915 results about "Daughterboard" patented technology

The invention relates to a high-speed data synchronous acquisition and emission system suitable for a satellite communication MIMO (Multiple Input Multiple Output) system. The system comprises two acquisition and emission daughter cards and a clock management unit, the acquisition and emission daughter card comprises a multi-channel ADC acquisition unit and a multi-channel DAC refreshing unit; a multi-channel ADC acquisition unit of the acquisition and emission daughter card sends acquired data to an FPGA for processing through a JESD204B interface, and then the data is forwarded through an optical module; a multi-channel DAC refreshing unit of the acquisition and emission daughter card sends data received by the optical module to an FPGA for processing, and then the data is sent to a DAC through a JESD204B interface for interpolation filtering and IQ conversion, refreshed and output to a radio frequency front end; and the clock management unit realigns the phase of the device clock and the phase of the reference clock in each power-on process by using a trigger signal of the clock chip so as to realize inter-board synchronization. The system can improve the synchronization performance and reduce the power consumption.

The invention relates to the technical field of printed embedded PCBs, and discloses an embedded PCB and a manufacturing method thereof.The embedded PCB comprises a daughter board, a first dielectric layer and a first circuit layer which are sequentially arranged in a stacked mode in the first direction, a device is embedded in the daughter board, the device is located on the side, close to the first dielectric layer, of the daughter board, and the first dielectric layer is located on the first circuit layer. One side, close to the first dielectric layer, of the device is provided with a first part, and the first part is provided with a first protection part; a first connection hole is formed in the first dielectric layer, a first conductive part is filled in the first connection hole, the first protection part is connected and electrically conducted with the first conductive part, and the first conductive part is connected and electrically conducted with the first circuit layer. The embedded PCB and the manufacturing method thereof provided by the invention are used for improving the problem of poor hole filling in the electroplating hole filling process in the related technology.

The invention discloses a multichannel data acquisition recording storage system and method.The system comprises a plurality of recording daughter cards, a recording storage unit and an upper computer, and each recording daughter card receives sampling messages obtained through multichannel data acquisition; the daughter card FPGA analyzes the sampling message, generates a fault wave recording message, writes the fault wave recording message into a daughter card DDR sending cache module, and sends the fault wave recording message to a wave recording storage unit; a wave recording storage unit FPGA writes the fault wave recording message into a DDR wave recording storage module according to a preset read-write mechanism, and a CPU control module reads and writes fault wave recording data in the fault wave recording message within a preset time as a fault wave recording file into an SSD hard disk storage module; and the upper computer reads the fault recording file in the SSD storage module, analyzes the fault recording file and displays a recording waveform corresponding to the fault recording file. According to the invention, the expenditure of CPU processor software is obviously reduced, and high-speed recording of fault data is realized.

This application provides a terminal device, including a housing, a sub-board, a metal bracket, and a fastening part. The housing includes a plurality of fastening holes and a plurality of positioning parts, and the sub-board includes a plurality of positioning holes. The metal bracket includes a plurality of clamping parts and a plurality of mounting holes. The plurality of clamping parts are in a one-to-one correspondence with the plurality of positioning parts. The plurality of fastening holes are in a one-to-one correspondence with the plurality of positioning holes and the plurality of mounting holes. Each clamping part is clamped to one positioning part. The plurality of positioning holes are aligned with the plurality of mounting holes in the Z-axis direction, and the fastening part sequentially passes through the aligned mounting holes, positioning holes, and fastening holes.

An information handling system may include a motherboard and an information handling resource mechanically and electrically coupled to the motherboard. The information handling resource may include a circuit board, a connector mounted to a surface of the circuit board and configured to electrically couple to a corresponding connector mounted to a surface of a second circuit board of a second information handling resource, a first standoff extending from a surface of the circuit board, and a second standoff extending from the surface and arranged relative to the first standoff such that the first standoff and the second standoff are configured to mechanically engage with engagement features of the second information handling resource to define an axis of pivot between the circuit board and the second circuit board to align the connector to the corresponding connector.

