720 results about "Daughterboard" patented technology

The invention relates to the technical field of printed embedded PCBs, and discloses an embedded PCB and a manufacturing method thereof.The embedded PCB comprises a daughter board, a first dielectric layer and a first circuit layer which are sequentially arranged in a stacked mode in the first direction, a device is embedded in the daughter board, the device is located on the side, close to the first dielectric layer, of the daughter board, and the first dielectric layer is located on the first circuit layer. One side, close to the first dielectric layer, of the device is provided with a first part, and the first part is provided with a first protection part; a first connection hole is formed in the first dielectric layer, a first conductive part is filled in the first connection hole, the first protection part is connected and electrically conducted with the first conductive part, and the first conductive part is connected and electrically conducted with the first circuit layer. The embedded PCB and the manufacturing method thereof provided by the invention are used for improving the problem of poor hole filling in the electroplating hole filling process in the related technology.

The invention discloses a multichannel data acquisition recording storage system and method.The system comprises a plurality of recording daughter cards, a recording storage unit and an upper computer, and each recording daughter card receives sampling messages obtained through multichannel data acquisition; the daughter card FPGA analyzes the sampling message, generates a fault wave recording message, writes the fault wave recording message into a daughter card DDR sending cache module, and sends the fault wave recording message to a wave recording storage unit; a wave recording storage unit FPGA writes the fault wave recording message into a DDR wave recording storage module according to a preset read-write mechanism, and a CPU control module reads and writes fault wave recording data in the fault wave recording message within a preset time as a fault wave recording file into an SSD hard disk storage module; and the upper computer reads the fault recording file in the SSD storage module, analyzes the fault recording file and displays a recording waveform corresponding to the fault recording file. According to the invention, the expenditure of CPU processor software is obviously reduced, and high-speed recording of fault data is realized.

An information handling system may include a motherboard and an information handling resource mechanically and electrically coupled to the motherboard. The information handling resource may include a circuit board, a connector mounted to a surface of the circuit board and configured to electrically couple to a corresponding connector mounted to a surface of a second circuit board of a second information handling resource, a first standoff extending from a surface of the circuit board, and a second standoff extending from the surface and arranged relative to the first standoff such that the first standoff and the second standoff are configured to mechanically engage with engagement features of the second information handling resource to define an axis of pivot between the circuit board and the second circuit board to align the connector to the corresponding connector.

The invention discloses a serial-port-based digital input and output control method and device and a storage medium, and relates to the technical field of electronic digital data processing.The serial-port-based digital input and output control method comprises the steps that if it is detected that a main board serial port is connected into a daughter card, serial port clock frequency multiplication is determined in response to programming interface calling; assembling the data to be transmitted into a communication instruction corresponding to the current frame; and transmitting the communication instruction to the daughter card through the serial port based on the baud rate determined by the serial port clock frequency multiplication. Therefore, the technical effect of reducing serial port data transmission delay so as to realize high-speed digital input and output expansion is realized.

The invention discloses a manufacturing method of a reconfigurable LPCAMM storage device, and relates to the technical field of production of storage devices, and the manufacturing method of the reconfigurable LPCAMM storage device realizes comprehensive improvement of technical performance, production efficiency and commercial value through an innovative modular hierarchical architecture and process collaborative design. On the basis that the compact characteristic of a traditional LPCAMM is kept, through the dual effects of mechanical guiding and elastic compensation, the sub-board assembly precision is improved, through the collaborative design of a self-compensation contact array of the detachable storage sub-board and a heat dissipation strengthening layer (S200), the ultra-long plugging service life is achieved, and through the combination of three-dimensional microstructure heat dissipation and the phase change heat storage technology, the phase change heat storage performance is improved. The working temperature of the device is reduced, the thermal resistance value is reduced, the thermal management bottleneck of a high-density storage module is broken through, and a complete solution with high reliability, maintainability and cost effectiveness is provided for large-scale application of the LPCAMM technology in emerging markets such as cloud computing terminals and industrial Internet of Things equipment.

