286 results about "Daughterboard" patented technology

The invention provides a time-triggered protocol network planning method and system for an aviation power supply system, and a storage medium. The network architecture adopts a hardware-level dual-redundancy design, each communication node is provided with two independent TTP physical interfaces and corresponding TTP daughter cards, and the TTP physical interfaces and the corresponding TTP daughter cards are respectively accessed to a TTP A network and a TTP B network which are logically independent, so that channel-level fault isolation is realized. The planning method comprises the following steps: classifying messages according to power supply system services and defining a transmission period; initializing a cluster and setting time parameters such as a TDMA period and a cluster period; packaging the messages with consistent periods and reserving extension bits in a data structure; and calculating the time slot capacity based on the transmission rate, the node number and the TDMA period, and generating a deterministic message scheduling table. According to the method, high communication reliability is guaranteed through dual-network redundancy, the real-time requirement of various messages such as control and alarm is met through systematic scheduling, the expandability of the network is improved by reserving expansion bits, and the method is suitable for an aviation power supply system with strict communication performance requirements.

The invention provides a test platform for a power management chip. The test platform comprises an upper computer, a control panel, a load daughter board and an instrument, the control board is configured to receive a test instruction sent by the upper computer, configure the instrument based on the test instruction, send a test signal to the load daughter board, receive a response signal sent by the load daughter board, obtain a test result based on the response signal and send the test result to the upper computer; the load daughter board is configured to bear the tested power management chip, receive the test signal sent by the control board, match the test signal to the tested power management chip, obtain a response signal output by the tested power management chip and send the response signal to the control board; wherein the load daughter board is provided with a load circuit and is configured to provide a peripheral circuit for the tested power management chip, and the control board is further configured to switch the type of the load circuit. Wherein different types of power management chips can be verified by switching the types of the load circuits on the load daughter board.

The invention provides a single-line communication method and device based on pulse counting, electronic equipment and a medium, and relates to the technical field of switches and servers. The method is executed by a main board in a system, the main board is connected with a sub-board through a single in-place signal line, and the method specifically comprises the following steps: within a first preset time period after the system is powered on, sending a first pulse sequence through the single in-place signal line, and verifying the connection state of a cable based on a received response signal; if the connection state is verified to be normal, sending a second pulse sequence through a single in-place signal line, and performing data communication with the daughter board; wherein the second pulse sequence forms communication bytes in a pulse number coding mode. According to the invention, an in-place signal line which is only used for static level detection traditionally is transformed into a dynamic multifunctional channel, so that the dual defects of low communication efficiency and high misplugging risk of a traditional scheme are synchronously overcome on the premise of not increasing any hardware cost and wiring complexity.

The invention discloses a high-speed parallel EMMC (Embedded Multi Media Card) test method and system. The method comprises the following steps: generating a test script; the test script comprises the steps of generating a protocol setting instruction based on an interface protocol type of the to-be-tested EMMC, generating a test command based on a test item type of the to-be-tested EMMC, and setting a test ending condition; based on the test script, testing a plurality of to-be-tested EMMCs in parallel through a plurality of test daughter boards comprising multiple channels, and collecting test parameters in real time; wherein different test items of each to-be-tested EMMC are tested according to a preset sequence; in the testing process, follow-up testing is adjusted based on testing parameters collected in real time and a preset optimization rule; and for each tested EMMC, when it is judged that a test ending condition is met, ending the test, returning a test result, analyzing the test result and outputting a test report. Through the automatic optimization strategy and the parallel test, the test efficiency can be improved, and the labor dependence and the test cost can be reduced.