The utility model discloses a heavy fixture which comprises a mother board and a fixture daughter board, a positioning pin is arranged on the top of the mother board, the fixture daughter board is placed on the outer wall of the top of the mother board, and the fixture daughter board, a clamping air cylinder, a locking pin and a limiting sleeve are arranged, so that when the heavy fixture is used, the clamping air cylinder can be opened to enable the locking pin to slide in a pin sleeve, and then the locking pin is matched with the fixture daughter board. The locking pin inclined surface and the sub-plate inclined surface are arranged, so that the locking pin inclined surface can be matched with the sub-plate inclined surface to limit the clamp sub-plate no matter what state the clamp sub-plate is in or the clamping cylinder is interrupted in the use process, the device can stably operate when machining extra-heavy workpieces, and the clamping cylinder can be stably rotated even in an overturning state. The clamp daughter board can also be used. The heavy workpiece clamping device can stably operate when clamping a heavy workpiece, meanwhile, the jacking air cylinder, the jacking plate and the mounting plate are arranged, the jacking air cylinder can be opened to enable the jacking plate to abut against the clamp sub-plate to move, and then follow-up treatment and replacement are facilitated.

The invention discloses a liquid cooling heat dissipation device and a server, and relates to the technical field of server heat dissipation. The board card heat exchange mechanism comprises a fixing shaft, a rapid locking assembly and a board card heat exchange sub-board, the board card heat exchange sub-board is arranged on the fixing shaft in a penetrating mode so that the board card heat exchange sub-board can rotate around the fixing shaft and slide in the axial direction of the fixing shaft, the board card heat exchange sub-board is used for clamping a corresponding board card, and the rapid locking assembly is used for making the board card heat exchange sub-board abut against the main heat exchange runner. When the board card needs to be replaced, the board card can be taken out and replaced by a new board card only by opening the rapid locking assembly and rotating the board card heat exchange sub-board around the fixing shaft, and the board card heat exchange sub-board does not need to be taken down for disassembly and assembly. According to the invention, independent disassembly and maintenance of the board card are supported, and the flexibility, convenience and safety of production, test and operation and maintenance are greatly improved.

The invention discloses a general test method and device for an isolation chip and a readable storage medium, and relates to the technical field of electronic device tests.The general test device comprises a test daughter board, and the test daughter board connects pins of the isolation chip to be tested to a test bottom board; the test base plate is provided with the maximum pin number and the maximum isolation channel number according to the pin distribution rule of the isolation chip, and the isolation channel direction is set to be bidirectional; the test daughter board is connected above the test bottom board, and a resource leading-out board of a CTA8280F simulation test machine is connected below the test bottom board. The test daughter board is used for connecting pins of different types of isolation chips to the test base board. Different types of isolation chips can be tested only by replacing different test daughter boards, so that the difficulty and the period of test development can be reduced.

The invention discloses a serial-port-based digital input and output control method and device and a storage medium, and relates to the technical field of electronic digital data processing.The serial-port-based digital input and output control method comprises the steps that if it is detected that a main board serial port is connected into a daughter card, serial port clock frequency multiplication is determined in response to programming interface calling; assembling the data to be transmitted into a communication instruction corresponding to the current frame; and transmitting the communication instruction to the daughter card through the serial port based on the baud rate determined by the serial port clock frequency multiplication. Therefore, the technical effect of reducing serial port data transmission delay so as to realize high-speed digital input and output expansion is realized.

The invention provides a DPU equipment initialization method, and relates to the field of computer equipment. According to the method, a BAR space mapping process, a PCI device initialization process, a PF data channel initialization process and a VP data channel initialization process are executed respectively; the method comprises the following steps: firstly, carrying out IO remap mapping operation on a BAR register, and mapping a physical address of the BAR register to a virtual address space of a Linux kernel to obtain a BAR space; then PCI device initialization is carried out through the BAR space; secondly, initializing a PCI driver and a kernel timer, and on the basis, maintaining a work queue task and periodically executing port state polling; and finally, distributing an interrupt vector to the VP data channel, and managing the on-off of the VP data channel through the interrupt vector. The invention provides a complete and systematized initialization processing scheme of the DPU high-speed daughter card based on the domestic chip, which is beneficial to improving the development efficiency of domestic equipment.

