515 results about "Daughterboard" patented technology

The invention discloses a manufacturing method of a reconfigurable LPCAMM storage device, and relates to the technical field of production of storage devices, and the manufacturing method of the reconfigurable LPCAMM storage device realizes comprehensive improvement of technical performance, production efficiency and commercial value through an innovative modular hierarchical architecture and process collaborative design. On the basis that the compact characteristic of a traditional LPCAMM is kept, through the dual effects of mechanical guiding and elastic compensation, the sub-board assembly precision is improved, through the collaborative design of a self-compensation contact array of the detachable storage sub-board and a heat dissipation strengthening layer (S200), the ultra-long plugging service life is achieved, and through the combination of three-dimensional microstructure heat dissipation and the phase change heat storage technology, the phase change heat storage performance is improved. The working temperature of the device is reduced, the thermal resistance value is reduced, the thermal management bottleneck of a high-density storage module is broken through, and a complete solution with high reliability, maintainability and cost effectiveness is provided for large-scale application of the LPCAMM technology in emerging markets such as cloud computing terminals and industrial Internet of Things equipment.

The invention provides a time-triggered protocol network planning method and system for an aviation power supply system, and a storage medium. The network architecture adopts a hardware-level dual-redundancy design, each communication node is provided with two independent TTP physical interfaces and corresponding TTP daughter cards, and the TTP physical interfaces and the corresponding TTP daughter cards are respectively accessed to a TTP A network and a TTP B network which are logically independent, so that channel-level fault isolation is realized. The planning method comprises the following steps: classifying messages according to power supply system services and defining a transmission period; initializing a cluster and setting time parameters such as a TDMA period and a cluster period; packaging the messages with consistent periods and reserving extension bits in a data structure; and calculating the time slot capacity based on the transmission rate, the node number and the TDMA period, and generating a deterministic message scheduling table. According to the method, high communication reliability is guaranteed through dual-network redundancy, the real-time requirement of various messages such as control and alarm is met through systematic scheduling, the expandability of the network is improved by reserving expansion bits, and the method is suitable for an aviation power supply system with strict communication performance requirements.

The invention provides a test platform for a power management chip. The test platform comprises an upper computer, a control panel, a load daughter board and an instrument, the control board is configured to receive a test instruction sent by the upper computer, configure the instrument based on the test instruction, send a test signal to the load daughter board, receive a response signal sent by the load daughter board, obtain a test result based on the response signal and send the test result to the upper computer; the load daughter board is configured to bear the tested power management chip, receive the test signal sent by the control board, match the test signal to the tested power management chip, obtain a response signal output by the tested power management chip and send the response signal to the control board; wherein the load daughter board is provided with a load circuit and is configured to provide a peripheral circuit for the tested power management chip, and the control board is further configured to switch the type of the load circuit. Wherein different types of power management chips can be verified by switching the types of the load circuits on the load daughter board.

The invention provides a single-line communication method and device based on pulse counting, electronic equipment and a medium, and relates to the technical field of switches and servers. The method is executed by a main board in a system, the main board is connected with a sub-board through a single in-place signal line, and the method specifically comprises the following steps: within a first preset time period after the system is powered on, sending a first pulse sequence through the single in-place signal line, and verifying the connection state of a cable based on a received response signal; if the connection state is verified to be normal, sending a second pulse sequence through a single in-place signal line, and performing data communication with the daughter board; wherein the second pulse sequence forms communication bytes in a pulse number coding mode. According to the invention, an in-place signal line which is only used for static level detection traditionally is transformed into a dynamic multifunctional channel, so that the dual defects of low communication efficiency and high misplugging risk of a traditional scheme are synchronously overcome on the premise of not increasing any hardware cost and wiring complexity.

The invention relates to the technical field of printed circuit boards, and discloses a printed circuit board with an embedded ceramic part and a manufacturing method thereof.The manufacturing method of the printed circuit board with the embedded ceramic part comprises the steps that a laminated board is provided and comprises a first sub-board, a first dielectric layer, an embedded layer, a second dielectric layer and a second sub-board which are sequentially arranged in a stacked mode, the embedded layer comprises an embedded substrate and a ceramic part, the embedded substrate is provided with an embedded groove, the embedded substrate comprises a convex part arranged on the inner wall of the embedded groove, the ceramic part is arranged in the embedded groove, the edge of the ceramic part is provided with a concave part, and the convex part is accommodated in the concave part in a clearance manner; and processing a first via hole in the laminated plate, wherein the first via hole penetrates through the first sub-plate, the first dielectric layer, the lug boss, the second dielectric layer and the second sub-plate. According to the printed circuit board of the buried ceramic piece and the manufacturing method thereof, the problem that the quality of a subsequently drilled through hole is affected due to the fact that the pre-drilled hole located in the edge of the ceramic block is prone to the phenomena of insufficient glue filling and glue filling cavity in the prior art is solved.