The invention provides a time-triggered protocol network planning method and system for an aviation power supply system, and a storage medium. The network architecture adopts a hardware-level dual-redundancy design, each communication node is provided with two independent TTP physical interfaces and corresponding TTP daughter cards, and the TTP physical interfaces and the corresponding TTP daughter cards are respectively accessed to a TTP A network and a TTP B network which are logically independent, so that channel-level fault isolation is realized. The planning method comprises the following steps: classifying messages according to power supply system services and defining a transmission period; initializing a cluster and setting time parameters such as a TDMA period and a cluster period; packaging the messages with consistent periods and reserving extension bits in a data structure; and calculating the time slot capacity based on the transmission rate, the node number and the TDMA period, and generating a deterministic message scheduling table. According to the method, high communication reliability is guaranteed through dual-network redundancy, the real-time requirement of various messages such as control and alarm is met through systematic scheduling, the expandability of the network is improved by reserving expansion bits, and the method is suitable for an aviation power supply system with strict communication performance requirements.

The invention provides a test platform for a power management chip. The test platform comprises an upper computer, a control panel, a load daughter board and an instrument, the control board is configured to receive a test instruction sent by the upper computer, configure the instrument based on the test instruction, send a test signal to the load daughter board, receive a response signal sent by the load daughter board, obtain a test result based on the response signal and send the test result to the upper computer; the load daughter board is configured to bear the tested power management chip, receive the test signal sent by the control board, match the test signal to the tested power management chip, obtain a response signal output by the tested power management chip and send the response signal to the control board; wherein the load daughter board is provided with a load circuit and is configured to provide a peripheral circuit for the tested power management chip, and the control board is further configured to switch the type of the load circuit. Wherein different types of power management chips can be verified by switching the types of the load circuits on the load daughter board.

The utility model discloses a boundary beam, tray, battery pack and vehicle, boundary beam includes: boundary beam body, first reinforcing plate, second reinforcing plate and third reinforcing plate, boundary beam body defines cavity, cavity includes first side wall, second side wall and third side wall, third side wall is provided between first side wall and second side wall; two ends of the first reinforcing plate are respectively connected with the first side wall; two ends of the second reinforcing plate are respectively connected with two ends of the second side wall; one end of the third reinforcing plate is connected with the first reinforcing plate, and the other end of the third reinforcing plate is connected with the second reinforcing plate. Therefore, due to the arrangement of the first sub-plate and the second sub-plate, the first reinforcing plate can effectively support the first side wall, the structural strength of the first side wall of the edge beam is improved, force transmission is ensured through the arrangement of the first sub-plate and the second sub-plate, and the external acting force borne by the edge beam can be rapidly and evenly dispersed into the whole edge beam structure; the lateral load capacity of the edge beam is effectively improved, and the overall structure crashworthiness of the first side wall is improved.

The invention provides a single-line communication method and device based on pulse counting, electronic equipment and a medium, and relates to the technical field of switches and servers. The method is executed by a main board in a system, the main board is connected with a sub-board through a single in-place signal line, and the method specifically comprises the following steps: within a first preset time period after the system is powered on, sending a first pulse sequence through the single in-place signal line, and verifying the connection state of a cable based on a received response signal; if the connection state is verified to be normal, sending a second pulse sequence through a single in-place signal line, and performing data communication with the daughter board; wherein the second pulse sequence forms communication bytes in a pulse number coding mode. According to the invention, an in-place signal line which is only used for static level detection traditionally is transformed into a dynamic multifunctional channel, so that the dual defects of low communication efficiency and high misplugging risk of a traditional scheme are synchronously overcome on the premise of not increasing any hardware cost and wiring complexity.