The invention discloses a manufacturing method of a reconfigurable LPCAMM storage device, and relates to the technical field of production of storage devices, and the manufacturing method of the reconfigurable LPCAMM storage device realizes comprehensive improvement of technical performance, production efficiency and commercial value through an innovative modular hierarchical architecture and process collaborative design. On the basis that the compact characteristic of a traditional LPCAMM is kept, through the dual effects of mechanical guiding and elastic compensation, the sub-board assembly precision is improved, through the collaborative design of a self-compensation contact array of the detachable storage sub-board and a heat dissipation strengthening layer (S200), the ultra-long plugging service life is achieved, and through the combination of three-dimensional microstructure heat dissipation and the phase change heat storage technology, the phase change heat storage performance is improved. The working temperature of the device is reduced, the thermal resistance value is reduced, the thermal management bottleneck of a high-density storage module is broken through, and a complete solution with high reliability, maintainability and cost effectiveness is provided for large-scale application of the LPCAMM technology in emerging markets such as cloud computing terminals and industrial Internet of Things equipment.

The invention relates to the technical field of servers, and particularly discloses a direct connection hard disk system, a hard disk daughter board and a server. The hard disk daughter board and a backboard board card which are detachably connected are designed, and the hard disk daughter board is detachably connected with the backboard board card through a first hard disk state signal connector; an uplink data interface of a hard disk connector on the hard disk daughter board is directly connected with the server mainboard through a high-speed signal line, a downlink data interface of the hard disk connector is connected with a hard disk, and a hard disk state signal and a power signal of the hard disk connector are connected with a backboard controller of the backboard board card through a first hard disk state signal connector. Compared with a traditional direct-connection hard disk backboard, the universal backboard board card can be used in a cross-generation mode, only corresponding hard disk daughter boards need to be additionally arranged according to the number and the type of hard disks, a high-speed signal link is shortened, the impedance design difficulty is lowered, heat dissipation is facilitated, and noise and power consumption of the whole machine are lowered.

The invention provides electronic equipment. The electronic equipment comprises an antenna. The antenna comprises the radiator and the daughter board, and the radiation efficiency and the system efficiency of the antenna can be improved through the electronic elements on the daughter board, so that the electronic equipment has better communication performance. The antenna comprises a radiator, a daughter board, a first electronic component, a first connecting piece and a second connecting piece. The radiator comprises a first connecting point and a second connecting point, the first end of the first connecting piece is electrically connected with the first connecting point, and the first end of the second connecting piece is electrically connected with the second connecting point. The first electronic element is located on the daughter board, and the first electronic element is electrically connected between the second end of the first connecting piece and the second end of the second connecting piece; the radiator is provided with a first gap between the first connection point and the second connection point.

The invention provides a time-triggered protocol network planning method and system for an aviation power supply system, and a storage medium. The network architecture adopts a hardware-level dual-redundancy design, each communication node is provided with two independent TTP physical interfaces and corresponding TTP daughter cards, and the TTP physical interfaces and the corresponding TTP daughter cards are respectively accessed to a TTP A network and a TTP B network which are logically independent, so that channel-level fault isolation is realized. The planning method comprises the following steps: classifying messages according to power supply system services and defining a transmission period; initializing a cluster and setting time parameters such as a TDMA period and a cluster period; packaging the messages with consistent periods and reserving extension bits in a data structure; and calculating the time slot capacity based on the transmission rate, the node number and the TDMA period, and generating a deterministic message scheduling table. According to the method, high communication reliability is guaranteed through dual-network redundancy, the real-time requirement of various messages such as control and alarm is met through systematic scheduling, the expandability of the network is improved by reserving expansion bits, and the method is suitable for an aviation power supply system with strict communication performance requirements.