The invention relates to the field of water conservancy projects, in particular to a modular quickly-assembled assembly type flood control sub-embankment for emergency flood control, which comprises a triangular hinge frame, an assembly cross beam is arranged in the triangular hinge frame, and the triangular hinge frame is used for supporting flood control plates and can be folded and stored to reduce the transportation volume; splicing suites are fixedly arranged at the two ends of the assembling beams, and the assembling beams are in rapid butt joint with the assembling beams of other flood control sub-embankments through the splicing suites, so that modular splicing of the multiple sub-embankments is achieved. The water retaining daughter board is fixedly installed on the outer side of the assembly cross beam, the height of the water retaining daughter board is matched with the height of the triangular hinge frame, and the water retaining daughter board is used for blocking flood; and the folding and unfolding mechanism is arranged in the center of the bottom of the triangular hinge frame, according to the modular quickly-assembled assembly type flood control sub-embankment for emergency flood control, through the storage state, all components can be stored in order, and the damage risk in the transportation and storage process is reduced.

The invention relates to the technical field of PCB jointed board matching, in particular to an automatic PCB jointed board identification method, which comprises the following steps: acquiring a layer file containing PCB frame information, the frame information comprising coordinates and lengths of line segments forming a frame; taking the origin of coordinates as a starting point, searching a shortest closed path based on the frame information, and forming a first daughter board frame by an area enclosed by the closed path; according to the shape of the frame of the first daughter board, identifying the frames of all the daughter boards in the substrate through a graph matching algorithm; generating position information and rotation angle information of each daughter board relative to the first daughter board based on a matching result; according to the invention, frame layer data is directly processed, manual intervention is eliminated, and matching failure caused by wrong pad selection is avoided; the rotation angle is automatically calculated, any-angle board splicing is supported, and parameters do not need to be predefined; based on frame template matching of geometric features, the calculation amount is reduced, and the trial and error process is avoided; the physical frame structure is preferentially identified, and the problem of matching fault tolerance when the bonding pad is missing or deformed is solved.

The invention discloses a high-speed parallel EMMC (Embedded Multi Media Card) test method and system. The method comprises the following steps: generating a test script; the test script comprises the steps of generating a protocol setting instruction based on an interface protocol type of the to-be-tested EMMC, generating a test command based on a test item type of the to-be-tested EMMC, and setting a test ending condition; based on the test script, testing a plurality of to-be-tested EMMCs in parallel through a plurality of test daughter boards comprising multiple channels, and collecting test parameters in real time; wherein different test items of each to-be-tested EMMC are tested according to a preset sequence; in the testing process, follow-up testing is adjusted based on testing parameters collected in real time and a preset optimization rule; and for each tested EMMC, when it is judged that a test ending condition is met, ending the test, returning a test result, analyzing the test result and outputting a test report. Through the automatic optimization strategy and the parallel test, the test efficiency can be improved, and the labor dependence and the test cost can be reduced.

The invention provides an intelligent metasurface optimal position deployment method and system in an electric power scene, and the method is characterized in that the method comprises the following steps: constructing a single-input single-output system model for the inspection of a multi-intelligent metasurface (RIS)-assisted unmanned aerial vehicle, the system comprises a base station, an unmanned aerial vehicle and a plurality of RISs, the RIS is deployed in a candidate site set # imgabs0 # between a base station and an inspection area, the height # imgabs1 # azimuth angle theta i and the number Ti of daughter boards of each RIS are adjustable, and the inspection area is divided into N grids; establishing a channel model, and calculating average power gains of direct connection and cascade channels; an optimization problem with the goal of minimizing the total deployment cost is constructed, the total deployment cost comprises RIS site fixed cost and daughter board hardware cost, and the constraint condition is that the system coverage rate is not lower than a preset threshold value eta min; and converting the optimization problem into an integer linear programming problem, introducing a binary variable to represent RIS deployment configuration, and solving through a branch definition algorithm to obtain the optimal RIS position, height, azimuth angle and daughter board number.

