699 results about "Forming face" patented technology

A disclosed device includes a manufacturing method of semiconductor device including preparing a semiconductor substrate including semiconductor chip forming regions, scribing regions surrounding these regions, and cutting regions formed in the scribing regions and narrower than the scribing regions, forming check patterns and semiconductor chips, forming a resist film, forming through grooves narrower than the scribing regions and wider than the check patterns and the cutting regions, removing the check patterns with a wet blast process using the resist film and collectively forming grooves at portions of a protection film and the semiconductor substrate facing the through grooves, removing the resist film, forming internal connection terminals on the contacting faces, forming an insulating resin layer, forming a wiring forming face by removing until connecting faces are exposed, forming wiring patterns, and cutting the semiconductor substrate, the insulating resin layer, and a solder resist layer to separate into individual semiconductor devices.

A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of semiconductor chips mounted on the substrate by stacking one on top of another, and an encapsulation resin layer made of encapsulation resin. Among the plurality of semiconductor chips, a first semiconductor chip as an uppermost semiconductor chip is mounted with a surface thereof on which a circuit is formed facing toward the substrate, and the encapsulation resin layer is formed so that at least a surface of the first semiconductor chip opposite to the surface on which the circuit is formed and a part of side surfaces of the first semiconductor chip are exposed to the outside of the encapsulation resin layer.

A solid-state imaging device is provided. The solid-state imaging device includes a plurality of arrayed pixels, an optical inner filter layer, and a light-blocking side wall. The plurality of arrayed pixels each includes a photoelectric conversion portion and a pixel transistor. The optical inner filter layer is provided for blocking infrared light and formed facing toward a light-receiving surface of the photoelectric conversion portion of a desired pixel among the arrayed pixels. The light-blocking side wall is formed on a lateral wall of the optical inner filter layer.

A blade punch for forming teeth in a connector plate, the blade punch comprising an elongated blade having a metal working tip at one end and a shank at the other end. The blade has an elongated cross-section defined by opposing parallel spaced planar side walls and opposing ends. Each end comprises a major end wall and a minor end wall which converge to end wall intersections, where the end wall intersections are eccentric to a plane parallel to and midway between said side walls. Each end wall intersects a side wall at an obtuse angle. The metal working tip has opposed air cut faces abutting one another along an air cut edge and opposed first and second forming faces, each of the forming faces abutting one of the air cut faces along an exterior edge. Each of the air cut faces is bordered by a portion of one of the minor end walls, a portion of one of the side walls, the air cut edge, and one of the exterior edges. Each of the forming faces is bordered by a portion of one of the major end walls, a portion of one of the minor end walls, a portion of one of the side walls, and one of the exterior edges. A forming angle between 50 DEG and 60 DEG is formed between the first forming face and the exterior edge bordering the second forming face in a plane normal to the first forming face.

The invention comprises a product. The product comprises a first removable concrete form having a concrete forming face and a first insulating panel insert having a first primary surface and an opposite second primary surface, wherein the second primary surface of the first insulating panel insert contacts the concrete forming face of the first removable concrete form. The product also comprises an elongate anchor member having an enlarged portion and an elongate portion, the elongate portion having a first end and an opposite second end, wherein the enlarged portion is disposed adjacent the first end and contacts the second primary surface of the first insulating panel insert and wherein the elongate portion extends through the first insulating panel insert and extends outwardly from the first primary surface of the first insulating panel insert. A method of using a removable insulated concrete form system is also disclosed.

The invention refers to a non-glass and flexible solar power module and the method for its manufacture where the module is provided with a circumferential and flexible frame having integrated through-wiring and socket parts, which are formed face-side into the frame, for module interconnection by means of plug-in connectors. The solar module is thoroughly and completely sealed off on its rear side and has a full-surface smooth texture which is established by the insertion of a thin flexible panel, preferably made of plastic, together with the laminate into the form for the manufacture of the frame by means of RIM (reaction injection moulding). The modules are mounted on the building, preferably by means of bonding/cementing to practically any random roof materials, as well as to curved surfaces and without a backward cable lead.

