the relay base, and the SMD resistors are installed on the PCB. A first terminal base and a second PCB terminal base are arranged on the upper side of the PCB, and a first terminal base, a third PCB terminal base and a fourth PCB terminal base are arranged on the lower side of the PCB. According to the utility model, the installation space is obviously saved, complex external wiring is avoided, the overall structure is more compact and concise, the integration level of equipment is improved, and the difficulty of installation and maintenance is reduced.

The utility model belongs to the technical field of electronic components, and particularly relates to a beam welding alloy current detection chip resistor which comprises a current detection resistor and a circuit board, a shock absorption support is arranged between the current detection resistor and the circuit board, a buffer plate and a spring are arranged on the shock absorption support, and under the environment of high-frequency vibration or strong impact, the circuit board firstly extrudes the buffer plate, and then the buffer plate is pressed by the spring. The buffer plate drives the spring to move towards the damping bracket in the moving space, and as the fastening plate made of rubber is mounted, the vibration transmitted to the current detection resistor by the circuit board is further reduced by buffering through a rebound groove in the fastening plate; compared with the prior art, the vibration between the current detection resistor and the circuit board is reduced, and the stability of the current detection resistor is improved.

The invention belongs to the field of thick film electronic element manufacturing, and particularly relates to chip resistor MK layer UV curing slurry and a preparation method thereof. The problems that an existing UV curing protective layer is insufficient in heat resistance, and cracking and falling are caused by mismatching of thermal expansion coefficients are solved. Through an epoxy-organic silicon hybrid resin system and a composite functional filler, the resin system comprises trimethylolpropane triacrylate, hexanediol diacrylate, an epoxy acrylate oligomer, an organic silicon modified acrylate oligomer, a phosphorus-containing acrylate functional monomer and a thermal polymerization inhibitor, and the functional filler is prepared from modified spherical aluminum oxide, modified silicon dioxide, a photoinitiator, a photoinitiator, a photoinitiator, a photoinitiator, a photoinitiator and a photoinitiator. According to the invention, the thermal shock resistance and insulation reliability of the protective layer are improved while the high efficiency of the UV photocuring process is maintained.

This chip resistor comprises a substrate, a first electrode and a second electrode, and a resistor. A first trimming groove and a second trimming groove are formed in the resistor. The first trimming groove has a first linear portion and a second linear portion. The first linear portion extends from a first end edge of the resistor toward a second end edge thereof along a second direction intersecting a first direction. The second linear portion extends from a distal-end portion of the first linear portion toward the second trimming groove. The second trimming groove has a third linear portion and a curved portion. The third linear portion extends from the first end edge of the resistor toward the second end edge thereof. The curved portion extends from a distal-end portion of the third linear portion toward the first trimming groove. The curved portion is convex in a direction from the first end edge toward the second end edge.

The invention discloses a power semiconductor device with an external gate resistor, and relates to the field of semiconductor devices, the power semiconductor device with the external gate resistor comprises a semiconductor substrate, and a gate bus, a first gate connection region and a second gate connection region which are arranged on the front surface of the semiconductor substrate, the second gate connection region is electrically connected with a gate bus; and providing an external gate resistor, one end of the external gate resistor being electrically connected with the first gate connection region, and the other end of the external gate resistor being electrically connected with the second gate connection region. Through the structural design, the external chip resistor is used for replacing a traditional grid built-in resistor RGint made of polycrystalline silicon, the repeated tape-out verification period caused by the improper built-in resistor can be avoided, meanwhile, due to the flexibility of the external chip resistor, the grid resistance value requirements of different application scenes can be met, and the effects of reducing cost and increasing efficiency are achieved.

In a chip resistor, a first trimming groove has: a first linear portion extending linearly from a first edge along an X-axis direction; and a second linear portion extending linearly along the Y-axis direction. The second trimming groove includes: a third linear portion disposed on a second upper surface electrode side of the first linear portion and extending linearly along the first linear portion 1 from the first edge; and a fourth linear portion disposed on the second edge side of the second linear portion and extending linearly along the second linear portion from the tip of the third linear portion. When viewed in the X-axis direction, the tip of the second trimming groove is positioned closer to the second upper surface electrode side than the tip of the first trimming groove.

The present invention relates to the field of patch resistors, and more specifically, to a high-protection patch resistor, comprising a resistor body and a baffle, wherein two baffles are provided and symmetrically arranged on both sides of the two resistor bodies, the front and rear ends of the two baffles are both abutted and connected with a rotating plate, a sliding hole is longitudinally provided in one side of the baffle where the rotating plate is connected, a rotating shaft is slidably connected inside the sliding hole, and the rotating shaft is longitudinally fixedly connected to the baffle on the same side, the two rotating plates on the same side are abutted against each other and a slot is provided at the upper end of the abutting side, and the front and rear parts of the two baffles away from each other are fixedly connected with a positioning plate through a bottom plate. The present invention clamps a heat sink on the resistor body, and the upper surface of the heat sink is in a wavy structure. When in use, the heat sink is used to expand the contact area between the resistor body and the air, which facilitates the rapid heat dissipation of the resistor body, avoids the resistor body from being in a high temperature state for a long time, and achieves a high protection effect.

The invention belongs to the field of electronic component materials, and discloses UV curing slurry for a first protective layer of a chip resistor and a preparation method of the UV curing slurry. The UV curing slurry is prepared from the following raw materials in parts by weight: 30 to 50 parts of silicon-containing epoxy acrylate resin, 10 to 20 parts of polyurethane acrylate resin, 10 to 20 parts of modified polyphosphazene resin, 15 to 25 parts of reactive diluent, 5 to 8 parts of photoinitiator, 5 to 10 parts of composite boron nitride powder, 5 to 10 parts of inorganic filler, 0.1 to 1 part of wetting agent, 0.1 to 1 part of flatting agent and 0.5 to 2 parts of adhesion promoter, the protective layer formed by curing the slurry has the advantages of high hardness, high heat resistance and excellent insulating property.

The invention provides an over-voltage protection circuit with a variable over-current point, and belongs to the technical field of integrated circuits. Comprising a step-down module, an adjustable overcurrent protection module, a logic module, a reference module, a clock generation module, an overvoltage protection module, a step-up module, a driving module, a power MOS tube and an input power supply. Wherein one end of the adjustable over-current protection module is connected with an off-chip resistor node, and the other end of the adjustable over-current protection module is connected with the logic module, and the adjustable over-current protection module is used for detecting whether the output voltage output by the power MOS tube is over-current. No power tube is arranged in the overvoltage protection circuit, and an application manufacturer can select different power tubes according to needs, so that the application range of a chip can be expanded; meanwhile, the chip can dynamically adjust the overcurrent value of the overcurrent protection function through an off-chip connection resistor.