The invention relates to the field of blind slot laminated modules, in particular to a blind slot laminated module based on a multistage vertical interconnection device and a process method. A mother board module; the copper pin part is vertically connected with the copper pin part; the fixed supporting part is provided with a first tooth groove and a through hole; the adjusting support part is provided with a second tooth groove and a first threaded hole, the second tooth groove and the first tooth groove are embedded in a staggered mode, the copper pin part is clamped and fixed in an embedding gap of the second tooth groove and the first tooth groove, and the first threaded hole is aligned to the through hole and is perpendicular to the extending plane of the stepped teeth of the second tooth groove; and the clamping force of the second tooth groove on the copper pin part is controlled by the second screw arranged in a penetrating manner. The problem that high-reliability welding quality is affected due to the fact that the ultrahigh-density copper pins of the laminated module are skewed due to uneven temperature loads and inconsistent thermal deformation degrees of materials in the multiple welding processes of the vertical interconnection technology is solved, and the requirements of remote sensing satellites are met.

The invention discloses a multi-layer circuit board and a manufacturing method thereof. The manufacturing method comprises the steps of manufacturing and forming N sub-boards; a second prepreg is attached to the surface of one second inner conductive layer in the N-1 adjacent conductive groups through the first pin holes; a PET film is attached to the surface of the second prepreg, so that the PET film covers the second pin hole, and the first pin hole is exposed; pre-pressing a second prepreg and a PET film, then processing the PET film and the second prepreg by using laser, forming a blind hole in the second prepreg, and exposing a first conductive structure of a second inner conductive layer below the second prepreg; copper paste hole plugging and pre-curing are carried out on the blind hole, and then the PET film is removed; and through the second pin holes, all the daughter boards are stacked, pressed and molded to obtain the multi-layer circuit board. By adopting the technical scheme, the problems of poor reliability and low yield of the current manufacturing method can be solved.

The invention relates to the technical field of 5G communication modules, in particular to a compact integrated 5G communication module structure and an assembling method thereof.The compact integrated 5G communication module structure comprises a shielding shell, a sealing upper cover is installed at the upper end of the shielding shell, positioning units are installed at the four corners of the inner side of the shielding shell, and PCB stacking daughter boards and positioning middle frames are installed on the outer sides of the positioning units; the sealing upper cover comprises a plate body, the lower end of the plate body is fixedly connected with a buckle and a positioning ring plate, control grooves are formed in the four corners of the lower end of the plate body, and penetrating holes are formed in the four corners of the plate body. The positioning unit comprises a positioning column, vertical grooves are formed in the two sides of the positioning column, a plurality of fixing mechanisms are installed on the inner sides of the vertical grooves, the inner side of the positioning column is rotationally connected with a driving shaft through a circular plate, and edge grooves are formed in the two sides of the driving shaft. And the problems of contact resistance drift, signal integrity deterioration and creep failure after thermal circulation caused by insufficient pre-tightening of the middle layer are avoided.

This invention relates to the field of communication technology and discloses a method, apparatus, computer device, and storage medium for monitoring server sub-cards. The method for monitoring server sub-cards includes: after the server is powered on, selecting sub-cards supporting the System Management Bus (SMBus) from multiple sub-cards connected to the same I2C integrated circuit bus to obtain a set of sub-cards to be monitored; assigning an address to each sub-card in the set of sub-cards using the Address Resolution Protocol (ARP); and monitoring the sub-cards in the set of sub-cards based on their assigned addresses. This allows each sub-card in the set of sub-cards to have a different assigned address, thus eliminating the need for switching channels via a switch chip when monitoring the same sub-card, and enabling simultaneous monitoring of the same sub-cards, thereby improving monitoring efficiency.