The invention relates to the field of blind slot laminated modules, in particular to a blind slot laminated module based on a multistage vertical interconnection device and a process method. A mother board module; the copper pin part is vertically connected with the copper pin part; the fixed supporting part is provided with a first tooth groove and a through hole; the adjusting support part is provided with a second tooth groove and a first threaded hole, the second tooth groove and the first tooth groove are embedded in a staggered mode, the copper pin part is clamped and fixed in an embedding gap of the second tooth groove and the first tooth groove, and the first threaded hole is aligned to the through hole and is perpendicular to the extending plane of the stepped teeth of the second tooth groove; and the clamping force of the second tooth groove on the copper pin part is controlled by the second screw arranged in a penetrating manner. The problem that high-reliability welding quality is affected due to the fact that the ultrahigh-density copper pins of the laminated module are skewed due to uneven temperature loads and inconsistent thermal deformation degrees of materials in the multiple welding processes of the vertical interconnection technology is solved, and the requirements of remote sensing satellites are met.

This invention relates to the field of communication technology and discloses a method, apparatus, computer device, and storage medium for monitoring server sub-cards. The method for monitoring server sub-cards includes: after the server is powered on, selecting sub-cards supporting the System Management Bus (SMBus) from multiple sub-cards connected to the same I2C integrated circuit bus to obtain a set of sub-cards to be monitored; assigning an address to each sub-card in the set of sub-cards using the Address Resolution Protocol (ARP); and monitoring the sub-cards in the set of sub-cards based on their assigned addresses. This allows each sub-card in the set of sub-cards to have a different assigned address, thus eliminating the need for switching channels via a switch chip when monitoring the same sub-card, and enabling simultaneous monitoring of the same sub-cards, thereby improving monitoring efficiency.

The application discloses a high-density integrated chip modularized PCB (Printed Circuit Board), which comprises a daughter board and a mother board. The daughter board is used for arranging high-density integrated chips containing blind holes and comprises a functional module area, a blind hole concentrated area and a daughter board pad area. The functional module area is arranged with a plurality of chips and supporting lines. The blind hole concentrated area is arranged with most or all blind holes corresponding to the plurality of chips at a set interval according to a machining parameter reference. The daughter board pad area comprises a plurality of daughter board pads arranged at intervals on the edges of multiple layers of the daughter board, and is used for connecting with part of the supporting lines and the mother board to transmit chip signals to the mother board. The mother board is connected with at least one daughter board and comprises a mother board pad area corresponding to the position of the daughter board pad area, and is used for welding the daughter board to the corresponding position of the mother board to realize input, output and control of the chip signals of at least one daughter board corresponding to the mother board, and solves the problems of manufacturing difficulty, cost and cycle of the PCB of the high-density integrated chip with blind buried holes.

The invention provides an all-digital networked fault-tolerant calculation control method and system, and relates to the technical field of power station operation control, and the method comprises the steps: independently collecting reactor data in real time through a main control unit and a plurality of standby control units, and carrying out the synchronization of corresponding output data messages through a high-speed redundant communication bus; verifying the data message, performing automatic correction when a correctable error is detected, and immediately generating and reporting a fault positioning code when an uncorrectable error is detected; identifying a fault component through the fault positioning code, taking the function daughter board as a minimum granularity isolation fault source, and starting a recovery mechanism; operation parameters of each control unit and a field sensor are collected in real time through a safety data bus, and an online machine learning model is utilized to predict potential faults and take prevention measures. According to the invention, the technical problems of low reliability, safety and intelligence of the power station control system are solved.

A daughter board includes: a first flat portion to be connected to a current collector; a second flat portion having a step height difference with respect to the first flat portion for connection to an electrode assembly; and a first elastic portion connecting the first flat portion and the second flat portion, the first elastic portion having elasticity.

This utility model relates to a daughter card structure, a plug-in connector, and a connector. The daughter card structure includes an insulating frame, a differential signal conductor, and a ground conductor. The signal conductor includes a signal contact, a signal crimping member, and a signal transmission section. The ground conductor includes a ground contact, a ground crimping member, and a ground transmission section. A torsion section is provided between the ground contact and the ground transmission section. The size of the torsion section is adapted to the thickness of the insulating frame. After being twisted by the torsion section, the ground transmission section connects to the first and second contact arms of the ground contact. Through the torsion of the torsion section, the first and second contact arms can respectively contact different sleeves of the mating connector, improving the electromagnetic shielding effect and signal transmission quality. The plug-in connector equipped with the above-mentioned daughter card structure has strong anti-interference ability and high signal quality. The signal of the connector composed of the above-mentioned plug-in connector has low crosstalk during transmission and has high stability and reliability.