The invention relates to the technical field of PCBs, and provides a laminated PCB manufacturing method and a laminated PCB, and the method comprises the steps: S1, an upper sub-board and a lower sub-board are manufactured, the upper sub-board corresponds to a PCB top-layer connector wiring region, and the lower sub-board corresponds to a PCB bottom-layer connector wiring region; s2, forming a first through hole penetrating through the thickness of the upper daughter board in the upper daughter board, and forming a second through hole penetrating through the thickness of the lower daughter board in the lower daughter board; s3, back drilling processing is carried out on the first through holes and the second through holes so as to eliminate stubs on the inner layers of all the wires, and the stub length L meets the formula # imgabs0 #, wherein f is the cut-off frequency, c is the light velocity, epsilon r is the PCB dielectric constant, and L is the length of the stubs; and S4, laminating the upper daughter board and the lower daughter board which are subjected to the back drilling treatment to form an integral PCB structure. The problems of high cost and poor machinability in traditional blind hole production are solved by utilizing a method of respectively processing the two daughter cards and then carrying out through hole and back drilling.

The invention relates to the technical field of printed circuit boards, and discloses a printed circuit board with an embedded ceramic part and a manufacturing method thereof.The manufacturing method of the printed circuit board with the embedded ceramic part comprises the steps that a laminated board is provided and comprises a first sub-board, a first dielectric layer, an embedded layer, a second dielectric layer and a second sub-board which are sequentially arranged in a stacked mode, the embedded layer comprises an embedded substrate and a ceramic part, the embedded substrate is provided with an embedded groove, the embedded substrate comprises a convex part arranged on the inner wall of the embedded groove, the ceramic part is arranged in the embedded groove, the edge of the ceramic part is provided with a concave part, and the convex part is accommodated in the concave part in a clearance manner; and processing a first via hole in the laminated plate, wherein the first via hole penetrates through the first sub-plate, the first dielectric layer, the lug boss, the second dielectric layer and the second sub-plate. According to the printed circuit board of the buried ceramic piece and the manufacturing method thereof, the problem that the quality of a subsequently drilled through hole is affected due to the fact that the pre-drilled hole located in the edge of the ceramic block is prone to the phenomena of insufficient glue filling and glue filling cavity in the prior art is solved.

The invention discloses a port lighting method and system, a mainboard, a storage medium and electronic equipment, and belongs to the field of network equipment communication, and the method comprises the steps that a CPU of the mainboard carries out port lighting according to the number of serializer / deserializer SerDes interfaces provided for each daughter card slot position and the preset lighting sequence of each daughter card slot position; determining the number and the position of the lighting signal of each sub-card slot position in the whole section of lighting signal code stream; the CPU of the mainboard configures the lighting signal type of each daughter card slot position according to the number of the ports of the daughter cards, and outputs the whole section of lighting signal code stream to a programmable logic device of the mainboard through a switching chip; a programmable logic device of the mainboard intercepts the lighting signals of the sub-card slot positions from the whole section of lighting signal code stream according to the determined number and position, and distributes the lighting signals to the sub-card slot positions; and the programmable logic device of the corresponding daughter card in each daughter card slot receives the lighting signal, analyzes the lighting signal and sends the lighting signal to each port LED lamp for lighting. According to the method and the device, the problem of abnormal port lighting caused by change of the number of ports of the daughter card in a hardware lighting scheme is solved on equipment supporting hot plugging of the daughter card, meanwhile, the occupied CPU resource is low, and the real-time performance is high.

The invention relates to the field of water conservancy projects, in particular to a modular quickly-assembled assembly type flood control sub-embankment for emergency flood control, which comprises a triangular hinge frame, an assembly cross beam is arranged in the triangular hinge frame, and the triangular hinge frame is used for supporting flood control plates and can be folded and stored to reduce the transportation volume; splicing suites are fixedly arranged at the two ends of the assembling beams, and the assembling beams are in rapid butt joint with the assembling beams of other flood control sub-embankments through the splicing suites, so that modular splicing of the multiple sub-embankments is achieved. The water retaining daughter board is fixedly installed on the outer side of the assembly cross beam, the height of the water retaining daughter board is matched with the height of the triangular hinge frame, and the water retaining daughter board is used for blocking flood; and the folding and unfolding mechanism is arranged in the center of the bottom of the triangular hinge frame, according to the modular quickly-assembled assembly type flood control sub-embankment for emergency flood control, through the storage state, all components can be stored in order, and the damage risk in the transportation and storage process is reduced.