The application discloses a high-density integrated chip modularized PCB (Printed Circuit Board), which comprises a daughter board and a mother board. The daughter board is used for arranging high-density integrated chips containing blind holes and comprises a functional module area, a blind hole concentrated area and a daughter board pad area. The functional module area is arranged with a plurality of chips and supporting lines. The blind hole concentrated area is arranged with most or all blind holes corresponding to the plurality of chips at a set interval according to a machining parameter reference. The daughter board pad area comprises a plurality of daughter board pads arranged at intervals on the edges of multiple layers of the daughter board, and is used for connecting with part of the supporting lines and the mother board to transmit chip signals to the mother board. The mother board is connected with at least one daughter board and comprises a mother board pad area corresponding to the position of the daughter board pad area, and is used for welding the daughter board to the corresponding position of the mother board to realize input, output and control of the chip signals of at least one daughter board corresponding to the mother board, and solves the problems of manufacturing difficulty, cost and cycle of the PCB of the high-density integrated chip with blind buried holes.

The invention provides an all-digital networked fault-tolerant calculation control method and system, and relates to the technical field of power station operation control, and the method comprises the steps: independently collecting reactor data in real time through a main control unit and a plurality of standby control units, and carrying out the synchronization of corresponding output data messages through a high-speed redundant communication bus; verifying the data message, performing automatic correction when a correctable error is detected, and immediately generating and reporting a fault positioning code when an uncorrectable error is detected; identifying a fault component through the fault positioning code, taking the function daughter board as a minimum granularity isolation fault source, and starting a recovery mechanism; operation parameters of each control unit and a field sensor are collected in real time through a safety data bus, and an online machine learning model is utilized to predict potential faults and take prevention measures. According to the invention, the technical problems of low reliability, safety and intelligence of the power station control system are solved.

A daughter board includes: a first flat portion to be connected to a current collector; a second flat portion having a step height difference with respect to the first flat portion for connection to an electrode assembly; and a first elastic portion connecting the first flat portion and the second flat portion, the first elastic portion having elasticity.

This utility model relates to a daughter card structure, a plug-in connector, and a connector. The daughter card structure includes an insulating frame, a differential signal conductor, and a ground conductor. The signal conductor includes a signal contact, a signal crimping member, and a signal transmission section. The ground conductor includes a ground contact, a ground crimping member, and a ground transmission section. A torsion section is provided between the ground contact and the ground transmission section. The size of the torsion section is adapted to the thickness of the insulating frame. After being twisted by the torsion section, the ground transmission section connects to the first and second contact arms of the ground contact. Through the torsion of the torsion section, the first and second contact arms can respectively contact different sleeves of the mating connector, improving the electromagnetic shielding effect and signal transmission quality. The plug-in connector equipped with the above-mentioned daughter card structure has strong anti-interference ability and high signal quality. The signal of the connector composed of the above-mentioned plug-in connector has low crosstalk during transmission and has high stability and reliability.

The application relates to a manufacturing method of a blind slot circuit board, wherein after a pattern on a top layer of a second sub-board is manufactured, a reserved copper sheet exists in a blind slot pattern area besides a circuit, the reserved copper sheet can reduce the area of a non-copper area, so that a half-cured sheet cannot flow into the non-copper area in large quantity during pressing, the thickness of the cured sheet between the two sub-boards after pressing can be improved, the board can be prevented from being exploded, the reserved copper sheet is etched off after the blind slot is milled, the total board is uniformly stressed during pressing and subsequent processes after pressing, the board surface is not prone to warping, and the yield of products is improved; and in the method, the first sub-board bottom layer and the second sub-board top layer are covered with PI films, the circuit in the blind slot pattern area can be effectively protected during milling, and the circuit is prevented from being scratched due to an uncontrolled milling depth.

The application discloses a FLASH application verification system based on FPGA, which comprises a PC, an FPGA application verification board and a FLASH subboard. The FPGA application verification board is provided with two FPGA chips; each FPGA chip is connected with the FLASH and can independently access the FLASH to perform verification operation; each FPGA is externally connected with a large-capacity 160Mb SRAM; and the NOR_FLASH and the SPI_FLASH can be verified by replacing the FLASH subboard. The application also discloses a verification method based on the system, which comprises the following steps: determining power-on sequence, JTAG function verification, digital logic verification and read-write function verification. The application has comprehensive verification function, strong universality and important significance for application verification of a series of FLASH.

The utility model discloses a power adapter with a movable fixing hook, which relates to the technical field of power adapters and comprises a power adapter body, an input end of the power adapter body is connected with an input wire in an inserted mode, an output end of the power adapter body is connected with an output wire, and the power adapter further comprises a fixing hook. The fixing hook comprises a daughter board installed at the bottom end of the power adapter body and a mother seat installed on a table board, and the daughter board and the mother seat are connected and fixed through a sliding fit clamping structure so that the power adapter body can be rapidly installed at the bottom of the table or rapidly detached. According to the power adapter, through the arranged fixing hooks, the power adapter body and the table bottom can be rapidly installed and detached, a user can stably hang the power adapter to the table bottom, the problem that a traditional external power adapter occupies the space of a table top is effectively solved, the table top is neater and more attractive, and the overall coordination of the use environment is improved.