The application relates to a manufacturing method of a blind slot circuit board, wherein after a pattern on a top layer of a second sub-board is manufactured, a reserved copper sheet exists in a blind slot pattern area besides a circuit, the reserved copper sheet can reduce the area of a non-copper area, so that a half-cured sheet cannot flow into the non-copper area in large quantity during pressing, the thickness of the cured sheet between the two sub-boards after pressing can be improved, the board can be prevented from being exploded, the reserved copper sheet is etched off after the blind slot is milled, the total board is uniformly stressed during pressing and subsequent processes after pressing, the board surface is not prone to warping, and the yield of products is improved; and in the method, the first sub-board bottom layer and the second sub-board top layer are covered with PI films, the circuit in the blind slot pattern area can be effectively protected during milling, and the circuit is prevented from being scratched due to an uncontrolled milling depth.

The application discloses a FLASH application verification system based on FPGA, which comprises a PC, an FPGA application verification board and a FLASH subboard. The FPGA application verification board is provided with two FPGA chips; each FPGA chip is connected with the FLASH and can independently access the FLASH to perform verification operation; each FPGA is externally connected with a large-capacity 160Mb SRAM; and the NOR_FLASH and the SPI_FLASH can be verified by replacing the FLASH subboard. The application also discloses a verification method based on the system, which comprises the following steps: determining power-on sequence, JTAG function verification, digital logic verification and read-write function verification. The application has comprehensive verification function, strong universality and important significance for application verification of a series of FLASH.

The utility model discloses a power adapter with a movable fixing hook, which relates to the technical field of power adapters and comprises a power adapter body, an input end of the power adapter body is connected with an input wire in an inserted mode, an output end of the power adapter body is connected with an output wire, and the power adapter further comprises a fixing hook. The fixing hook comprises a daughter board installed at the bottom end of the power adapter body and a mother seat installed on a table board, and the daughter board and the mother seat are connected and fixed through a sliding fit clamping structure so that the power adapter body can be rapidly installed at the bottom of the table or rapidly detached. According to the power adapter, through the arranged fixing hooks, the power adapter body and the table bottom can be rapidly installed and detached, a user can stably hang the power adapter to the table bottom, the problem that a traditional external power adapter occupies the space of a table top is effectively solved, the table top is neater and more attractive, and the overall coordination of the use environment is improved.

The utility model belongs to an inertial navigation system, and particularly relates to an inertial navigation system antenna feeder circuit, which comprises an inertial navigation system and at least two antenna feeder circuits adopting differential signal transmission, and each antenna feeder circuit comprises a feed power supply, an anti-surge module, an anti-backflow module, an isolation module and an anti-static module, the output end of the inertial navigation system is connected with the input end of the feed power supply, the output end of the feed power supply is sequentially connected with the anti-surge module, the anti-backflow module, the isolation module and the anti-static module, and a multi-stage protection link is generated; the multi-stage protection link is integrated on an independent daughter board and is externally connected with a main control board through a metalized connector; the anti-surge module is used for inhibiting voltage impact; the anti-backflow module is used for preventing current from flowing reversely; the isolation module is used for noise isolation; the anti-static module is used for releasing electrostatic charges. The antenna feeder circuit of the inertial navigation system can solve the problem that the antenna feeder circuit of the inertial navigation system in the prior art is weak in protection against power supply surge and electrostatic interference.

This application discloses an electrical wiring system, method, semiconductor device, and storage medium, relating to the field of semiconductor device manufacturing technology. In this electrical wiring system, a main distribution board is electrically connected to a motion control module, and the main distribution board is provided with a main power input socket. Each sub-board module is respectively disposed in a corresponding functional component area, and each sub-board module is electrically connected to at least one load device in the corresponding functional component area. Each connecting cable is connected between the main distribution board and a corresponding sub-board module. The main distribution board is configured to receive an external power supply voltage through the main power input socket, and provide an external power supply voltage to the sub-board modules connected to each connecting cable according to the control commands issued by the motion control module. This application solves the technical problems of low assembly efficiency, difficulty in fault location, and insufficient reliability in existing centralized electrical architectures due to the constraints of centralized wiring methods.