The invention is directed to an improvement of cutting accuracy in a cutting process when a semiconductor device attached with a supporting member is manufactured. The invention provides a manufacturing method of a semiconductor device where a semiconductor wafer attached with a glass substrate is cut with moving a rotation blade along a dicing region and has following features. A pair of alignment marks is formed facing each other over the dicing region on the semiconductor wafer. Then, when the rotation blade is to be aligned on a center of the dicing region, that is, on a centerline thereof in the cutting process, positions of the alignment marks are detected by a recognition camera, the centerline is calculated based on the detection result, and the rotation blade is aligned on the centerline to perform cutting.

A blade of ceramic material is treated to enhance the strength and sharpness of the cutting edge. In one embodiment, ceramic particles along at least one margin of an edge-forming face are fused, such as by a laser treatment. The edge mardin can have a hard ceramic coating of a different ceramic material such as a nitride of chromium, zirconium, titanium, titanium carbon or boron. The hard ceramic coating can be used alone or in conjunction with the laser treatment. The invention includes the methods of treating the edge, both to form the hard ceramic coating and to fuse the particles by scanning with laser, such as an ultraviolet laser.

A liquid crystal display (LCD) includes a first substrate, a pixel electrode formed on the first substrate, a second substrate formed facing the first substrate, a common electrode formed on the second substrate, and a spacer disposed between the first and second substrates. The spacer is circular cylinder shaped or hexahedral-shaped. The spacer may be formed by dissolving a block copolymer that includes a hydrophilic group and a hydrophobic group in an acid aqueous solution including a silica particle precursor or an alkali aqueous solution including a silica particle precursor.

Methods and systems for forming face masks are disclosed. Embodiments may utilize computer-aided design and computer-aided manufacturing to form custom fitted face masks. System software may be configured to acquire facial topography information, design a mask based on the topography information, and send mask information to a computerized manufacturing device. The software may communicate with a scanning device for facial topography acquisition and a milling machine for pattern fabrication. In an embodiment, the scanning device may include a linear scan non-contact laser imager. In an embodiment, the scanning device may be manually moved with respect to an individual being scanned, thereby eliminating the need for motive apparatus. In such embodiments, position information may be determined based on data from a position sensor coupled to the scanning device.

The fuel cell of the invention includes an electrolyte assembly, and a separator having one face as a gas flow path-forming face with a gas flow path formed thereon to allow flow of a reactive gas and the other face, which is reverse to the one face, as a refrigerant flow path-forming face with a refrigerant flow path formed thereon to allow flow of a refrigerant. The gas flow path-forming face of the separator has multiple linear gas flow paths that are arranged in parallel to one another, and a gas flow path connection structure that divides the multiple linear gas flow paths into plural linear gas flow path groups and connects at least part of the plural linear gas flow path groups in series. The refrigerant flow path-forming face has multiple linear refrigerant flow paths that are formed as a reverse structure of the multiple linear gas flow paths on the gas flow path-forming face, and a refrigerant flow path connection structure that is formed as a reverse structure of the gas flow path connection structure on the gas flow path-forming face to connect the multiple linear refrigerant flow paths in parallel.

A method of manufacturing an optical module includes the steps of mounting an optical device onto a substrate with a surface on which an optical part is formed facing the substrate, and aligning an optical fiber with the optical part through the substrate. An aligning guide is provided at an end portion of the optical fiber except an end surface facing the optical part. The guide is attached to a guide receiving section, the position of which is determined relatively with the optical device.

The invention provides a ship track active-disturbance-rejection control method based on the slip form of a multi-modal nonsingular terminal. The method includes the steps of constructing an expectedship heading equation according to navigational parameters of a ship, deducing a discretization nonlinear structural model of a two-order differentiator, processing expected ship heading signals in the expected ship heading equation to obtain expected ship heading differential signals required for controlling the rudder angle by the control law, obtaining the output rudder angle on the basis of the switchable error feedback control law, constructing an expanded state observer in combination with the error feedback control law, tracking the output deviation according to the expanded state observer, estimating the heading angle and inner and outer disturbance errors controlled by the control law, and feeding the heading angle and the inner and outer disturbance errors back into the control law. By improving the expanded state observer, a linear function and a nonlinear function can be switched in real time; the switchable segmented slip form face is designed; through the segmented slip form face, the switchable error feedback control law is designed, and the under-actuated ship track control is well realized.