The automatic testing device comprises a verification mother board, a verification daughter board, a program control direct current power supply, a digital multimeter, an angle simulation instrument, a signal generator and an upper computer, and the upper computer is provided with upper computer software of the automatic testing device for the synchronous-to-digital converter. Power input, reference input voltage and angle synchronous input signals needed by the synchronous-digital converter are provided, and normal work of the two-channel synchronous-digital converter is achieved. Synchronous conversion angle signals and reference voltage are input through the angle simulation instrument, the converter outputs corresponding binary bit angle digital signals, and the controller collects the corresponding angle digital signals, converts the angle digital signals into angles and transmits the angles to the upper computer through a serial port. And the high and low levels output by the synchronous-digital converter are measured by the digital multimeter and then are transmitted to the upper computer. And finally, the upper computer judges whether the standard is reached or not. Test indexes comprise shaft angle conversion, resolution, output high level, output low level and the like.

The invention discloses a display module and a display device. The display module comprises a composite supporting layer, a display panel, a protection piece and a fixing plate, the display panel comprises a first body, a second body and a bending part connecting the first body and the second body, the first body is arranged on the first side of the composite supporting layer, the second body is arranged on the second side, opposite to the first side, in the composite supporting layer, and the protection piece is arranged on the second side. A first protection part of the protection piece is located on the side, away from the composite supporting layer, of the bent part and extends to the side, away from the first body, of part of the second body. The first sub-plate of the fixing plate is arranged on the surface of the side, away from the first body, of the first protection part, and the Young modulus of the fixing plate is larger than that of the protection piece, so that the shape of the first protection part is the same as that of the fixing plate in the curing process, the uncertainty of the shape of the first protection part is eliminated, and the stability of the first protection part is improved. And the technical problems of interference between the protection piece and the whole machine middle frame and the like are avoided.

The invention relates to the technical field of new energy automobile battery management systems, in particular to a management method and device for a battery dormancy equalization function, a vehicle and a medium, and the method comprises the steps: obtaining the voltage of each battery cell in a battery pack and the temperature of a chip in a battery controller; determining a dormancy equalization parameter of the corresponding battery cell according to the voltage of each battery cell and the chip temperature; managing the dormancy equalization function of the battery pack according to the dormancy equalization parameter of each battery cell; if the voltage of any battery cell in the battery is smaller than a first preset value or larger than a second preset value, the sleep equalization function of the battery pack is quitted, and the second preset value is larger than the first preset value. Therefore, the problems of low equalization efficiency, long-time high-temperature operation of a battery management system BMS daughter board, potential safety hazards of overvoltage and undervoltage and the like in a traditional passive equalization strategy are solved.

The invention relates to a stepped printed circuit board preparation method and a printed circuit board, and belongs to the technical field of printed circuit boards. The method comprises the following steps of: plugging through holes in a first sub-board and a second sub-board with resin and electroplating caps; performing pattern etching on the step region of the second sub-board; after the step area of the second daughter board is coated with solder resist ink and a glue-resistant protective material is placed, the first daughter board and the second daughter board are laminated to form a mother board; covering a dry film on the through hole which is plugged by resin in the step area, and performing thinning and copper reduction on the corresponding step area on the surface of the mother board; secondary drilling is carried out on the corresponding step area of the mother board, and resin in secondary drilling holes is removed; and drilling a step area on the first daughter board in a blind fishing mode to expose the pattern etched on the second daughter board. According to the method provided by the invention, solder leakage and impurities can be prevented from entering the through hole in the operation process, the through hole is effectively protected, and meanwhile, the etching precision of the golden finger pattern in the step region is improved.

