The application discloses a preparation method of an
antioxidant lead-free
tin-based
solder alloy for high temperature, and belongs to the technical field of
solder alloy production processes. When the
solder alloy is prepared by the method, elements in raw materials include the following in percentage by
mass: 88-95% of Sn, 1-4% of Ag, 0.5-3% of Bi, 0.1-1% of Y, 0.05-0.2% of Hf, and the balance is inevitable impurities. The preparation method of the solder
alloy is as follows: after
metal raw materials are pickled and dried, Sn is first smelted and kept warm under
inert gas protection, then Ag and Bi are added, stirring and heating, Y and Hf are further added and ultrasonic
smelting is conducted; after a deoxidizing agent is added and reacts, the solder
alloy is placed and
slag is removed; three-stage refining is conducted through
plasma atomization, high-
low frequency ultrasonic treatment and a pulse ultrasonic conversion
system; finally, the solder
alloy is cooled, sieved and annealed to obtain the solder alloy. The application combines
plasma technology, gas atomization and
ultrasonic technology, realizes preparation of a
tin-based solder alloy with uniform composition, high
oxidation resistance and excellent mechanical properties, and meets the needs of the electronic
welding field under high temperature environment.