477 results about "Film resistance" patented technology

The invention specifically relates to a current collector and application thereof, and a pole piece and a battery using the same, belonging to the field of batteries. The current collector of the invention comprises an insulating layer and a conducting layer, wherein the insulating layer is used for bearing the conducting layer; the conducting layer is used for bearing an electrode active materiallayer; and the normal-temperature film resistance Rs of the conducting layer is no less than 0.016 omega/sq and no more than 420 omega/sq. The current collector provided by the invention can greatlyincrease the short-circuit resistance of the battery in cases of abnormal conditions, allows short-circuit current to be greatly reduced, so heat produced by short circuits is greatly lowered, and heat produced at sites where internal short circuits occur can be totally absorbed by the battery; and thus, the influence of short-circuit damage to the battery is limited to certain points, only pointcircuit break occurs, and the normal operation of the battery in a short period of time is not affected.

An EL display device capable of reducing an average film resistance of an anode in an EL device as well as displaying an image with high definition, and electrical equipment including such an EL display device are provided. A light-shielding metal film 109 is provided on an anode 108 so as to conceal gaps between the pixels. Thus, an average film resistance of the anode 108 in the EL device is reduced. Furthermore, light leakage from the gaps between the pixels can be prevented, resulting in an image display with high definition.

The present invention relates to methods and compositions for rendering a surface resistant to bio-film formation by a combination of an alkanediol and an antimicrobial agent (and, optionally, an organic hydroxy acid). The invention provides for compositions which may be used to render surfaces bio-film resistant, articles having bio-film resistant surfaces, and methods for their preparation. The present invention may be advantageously applied to medical articles as well as articles used in non-medical contexts, such as child care or food preparation.

A method of producing a transparent and conductive film, comprising (a) forming aerosol droplets of a first dispersion comprising a first conducting nano filaments in a first liquid; (b) forming aerosol droplets of a second dispersion comprising a graphene material in a second liquid; (c) depositing the aerosol droplets of a first dispersion and the aerosol droplets of a second dispersion onto a supporting substrate; and (d) removing the first liquid and the second liquid from the droplets to form the film, which is composed of the first conducting nano filaments and the graphene material having a nano filament-to-graphene weight ratio of from 1/99 to 99/1, wherein the film exhibits an optical transparence no less than 80% and sheet resistance no higher than 300 ohm/square.

A thin film resistor device and method of manufacture includes a layer of a thin film conductor material and a current density enhancing layer (CDEL). The CDEL is an insulator material adapted to adhere to the thin film conductor material and enables the said thin film resistor to carry higher current densities with reduced shift in resistance. In one embodiment, the thin film resistor device includes a single CDEL layer formed on one side (atop or underneath) the thin film conductor material. In a second embodiment, two CDEL layers are formed on both sides (atop and underneath) of the thin film conductor material. The resistor device may be manufactured as part of both BEOL and FEOL processes.

The invention relates to a hydroxylated polyurethane water dispersoid for a waterborne soft-feel coating and a preparation method thereof. The hydroxylated polyurethane water dispersoid is the water dispersoid formed by the following steps of: taking the raw materials in parts by weight: 15 to 20 parts of polycarbonate diols, 15 to 25 parts of elastic 4-butanediol, 1 to 5 parts of pentaerythritol, 2 to 5 parts of hydroxylated dimethylolpropionic acid or dihydroxymethyl butyric acid, 10 to 20 parts of fatty group or alicyclic group isocyanates monomers and 0.1 to 1.0 part of catalysts and solvents; carrying out heating polymerization to obtain hydroxylated urethane resin; and then neutralizing a water dispersoid formed after salt forming, self emulsifying and the solvent removing, wherein the coating-4 viscosity change of the coating stored for 6 months is smaller than 5 percent. After the hydroxylated polyurethane water dispersoid prepared by the method is prepared into a double-ingredient waterborne soft-feel coating, better balance is obtained between the coating film soft feel and the coating film resistance on alcohol and contaminants, and the effect of the hydroxylated polyurethane water dispersoid is proved.