An electroluminescent device includes a substrate having a bank-forming face on one surface thereof, a bank formed on the bank-forming face, and a thin-film layer constituting an electroluminescent element at a region surrounded by the bank. The thin-film layer is formed by filling the region surrounded by the bank with a thin-film material liquid and solidifying the liquid. The bank-forming face and a contact face with the thin-film layer have curved surfaces so that the central portions thereof are convexed toward the substrate side.

The battery pack of the present invention includes a circuit board placed on the upper side of a unit cell, an upper cover placed on the upper side of the circuit board, and a resin mold that is formed in between the upper cover and the upper surface of the unit cell and integrates the circuit board and the upper cover with the upper surface of the unit cell. External connection terminals for connection with the contact terminals of external equipment are placed on the upper surface of the circuit board, and the upper cover has a window that is provided in a penetrating form facing the external connection terminals. In order to regulate a spacing between the upper cover and the upper surface of the unit cell, a positioning projection is provided directed downward at both right and left ends on the lower surface of the upper cover, and a board fitting portion in which the circuit board is fit is formed on the lower surface of the upper cover.

The present invention, in one embodiment, provides a method for making a wood-type golf club head. The method includes the steps of: forming a face portion of the golf club head from a piece of sheet metal consisting essentially of a titanium alloy; and after forming the face portion, attaching the formed face portion to a crown and a sole of the golf club head. The step of forming the face portion includes pressing the piece of sheet metal into a die at about 70 tons psi.

A semiconductor integrated circuit device includes at least one MOS transistor that is formed in a main region of the circuit device. The main region has one conductivity type. The semiconductor integrated circuit device also includes a guard ring region formed surrounding the MOS transistor and in contact with the main region. The guard ring has the same conductivity type as the main region. The semiconductor integrated circuit device further includes an anode region formed facing the guard ring region and in contact with the main region. The anode region has the opposite conductivity type to the main region. The semiconductor integrated circuit device also includes a cathode region having at least a portion of the guard ring region. The anode region, the main region, and the cathode region form a diode.

The invention relates to a bulging die for titanium-alloy thin-walled complicated irregular annular workpieces. The bulging die comprises a core shaft, n brackets, n male dies, female dies and a base, wherein n sliding rails are uniformly distributed on the upper surface of the base, and all brackets are respectively embedded in all the sliding rails so as to form a circular assembly; the small-diameter end of the core shaft is located in the assembly and is fit with the internal surfaces of all the brackets; the n male dies are fixedly arranged on all the brackets respectively; each circular female die is formed through folding corresponding two semicircular female die clacks and sleeves the external surface of the corresponding male die; the internal surfaces of the female dies and the external surfaces of the male dies are workpiece forming faces. According to the bulging die, the forming of the irregular annular workpieces mainly relies on the plastic forming of a material, so that the surface wear resistance of parts is improved, the service lives of the parts are prolonged, and the material is saved; the accuracy of the annular workpieces can be corrected; during continuous repeated machining, the consistency of size and accuracy of the parts can be guaranteed.

A recessed portion is formed in a predetermined position in a heat-spreading component. A thermoplastic resin serving as a thermal interface material (TIM) is stored in the recessed portion. Meanwhile, a large number of filamentous thermo-conductive elements serving as the TIM are arranged to stand side by side on a surface of the heat-spreading component in which the recessed portion is formed (or on an exposed surface of an electronic component). Then, the heat-spreading component is fixed onto a board in such a manner that the surface of the heat-spreading component in which the recessed portion is formed faces the board and that a clearance is adjusted between the electronic component and the heat-spreading component. Thereafter, the resin is heated to a softening point thereof into a fluidized state, and the resin is flowed and filled into the clearance between the electronic component and the heat-spreading component.