The application relates to a battery cell module milling clamping tool, which comprises a fixed clamping assembly and a centering positioning assembly; the fixed clamping assembly comprises a sub-plate, an X-axis clamping piece and a Z-axis pressing piece, the X-axis clamping piece is installed on the sub-plate, and the Z-axis pressing piece is installed on the sub-plate; the centering positioning assembly comprises a bottom plate and a Y-axis positioning piece, and the bottom plate is detachably connected with the sub-plate; a mother plate is used for being installed on a machine tool, and the sub-plate is detachably connected with the mother plate; a battery cell module to be milled is placed on the sub-plate, the sub-plate is hung on the bottom plate, the position of the battery cell module in the horizontal Y-axis direction is adjusted through the Y-axis positioning piece, the position of the battery cell module on the XZ axis is adjusted and fixed through the X-axis clamping piece and the Z-axis pressing piece, at the moment, the sub-plate is hung on the mother plate according to the positioning connecting points of the mother plate, the relative position between the sub-plate and the mother plate can be determined through the set positioning connecting points, at the moment, the sub-plate and the mother plate are connected, and the positioning of the battery cell module relative to the machine tool is completed, and the tool is convenient to use.

The utility model relates to a kind of board division magnetic attraction type high-power device integrated assembly, including circuit board, several power devices and radiator, and circuit board includes several circuit sub-boards, and same number of power devices is distributed to each circuit sub-board to construct power module unit;Power device is equipped with magnetic attraction material near the side of radiator;Each power module unit is magnetically attracted and connected on radiator by several power devices on its circuit sub-board.The utility model evenly distributes power device in multiple standardization circuit sub-boards, disperses thermal stress, reduces the risk of deformation of single circuit board;And using magnetic material realizes the automatic alignment and close fit of device and radiator, avoids the alignment error of traditional mechanical fixing, substantially improves assembly efficiency;Its standardization sub-board supports power flexible extension.Therefore, the board division magnetic attraction type high-power device integrated assembly of the utility model systematically solves the collaborative optimization problem of heat management, mechanical reliability and assembly efficiency in traditional high-power module.

The application discloses a method for high-speed data synchronization transmission between boards, which adopts high-speed transceivers to realize high-speed data transmission between boards in a many-to-one mode; the data transmission time delay of each sub-board to the main board is tested, and the maximum value T0 is obtained; meanwhile, the data transmission buffer of each sub-board and the data receiving buffer of the main board are reset; after the resetting, each sub-board starts to send data, and the main board starts to receive the data of each sub-board from the local buffer after waiting for a time T greater than T0. The application realizes high-speed data transmission between boards, effectively controls the time delay of high-speed data transmission between boards, and realizes the synchronization transmission of data, which is very important in a system with complex data interaction and high data synchronization requirement.

The application discloses a kind of new battery management systems applied to A00 grade new energy electric vehicle new type, including main control daughter board and MOS daughter board, the MOS daughter board is fixed on assembly support, the main control daughter board is fixed on MOS daughter board by copper stud, the main control daughter board is constituted by AFE chip, MCU module, power module, CAN module, wake-up module, EEPROM module and FLASH module, the MOS daughter board is constituted by charging MOS, discharging MOS, shunt, DCDC pre-charging MOS, DCDC MOS and heating MOS;The application is under the monitoring of high-power management system, the whole vehicle DCDC module continuously outputs 12V low-voltage power supply to central control platform, reduces battery pack cost, integrates the traditional PDU function in battery pack to management system, simultaneously reduces the assembly complexity of battery pack, improves the whole vehicle safety, built-in power battery output short-circuit protection function, can prevent the whole vehicle safety hazard caused by external short circuit.