The invention relates to the technical field of PCB jointed board matching, in particular to an automatic PCB jointed board identification method, which comprises the following steps: acquiring a layer file containing PCB frame information, the frame information comprising coordinates and lengths of line segments forming a frame; taking the origin of coordinates as a starting point, searching a shortest closed path based on the frame information, and forming a first daughter board frame by an area enclosed by the closed path; according to the shape of the frame of the first daughter board, identifying the frames of all the daughter boards in the substrate through a graph matching algorithm; generating position information and rotation angle information of each daughter board relative to the first daughter board based on a matching result; according to the invention, frame layer data is directly processed, manual intervention is eliminated, and matching failure caused by wrong pad selection is avoided; the rotation angle is automatically calculated, any-angle board splicing is supported, and parameters do not need to be predefined; based on frame template matching of geometric features, the calculation amount is reduced, and the trial and error process is avoided; the physical frame structure is preferentially identified, and the problem of matching fault tolerance when the bonding pad is missing or deformed is solved.

The embodiment of the utility model provides a magnetic type clamping and locking mechanism for circuit board testing, and relates to the technical field of circuit board testing. The magnetic type clamping and locking mechanism for the circuit board test comprises a base, an adjusting mechanism is installed at the upper end close to one side of the base, a sub-part clamping mechanism used for clamping a sub-board is installed at the upper end of the adjusting mechanism, a supporting rod is installed at the upper end close to the other side of the base, and the supporting rod supports a supporting plate. And a main part clamping mechanism for clamping the main board is mounted on the upper side of the supporting plate. A main board of a circuit board is fixed through the clamp, then a daughter board of the circuit board is placed above the placing plate and fixed through the fixing plate, the width between the two moving blocks can be adjusted through sliding of the moving blocks on the adjusting plate, the front-back position of the daughter board can be adjusted through sliding of the adjusting plate on the adjusting rail, and after adjustment is completed, the daughter board is fixed through the fixing plate. The magnetic attraction switch is turned on, so that the daughter board is firmly attracted, and the stability of the daughter board during detection is improved.

The invention discloses a high-speed parallel EMMC (Embedded Multi Media Card) test method and system. The method comprises the following steps: generating a test script; the test script comprises the steps of generating a protocol setting instruction based on an interface protocol type of the to-be-tested EMMC, generating a test command based on a test item type of the to-be-tested EMMC, and setting a test ending condition; based on the test script, testing a plurality of to-be-tested EMMCs in parallel through a plurality of test daughter boards comprising multiple channels, and collecting test parameters in real time; wherein different test items of each to-be-tested EMMC are tested according to a preset sequence; in the testing process, follow-up testing is adjusted based on testing parameters collected in real time and a preset optimization rule; and for each tested EMMC, when it is judged that a test ending condition is met, ending the test, returning a test result, analyzing the test result and outputting a test report. Through the automatic optimization strategy and the parallel test, the test efficiency can be improved, and the labor dependence and the test cost can be reduced.

The invention provides an intelligent metasurface optimal position deployment method and system in an electric power scene, and the method is characterized in that the method comprises the following steps: constructing a single-input single-output system model for the inspection of a multi-intelligent metasurface (RIS)-assisted unmanned aerial vehicle, the system comprises a base station, an unmanned aerial vehicle and a plurality of RISs, the RIS is deployed in a candidate site set # imgabs0 # between a base station and an inspection area, the height # imgabs1 # azimuth angle theta i and the number Ti of daughter boards of each RIS are adjustable, and the inspection area is divided into N grids; establishing a channel model, and calculating average power gains of direct connection and cascade channels; an optimization problem with the goal of minimizing the total deployment cost is constructed, the total deployment cost comprises RIS site fixed cost and daughter board hardware cost, and the constraint condition is that the system coverage rate is not lower than a preset threshold value eta min; and converting the optimization problem into an integer linear programming problem, introducing a binary variable to represent RIS deployment configuration, and solving through a branch definition algorithm to obtain the optimal RIS position, height, azimuth angle and daughter board number.