The invention relates to the technical field of digital printing machines, and discloses a double-cross-beam digital printing machine, a printing trolley is slidably connected with a first cross beam and a second cross beam through mover plates on the two sides of the printing trolley, the double cross beams can provide huge lifting force, and meanwhile first sliding rails are arranged on the tops and the side faces of the cross beams; the first sliding rails are additionally arranged on the top and the side faces, so that the stress of the sliding rails is increased, and the running stability of the printing trolley can be improved under the huge weight of the printing trolley; the first sliding rail located at the top of the cross beam can increase bearing capacity, and the first sliding rail located on the side face can improve operation precision. The printing trolley is driven through the linear motor and the mover plates at the same time, the linear motor is located above the cross beam, the structure is simple, the installation precision can be easily guaranteed, thrust can be easily increased, movers of the mover plates are powered on, the magnetic induction effect is generated, thrust is also given to the printing trolley, meanwhile, the mover plates on the two sides are controlled in parallel, and therefore the printing trolley is more stable. Synchronous driving of the two mover plates can be guaranteed, driving force is kept synchronous, meanwhile, accurate control is achieved, and printing stability and precision are effectively guaranteed.

The utility model discloses an MCU general test platform with high test coverage. The MCU general test platform comprises an excitation board, a mother board, a daughter board, a tested MCU chip, an upper computer and peripheral test resources, the tested MCU chip is connected with the daughter board through a chip test seat on the daughter board, the daughter board is connected with the mother board and used for sending a test command received by the mother board to the daughter board, and the daughter board transmits test data to the mother board; the mother board is connected with the excitation board and is used for sending a test instruction to the mother board by the excitation board, and the mother board transmits test data to the excitation board; the excitation board is respectively connected with the upper computer and the peripheral test resource and is used for sending a test command to the excitation board by the upper computer, the excitation board uploads test data to the upper computer, and the peripheral test resource assists the excitation board in function test; the device has the advantages that full-function testing can be carried out on MCU chips of different models and different packages, and the testing efficiency is improved; functional tests under different environment temperatures are completed through the incubator, the hardware cost of the test device is saved, and the scheme is simple to disassemble and easy to transport and store the test device.

The invention relates to the technical field of semiconductor packaging equipment, in particular to an external high-speed and high-precision force control mechanism which comprises a fixed seat, a power assembly, a pressure assembly and a flexible hinge assembly. The power assembly comprises a ball guide rail assembly and a large voice coil motor, the ball guide rail assembly is arranged on the fixing base, a Z-direction mover plate is arranged on the ball guide rail assembly in a sliding mode, a stator fixing plate of the large voice coil motor is connected to the upper end of the fixing base, and a mover fixing plate of the large voice coil motor is fixedly arranged on the Z-direction mover plate; the pressure assembly comprises a small voice coil motor and a lower pressing plate, the upper end of the small voice coil motor is arranged at the right upper end of the Z-direction mover plate, and the lower pressing plate is arranged at the lower end of the small voice coil motor; the flexible hinge assembly comprises a plate spring connecting base and a plate spring fixing base, the right end of the plate spring connecting base is connected to the lower portion of the middle of the small voice coil motor, the plate spring fixing base is fixed to the Z-direction mover plate, and a plate spring pressing block, an upper plate spring and a lower plate spring are fixed to the upper end of the plate spring connecting base and the upper end of the plate spring fixing base through fastening screws.

The invention provides a test platform for a power management chip. The test platform comprises an upper computer, a control panel, a load daughter board and an instrument, the control board is configured to receive a test instruction sent by the upper computer, configure the instrument based on the test instruction, send a test signal to the load daughter board, receive a response signal sent by the load daughter board, obtain a test result based on the response signal and send the test result to the upper computer; the load daughter board is configured to bear the tested power management chip, receive the test signal sent by the control board, match the test signal to the tested power management chip, obtain a response signal output by the tested power management chip and send the response signal to the control board; wherein the load daughter board is provided with a load circuit and is configured to provide a peripheral circuit for the tested power management chip, and the control board is further configured to switch the type of the load circuit. Wherein different types of power management chips can be verified by switching the types of the load circuits on the load daughter board.