The application discloses an airborne 1394 subcard detection device, which belongs to the technical field of 1394 communication detection and comprises a detection device and a test box body which are connected with each other. The detection device comprises an input device, a display device, a power module, a main control module circuit board, a 1394 communication module circuit board, an AD acquisition module circuit board and a discrete quantity module circuit board. The main control module circuit board is connected with the to-be-detected airborne 1394 subcard 45 through the 1394 communication module circuit board. The main control module circuit board is connected with the AD acquisition module circuit board. The airborne 1394 subcard can be tested in detail, including data transmission rate, configuration information, communication state and other related functions. Meanwhile, the state of the airborne 1394 subcard can be monitored in real time and displayed on a screen. The test efficiency is high, and the accuracy is high.

The invention provides a digital-to-analog conversion chip test system and electronic equipment, and relates to the technical field of chips, and the system comprises an upper computer, a chip evaluation mother set, and a plurality of chip evaluation daughter boards. The upper computer is used for determining a test instruction according to a test item, sending the test instruction to a chip evaluation master mask and receiving test feedback data sent by the chip evaluation master mask; and the chip evaluation mother set comprises a plurality of interfaces, is used for accessing a measuring device and the chip evaluation daughter board, and is used for executing test operation on the chip evaluation daughter board according to the test instruction and acquiring test feedback data of the measuring device. By integrating the functions of testing, analyzing, recording and the like on the chip testing system, efficient testing of the chip system is achieved, and the efficiency of the chip testing process is improved.

A group communication method, a group communication apparatus, a base station, a terminal, a group communication system and a computer-readable storage medium. The method is executed by a radio-frequency daughter board of a base station, and comprises: sending a synchronization frame to a terminal group within a communication cycle, wherein the synchronization frame includes indication information that indicates whether the communication cycle is a wake-up packet sending cycle, the terminal group comprises a plurality of terminals, and the plurality of terminals are grouped in a multi-level organization manner (S110); and within the wake-up packet sending cycle, sending to the terminal group a multi-level description field for waking up terminals and a data payload field (S120).

A multiple input / output antenna device is provided that can prevent an increase in the unit cost of manufacturing a product due to automation and simplification of the manufacturing process of the product. [Solution] The multiple input / output antenna device includes a main board stacked with its back surface tightly attached to the inner surface of a heat dissipation housing, a sub-board stacked with its front or back surface tightly attached to the main board, a first heat-generating element mounted only on the main board of the main board and the sub-board, and mounted only on the back surface of the main board, which is the side where a number of heat dissipation fins are provided on the outer surface of the heat dissipation housing, and a second heat-generating element mounted only on the sub-board of the main board and the sub-board, and mounted only on the back surface of the sub-board, which is the side where a number of heat dissipation fins are provided on the outer surface of the heat dissipation housing.

The utility model discloses a connecting structure for a BMS (Battery Management System) daughter board and a signal acquisition circuit board in a power battery, one end of the BMS daughter board is provided with a row of connecting points which are arranged side by side at intervals, and the signal acquisition circuit board integrated with a plurality of signal acquisition lines and the BMS daughter board are respectively fixed at different positions on the same insulating bracket. And the signal acquisition lines are in one-to-one correspondence with the connection points at one end of the BMS daughter board, are oppositely arranged at intervals, and are welded and connected together through connecting pieces. And defects such as tin stacking, welding slag and welding deviation of tin materials are avoided, the appearance is attractive, the performance is stable, the yield is high, and a welding area can be subjected to AVI detection. The BMS daughter board does not pass through a high-temperature environment, the type selection of components on the BMS daughter board is simple, the cost is controllable, and the BMS daughter board can be replaced and maintained if the BMS daughter board breaks down in the later use process.