The invention relates to the technical field of printed circuit boards, and discloses a PCB with a built-in power chip and a manufacturing method thereof, the PCB comprises a daughter board, a first insulating layer, a first line layer, an insulating part and a line part which are sequentially arranged along a first direction, one side, facing the first insulating layer, of the daughter board is provided with a chip, and the chip is provided with a first bonding pad and a second bonding pad; the first circuit layer comprises a first part and a second part, the first part is electrically conducted with the first bonding pad, the first part is electrically conducted with the circuit part, one end of the second part and the first part are arranged at an interval, and the other end of the second part is electrically conducted with the circuit part. The other end of the second part protrudes out of the insulating part in the second direction and protrudes out of the circuit part in the second direction, the second part is electrically connected with the second bonding pad, and the second direction is perpendicular to the first direction. According to the PCB with the built-in power chip and the manufacturing method of the PCB, the hole filling frequency can be reduced, and the production cost is reduced.

The invention provides a printed circuit board (PCB) and a PCB processing method. The invention provides a printed circuit board (PCB), the PCB comprises a first daughter board provided with a high-speed wiring layer and a grounding layer and a second daughter board provided with a non-high-speed wiring layer, the first daughter board comprises via hole points arranged according to an array mode, and any via hole point represents a differential pair of via holes; differential pair via holes represented by via hole points in each array are connected with the high-speed wiring layer in the first daughter board in sequence; a shielding groove along the row direction is configured between adjacent rows in the array, or a shielding groove along the column direction is configured between adjacent columns in the array, the shielding grooves arranged between the adjacent rows or between the adjacent columns are connected with a grounding layer in the first daughter board, the depth of the shielding grooves is in a step shape, and step grooves are formed through the shielding grooves. On the basis of not influencing the fan-out of the differential signal wire, the crosstalk between the differential pair via holes between adjacent rows or columns is isolated.

The embodiment of the utility model provides a circuit board, a display module and a display device, relates to the technical field of display, and aims to increase the space occupied by a battery, improve the battery capacity and improve the cruising ability of the display device. The circuit board includes a first daughter board and a second daughter board. The first daughter board comprises a first circuit board, a first electronic component and a first binding pin, and the first electronic component is arranged on the first side of the first circuit board. The first binding pin is arranged on the second side of the first circuit board and located at one end of the first circuit board. The second daughter board comprises a second circuit board. The second circuit board is connected with one end, provided with the first binding pin, of the first circuit board. The second circuit board comprises a first part and a second part, and the first part can be bent towards the second side of the first circuit board along the first bending shaft, so that the second part is bent to the second side of the first circuit board. The second portion is located at one side of the first portion away from the first circuit board. The circuit board is used for the display device.

The utility model relates to an assembly type autoclaved aerated inclined top plate, which belongs to the technical field of building materials and comprises a mother plate body, an assembly groove is arranged on the surface of the mother plate body, and a daughter plate body is inserted in the assembly groove of the mother plate body. A positioning groove is formed in the bottom end of the assembling groove of the mother board body, and a threaded groove is formed in the surface of the positioning groove. The autoclaved aerated inclined top plate is made into a two-part structure of the mother plate body and the daughter plate body, during installation treatment, the mother plate body is firstly carried and fixed to a designated installation position of a building, then the daughter plate body is carried and inserted into the assembly groove of the mother plate body until the positioning block at the bottom of the daughter plate body corresponds to the positioning groove in an inserted mode, and then the daughter plate body is installed. And then lengthened bolts sequentially penetrate through the through holes and the threaded holes, the penetrating ends of the lengthened bolts extend into the threaded grooves, installation and fixation of the sub-plate bodies are completed, the weight of the autoclaved aerated inclined top plate is decomposed, carrying treatment is convenient, and therefore the assembly effect is improved.