The invention discloses a microwave film resistor and a manufacturing method thereof, and belongs to the field of circuit elements. The microwave film resistor comprises a ceramic substrate, a film resistance layer which is adhered to the upper surface of the ceramic substrate and an electrode layer which is adhered to the film resistance layer. The film resistor has the advantages of high precision, high using frequency and high resistance stability. In addition, the invention also discloses a microwave film resistor network module and a manufacturing method thereof, wherein the microwave film resistor network module is formed by integrating three or more microwave film resistors on one module.

The invention provides an MEMS heating chip integrating multiple Pt thin film resistor temperature sensors. The MEMS heating chip comprises a first substrate (1-1) and a second substrate (1-2). The front side of the first substrate is provided with a concave micro-cavity body (2); a micro-through hole (3) penetrating through the first substrate (1-1) is formed in the micro-cavity body (2); the back side of the second substrate (1-2) is provided with a micro-channel array (4) perpendicular to the back side thereof; the central area of the front side is provided with a multi-hole structure (5) perpendicular to the front side thereof; the micro-channel array (4) communicates with the multi-hole structure (5); the surface of the front side of the second substrate is provided with a plurality of Pt thin film resistor temperature sensors (6); the front side of the first substrate (1-1) and the back side of the second substrate (1-2) are bonded together. The invention also provides a manufacture method for the heating chip. The temperature of the heating chip can be measured in real time and the problem of inaccurate temperature measurement can be effectively avoided.

A reinforced perfluoro ion exchange film is composed of at least two layers of ionic film, which prepared from perfluoro ion exchange resin and fused together without interface, at least one layer of perfluoro polymer mesh as reinforcing material and the perfluoro polymer microfibres added to said filming resin. It is prepared through sequential coating. Its advantages are low film resistance, high electric current efficiency, and high mechanical strength and size stability.

The invention discloses a manufacturing method for a plate type thin film resistor, which belongs to a manufacturing method for a plate type resistor. The invention aims to provide a manufacturing method for producing the plate type thin film resistor with high productivity and low cost. The manufacturing method comprises the manufacture of a gauge, a back electrode and a resistor body, encapsulating, trimming, splintering, sintering, end coating and electroplating; and the concrete steps comprise substrate burnishing and cleaning, printing for the gauge and the back electrode, electrode sintering, baffle layer printing, vacuum sputtering, baffler layer removing, thermal treatment, laser trimming, protective layer printing, protective layer curing, primary splintering, end coating for the electrode, end electrode sintering, secondary splintering, nickel plating and tinlead plating. The manufacturing method has the advantages of high productivity, low cost and the like, and is an ideal method for producing the plate type thin film resistors on a large scale.

The system of the invention for measuring characteristics of thin conductive and non-conductive material, such as bulk material or films, is based on the use of a resonance oscillating circuit that incorporates at least two components selected from the group consisting of an inductive coil and a capacitor, which in combination form a sensor that could be approached close to the surface to be measured. The measurement of the film or material characteristics, such as film resistance (film thickness) or a dielectric constant (film thickness) of a non-conductive material, is based on the principle that the sensor is approached to the measured surface at a distance, at which the inductance and capacitance of the sensor generate in the measured material a virtual coil and an additional capacitance, which strongly depend on the characteristics of the measured material. As the sensor approached towards the surface to be measured, the sensor-material system generates a series of resonances having different values of power. One of these resonances can be defined as the so-called full resonance, which is characterized by the maximum value of the power, and hence provides the most accurate measurement and can be used for precisely determining the measurement distance. By comparing the results of measurements with those known from measuring the precalibrated films or materials under the same conditions, it becomes possible to determine the target characteristics of the films or materials.

A touch sensor employs one or more transparent conductors including a random pattern of voids. These voids are arranged according to a random pattern that maintains the electrical continuity of the transparent conductive layer. Touch sensors are fabricated by depositing a layer of transparent conductor and forming voids in the transparent conductor. The sheet resistance of selected conductive layers can be obtained by forming voids, as well as increasing light transmission through the touch sensor.

The invention provides a lithium ion battery failure analysis method based on an alternating current impedance method. The safety performance of a lithium-ion battery has attracted much attention, anda negative electrode of the lithium ion battery is easily subjected to lithium evolution under the abuse condition, so that a lithium dendritic crystal is formed, and thermal runaway or even explosion of the battery is caused. According to the lithium ion battery failure analysis method based on the alternating current impedance method provided by the invention, an electrochemical alternating current impedance testing method is adopted, a relationship between an alternating current impedance spectrum signal and the internal environment of the battery is analyzed, the SEI film resistance change can be analyzed from an alternating current impedance spectrum, and therefore the state of short circuit in the dendritic crystal of the battery can be quickly and accurately predicted without damaging the battery, thereby evaluating the service life and the safety of the battery.