An integrated terminal, a secondary battery including the same, and a method of manufacturing the same are disclosed. An integrated terminal includes: a terminal assembly including a terminal member configured to abut a daughter board electrically connected to an electrode assembly of a secondary battery and a terminal insulator surrounding a side surface of the terminal member; and a cap insulator extending along a through hole in a cap plate, the cap plate being coupled to a case accommodating the electrode assembly and the through hole into which the terminal assembly is inserted being formed in the cap plate. When the terminal assembly is inserted into the through hole, the terminal insulator and the cover insulator abut each other, and a reinforcing material is inserted into at least one of the terminal insulator and the cover insulator.

This disclosure provides a display panel motherboard, a method for fabricating a display panel, and a display device. The display panel motherboard includes a substrate, at least one test terminal, and at least one test line. The substrate is divided into a panel area and a first dicable area located around the panel area. The panel area includes a second dicable area and multiple sub-panel areas, each separated by the second dicable area. At least one test terminal is located on the substrate and in the first dicable area around the panel area, exposed away from the substrate surface to allow connection to an external test signal. At least one test line is located on the substrate, extending from the second dicable area to the first dicable area. One end of the test line is connected to a corresponding sub-panel area, and the other end extends into the first dicable area and connects to the test terminal. In this display panel motherboard, the test terminal exposed on the substrate allows for monitoring of the optical parameters of the light-emitting device during the vapor deposition process.

The present application belongs to the field of pulse electric field ablation technology, and particularly relates to a multi-channel temperature measuring device and a pulse electric field ablation device, wherein the multi-channel temperature measuring device includes multiple temperature measuring sub-boards and a temperature measuring motherboard, the temperature measuring motherboard is provided with a power supply circuit and multiple temperature measuring sub-board interfaces, the multiple temperature measuring sub-boards are connected to the temperature measuring motherboard through the temperature measuring sub-board interfaces, and the multiple temperature measuring sub-boards are respectively provided with multiple sub-temperature measuring circuits; the multiple temperature measuring sub-boards are mutually isolated from each other by high voltage; the multiple sub-temperature measuring circuits are respectively connected to the ablation electrode needle, for monitoring the temperature of the ablation electrode needle and outputting temperature data; the temperature measuring motherboard is respectively connected to the multiple sub-temperature measuring circuits, for receiving temperature data and sending it to the pulse electric field ablation main device to monitor the temperature of the ablation electrode needle in real time. The present application solves the technical problems of the temperature measuring circuit's high voltage resistance and the isolation of the pulse electric field ablation device between multiple channels.

The present invention discloses a method for manufacturing a wire harness-like high-shielding flexible circuit board, comprising the steps of: setting a laminated winding area and a flattening area on the flexible board, dividing the laminated winding area into a plurality of split boards distributed in parallel, adding an expansion area in the splitting direction, manufacturing a circuit pattern including an impedance line, forming a flexible core board, manufacturing a shielding line, corresponding to the impedance line distribution, stacking the flexible core board, the adhesive layer, and the shielding layer core board in sequence, and performing a first pressing, taking a shielding film, attaching it to one side of the shielding layer core board of the pressed board, and performing a second pressing, and splitting to form a plurality of split sub-boards distributed in parallel, and winding them with acetate tape to form a wire harness-like high-shielding flexible circuit board; the technical solution of the present invention effectively improves the impedance accuracy between the laminated boards by setting a shielding line and a graphic shielding film, and can form a wire harness-like high-shielding flexible circuit board with high shielding and high reliability.