The utility model discloses a boundary beam, tray, battery pack and vehicle, boundary beam includes: boundary beam body, first reinforcing plate, second reinforcing plate and third reinforcing plate, boundary beam body defines cavity, cavity includes first side wall, second side wall and third side wall, third side wall is provided between first side wall and second side wall; two ends of the first reinforcing plate are respectively connected with the first side wall; two ends of the second reinforcing plate are respectively connected with two ends of the second side wall; one end of the third reinforcing plate is connected with the first reinforcing plate, and the other end of the third reinforcing plate is connected with the second reinforcing plate. Therefore, due to the arrangement of the first sub-plate and the second sub-plate, the first reinforcing plate can effectively support the first side wall, the structural strength of the first side wall of the edge beam is improved, force transmission is ensured through the arrangement of the first sub-plate and the second sub-plate, and the external acting force borne by the edge beam can be rapidly and evenly dispersed into the whole edge beam structure; the lateral load capacity of the edge beam is effectively improved, and the overall structure crashworthiness of the first side wall is improved.

The invention discloses a liquid cooling heat dissipation device and a server, and relates to the technical field of server heat dissipation. The processor heat exchange mechanism is communicated with the main heat exchange runner through a quick connector assembly; when only the processor needs to be replaced, the heat exchange mechanism of the processor can be independently dismounted and mounted by disconnecting the quick connector assembly; the memory heat exchange mechanism comprises a fixing shaft, a quick locking assembly and a plurality of memory heat exchange sub-plates, the memory heat exchange sub-plates are arranged on the fixing shaft in a penetrating mode, and the quick locking assembly is used for making the memory heat exchange sub-plates abut against the main heat exchange flow channel so that the memory heat exchange sub-plates can exchange heat with the main heat exchange flow channel; when the memory needs to be replaced, the memory can be taken out and replaced by a new memory only by opening the quick locking assembly and rotating the memory heat exchange daughter board around the fixed shaft, and the memory heat exchange daughter board does not need to be taken down for disassembly and assembly. According to the invention, independent disassembly, assembly and maintenance of the processor and the memory are supported, and the flexibility, convenience and safety of production, test and operation and maintenance are greatly improved.

The invention provides a single-line communication method and device based on pulse counting, electronic equipment and a medium, and relates to the technical field of switches and servers. The method is executed by a main board in a system, the main board is connected with a sub-board through a single in-place signal line, and the method specifically comprises the following steps: within a first preset time period after the system is powered on, sending a first pulse sequence through the single in-place signal line, and verifying the connection state of a cable based on a received response signal; if the connection state is verified to be normal, sending a second pulse sequence through a single in-place signal line, and performing data communication with the daughter board; wherein the second pulse sequence forms communication bytes in a pulse number coding mode. According to the invention, an in-place signal line which is only used for static level detection traditionally is transformed into a dynamic multifunctional channel, so that the dual defects of low communication efficiency and high misplugging risk of a traditional scheme are synchronously overcome on the premise of not increasing any hardware cost and wiring complexity.

The invention relates to the technical field of PCBs, and provides a laminated PCB manufacturing method and a laminated PCB, and the method comprises the steps: S1, an upper sub-board and a lower sub-board are manufactured, the upper sub-board corresponds to a PCB top-layer connector wiring region, and the lower sub-board corresponds to a PCB bottom-layer connector wiring region; s2, forming a first through hole penetrating through the thickness of the upper daughter board in the upper daughter board, and forming a second through hole penetrating through the thickness of the lower daughter board in the lower daughter board; s3, back drilling processing is carried out on the first through holes and the second through holes so as to eliminate stubs on the inner layers of all the wires, and the stub length L meets the formula # imgabs0 #, wherein f is the cut-off frequency, c is the light velocity, epsilon r is the PCB dielectric constant, and L is the length of the stubs; and S4, laminating the upper daughter board and the lower daughter board which are subjected to the back drilling treatment to form an integral PCB structure. The problems of high cost and poor machinability in traditional blind hole production are solved by utilizing a method of respectively processing the two daughter cards and then carrying out through hole and back drilling.

