The invention relates to a method for manufacturing a high thermal conductivity metal-base copper-clad plate, belonging to the technical field of a circuit board. The method takes high thermal conductivity glue as key technology, and comprises the steps of: spreading the high thermal conductivity glue prepared by magnesium hydroxide, aluminum oxide, boron nitride, epoxy resin, acetone and dicyandiamide on the back of a copper foil, putting the copper foil spread with the high thermal conductivity glue on a metal base plate after drying and cutting, laminating the copper foil on the metal base plate, sticking a protective film on the copper foil, then trimming, examining and packaging, and finally, obtaining the finished product of the high thermal conductivity metal-base copper-clad plate. The high thermal conductivity metal-base copper-clad plate is used for the circuit board of a light-emitting diode (LED) lamp, an igniter, a power supply, a backlight lamp or the like with high power and heat dissipation performance. After the method is adopted, the product quality is good, the cost is low, the technical process is simple, the interlayer binding force is good, and the method is environment-friendly and beneficial to being popularized and applied.