A secondary battery and a method of manufacturing the same are provided. The secondary battery includes: an electrode assembly; a case accommodating the electrode assembly; a daughter board assembly coupled to a first side of the electrode assembly; and a cover assembly coupled to the daughter board assembly. The daughter board assembly includes a daughter board connected to the electrode assembly and a current collector bonded to the daughter board, and the case includes a bottom portion, a side portion connected to the bottom portion, and a cover facing the bottom portion. The cover is welded to a side portion of the housing.

The invention relates to the field of blind slot laminated modules, in particular to a blind slot laminated module based on a multistage vertical interconnection device and a process method. A mother board module; the copper pin part is vertically connected with the copper pin part; the fixed supporting part is provided with a first tooth groove and a through hole; the adjusting support part is provided with a second tooth groove and a first threaded hole, the second tooth groove and the first tooth groove are embedded in a staggered mode, the copper pin part is clamped and fixed in an embedding gap of the second tooth groove and the first tooth groove, and the first threaded hole is aligned to the through hole and is perpendicular to the extending plane of the stepped teeth of the second tooth groove; and the clamping force of the second tooth groove on the copper pin part is controlled by the second screw arranged in a penetrating manner. The problem that high-reliability welding quality is affected due to the fact that the ultrahigh-density copper pins of the laminated module are skewed due to uneven temperature loads and inconsistent thermal deformation degrees of materials in the multiple welding processes of the vertical interconnection technology is solved, and the requirements of remote sensing satellites are met.

A connector system having a first connector and a second connector. The first connector is mounted to a substrate and includes a housing and a first shell. The first shell has solder hold down posts which extend from a circuit board mounting surface of the first connector. Securing openings are provided in side walls of the first shell. The second connector includes a daughterboard and a second shell. The second shell has side plates, resilient latching projections are formed from mating connector alignment portions positioned on the side plates proximate a connector receiving surface of the second connector. The resilient latching projections of the second connector cooperate with the securing openings of the first connector to secure the second connector to the first connector. The first connector is secured to the substrate by soldering the solder hold down posts to the substrate.

The invention discloses a multi-layer circuit board and a manufacturing method thereof. The manufacturing method comprises the steps of manufacturing and forming N sub-boards; a second prepreg is attached to the surface of one second inner conductive layer in the N-1 adjacent conductive groups through the first pin holes; a PET film is attached to the surface of the second prepreg, so that the PET film covers the second pin hole, and the first pin hole is exposed; pre-pressing a second prepreg and a PET film, then processing the PET film and the second prepreg by using laser, forming a blind hole in the second prepreg, and exposing a first conductive structure of a second inner conductive layer below the second prepreg; copper paste hole plugging and pre-curing are carried out on the blind hole, and then the PET film is removed; and through the second pin holes, all the daughter boards are stacked, pressed and molded to obtain the multi-layer circuit board. By adopting the technical scheme, the problems of poor reliability and low yield of the current manufacturing method can be solved.

The invention relates to the technical field of 5G communication modules, in particular to a compact integrated 5G communication module structure and an assembling method thereof.The compact integrated 5G communication module structure comprises a shielding shell, a sealing upper cover is installed at the upper end of the shielding shell, positioning units are installed at the four corners of the inner side of the shielding shell, and PCB stacking daughter boards and positioning middle frames are installed on the outer sides of the positioning units; the sealing upper cover comprises a plate body, the lower end of the plate body is fixedly connected with a buckle and a positioning ring plate, control grooves are formed in the four corners of the lower end of the plate body, and penetrating holes are formed in the four corners of the plate body. The positioning unit comprises a positioning column, vertical grooves are formed in the two sides of the positioning column, a plurality of fixing mechanisms are installed on the inner sides of the vertical grooves, the inner side of the positioning column is rotationally connected with a driving shaft through a circular plate, and edge grooves are formed in the two sides of the driving shaft. And the problems of contact resistance drift, signal integrity deterioration and creep failure after thermal circulation caused by insufficient pre-tightening of the middle layer are avoided.