The invention discloses middle temperature sintering thick-film resistance paste based on a high-temperature-resistant flexible substrate and a preparation method thereof. The thick-film resistance paste comprises an inorganic bonding phase, a composite function phase, a TCR regulator and an organic carrier. The inorganic bonding phase is formed by SiO2, Bi2O3, B2O3, P2O5, Al2O3, Li2O and CaF2; the composite function phase is formed by micron flake silver powders, micron spherical silver powders and nanometer silver powders; and the organic carrier is formed by organic solvents, macromolecule thickeners, high-temperature-resistant organic resin, surfactants, plasticizers, dispersants, antifoaming agents and thixotropic agents. The preparation method comprises the steps of preparation of the inorganic bonding phase, preparation of the composite function phase, preparation of the organic carrier and preparation of the resistance paste. The thick-film resistance paste is low in sintering temperature, short in sintering time, large in adhesive force, resistant to aging, high in flexibility, adjustable in square resistance, low and adjustable in resistance temperature coefficient and excellent in printing characteristic and sintering characteristic, and can be matched with the high-temperature-resistant flexible substrate.

The present invention provides a glass paste for protection coating. The glass paste does not contain lead basically, and can be sintered under low temperature specially under the temperatures below 700 DEG C, also the air-tightness and chemistry endurance, especially acid resistance are excellent. Laser trimming can be easily carried out without damaging resistance stability when glass paste is used as precoated layer glass of thick film resistance element. A glass paste for protection coating has a character that said low melting point glass does not contain Pb basically, represented with the mol % of oxide, containing SiO2: 20 to 50 percents, Al2O3: 0.5 to 10 percents, chosen from at least one of BaO and SrO: 5 to 35 percents, ZnO: 5 to 35 percents, TiO2: 1 to 10 percents, chosen from at least one of Li2O, Na2O and K2O: 1 to 13 percents, B2O3: 0 to 20 percents, chosen from at least one of WO3 and MoO3: 0 to 5 percents.

An integrated circuit with a metal thin film resistor with an overlying etch stop layer. A process for forming a metal thin film resistor in an integrated circuit with the addition of one lithography step.

The invention relates to a taking machine for liquid or ropy material with better liquidity in a high-capacity plastic flexible package. The taking machine comprises a thimble provided with a limit table and a film resistance table, a locking slide bush A or a locking slide bush B or a locking slide bush C or a base provided with a locking face, a locking seal part, a seal element, a spring, a spring slot, a stopcock or a valve or a water suction pump and a cover or a plug. The beneficial effects of the taking machine are as follows: the possibility that the material in the high-capacity plastic flexible package outflows during the package puncturing process or leaks due to imperfect sealing in use process is completely eradicated; the taking machine provided by the invention can be independently or be connected with a clamp, a stopcock and a valve or a water suction pump for being repeatedly applied to the high-capacity plastic flexible package; and based on the taking machine, a novel portable taking machine, or a connecting device or an all-in-one machine in upper material taking pipeline connecting type, an upper material taking floater connecting type, a lower material taking fixing thimble pipeline connecting type, a lower material taking fixing thimble floater connecting type, a lower material taking movable thimble pipeline connecting type and a lower material movable thimble floater connecting type can be assembled.

An injection molding system and injection molding method for making molded parts that include one or more planar heaters having a thin or a thick film resistive heater element coupled, secured, or releaseably secured to one or more sides of each of the one or more injection molding nozzles. The releasably secure coupling allows heater device to be visually inspected, tested, removed, and/or replaced. The planar heater device can have a support device patterned with a film electrical resistive path. The electrical resistive path can include any pitch or number of electrical resistance lines, such that a longitudinal uniform heat profile is generated along a melt flow channel of the one or more injection molding nozzles when the nozzles are in use. In some examples, the planar heater has more than one film resistive heater element that can be coupled to one or each side of a nozzle, with dielectric material interposed between the planar film resistive heater elements. This can allow for additional or alternative heating in various applications.