The utility model belongs to an inertial navigation system, and particularly relates to an inertial navigation system antenna feeder circuit, which comprises an inertial navigation system and at least two antenna feeder circuits adopting differential signal transmission, and each antenna feeder circuit comprises a feed power supply, an anti-surge module, an anti-backflow module, an isolation module and an anti-static module, the output end of the inertial navigation system is connected with the input end of the feed power supply, the output end of the feed power supply is sequentially connected with the anti-surge module, the anti-backflow module, the isolation module and the anti-static module, and a multi-stage protection link is generated; the multi-stage protection link is integrated on an independent daughter board and is externally connected with a main control board through a metalized connector; the anti-surge module is used for inhibiting voltage impact; the anti-backflow module is used for preventing current from flowing reversely; the isolation module is used for noise isolation; the anti-static module is used for releasing electrostatic charges. The antenna feeder circuit of the inertial navigation system can solve the problem that the antenna feeder circuit of the inertial navigation system in the prior art is weak in protection against power supply surge and electrostatic interference.

This application discloses an electrical wiring system, method, semiconductor device, and storage medium, relating to the field of semiconductor device manufacturing technology. In this electrical wiring system, a main distribution board is electrically connected to a motion control module, and the main distribution board is provided with a main power input socket. Each sub-board module is respectively disposed in a corresponding functional component area, and each sub-board module is electrically connected to at least one load device in the corresponding functional component area. Each connecting cable is connected between the main distribution board and a corresponding sub-board module. The main distribution board is configured to receive an external power supply voltage through the main power input socket, and provide an external power supply voltage to the sub-board modules connected to each connecting cable according to the control commands issued by the motion control module. This application solves the technical problems of low assembly efficiency, difficulty in fault location, and insufficient reliability in existing centralized electrical architectures due to the constraints of centralized wiring methods.

The application relates to a battery cell module milling clamping tool, which comprises a fixed clamping assembly and a centering positioning assembly; the fixed clamping assembly comprises a sub-plate, an X-axis clamping piece and a Z-axis pressing piece, the X-axis clamping piece is installed on the sub-plate, and the Z-axis pressing piece is installed on the sub-plate; the centering positioning assembly comprises a bottom plate and a Y-axis positioning piece, and the bottom plate is detachably connected with the sub-plate; a mother plate is used for being installed on a machine tool, and the sub-plate is detachably connected with the mother plate; a battery cell module to be milled is placed on the sub-plate, the sub-plate is hung on the bottom plate, the position of the battery cell module in the horizontal Y-axis direction is adjusted through the Y-axis positioning piece, the position of the battery cell module on the XZ axis is adjusted and fixed through the X-axis clamping piece and the Z-axis pressing piece, at the moment, the sub-plate is hung on the mother plate according to the positioning connecting points of the mother plate, the relative position between the sub-plate and the mother plate can be determined through the set positioning connecting points, at the moment, the sub-plate and the mother plate are connected, and the positioning of the battery cell module relative to the machine tool is completed, and the tool is convenient to use.

The utility model discloses a glue filling technology, and provides a solution for optimizing the layout of a high-density power supply product, which comprises at least one or more electronic devices, a glue filling material and a PCB (Printed Circuit Board), the glue filling material is not limited to epoxy resin, a surrounding piece can be added aiming at the glue filling mode, but the glue filling material is not limited to one of sealants and an epoxy board; the electronic device is surrounded by the pouring glue, the surrounding shape can be irregular, and the pouring glue is filled and covers the electronic device, so that the layout design of a high-density product is improved, and the processing cost of a sub-board and the number of PCBs (Printed Circuit Board) can be reduced. According to the utility model, through a glue pouring process, the combination and integrated manufacturing of the mother board and the son board is realized by welding and assembling a plurality of boards, so that the welding quantity of the boards is reduced, the manufacturing quantity of the boards can be reduced by about 30%, and the cost is effectively reduced.

The utility model relates to a kind of board division magnetic attraction type high-power device integrated assembly, including circuit board, several power devices and radiator, and circuit board includes several circuit sub-boards, and same number of power devices is distributed to each circuit sub-board to construct power module unit;Power device is equipped with magnetic attraction material near the side of radiator;Each power module unit is magnetically attracted and connected on radiator by several power devices on its circuit sub-board.The utility model evenly distributes power device in multiple standardization circuit sub-boards, disperses thermal stress, reduces the risk of deformation of single circuit board;And using magnetic material realizes the automatic alignment and close fit of device and radiator, avoids the alignment error of traditional mechanical fixing, substantially improves assembly efficiency;Its standardization sub-board supports power flexible extension.Therefore, the board division magnetic attraction type high-power device integrated assembly of the utility model systematically solves the collaborative optimization problem of heat management, mechanical reliability and assembly efficiency in traditional high-power module.