The invention discloses an underground verification system and method for a high-temperature integrated circuit, relates to the technical field of integrated circuit verification, and aims at solving the problems that an existing verification method for the high-temperature integrated circuit is high in cost, long in test process time consumption and deviated in verification result. The system comprises a cabin body and an upper computer, a first mounting groove for placing power supply equipment, a second mounting groove for placing a verification mother board and a third mounting groove for placing a verification daughter board are formed in the side wall of the cabin body; the first mounting groove, the second mounting groove and the third mounting groove are of sealing structures; the upper computer is used for providing operating parameters for the verification mother board, the verification mother board performs underground work according to the operating parameters after the cabin body is placed underground, and the upper computer determines the working state of the integrated circuit to be verified according to the stored data in the verification mother board after the underground work is completed. The underground verification system and method for the high-temperature integrated circuit are used for improving the verification accuracy and verification efficiency of the underground integrated circuit.

This application discloses a circuit board and an electronic device. The circuit board includes a motherboard layer, a first frame layer, a first sub-board layer, a first device, and a second device. The motherboard layer has a cutout area, a first layout area, and a second layout area, which are located on opposite sides of the cutout area. The first frame layer is stacked on the first layout area, and the first sub-board layer is stacked on the side of the first frame layer facing away from the motherboard layer. The first device is disposed on the motherboard layer, and the second device is disposed on the first sub-board layer. By stacking a first sub-board layer on the motherboard layer, this application can obtain a larger layout area in the Z-direction space through a stacking method, that is, increase the layout area of ​​the circuit board. At this time, the first device can be disposed on the motherboard layer and the second device can be disposed on the first sub-board layer, thereby satisfying the layout and wiring requirements of devices and circuits.

The utility model relates to the technical field of machining, in particular to a zero-point positioning machining tool based on a mother-son board structure, which comprises a square box, a plurality of mother boards are fixedly mounted on the outer wall of the square box through screws and mother board positioning pins, and an air pressure locking mechanism is mounted at the lower end of each mother board. A plurality of reference seats are fixedly mounted at the outer end of each mother board, positioning hole systems are formed in the outer ends of the reference seats, daughter boards are arranged at the outer ends of the reference seats, parts are mounted on the daughter boards, the daughter boards are mounted at the outer ends of the mother boards, and under the condition that each part is provided with one daughter board, multi-variety, multi-standard, multi-product and multi-standard production can be realized under the condition that the mother boards are not changed. By means of rapid machining with few clamps, alignment time and tool setting time before machining are omitted, and by means of simultaneous machining of multiple parts, the utilization rate of equipment is increased, the labor intensity of workers is reduced, and the production efficiency is improved.

A vertical line card (VLC) arrangement for networking modules is disclosed. The system includes a mainboard containing a high-speed ASIC and one or more outward cage structures, along with a centrally located daughterboard supporting one or more additional cages. This architecture significantly shortens high-speed SerDes traces, preserves front-to-back airflow, and sustains high port density. By mounting certain cages directly on the mainboard, extra insertion losses from interconnects are eliminated, while the centrally positioned daughterboard ensures only minimal additional signal degradation. Strategic cutouts and angled faceplates provide optimal thermal management. Overall, the solution avoids expensive flyover cables or multiple board-to-board connectors and accommodates busbar power delivery for high-current ASICs. This modular design offers flexibility in port counts, component placement, and power management, enabling robust signal integrity and enhanced heat dissipation for next-generation data center and telecom systems.

A high-precision circuit board and a preparation method therefor. The method comprises: acquiring a preset circuit diagram (S1001); arranging a plurality of conductive layer groups on the basis of the preset circuit diagram, wherein conductive layers requiring formation of the same blind hole or buried hole constitute a conductive layer group, adjacent conductive layers requiring no formation of a blind hole or buried hole constitute a conductive layer group, and the conductive layer groups comprise core boards (S1002); disposing conductive layers in a stacked manner, disposing adhesive layers between the core boards of the same group or between the core boards and the conductive layers, and disposing an auxiliary layer between different conductive layer groups (S1003); laminating the stacked conductive layers, the adhesive layers, and the auxiliary layer, and peeling off the auxiliary layer after the lamination, so that the conductive layer groups constitute sub-boards (S1004); performing drilling at a preset position of a sub-board to form a through hole (S1005); disposing the sub-boards in a stacked manner, and disposing an adhesive layer between adjacent sub-boards (S1006); and laminating the stacked sub-boards and the adhesive layer (S1007).