The invention provides a rigid-flex printed circuit board with an electromagnetic shielding film and a preparation method of the rigid-flex printed circuit board. The rigid-flexible combined board comprises a flexible area and a rigid area connected with the flexible area; the rigid area comprises a rigid sub-board, a bonding sheet, a flexible sub-board, a bonding sheet and a rigid sub-board which are stacked in sequence; the flexible area comprises an electromagnetic shielding film, a covering film, a flexible daughter board, a covering film and an electromagnetic shielding film which are stacked in sequence; the electromagnetic shielding film comprises a conductive adhesive layer, a metal layer and an insulating layer which are sequentially stacked. The metal layer has a concave-convex structure. According to the invention, by adjusting the selection of the electromagnetic shielding film material, the interlayer binding force of the rigid-flexible combined board is improved, and the erosion phenomenon possibly occurring after the flexible area is laminated with the electromagnetic shielding film is avoided; and the preparation method avoids the problems of burrs, electromagnetic shielding film breakage and the like.

The invention relates to the technical field of printed circuit boards, and discloses a printed circuit board with an embedded ceramic part and a manufacturing method thereof.The manufacturing method of the printed circuit board with the embedded ceramic part comprises the steps that a laminated board is provided and comprises a first sub-board, a first dielectric layer, an embedded layer, a second dielectric layer and a second sub-board which are sequentially arranged in a stacked mode, the embedded layer comprises an embedded substrate and a ceramic part, the embedded substrate is provided with an embedded groove, the embedded substrate comprises a convex part arranged on the inner wall of the embedded groove, the ceramic part is arranged in the embedded groove, the edge of the ceramic part is provided with a concave part, and the convex part is accommodated in the concave part in a clearance manner; and processing a first via hole in the laminated plate, wherein the first via hole penetrates through the first sub-plate, the first dielectric layer, the lug boss, the second dielectric layer and the second sub-plate. According to the printed circuit board of the buried ceramic piece and the manufacturing method thereof, the problem that the quality of a subsequently drilled through hole is affected due to the fact that the pre-drilled hole located in the edge of the ceramic block is prone to the phenomena of insufficient glue filling and glue filling cavity in the prior art is solved.

The invention discloses a port lighting method and system, a mainboard, a storage medium and electronic equipment, and belongs to the field of network equipment communication, and the method comprises the steps that a CPU of the mainboard carries out port lighting according to the number of serializer / deserializer SerDes interfaces provided for each daughter card slot position and the preset lighting sequence of each daughter card slot position; determining the number and the position of the lighting signal of each sub-card slot position in the whole section of lighting signal code stream; the CPU of the mainboard configures the lighting signal type of each daughter card slot position according to the number of the ports of the daughter cards, and outputs the whole section of lighting signal code stream to a programmable logic device of the mainboard through a switching chip; a programmable logic device of the mainboard intercepts the lighting signals of the sub-card slot positions from the whole section of lighting signal code stream according to the determined number and position, and distributes the lighting signals to the sub-card slot positions; and the programmable logic device of the corresponding daughter card in each daughter card slot receives the lighting signal, analyzes the lighting signal and sends the lighting signal to each port LED lamp for lighting. According to the method and the device, the problem of abnormal port lighting caused by change of the number of ports of the daughter card in a hardware lighting scheme is solved on equipment supporting hot plugging of the daughter card, meanwhile, the occupied CPU resource is low, and the real-time performance is high.

The invention discloses a high-precision circuit board and a preparation method thereof. The preparation method comprises the following steps: acquiring a preset circuit diagram; setting a plurality of conductive layer groups according to a preset circuit diagram; wherein the conductive layers which need to form the same blind hole or buried hole form a conductive layer group, and the adjacent conductive layers which do not need to form the blind hole or buried hole form a conductive layer group; each conductive layer group comprises a core plate; placing the conductive layers in a stacked manner, placing bonding layers between the core plates in the same group or between the core plates and the conductive layers, and placing auxiliary layers between different conductive layer groups; laminating the conductive layer, the bonding layer and the auxiliary layer which are stacked, and stripping the auxiliary layer after lamination so as to enable the conductive layer group to form a sub-board; drilling a hole in a preset position of the daughter board to form a through hole; the daughter boards are placed in a stacked mode, and bonding layers are placed between the adjacent daughter boards; and laminating the sub-board and the bonding layer which are stacked. By adopting the technical scheme, the problems of alignment and warping caused by an asymmetric structure due to respective pressing of the sub-boards can be solved.

The invention relates to a dual-core industrial computer and a control method thereof. The dual-core industrial computer comprises a main control board; the auxiliary board is connected with the COME Type 6 interface of the main control board through a COME Type 6 interface, the auxiliary board comprises an auxiliary board interface board and an auxiliary board core daughter card, and the auxiliary board core daughter card is connected with the main control board through the auxiliary board interface board. The auxiliary board is connected with the COME Type6 interface of the main control board through the COME Type6 interface, the auxiliary board core daughter card is connected with the main control board through the auxiliary board interface board to form the dual-core industrial computer, redundant design is formed, and the problem that an intelligent factory or an automatic production line is paused due to the fact that a main board of the industrial computer is abnormal is avoided.

The embodiment of the utility model provides a mainboard, a daughter card and electronic equipment. The first mainboard comprises a selection switch, a phase-locked loop and at least one first clock buffer, the output end of the selection switch is connected with the input end of the phase-locked loop, and the selection switch is used for gating one of the input ends of the selection switch and the output end of the selection switch; a plurality of input ends of the selection switch are respectively used for inputting a first clock source signal and a second clock source signal, the first clock source signal is generated by a clock source of the first mainboard, and the second clock source signal is generated by a clock source of the daughter card; the output end of the phase-locked loop is connected with the input end of the first clock buffer, and the phase-locked loop is used for outputting a first output clock signal to the first clock buffer; the first clock buffers are used for buffering first output clock signals and outputting second output clock signals to the daughter cards, and one first clock buffer corresponds to one daughter card.

The present invention provides a method and device for automatic QC of SOC chips, wherein the device includes a QC motherboard, the QC motherboard includes a PMU power supply, an MCU main controller, a SOCKET socket, a QC sub-board, a combination switch, a TEST button, a DEBUG button, a functional module, and a result display module; the method is implemented on the device, and includes the following contents: the MCU main controller is connected to the SOC chip to be tested through the SWD bus, and then the CHIPID pre-burned in the SOC chip is read; according to the CHIPID, the MCU main controller loads the required QC code into the SOC chip to be tested according to the set priority order and controls it to perform functional testing; if the test passes, the result display module displays PASS information, and if the test fails, the result display module displays FAIL information; when FAIL occurs, the MCU main controller can also debug the SOC chip to be tested to quickly locate the fault position. The present invention proposes a method and device for automatic QC of SOC chips, which can realize fast automatic testing of SOC chips, effectively shorten the test time, and improve the test efficiency.

The invention relates to the field of water conservancy projects, in particular to a modular quickly-assembled assembly type flood control sub-embankment for emergency flood control, which comprises a triangular hinge frame, an assembly cross beam is arranged in the triangular hinge frame, and the triangular hinge frame is used for supporting flood control plates and can be folded and stored to reduce the transportation volume; splicing suites are fixedly arranged at the two ends of the assembling beams, and the assembling beams are in rapid butt joint with the assembling beams of other flood control sub-embankments through the splicing suites, so that modular splicing of the multiple sub-embankments is achieved. The water retaining daughter board is fixedly installed on the outer side of the assembly cross beam, the height of the water retaining daughter board is matched with the height of the triangular hinge frame, and the water retaining daughter board is used for blocking flood; and the folding and unfolding mechanism is arranged in the center of the bottom of the triangular hinge frame, according to the modular quickly-assembled assembly type flood control sub-embankment for emergency flood control, through the storage state, all components can be stored in order, and the damage risk in the transportation and storage process is reduced.